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5SLX12M6500

型号:

5SLX12M6500

描述:

快速二极管管芯[ Fast-Diode Die ]

品牌:

ABB[ THE ABB GROUP ]

页数:

3 页

PDF大小:

59 K

VRRM  
IF  
=
=
6500 V  
50 A  
Fast-Diode Die  
5SLX 12M6500  
x
Die size: 13.6 13.6 mm  
Doc. No. 5SYA1666-01 July 07  
· Fast and soft reverse recovery  
· Low losses  
· Large SOA  
· Passivation: SIPOS and Silicon Nitride plus Polyimide  
1)  
Maximum rated values  
Parameter  
Symbol Conditions  
min max Unit  
Repetitive peak reverse voltage  
Continuous forward current  
Repetitive peak forward current  
Junction temperature  
VRRM  
IF  
6500  
50  
V
A
Tvj ³ 25 °C  
IFRM  
Tvj  
Limited by Tvjmax  
100  
125  
A
-40  
°C  
1)  
Maximum rated values indicate limits beyond which damage to the device may occur per IEC 60747 - 2  
2)  
Diode characteristic values  
Parameter  
Symbol Conditions  
min  
typ max Unit  
Tvj = 25 °C  
Tvj = 125 °C  
Tvj = 25 °C  
Tvj = 125 °C  
Tvj = 25 °C  
Tvj = 125 °C  
Tvj = 25 °C  
Tvj = 125 °C  
Tvj = 25 °C  
Tvj = 125 °C  
Tvj = 25 °C  
Tvj = 125 °C  
3.2  
3.4  
20  
V
V
Continuous forward voltage  
VF  
IR  
IF = 50 A  
µA  
mA  
A
Continuous reverse current  
Peak reverse recovery current  
Recovered charge  
VR = 6500 V  
3
6
70  
Irr  
80  
A
IF = 50 A,  
65  
µC  
µC  
ns  
ns  
mJ  
mJ  
VR = 3600 V,  
di/dt = 230 A/µs,  
Ls = 3400 nH,  
Inductive load,  
Switch:  
Qrr  
trr  
100  
1700  
2250  
100  
180  
Reverse recovery time  
2x 5SMX12M6500  
Reverse recovery energy  
Erec  
2)  
Characteristic values according to IEC 60747 - 2  
ABB Switzerland Ltd, Semiconductors reserves the right to change specifications without notice.  
5SLX 12M6500  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
250  
200  
150  
100  
50  
VCC = 3600 V  
di/dt = 230 A/µs  
Tvj = 125 °C  
Erec  
Ls = 3.4 µH  
125 °C  
25 °C  
Qrr  
Irr  
E rec [mJ] = -1.78 x 10 -2 x IF + 3.8 x IF + 34  
2
0
0
1
2
3
4
5
0
10 20 30 40 50 60 70 80 90 100  
IF [A]  
VF [V]  
Fig. 1  
Typical diode forward characteristics  
Fig. 2  
Typical reverse recovery characteristics  
vs. forward current  
200  
150  
100  
50  
60  
0
VCC = 3600 V  
IF = 50 A  
Tvj = 125 °C  
VR = 3600 V  
IF = 50 A  
-500  
40  
20  
0
di/dt = 230 A/µs  
Tvj = 125 °C  
Ls = 3.4 µH  
Erec  
-1000  
Ls = 3.4 µH  
-1500  
IR  
Qrr  
-20  
-40  
-2000  
-2500  
-3000  
Irr  
-60  
VR  
-80  
-3500  
-100  
-4000  
0
0
2000  
4000  
6000  
8000  
0
50  
100  
150  
200  
250  
time [ns]  
di/dt [A/µs]  
Typical diode reverse recovery behaviour  
Typical reverse recovery vs. di/dt  
Fig. 3  
Fig. 4  
ABB Switzerland Ltd, Semiconductors reserves the right to change specifications without notice.  
Doc. No. 5SYA1666-01 July 07  
page 2 of 3  
5SLX 12M6500  
Mechanical properties  
Parameter  
Unit  
x
L W  
x
Overall die  
mm  
mm  
13.6 13.6  
exposed  
front metal  
x
Dimensions  
L W  
x
8.58 8.58  
thickness  
front (A)  
back (K)  
µm  
µm  
µm  
670 ± 20  
AlSi1  
4
3)  
Metallization  
Al / Ti / Ni /Ag  
1.2  
3)  
For assembly instructions refer to: IGBT and Diode chips from ABB Switzerland Ltd, Semiconductors, Doc. No. 5SYA 2033.  
Outline Drawing  
A (Anode)  
8.58  
±0.05  
13.56  
Note : All dimensions are shown in mm  
This product has been designed and qualified for Industrial Level.  
ABB Switzerland Ltd, Semiconductors reserves the right to change specifications without notice.  
ABB Switzerland Ltd  
Semiconductors  
Doc. No. 5SYA1666-01 July 07  
Fabrikstrasse 3  
CH-5600 Lenzburg, Switzerland  
Telephone +41 (0)58 586 1419  
Fax  
+41 (0)58 586 1306  
Email  
Internet  
abbsem@ch.abb.com  
www.abb.com/semiconductors  
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