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QT161

型号：

QT161

描述：

6键电荷转移的QTouch传感器IC[ 6 KEY CHARGE TRANSFER QTOUCH SENSOR IC ]

品牌：

QUANTUM[ QUANTUM RESEARCH GROUP ]

页数：

12 页

PDF大小：

701 K

下载PDF手册
lQ  
QProx™ QT160 / QT161  
6 KEY  
CHARGE-TRANSFER QTOUCH™ SENSOR IC  
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6 completely independent touch circuits  
Individual logic outputs per channel (active high)  
Projects prox fields through any dielectric  
Only one external capacitor required per channel  
Sensitivity easily adjusted on a per-channel basis  
100% autocal for life - no adjustments required  
3-5.5V, 5mA single supply operation  
Toggle mode for on/off control (strap option)  
10s, 60s, infinite auto-recal timeout (strap options)  
AKS™ Adjacent Key Suppression (QT160)  
Less expensive per key than many mechanical switches  
Eval board with backlighting - p/n E160  
NOTE: Pinouts are not the same!  
Pb-Free package available (QT160-ASG)  
APPLICATIONS  
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PC Peripherals  
Backlighted buttons  
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Appliance controls  
Security systems  
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Access systems  
Pointing devices  
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Instrument panels  
Gaming machines  
QT160 / QT161 charge-transfer (“QT’”) QTouch ICs are self-contained digital controllers capable of detecting near-proximity or  
touch from up to 6 electrodes. They allow electrodes to project 6 independent sense fields through any dielectric like glass,  
plastic, stone, ceramic, and wood. They can also make metal-bearing objects responsive to proximity or touch by turning them  
into intrinsic sensors. These capabilities coupled with continuous self-calibration can lead to entirely new product concepts,  
adding high value to product designs.  
Each of the 6 channels operate independently of the others, and each can be tuned for a unique sensitivity level by simply  
changing its sample capacitor value.  
The devices are designed specifically for human interfaces, like control panels, appliances, gaming devices, lighting controls,  
or anywhere a mechanical switch or button may be found; they may also be used for some material sensing and control  
applications. The option-selectable toggle mode permits on/off touch control, for example for light switch replacement.  
The devices require only a common inexpensive capacitor per channel in order to function. The QT160 also offers the unique  
adjacent key suppression (AKS™, patent pending) feature which suppresses touch from weaker responding keys and allows  
only a dominant key to detect, for example to solve the problem of large fingers on tightly spaced keys.  
In most cases the power supply need only be minimally regulated, for example by an inexpensive 3-terminal regulator.  
The RISC core of these devices employ signal processing techniques pioneered by Quantum; these are specifically designed  
to make the device survive real-world challenges, such as ‘stuck sensor’ conditions and signal drift.  
By using the charge transfer principle, these parts deliver a level of performance clearly superior to older technologies yet are  
highly cost-effective.  
AVAILABLE OPTIONS  
TA  
DIP-28  
QT160-D  
SSOP-28  
-
Notes  
00C to +700C  
-400C to +1050C  
-400C to +1050C  
00C to +700C  
-400C to +1050C  
-
QT160-AS  
QT160-ASG  
-
-
Pb-Free  
QT161-D  
-
QT161-AS  
LQ  
Copyright © 2002 QRG Ltd  
QT160/161 1.07/0904  
Option pins allow the selection of several timing features.  
1 - OVERVIEW  
QT160/161 is a 6-channel burst mode digital charge-transfer  
(QT) sensor designed specifically for touch controls; they  
include all hardware and signal processing functions  
necessary to provide stable sensing under a wide variety of  
conditions. Only a single low cost, non-critical capacitor per  
channel is required for operation.  
1.2 ELECTRODE DRIVE  
The devices have 6 independent channels. The internal ADC  
treats Cs on each channel as a floating transfer capacitor; as  
a direct result, the sense electrode can be connected to  
either SNS1A or SN1B with no performance difference. In  
both cases the rule Cs >> Cx must be observed for proper  
operation. The polarity of the charge buildup across Cs  
during a burst is the same in either case.  
Figure 1-1 shows the basic circuit using the device. See  
Tables 7-1 and 7-2 (page 11) for pin listings. The DIP and  
SOIC pinouts are not the same and serious damage can  
occur if a part is mis-wired).  
It is possible to connect separate Cx and Cx’ loads to  
SNS1A and SNS1B simultaneously, although the result is no  
