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LZ23BP2

型号：

LZ23BP2

描述：

三分之一型逐行扫描彩色CCD传感器面积与350的k个像素[ 1/3-type Progressive-scan Color CCD Area Sensor with 350 k Pixels ]

品牌：

SHARP[ SHARP ELECTRIONIC COMPONENTS ]

页数：

11 页

PDF大小：

91 K

下载PDF手册
LZ23BP2  
1/3-type Progressive-scan Color CCD  
Area Sensor with 350 k Pixels  
LZ23BP2  
DESCRIPTION  
PIN CONNECTIONS  
The LZ23BP2 is a 1/3-type (6.0 mm) solid-state  
image sensor that consists of PN photo-diodes and  
CCDs (charge-coupled devices). With approxi-  
mately 350 000 pixels (695 horizontal x 504  
vertical), the sensor provides a stable high-  
resolution color image. All pixel signals can be read  
independently via the vertical shift register and  
horizontal shift register.  
16-PIN HALF-PITCH WDIP  
TOP VIEW  
ØV4  
ØV3  
1
2
3
4
5
6
7
8
16 ØH2  
15 ØH1  
14 ØRS  
13 PW  
12 OFD  
11 GND  
10 NC2  
ØV2  
ØV1  
GND  
NC1  
GND  
OS  
FEATURES  
• Progressive scan  
• Square pixel  
• Compatible with VGA format  
• Number of effective pixels : 659 (H) x 494 (V)  
• Number of optical black pixels  
– Horizontal : 2 front and 34 rear  
– Vertical : 8 front and 2 rear  
• Number of dummy bits  
9
OD  
(WDIP016-N-0450)  
– Horizontal : 16  
– Vertical : 4  
PRECAUTIONS  
• The exit pupil position of lens should be more  
than 25 mm from the top surface of the CCD.  
• Refer to "PRECAUTIONS FOR CCD AREA  
SENSORS" for details.  
• Pixel pitch : 7.4 µm (H) x 7.4 µm (V)  
• R, G, and B primary color mosaic filters  
• Low fixed-pattern noise and lag  
• No burn-in and no image distortion  
• Blooming suppression structure  
• Built-in output amplifier  
• Built-in overflow drain voltage circuit and reset  
gate voltage circuit  
• Variable electronic shutter (1/30 to 1/10 000 s)  
• Package :  
16-pin half-pitch WDIP [Ceramic]  
(WDIP016-N-0450)  
Row space : 11.43 mm  
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in  
catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.  
1
LZ23BP2  
PIN DESCRIPTION  
SYMBOL  
PIN NAME  
Output transistor drain  
OD  
OS  
Output signals  
ØRS  
Reset transistor clock  
Vertical shift register clock  
Horizontal shift register clock  
Overflow drain  
ØV1, ØV2, ØV3, ØV4  
ØH1, ØH2  
OFD  
PW  
P-well  
GND  
Ground  
NC1, NC2  
No connection  
ABSOLUTE MAXIMUM RATINGS  
PARAMETER  
Output transistor drain voltage  
Overflow drain voltage  
(TA = +25 ˚C)  
UNIT NOTE  
V
SYMBOL  
VOD  
VOFD  
VØRS  
VØV  
RATING  
0 to +18  
Internal output  
Internal output  
–11.5 to +17.5  
–0.3 to +12  
–29 to 0  
0 to +15  
–40 to +85  
–20 to +70  
V
V
1
2
Reset gate clock voltage  
Vertical shift register clock voltage  
Horizontal shift register clock voltage  
Voltage difference between P-well and vertical clock  
Voltage difference between vertical clocks  
Storage temperature  
V
V
V
VØH  
VPW-VØV  
VØV-VØV  
TSTG  
V
3
˚C  
˚C  
Ambient operating temperature  
TOPR  
NOTES :  
1. Do not connect to DC voltage directly. When OFD is connected to GND, connect VOD to GND. Overflow drain clock is  
applied below 27 Vp-p.  
2. Do not connect to DC voltage directly. When ØRS is connected to GND, connect VOD to GND. Reset gate clock is  
applied below 8 Vp-p.  
3. When clock width is below 10 µs, and clock duty factor is below 0.1%, voltage difference between vertical clocks will be  
below 28 V.  
2
LZ23BP2  
RECOMMENDED OPERATING CONDITIONS  
PARAMETER  
Ambient operating temperature  
Output transistor drain voltage  
Overflow drain clock p-p level  
Ground  
SYMBOL  
MIN.  
TYP. MAX. UNIT NOTE  
TOPR  
VOD  
VØOFD  
25.0  
14.55 15.0 15.45  
22.5  
˚C  
V
24.5  
V
V
V
1
2
GND  
0.0  
P-well voltage  
VPW  
–10.0  
–9.5  
VØVL  
–8.5  
VØV1L, VØV2L  
