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WZ20360

型号：

WZ20360

品牌：

SEOUL[ Seoul Semiconductor ]

页数：

17 页

PDF大小：

406 K

下载PDF手册
XZ20360  
Z2  
Description  
Features  
• Super high Flux output  
and high Luminance  
Z-Power series is designed for high  
current operation and high flux output  
applications.  
• Designed for high  
current operation  
• Low thermal resistance  
• SMT solderbility  
Z-Power LED's thermal management  
perform exceeds other power LED  
solutions.  
• Lead Free product  
• RoHS compliant  
It incorporates state of the art SMD design  
and Thermal emission material.  
Z Power LED is ideal light sources for general  
Illumination applications, custom designed  
solutions, automotive large LCD backlights  
Applications  
• Mobile phone flash  
• Automotive interior  
/ exterior lighting  
• Automotive signal lighting  
• Automotive forward lighting  
• General Torch  
• Architectural lighting  
• LCD TV / Monitor Backlight  
• Projector light source  
• Traffic signals  
• Task lighting  
• Decorative / Pathway lighting  
• Remote / Solar powered lighting  
• Household appliances  
*The appearance and specifications of the product may be changed  
for improvement without notice.  
Rev. 02  
October. 2010  
1
www.ZLED.com  
Document No. : SSC-QP-7-07-24 (Rev.00)  
Full Code of Z-Power LED Series  
Full code form : X1 X2 X3 X4 X5 X6 X7 – X8 X9 –X10X11 X12 X13X14  
1. Part Number  
- X1 : Color  
- X2 : New Z-Power LED - ‘Z’  
- X3 : New Z-Power LED series number  
- X4 : LENS type  
- X5 : Chip quantity (or Power Dissipation)  
- X6 : Package outline size  
-X7: Type of PCB  
2. Internal Number  
- X8  
- X9  
3. Code Labeling  
- X10 : Luminous flux (or Radiant flux for royal blue)  
- X11 X12 X13: Dominant wavelength (or x,y coordinates rank code)  
- X1 4: Forward voltage  
4. Sticker Diagram on Reel & Aluminum Vinyl Bag  
X X X X X X X – X X  
9
PART NO. :  
QUANTITY : ###  
LOT NUMBER : ##########  
1
2
3
4
5
6
7
8
X10 X11 X12 X13 X14  
BIN CODE :  
For more information about binning and labeling, refer to the Application Note -1  
Rev. 02  
October. 2010  
www.ZLED.com  
2
Document No. : SSC-QP-7-07-24 (Rev.00)  
Outline Dimension  
1. Flat Type  
[Package Outlines]  
[Top VIEW]  
[Bottom VIEW]  
Cathode Mark  
Cathode Pad  
Thermal Pad  
Anode Pad  
[Front VIEW]  
Notes :  
1. All dimensions are in millimeters. (tolerance : ±0.2 )  
2. Scale : none  
3. Thermal pad (slug) is isolated.  
*The appearance and specifications of the product may be changed for improvement without  
notice.  
Rev. 02  
October. 2010  
www.ZLED.com  
3
Document No. : SSC-QP-7-07-24 (Rev.00)  
Characteristics for Z-Power LED  
1. Pure White (WZ20360)  
1-1 Electro-Optical characteristics at IF=350mA, TA=25ºC  
Value  
Typ  
270  
6300  
68  
Parameter  
Symbol  
Unit  
Min  
200  
-
Max  
340  
-
[1]  
[2]  
Luminous Flux  
lm  
K
ФV  
[3]  
Correlated Color Temperature  
CRI  
CCT  
Ra  
-
-
-
[4]  
Forward Voltage  
VF  
9.5  
10.0  
120  
7.0  
11.0  
V
View Angle  
2Θ ½  
RθJ-B  
RθJ-C  
deg.  
ºC /W  
ºC /W  
[5]  
Thermal resistance  
[6]  
Thermal resistance  
3.8  
1-2 Absolute Maximum Ratings  
Parameter  
Symbol  
Value  
Unit  
mA  
W
Forward Current  
IF  
Pd  
400  
4.4  
Power Dissipation  
Junction Temperature  
Operating Temperature  
Storage Temperature  
Tj  
125  
ºC  
ºC  
ºC  
-
Topr  
Tstg  
-
-40 ~ +85  
-40 ~ +100  
[7]  
ESD Sensitivity  
±10,000V HBM  
*Notes :  
[1] SSC maintains a tolerance of ±10% on flux and power measurements.  
[2] ФV is the total luminous flux output as measured with an integrated sphere.  
[3] Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram.  
CCT ±5% tester tolerance  
[4] A tolerance of ±0.06V on forward voltage measurements  
[5], [6] RθJ-B is measured with a SSC metal core pcb.(25 ºC ≤TJ ≤ 110 ºC)  
RθJ-C is measured with only emitter.(25 ºC ≤TJ ≤ 110 ºC)  