different than if the loads were connected together at SNS1A  
(or SNS1B). It is important to limit the amount of stray  
capacitance on both terminals, especially if the load Cx is  
already large, for example by minimizing trace lengths and  
widths so as not to exceed the Cx load specification and to  
allow for a larger sensing electrode size if so desired.  
1.1 BASIC OPERATION  
The devices employ bursts of charge-transfer cycles to  
acquire signals. Burst mode permits low power operation,  
dramatically reduces RF emissions, lowers susceptibility to  
RF fields, and yet permits excellent speed. Internally, signals  
are digitally processed to reject impulse noise using a  
'consensus' filter that requires three consecutive  
confirmations of detection. Each channel is measured in  
sequence starting with channel 1.  
Unused channels: If a channel is not used, a dummy  
nominal 1nF sense capacitor of any type must be connected  
to the SNS pins ensure correct operation.  
The PCB traces, wiring, and any components associated  
with or in contact with SNS1A and SNS1B will become touch  
sensitive and should be treated with caution to limit the touch  
area to the desired location. Multiple touch electrodes can be  
used, for example to create a control button on both sides of  
an object, however it is impossible for the sensor to  
distinguish between the two touch areas.  
The QT switches and charge measurement hardware  
functions are all internal to the device (Figure 1-2). A 14-bit  
single-slope switched capacitor ADC includes both the  
required QT charge and transfer switches in a configuration  
that provides direct ADC conversion. The ADC is designed  
to dynamically optimize the QT burst length according to the  
rate of charge buildup on Cs, which in turn depends on the  
values of Cs, Cx, and Vdd. Vdd is used as the charge  
reference voltage. Larger values of Cx cause the charge  
transferred into Cs to rise more rapidly, reducing available  
resolution; as a minimum resolution is required for proper  
operation, this can result in dramatically reduced apparent  
gain. Conversely, larger values of Cs reduce the rise of  
differential voltage across it, increasing available resolution  
by permitting longer QT bursts. The value of Cs can thus be  
increased to allow larger values of Cx to be tolerated. The IC  
is responsive to both Cx and Cs, and changes in Cs can  
result in substantial changes in sensor gain.  
1.3 KEY DESIGN  
1.3.1 KEY  
G
EOMETRY AND  
S
IZE  
There is no restriction on the shape of the key electrode; in  
most cases common sense and a little experimentation can  
result in a good electrode design. The devices will operate  
equally well with long, thin keys as with round or square  
ones; even random shapes are acceptable. The electrode  
can also be a 3-dimensional surface or object. Sensitivity is  
related to the amount of surface metallization, touch contact  
area, overlying panel material and thickness, and ground  
coupling quality of the sensor  
circuit.  
Figure 1-1 Recommended Basic Circuit (SSOP Package)  
If a relatively large touch area is  
desired, and if tests show that  
the electrode has more  
capacitance than the part can  
tolerate, the electrode can be  
made into a sparse mesh (Figure  
1-3) having lower Cx than a solid  
plane.  
1.3.2 BACKLIGHTING  
Touch pads can be  
K
EYS  
back-illuminated quite readily  
using electrodes with a hole in  
the middle (Figure 1-4). The  
holes can be as large as 4 cm in  
diameter provided that the ring of  
metal is at least twice as wide as  
the thickness of the overlying  
panel, and the panel is greater  
than 1/8 as thick as the diameter  
of the hole. Thin panels do not  
work well with this method they  
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2
QT160/161 1.07/0904  
will generally be enough to couple a few  
picofarads back to local earth.  
Figure 1-2 Internal Switching & Timing  
ELECTRODE  
Electrodes connected to the IC  
themselves act as coupling plates back  
to local ground, since when one  
channel is sensing the other channels  
are clamped to circuit ground.  
Result  
SNS2  
1.3.4 VIRTUAL  
C
APACITIVE  
G
ROUNDS  
Cs  
When detecting human contact (e.g. a  
fingertip), grounding of the person is  
never required. The human body  
Start  
Cx  
Done  
naturally has several hundred  
SNS1  
picofarads of ‘free space’ capacitance  
to the local environment (Cx3 in Figure  
1-5), which is more than two orders of  
magnitude greater than that required to  
create a return path to the IC via earth.  
The PCB however can be physically  
quite small, so there may be little ‘free  
space’ coupling (Cx1 in Figure 1-5)  