VØV3L, VØV4L  
VØV1I, VØV2I  
VØV3I, VØV4I  
VØV1H, VØV3H  
VØH1L, VØH2L  
VØH1H, VØH2H  
VØRS  
LOW level  
–9.0  
0.0  
V
V
Vertical shift  
register clock  
INTERMEDIATE level  
HIGH level  
LOW level  
HIGH level  
14.55 15.0 15.45  
–0.05  
4.5  
V
V
V
V
Horizontal shift  
register clock  
0.0  
5.0  
5.0  
0.05  
5.5  
5.5  
Reset gate clock p-p level  
4.5  
1
fØV1, fØV2  
fØV3, fØV4  
fØH1, fØH2  
fØRS  
Vertical shift register clock frequency  
15.73  
kHz  
Horizontal shift register clock frequency  
Reset gate clock frequency  
12.27  
12.27  
MHz  
MHz  
NOTES :  
• Connect NC1 and NC2 to GND directly or through a capacitor larger than 0.047 µF.  
1. Use the circuit parameter indicated in "SYSTEM CONFIGURATION EXAMPLE", and do not connect to DC voltage directly.  
2. VPW is set below VØVL that is low level of vertical shift register clock, or is used with the same power supply that is connected  
to VL of V driver IC.  
* To apply power, first connect GND and then turn on VOD. After turning on VOD, turn on PW first and then turn on other powers  
and pulses. Do not connect the device to or disconnect it from the plug socket while power is being applied.  
3
LZ23BP2  
CHARACTERISTICS (1/30 s progressive scan readout mode)  
(TA = +25 ˚C, Operating conditions : The typical values specified in "RECOMMENDED OPERATING CONDITIONS".  
Color temperature of light source : 3 200 K, IR cut-off filter (CM-500, 1 mmt) is used.)  
PARAMETER  
Standard output voltage  
Photo response non-uniformity  
Saturation output voltage  
Dark output voltage  
SYMBOL  
VO  
MIN.  
TYP. MAX. UNIT NOTE  
150  
mV  
%
2
3
PRNU  
VSAT  
VDARK  
DSNU  
R
10  
500  
mV  
mV  
mV  
mV  
4
0.5  
0.5  
370  
0.55  
0.4  
3.0  
2.0  
1, 5  
1, 6  
7
8
8
Dark signal non-uniformity  
Sensitivity (green channel)  
245  
0.3  
0.2  
RR  
RB  
0.8  
0.6  
Sensitivity ratio  
Smear ratio  
Image lag  
Blooming suppression ratio  
Output transistor drain current  
Output impedance  
Dark noise  
SMR  
AI  
ABL  
IOD  
RO  
VNOISE  
–86  
–76  
1.0  
dB  
%
9
10  
11  
500  
4.0  
350  
0.2  
8.0  
mA  
$
mV  
mV  
0.3  
1.0  
12  
1, 13  
OB difference in level  
NOTES :  
• Within the recommended operating conditions of VOD,  
VOFD of the internal output satisfies with ABL larger than  
500 times exposure of the standard exposure conditions,  
and VSAT larger than 500 mV.  
8. RR is defined by VR/VG. RB is defined by VB/VG, where  
VR, VG and VB are the average output voltages of red,  
green and blue signals respectively, under the standard  
exposure conditions.  
1. TA = +60 ˚C  
9. The sensor is exposed only in the central area of V/10  
square with a lens at F4, where V is the vertical image  
size. SMR is defined by the ratio of the output voltage  
detected during the vertical blanking period to the  
maximum output voltage in the V/10 square.  
10. The sensor is exposed at the exposure level  
corresponding to the standard conditions. AI is defined  
by the ratio of the output voltage measured at the 1st  
field during the non-exposure period to the standard  
output voltage.  
11. The sensor is exposed only in the central area of V/10  
square, where V is the vertical image size. ABL is  
defined by the ratio of the exposure at the standard  
conditions to the exposure at a point where blooming is  
observed.  
2. The average output voltage of G signal under uniform  
illumination. The standard exposure conditions are  
defined as when Vo is 150 mV.  
3. The image area is divided into 10 x 10 segments under  
the standard exposure conditions. Each segment's  
voltage is the average output voltage of all pixels within  
the segment. PRNU is defined by (Vmax – Vmin)/Vo,  