Break voltage of Metal PCB is 6.5kVAC  
[7] It is included the zener chip to protect the product from ESD.  
--------------------------Caution--------------------------  
1. Please do not drive at rated current more than 5 sec. without proper heat sink.  
Rev. 02  
October. 2010  
www.ZLED.com  
4
Document No. : SSC-QP-7-07-24 (Rev.00)  
Characteristics for Z-Power LED  
2. Warm White (NZ20360)  
2-1 Electro-Optical characteristics at IF=350mA, TA=25ºC  
Value  
Typ  
210  
3000  
80  
Parameter  
Symbol  
Unit  
Min  
177  
-
Max  
240  
-
[1]  
[2]  
Luminous Flux  
lm  
K
ФV  
[3]  
Correlated Color Temperature  
CRI  
CCT  
Ra  
-
-
-
[4]  
Forward Voltage  
VF  
9.5  
10.0  
120  
7.0  
11.0  
V
View Angle  
2Θ ½  
RθJ-B  
RθJ-C  
deg.  
ºC /W  
ºC /W  
[5]  
Thermal resistance  
[6]  
Thermal resistance  
3.8  
2-2 Absolute Maximum Ratings  
Parameter  
Symbol  
Value  
Unit  
mA  
W
Forward Current  
IF  
Pd  
400  
4.4  
Power Dissipation  
Junction Temperature  
Operating Temperature  
Storage Temperature  
Tj  
125  
ºC  
ºC  
ºC  
-
Topr  
Tstg  
-
-40 ~ +85  
-40 ~ +100  
[7]  
ESD Sensitivity  
±10,000V HBM  
*Notes :  
[1] SSC maintains a tolerance of ±10% on flux and power measurements.  
[2] ФV is the total luminous flux output as measured with an integrated sphere.  
[3] Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram.  
CCT ±5% tester tolerance  
[4] A tolerance of ±0.06V on forward voltage measurements  
[5], [6] RθJ-B is measured with a SSC metal core pcb.(25 ºC ≤TJ ≤ 110 ºC)  
RθJ-C is measured with only emitter.(25 ºC ≤TJ ≤ 110 ºC)  
Break voltage of Metal PCB is 6.5kVAC  
[7] It is included the zener chip to protect the product from ESD.  
--------------------------Caution--------------------------  
1. Please do not drive at rated current more than 5 sec. without proper heat sink  
Rev. 02  
October. 2010  
www.ZLED.com  
5
Document No. : SSC-QP-7-07-24 (Rev.00)  
Characteristics for Z-Power LED  
3. Natural White (SZ20360)  
3-1 Electro-Optical characteristics at IF=350mA, TA=25ºC  
Value  
Typ  
230  
4000  
80  
Parameter  
Symbol  
Unit  
Min  
177  
-
Max  
260  
-
[1]  
[2]  
Luminous Flux  
lm  
K
ФV  
[5]  
Correlated Color Temperature  
CRI  
CCT  
Ra  
-
-
-
[3]  
Forward Voltage  
VF  
9.5  
10.0  
120  
7.0  
11.0  
V
View Angle  
2Θ ½  
RθJ-B  
RθJ-C  
deg.  
ºC /W  
ºC /W  
[5]  
Thermal resistance  
[6]  
Thermal resistance  
3.8  
3-2 Absolute Maximum Ratings  
Parameter  
Symbol  
Value  
Unit  
mA  
W
Forward Current  
IF  
Pd  
400  
4.4  
Power Dissipation  
Junction Temperature  
Operating Temperature  
Storage Temperature  
Tj  
125  
ºC  
ºC  
ºC  
-
Topr  
Tstg  
-
-40 ~ +85  
-40 ~ +100  
[7]  
ESD Sensitivity  
±10,000V HBM  
*Notes :  
[1] SSC maintains a tolerance of ±10% on flux and power measurements.  
[2] ФV is the total luminous flux output as measured with an integrated sphere.  
[3] Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram.  
CCT ±5% tester tolerance  
[4] A tolerance of ±0.06V on forward voltage measurements  
[5], [6] RθJ-B is measured with a SSC metal core pcb.(25 ºC ≤TJ ≤ 110 ºC)  
RθJ-C is measured with only emitter.(25 ºC ≤TJ ≤ 110 ºC)  
Break voltage of Metal PCB is 6.5kVAC  
[7] It is included the zener chip to protect the product from ESD.  
--------------------------Caution--------------------------  
1. Please do not drive at rated current more than 5 sec. without proper heat sink  
Rev. 02  
October. 2010  
www.ZLED.com  
6
Document No. : SSC-QP-7-07-24 (Rev.00)  
Color Spectrum, TA=25ºC  
1. Pure White  
1.0  
Standard eye response curve  
0.8  
0.6  
0.4  
0.2  
0.0  
300  
400  
500  
600  
700  
800  
Wavelength (nm)  
2. Warm White  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
300  
400  
500  
600  
700  
800  
Wavelength (nm)  
Rev. 02  
October. 2010  
www.ZLED.com  
7
Document No. : SSC-QP-7-07-24 (Rev.00)  