between it and the environment to  
Charge  
Amp  
do not propagate fields laterally very well, and will have poor  
sensitivity in the middle. Experimentation is required.  
complete the return path. If the circuit ground cannot be  
earth grounded by wire, for example via the supply  
connections, then a ‘virtual capacitive ground’ may be  
required to increase return coupling.  
Since the channels acquire their signals in time-sequence,  
any of the 6 electrodes can be placed in direct proximity to  
each other if desired without cross-interference.  
A ‘virtual capacitive ground’ can be created by connecting  
the IC's own circuit ground to:  
A good example of backlighting can be found in the E160  
eval board for the QT160.  
(1) A nearby piece of metal or metallized housing;  
(2) A floating conductive ground plane;  
(3) A nail driven into a wall;  
(4) A larger electronic device (to which its output might be  
connected anyway).  
1.3.3 KIRCHOFF  
’
S
C
URRENT  
L
AW  
Like all capacitance sensors, these parts rely on Kirchoff’s  
Current Law (Figure 1-5) to detect the change in capacitance  
of the electrode. This law as applied to capacitive sensing  
requires that the sensor’s field current must complete a loop,  
returning back to its source in order for capacitance to be  
sensed. Although most designers relate to Kirchoff’s law with  
regard to hardwired circuits, it applies equally to capacitive  
field flows. By implication it requires that the signal ground  
and the target object must both be coupled together in some  
manner for a capacitive sensor to operate properly. Note that  
there is no need to provide actual hardwired ground  
connections; capacitive coupling to ground (Cx1) is always  
sufficient, even if the coupling might seem very tenuous. For  
example, powering the sensor via an isolated transformer  
will provide ample ground coupling, since there is  
capacitance between the windings and/or the transformer  
core, and from the power wiring itself directly to 'local earth'.  
Even when battery powered, just the physical size of the  
PCB and the object into which the electronics is embedded  
Figure 1-3 Mesh Key Geometry  
Figure 1-4 Open Electrode for Back-Illumination  
Free-floating ground planes such as metal foils should  
maximize exposed surface area in a flat plane if possible. A  
square of metal foil will have little effect if it is rolled up or  
crumpled into a ball. Virtual ground planes are more effective  
and can be made smaller if they are physically bonded to  
other surfaces, for example a wall or floor.  
1.3.5 FIELD  
S
HAPING  
The electrode can be prevented from sensing in undesired  
directions with the assistance of metal shielding connected  
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3
QT160/161 1.07/0904  
to circuit ground (Figure 1-6). For example, on flat surfaces,  
the field can spread laterally and create a larger touch area  
than desired. To stop field spreading, it is only necessary to  
surround the touch electrode on all sides with a ring of metal  
connected to circuit ground; the ring can be on the same or  
opposite side from the electrode. The ring will kill field  
spreading from that point outwards.  
Figure 1-6 Shielding Against Fringe Fields  
If one side of the panel to which the electrode is fixed has  
moving traffic near it, these objects can cause inadvertent  
detections. This is called ‘walk-by’ and is caused by the fact  
that the fields radiate from either surface of the electrode  
equally well. Again, shielding in the form of a metal sheet or  
foil connected to circuit ground will prevent walk-by; putting a  
small air gap between the grounded shield and the electrode  
will keep the value of Cx lower and is encouraged. In the  
case of the QT160/161, sensitivity can be high enough  
(depending on Cx and Cs) that 'walk-by' signals are a  
concern; if this is a problem, then some form of rear  
shielding may be required.  
Sense  
Sense  
wire  
wire  
1.3.6 SENSITIVITY  
Sensitivity can be altered to suit various applications and  
situations on a channel-by-channel basis. The easiest and  
most direct way to impact sensitivity is to alter the value of  
Cs. More Cs yields higher sensitivity.  
1.3.6.1 Alternative Ways to Increase Sensitivity  
Sensitivity can also be increased by using bigger electrodes,  
reducing panel thickness, or altering panel composition.  
1.3.6.2 Decreasing Sensitivity  
In some cases the QT160 may be too sensitive. In this case  
gain can be lowered further by a number of strategies:  
a) making the electrode smaller, b) making the electrode into  
a sparse mesh using a high space-to-conductor ratio (Figure  