where Vmax and Vmin are the maximum and minimum  
values of each segment's voltage respectively.  
4. The image area is divided into 10 x 10 segments. Each  
segment's voltage is the average output voltage of all  
pixels within the segment. VSAT is the minimum  
segment's voltage under 10 times exposure of the  
standard exposure conditions.  
5. The average output voltage under non-exposure  
conditions.  
12. The RMS value of the dark noise (after CDS). (100 kHz  
to 5.0 MHz, SC trap on.)  
6. The image area is divided into 10 x 10 segments under  
non-exposure conditions. DSNU is defined by (Vdmax –  
Vdmin), where Vdmax and Vdmin are the maximum and  
minimum values of each segment's voltage respectively.  
7. The average output voltage of G signal when a 1 000  
lux light source with a 90% reflector is imaged by a lens  
of F4, f50 mm.  
13. The difference between the average output voltage of  
the effective area and that of the OB area under non-  
exposure conditions.  
4
LZ23BP2  
PIXEL STRUCTURE  
OPTICAL BLACK  
(2 PIXELS)  
1 pin  
OPTICAL BLACK  
(2 PIXELS)  
OPTICAL BLACK  
(34 PIXELS)  
659 (H) x 494 (V)  
OPTICAL BLACK  
(8 PIXELS)  
COLOR FILTER ARRAY  
(1, 494)  
(659, 494)  
G
B
G
B
G
G
B
G
B
G
R
G
R
G
R
G
B
G
B
G
R
G
R
G
R
G
B
G
B
G
R
G
R
G
R
R
G
R
G
R
G
B
G
B
G
R
G
R
G
R
G
B
G
B
G
R
G
R
G
R
G
B
G
B
G
G
B
G
B
G
R
G
G
B
G
B
G
R
G
R
G
R
G
B
G
B
G
R
G
R
G
R
R
G
R
G
R
G
B
G
B
G
R
G
R
G
R
G
B
G
B
G
R
G
R
G
R
R
G
R
(1, 1)  
(659, 1)  
5
LZ23BP2  
TIMING CHART  
VERTICAL TRANSFER TIMING  
525 1  
HD  
10  
20  
30  
VD  
ØV1  
ØV2  
ØV3  
ØV4  
ØOFD  
492  
494  
OB2  
D2  
D4  
OB2  
OB4  
OB6  
OB8  
493  
OB1  
D1  
D3  
OB1 OB3  
OB5  
OB7  
1
2
OS  
HORIZONTAL TRANSFER TIMING  
780, 1  
78  
HD  
ØH1  
ØH2  
ØRS  
OS  
38  
107.5  
PRE SCAN (16)  
OB (2)  
OUTPUT (659) 1πππππππππππ  
πππππ659  
OB (34)  
780  
1
45  
73  
ØV1  
ØV2  
ØV3  
59  
87  
38  
80  
52  
94  
ØV4  
83  
66  
ØOFD  
6
LZ23BP2  
READOUT TIMING  
HD  
ØV1  
ØV2  
ØV3  
ØV4  
22.5 µs (276 bits)  
32.5 µs (399 bits)  
5.05 µs 5.05 µs  
(62 bits)(62 bits)  
63.5 µs (780 bits)  
7
LZ23BP2  
SYSTEM CONFIGURATION EXAMPLE  
+
OS  
OD  
NC2  
GND  
OFD  
PW  
GND  
NC1  
GND  
ØV1  
ØV2  
ØRS  
ØV3  
ØH1  
ØV4  
ØH2  
POFD  
VMb  
VL  
VOFDH  
VH3BX  
OFDX  
V2X  
V2  
+
V4  
NC  
V3B  
V3A  
V1B  
V1A  
VMa  
VH  
V1X  
VH1AX  
V3X  
VDD  
+
GND  
VH3AX  
V4X  
VH1BX  
+
8
PACKAGES FOR CCD AND CMOS DEVICES  
PACKAGE  
(Unit : mm)  
16 WDIP (WDIP016-N-0450)  
Center of effective imaging area  
and center of package  
±0.15  
12.20  
±0.10  
±0.45  
0.85  
10.50  
(◊2)  
(◊1 : Reference area)  
(◊2 : Lid's size)  
16  
9
Glass Lid  
¬
CCD  
CCD  
Package (Cerdip)  
1
8
0.04  
(◊  
1)  
Cross Section A-A'  
MAX.  
4-0.20R  
±0.15  
6.10  
MAX.  
Rotation error of die : ¬ = 1.5˚  
9.2  
2.5  
A
A'  
TYP.  
±0.05  
P-1.27  
0.25  
0.25  
M
±0.25  
TYP.  
TYP.  
11.43  
0.30  
0.46  
9
PRECAUTIONS FOR CCD AREA SENSORS  
PRECAUTIONS FOR CCD AREA SENSORS  
(In the case of plastic packages)  
1. Package Breakage  
– The leads of the package are fixed with  
package body (plastic), so stress added to a  
lead could cause a crack in the package  
body (plastic) in the jointed part of the lead.  
In order to prevent the package from being broken,  
observe the following instructions :  
1) The CCD is a precise optical component and  
the package material is ceramic or plastic.  
Therefore,  
Glass cap  
Package  
ø Take care not to drop the device when  
mounting, handling, or transporting.  
Lead  
Fixed  
ø Avoid giving a shock to the package.  
Especially when leads are fixed to the socket  
or the circuit board, small shock could break  
the package more easily than when the  
