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5SMY12M1200

型号:

5SMY12M1200

描述:

IGBT -模具[ IGBT-Die ]

品牌:

ABB[ THE ABB GROUP ]

页数:

5 页

PDF大小:

62 K

VCE  
IC  
=
=
1200 V  
150 A  
IGBT-Die  
5SMY 12M1200  
x
Die size: 13.5 13.5 mm  
Doc. No. 5SYA1639-01 Sep 06  
· Ultra low loss thin IGBT die  
· Highly rugged SPT+ design  
· Large bondable emitter area  
1)  
Maximum rated values  
Parameter  
Symbol Conditions  
min max Unit  
Collector-emitter voltage  
DC collector current  
Peak collector current  
Gate-emitter voltage  
VCES  
IC  
1200  
150  
300  
20  
V
A
A
V
VGE = 0 V, Tvj ³ 25 °C  
ICM  
Limited by Tvjmax  
VGES  
-20  
-40  
VCC = 900 V, VCEM £ 1200 V  
IGBT short circuit SOA  
Junction temperature  
tpsc  
Tvj  
10  
µs  
°C  
VGE £ 15 V, Tvj £ 125 °C  
150  
1)  
Maximum rated values indicate limits beyond which damage to the device may occur per IEC 60747 - 9  
ABB Switzerland Ltd, Semiconductors reserves the right to change specifications without notice.  
5SMY 12M1200  
2)  
IGBT characteristic values  
Parameter  
Symbol Conditions  
min typ max Unit  
Collector (-emitter)  
breakdown voltage  
V(BR)CES VGE = 0 V, IC = 1 mA, Tvj = 25 °C  
1200  
V
Tvj = 25 °C  
Tvj = 125 °C  
Tvj = 25 °C  
Tvj = 125 °C  
1.9  
2.1  
V
V
Collector-emitter  
saturation voltage  
VCE sat  
IC = 150 A, VGE = 15 V  
VCE = 1200 V, VGE = 0 V  
100  
µA  
µA  
nA  
V
Collector cut-off current  
ICES  
600  
Gate leakage current  
Gate-emitter threshold voltage  
Gate charge  
IGES  
VGE(TO)  
Qge  
-200  
5
200  
7
VCE = 0 V, VGE = ±20 V, Tvj = 125 °C  
IC = 6 mA, VCE = VGE, Tvj = 25 °C  
6.2  
1530  
10.6  
0.71  
0.47  
2
IC = 150 A, VCE = 600 V, VGE = -15 ..15 V  
nC  
Input capacitance  
Cies  
VCE = 25 V, VGE = 0 V, f = 1 MHz,  
Tvj = 25 °C  
nF  
Output capacitance  
Coes  
Cres  
Reverse transfer capacitance  
Internal gate resistance  
RGint  
W
Tvj = 25 °C  
Tvj = 125 °C  
Tvj = 25 °C  
Tvj = 125 °C  
Tvj = 25 °C  
Tvj = 125 °C  
Tvj = 25 °C  
Tvj = 125 °C  
190  
220  
60  
VCC = 600 V, IC = 150 A,  
RG = 6.8 W, VGE = ±15 V,  
Ls = 60 nH,  
Turn-on delay time  
Rise time  
td(on)  
ns  
tr  
ns  
ns  
ns  
inductive load  
60  
460  
530  
55  
VCC = 600 V, IC = 150 A,  
RG = 6.8 W, VGE = ±15 V,  
Ls = 60 nH,  
Turn-off delay time  
Fall time  
td(off)  
tf  
inductive load  
75  
VCC = 600 V, IC = 150 A,  
VGE = ±15 V, RG = 6.8 W,  
Ls = 60 nH,  
Tvj = 25 °C  
Tvj = 125 °C  
11.2  
16.7  
Turn-on switching energy  
Eon  
mJ  
inductive load,  
FWD: 2x 5SLX 12F1200  
VCC = 600 V, IC = 150 A,  
VGE = ±15 V, RG = 6.8 W,  
Ls = 60 nH,  
Tvj = 25 °C  
Tvj = 125 °C  
9.8  
15.3  
650  
Turn-off switching energy  
Short circuit current  
Eoff  
mJ  
A
inductive load  
tpsc 10 μs, VGE = 15 V, Tvj = 125 °C,  
ISC  
VCC = 900 V, VCEM 1200 V  
2)  
Characteristic values according to IEC 60747 - 9  