1-3), or c) by decreasing the Cs capacitors.  
Figure 1-5 Kirchoff's Current Law  
2 - QT160/QT161 SPECIFICS  
C
X2  
2.1 SIGNAL PROCESSING  
The QT160 processes all signals using 16 bit math, using a  
number of algorithms pioneered by Quantum. The algorithms  
are specifically designed to provide for high survivability in  
the face of adverse environmental changes.  
Sense Electrode  
SENSOR  
2.1.1 DRIFT  
C
OMPENSATION  
A
LGORITHM  
Signal drift can occur because of changes in Cx, Cs, and  
Vdd over time. If a low grade Cs capacitor is chosen, the  
signal can drift greatly with temperature. If keys are subject  
to extremes of temperature and humidity, the signal can also  
shift. It is crucial that drift be compensated, else false  
detections, non-detections, and sensitivity shifts will follow.  
C
X1  
C
X3  
Surrounding environm ent  
Drift compensation (Figure 2-1) is a method that makes the  
reference level track the raw signal at a slow rate, only while  
no detection is in effect. The rate of reference adjustment  
must be performed slowly else legitimate detections can also  
be ignored. The IC drift compensates each channel  
independently using a slew-rate limited change to the  
reference level; the threshold and hysteresis values are  
slaved to this reference.  
Increasing electrode size can have diminishing returns, as  
high values of Cx counteract sensor gain. Also, increasing  
the electrode's surface area will not substantially increase  
touch sensitivity if its diameter is already much larger in  
surface area than the object being detected. The panel or  
other intervening material can be made thinner, but again  
there are diminishing rewards for doing so. Panel material  
can also be changed to one having a higher dielectric  
constant, which will help propagate the field through to the  
front. Locally adding some conductive material to the panel  
(conductive materials essentially have an infinite dielectric  
constant) will also help; for example, adding carbon or metal  
fibers to a plastic panel will greatly increase frontal field  
strength, even if the fiber density is too low to make the  
plastic bulk-conductive.  
Once an object is sensed, the drift compensation  
mechanism ceases since the signal is legitimately high, and  
therefore should not cause the reference level to change.  
The signal drift compensation is 'asymmetric'; the reference  
level drift-compensates in one direction faster than it does in  
the other. Specifically, it compensates faster for decreasing  
signals than for increasing signals. Increasing signals should  
not be compensated for quickly, since an approaching finger  
lQ  
4
QT160/161 1.07/0904  
this, the IC's incorporate a detect integration  
counter that increments with each detection until a  
limit is reached, after which the output is activated.  
If no detection is sensed prior to the final count, the  
counter is reset immediately to zero. In the  
QT160/161, the required count is 3.  
Figure 2-1 Drift Compensation  
Signal  
Hysteresis  
Threshold  
The Detection Integrator can also be viewed as a  
'consensus' filter, that requires three detections in  
three successive bursts to create an output.  
Reference  
2.1.5 FORCED  
S
ENSOR  
R
ECALIBRATION  
Pin 28 is a Reset pin, active-low, which in cases  
where power is clean can be simply tied to Vdd. On  
power-up, the device will automatically recalibrate  
all 6 channels of sensing.  
Output  
could be compensated for partially or entirely before even  
approaching the sense electrode. However, an obstruction  
over the sense pad, for which the sensor has already made  
full allowance for, could suddenly be removed leaving the  
sensor with an artificially elevated reference level and thus  
become insensitive to touch. In this latter case, the sensor  
will compensate for the object's removal very quickly, usually  
in only a few seconds.  
Pin 28 can also be controlled by logic or a microcontroller to  
force the chip to recalibrate, by toggling it low for 5µs then  
raising it high again.  
The option pins are read by the IC once each acquisition  
cycle and can be changed during operation.  
2.1.6 RESPONSE  
T
IME  
Response time is fixed at 99ms at a 10MHz clock. Response  
time can be altered by changing the clock frequency.  
Doubling the recommended clock frequency to 20MHz will  
halve the response time to 49ms.  
With large values of Cs and small values of Cx, drift  
compensation will appear to operate more slowly than with  
the converse.  
Response time will become slower if the total duration of all  
bursts is greater than 33ms, i.e. an average of 5.5ms per  
channel.  
2.1.2 THRESHOLD  
C
ALCULATION  