3. Natural White  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
300  
400  
500  
600  
700  
800  
Wavelength (nm)  
Rev. 02  
October. 2010  
www.ZLED.com  
8
Document No. : SSC-QP-7-07-24 (Rev.00)  
Junction Temperature Characteristics  
1. Relative Light Output vs. Junction Temperature at IF=350mA  
160  
WZ20360  
NZ20360  
140  
120  
100  
80  
60  
40  
20  
0
25  
50  
75  
100  
125  
Junction Temperature, TJ [oC]  
2. Forward Voltage Shift vs. Junction Temperature at IF=350mA  
Pure White & Warm white & Natural White  
0.0  
-0.2  
-0.4  
-0.6  
-0.8  
-1.0  
25  
50  
75  
100  
125  
Rev. 02  
October. 2010  
www.ZLED.com  
Junction Temperature, TJ [oC]  
9
Document No. : SSC-QP-7-07-24 (Rev.00)  
Forward Current Characteristics  
1. Forward Voltage vs. Forward Current , TA=25 ºc  
600  
Pure White & Warm White  
& Natural White  
500  
400  
300  
200  
100  
0
0
2
4
6
8
10  
Forward Voltage [V]  
2. Forward Current vs. Normalized Relative Luminous Flux, TA=25 ºc  
1.5  
Pure White & Warm White  
& Natural White  
1.0  
0.5  
0.0  
0
100  
200  
300  
400  
Forward Current [mA]  
Rev. 02  
October. 2010  
10  
www.ZLED.com  
Document No. : SSC-QP-7-07-24 (Rev.00)  
Ambient Temperature vs Allowable Forward Current  
1-1. Pure White, Warm White, Natural White  
(TJMAX = 125 ºC, @350mA)  
400  
350  
300  
250  
RjaT = 15oC/W  
RjaT = 10oC/W  
200  
150  
100  
50  
0
0
25  
50  
75  
100  
125  
150  
Ambient Temperature [oC]  
Rev. 02  
October. 2010  
www.ZLED.com  
11  
Document No. : SSC-QP-7-07-24 (Rev.00)  
Typical Dome Type Radiation pattern  
1. Pure White, Warm White, Natura White  
0
1.0  
30  
0.8  
0.6  
0.4  
0.2  
0.0  
60  
90  
-80  
-60  
-40  
-20  
0
Angle(deg.)  
Rev. 02  
October. 2010  
12  
www.ZLED.com  
Document No. : SSC-QP-7-07-24 (Rev.00)  
3. Reflow Soldering Conditions / Profile  
Tm : Reflow machine setting temp (max 30 sec.)  
Ts : Surface temp of PCB (max)  
Ts : Surface temp of PCB (recommend)  
Ts : Surface temp of PCB (min)  
260  
240  
220  
200  
Cooling  
-5 °C/sec  
Rising  
5 °C/sec  
Pre-heating  
180  
150  
0
Time  
[Hr]  
4. Hand Soldering conditions  
Lead : Not more than 3 seconds @MAX280℃  
Slug : Use a thermal-adhesives  
* Caution  
1. Reflow soldering should not be done more than one time.  
2. Repairing should not be done after the LEDs have been soldered.  
When repairing is unavoidable, suitable tools have to be used.  
3. Die slug is to be soldered.  
4. When soldering, do not put stress on the LEDs during heating.  
5. After soldering, do not warp the circuit board.  
6. Recommend to use a convection type reflow machine with 7 ~ 8 zones.  
Rev. 02  
October. 2010  
www.ZLED.com  
13  
Document No. : SSC-QP-7-07-24 (Rev.00)  
Emitter Type Reel Packaging  
Note :  
1. The number of loaded products in the reel is 500ea  
2. All dimensions are in millimeters (tolerance : ±0.2 )  
3. Scale none  
*The appearance and specifications of the product may be changed for improvement without  
notice.  
Rev. 02  
October. 2010  
www.ZLED.com  
14  
Document No. : SSC-QP-7-07-24 (Rev.00)  
Packaging Structure  
Aluminum Vinyl Bag  
PART NO. : ######-##  
QUANTITY : ***  
LOT NUMBER : #######-#######  
BIN CODE : #######  
Outer Box  
SIZE(mm)  
TYPE  
a
c
b
350 350 370  
c
ZLED  
PART : XZ20360-**  
ZLED  
PO CODE : ##  
Q'YT : ######  
LOT NO : YMDD-#####  
DATE : ######  
b
SEOUL SEMICONDUCTOR CO.,LTD  
a
Note :  
1. 6~10 reels are loaded in box  
2. Scale none  
3. For more information about binning and labeling, refer to the Application Note - 1  
Rev. 02  
October. 2010  
www.ZLED.com  
15  
Document No. : SSC-QP-7-07-24 (Rev.00)  
precaution for use  
• Storage  
To avoid the moisture penetration, we recommend storing Z Power LEDs in a dry box  
(or desiccator) with a desiccant . The recommended storage conditions are Temperature 5 to 30  
degrees Centigrade. Humidity 50% maximum.  