package isn’t fixed.  
Stand-off  
2) When applying force for mounting the device or  
any other purposes, fix the leads between a  
joint and a stand-off, so that no stress will be  
given to the jointed part of the lead. In addition,  
when applying force, do it at a point below the  
stand-off part.  
3) When mounting the package on the housing,  
be sure that the package is not bent.  
– If a bent package is forced into place  
between a hard plate or the like, the pack-  
age may be broken.  
4) If any damage or breakage occurs on the sur-  
face of the glass cap, its characteristics could  
deteriorate.  
(In the case of ceramic packages)  
– The leads of the package are fixed with low  
melting point glass, so stress added to a  
lead could cause a crack in the low melting  
point glass in the jointed part of the lead.  
Therefore,  
ø Do not hit the glass cap.  
ø Do not give a shock large enough to cause  
distortion.  
ø Do not scrub or scratch the glass surface.  
– Even a soft cloth or applicator, if dry, could  
cause dust to scratch the glass.  
Low melting point glass  
Lead  
2. Electrostatic Damage  
As compared with general MOS-LSI, CCD has  
lower ESD. Therefore, take the following anti-static  
measures when handling the CCD :  
Fixed  
1) Always discharge static electricity by grounding  
the human body and the instrument to be used.  
To ground the human body, provide resistance  
of about 1 M$ between the human body and  
the ground to be on the safe side.  
Stand-off  
2) When directly handling the device with the  
fingers, hold the part without leads and do not  
touch any lead.  
10  
PRECAUTIONS FOR CCD AREA SENSORS  
3) To avoid generating static electricity,  
a. do not scrub the glass surface with cloth or  
plastic.  
ø The contamination on the glass surface  
should be wiped off with a clean applicator  
soaked in Isopropyl alcohol. Wipe slowly and  
gently in one direction only.  
b. do not attach any tape or labels.  
c. do not clean the glass surface with dust-  
cleaning tape.  
– Frequently replace the applicator and do not  
use the same applicator to clean more than  
one device.  
4) When storing or transporting the device, put it in  
a container of conductive material.  
◊ Note : In most cases, dust and contamination  
are unavoidable, even before the device  
is first used. It is, therefore, recommended  
that the above procedures should be  
taken to wipe out dust and contamination  
before using the device.  
3. Dust and Contamination  
Dust or contamination on the glass surface could  
deteriorate the output characteristics or cause a  
scar. In order to minimize dust or contamination on  
the glass surface, take the following precautions :  
1) Handle the CCD in a clean environment such  
as a cleaned booth. (The cleanliness level  
should be, if possible, class 1 000 at least.)  
2) Do not touch the glass surface with the fingers.  
If dust or contamination gets on the glass  
surface, the following cleaning method is  
recommended :  
4. Other  
1) Soldering should be manually performed within  
5 seconds at 350 °C maximum at soldering iron.  
2) Avoid using or storing the CCD at high tem-  
perature or high humidity as it is a precise  
optical component. Do not give a mechanical  
shock to the CCD.  
ø Dust from static electricity should be blown  
off with an ionized air blower. For anti-  
electrostatic measures, however, ground all  
the leads on the device before blowing off  
the dust.  
3) Do not expose the device to strong light. For  
the color device, long exposure to strong light  
will fade the color of the color filters.  
11  
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