ABB Switzerland Ltd, Semiconductors reserves the right to change specifications without notice.  
Doc. No. 5SYA1639-01 Sep 06  
page 2 of 5  
5SMY 12M1200  
Unit  
Mechanical properties  
Parameter  
x
x
L W  
13.5 13.5  
Overall die  
mm  
mm  
mm  
exposed  
front metal  
x
x
L W (except gate pad)  
12.0 12.0  
Dimensions  
x
x
L W  
1.47 1.47  
gate pad  
thickness  
front (E)  
back (C)  
130 ± 20  
µm  
µm  
µm  
AlSi1  
4
3)  
Metallization  
Al / Ti / Ni / Ag  
1.2  
3)  
For assembly instructions refer to : IGBT and Diode chips from ABB Switzerland Ltd, Semiconductors, Doc. No. 5SYA 2033.  
Outline drawing  
1.58  
±0.05  
1.47  
G
Emitter  
11.97  
12.33  
±0.05  
13.49  
Note: all dimensions are shown in mm  
This is an electrostatic sensitive device, please observe the international standard IEC 60747-1, Chap. IX.  
This product has been designed and qualified for Industrial Level.  
ABB Switzerland Ltd, Semiconductors reserves the right to change specifications without notice.  
Doc. No. 5SYA1639-01 Sep 06  
page 3 of 5  
5SMY 12M1200  
300  
250  
200  
150  
100  
50  
450  
400  
350  
300  
250  
200  
150  
100  
50  
VCE = 20 V  
25 °C  
125 °C  
125 °C  
25 °C  
VGE = 15 V  
0
0
0
1
2
3
4
0
2
4
6
8
10  
12  
14  
VCE [V]  
VGE [V]  
Fig. 1  
Typical on-state characteristics  
Fig. 2  
Typical transfer characteristics  
160  
140  
120  
100  
80  
70  
60  
50  
40  
30  
20  
10  
0
VCC = 600 V  
IC = 150 A  
VCC = 600 V  
RG = 6.8 ohm  
VGE = ±15 V  
Tvj = 125 °C  
Ls = 60 nH  
VGE = ±15 V  
Tvj = 125 °C  
Ls = 60 nH  
Eon  
Eon  
60  
Eoff  
40  
Eoff  
20  
Esw [mJ] = 8.2 x E-4 x IC2 + 2.65 x E-2 x IC + 7.33  
0
0
100  
200  
300  
400  
500  
0
10  
20  
30  
40  
50  
IC [A]  
RG [ohm]  
Typical switching characteristics vs  
collector current  
Typical switching characteristics vs  
gate resistor  
Fig. 3  
Fig. 4  
ABB Switzerland Ltd, Semiconductors reserves the right to change specifications without notice.  
Doc. No. 5SYA1639-01 Sep 06  
page 4 of 5  
5SMY 12M1200  
100  
10  
1
20  
15  
10  
5
VGE = 0 V  
fOSC = 1 MHz  
VOSC = 50 mV  
VCC = 600 V  
Cies  
VCC = 900 V  
Coes  
Cres  
IC = 150 A  
Tvj = 25 °C  
0
0.1  
0.0  
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
1.4  
0
5
10  
15  
20  
25  
30  
35  
Qg [µC]  
VCE [V]  
Fig. 5  
Typical gate charge characteristics  
Fig. 6  
Typical capacitances vs  
collector-emitter voltage  
ABB Switzerland Ltd, Semiconductors reserves the right to change specifications without notice.  
ABB Switzerland Ltd  
Semiconductors  
Doc. No. 5SYA1639-01 Sep 06  
Fabrikstrasse 3  
CH-5600 Lenzburg, Switzerland  
Telephone +41 (0)58 586 1419  
Fax  
+41 (0)58 586 1306  
Email  
Internet  
abbsem@ch.abb.com  
www.abb.com/semiconductors  
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