• Precaution after opening packaging  
However LED is correspond SMD, when LED be soldered dip, interfacial separation may affect  
the light transmission efficiency, causing the light intensity to drop.  
Attention in followed.  
a. Soldering should be done right after opening the package(within 24Hrs).  
b. Keeping of a fraction  
- Sealing  
- Temperature : 5 ~ 40℃ Humidity : less than 30%  
c. If the package has been opened more than 1week or the color of desiccant changes,  
components should be dried for 10-12hr at 60±5℃  
• Any mechanical force or any excess vibration shall not be accepted to apply during cooling  
process to normal temp. after soldering.  
• Please avoid rapid cooling after soldering.  
• Components should not be mounted on warped direction of PCB.  
• Anti radioactive ray design is not considered for the products listed here in.  
• Gallium arsenide is used in some of the products listed in this publication. These products are  
dangerous if they are burned or shredded in the process of disposal. It is also dangerous to  
drink the liquid or inhale the gas generated by such products when chemically disposed.  
• This device should not be used in any type of fluid such as water, oil, organic solvent and etc.  
When washing is required, IPA(Isopropyl Alcohol) should be used.  
• When the LEDs are illuminating, operating current should be decided after considering the  
package maximum temperature.  
• LEDs must be stored to maintain a clean atmosphere. If the LEDs are stored for 3 months or  
more after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used  
for storage.  
• The appearance and specifications of the product may be modified for improvement without  
notice.  
• Long time exposure of sunlight or occasional UV exposure will cause lens discoloration.  
• Attaching LEDs, don’t use adhesives to generate organic vapor.  
Rev. 02  
October. 2010  
www.ZLED.com  
16  
Document No. : SSC-QP-7-07-24 (Rev.00)  
Handling of Silicone Resin LEDs  
(1) During processing, mechanical stress on the surface should be minimized as much as  
possible. Sharp objects of all types should not be used to pierce the sealing compound.  
(2) In general, LEDs should only be handled from the side. By the way, this also applies  
to LEDs without a silicone sealant, since the surface can also become scratched.  
(3) When populating boards in SMT production, there are basically no restrictions  
regarding the form of the pick and place nozzle, except that mechanical pressure on the  
surface of the resin must be prevented.  
This is assured by choosing a pick and place nozzle which is larger than the LED’s  
reflector area.  
(4) Silicone differs from materials conventionally used for the manufacturing of LEDs.  
These conditions must be considered during the handling of such devices. Compared to  
standard encapsulants, silicone is generally softer, and the surface is more likely to  
attract dust.  
As mentioned previously, the increased sensitivity to dust requires special care  
during processing. In cases where a minimal level of dirt and dust particles cannot be  
guaranteed, a suitable cleaning solution must be applied to the surface after the  
soldering of components.  
(5) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it  
must be assured that these solvents do not dissolve the package or resin.  
Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the  
Rev. 02  
LED.  
October. 2010  
www.ZLED.com  
17  
Document No. : SSC-QP-7-07-24 (Rev.00)  
厂商 型号 描述 页数 下载

NJRC

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FOXCONN

 		WZ21131-G2-8F [ Board Connector, 68 Contact(s), 2 Row(s), Female, Right Angle, 0.05 inch Pitch, Surface Mount Terminal, Locking, Natural Insulator, Socket, LEAD FREE ] 1 页

NJRC

 		WZ230 [ Zener Diode, 23V V(Z), 5%, 0.5W, ] 1 页

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