The internal threshold level is fixed at 6 counts for all  
channels. These IC's employ a fixed hysteresis of 2 counts  
below the threshold (33%).  
2.2 OUTPUT FEATURES  
2.1.3 MAX  
ON-DURATION  
The ICs are designed for maximum flexibility and can  
accommodate most popular sensing requirements. These  
are selectable using strap options on pins OPT1 and OPT2.  
All options are shown in Table 2-1.  
If an object or material contacts a sense pad the signal may  
rise enough to trigger an output, preventing further normal  
operation. To prevent this ‘stuck key’ condition, the sensor  
includes a timer on each channel to monitors detections. If a  
detection exceeds the timer setting, the timer causes the  
sensor to perform a full recalibration (when not set to  
infinite). This is known as the Max On-Duration feature.  
2.2.1 DC MODE  
O
UTPUT  
The outputs of these ICs can respond in a DC mode, where  
they are active upon detection. The output will remain active  
for the duration of the detection, or until the Max On-Duration  
expires (if not infinite), whichever occurs first. If a max  
on-duration timeout occurs first, the sensor performs a full  
recalibration and the output becomes inactive until the next  
detection.  
After the Max On-Duration interval, the sensor channel will  
once again function normally, even if partially or fully  
obstructed, to the best of its ability given electrode  
conditions. There are three timeout durations available via  
strap option: 10s, 60s, and infinite (disabled) (Table 2-1).  
2.2.2 TOGGLE  
M
ODE  
O
UTPUT  
Max On-Duration works independently per channel; a  
timeout on one channel has no effect on another channel  
except when the AKS feature is impacted on an adjacent  
key. Note also that the timings in Table 2-1 are dependent  
on the oscillator frequency: Doubling the recommended  
frequency will halve the timeouts.  
This makes the sensor respond in an on/off mode like a flip  
flop. It is most useful for controlling power loads, for example  
in kitchen appliances, power tools, light switches, etc.  
Max On-Duration in Toggle mode is fixed at 10 seconds.  
When a timeout occurs, the sensor recalibrates but leaves  
the output state unchanged.  
Infinite timeout is useful in applications where a prolonged  
detection can occur and where the output must reflect the  
detection no matter how long. In infinite timeout mode, the  
designer should take care to be sure that drift in Cs, Cx, and  
Vdd do not cause the device to ‘stick on’ inadvertently even  
when the target object is removed from the sense field.  
2.2.3 OUTPUT  
D
RIVE  
The outputs are active-high and can source 1mA and sink  
5mA of non-inductive current. If inductive loads are used,  
such as small relays, the inductances should be diode  
clamped to prevent damage. When set to operate in a  
proximity mode (at high gain) Out currents should be limited  
to 1mA to prevent gain shifting side effects from occurring,  
which happens when the load current creates voltage drops  
on the die and bonding wires; these small shifts can  
materially influence the signal level to cause detection  
instability as described below.  
The delay timings for max on-duration will increase if the  
total duration of all bursts is greater than 33ms, i.e. an  
average of 5.5ms per channel.  
2.1.4 DETECTION  
I
NTEGRATOR  
It is desirable to suppress detections generated by electrical  
noise or from quick brushes with an object. To accomplish  
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5
QT160/161 1.07/0904  
Care should be taken when the IC and the loads are both  
powered from the same supply, and the supply is minimally  
regulated. The QT160/161 derives its internal references  
from the power supply, and sensitivity shifts can occur with  
changes in Vdd, as happens when loads are switched on.  
This can induce detection ‘cycling’, whereby an object is  
detected, the load is turned on, the supply sags, the  
detection is no longer sensed, the load is turned off, the  
supply rises and the object is reacquired, ad infinitum. To  
prevent this occurrence, the Out pins should only be lightly  
loaded if the device is operated from an unregulated supply,  
e.g. batteries. Detection ‘stiction’, the opposite effect, can  
occur if a load is shed when an Out pin is active.  
Table 2-1 Strap Options  
OPT1  
Gnd  
Vdd  
OPT2  
Max On-Duration  
Vdd  
10s  
60s  
DC Out  
DC Out  
Toggle  
DC Out  
Gnd  
Vdd  
Vdd  
10s  
Gnd  
Gnd  
infinite  
3.2 OPTION STRAPPING  
The option pins OPT1 and OPT2 should never be left  
floating. If they are floated, the device can draw excess  
power and the options will not be properly read.  
The outputs of the IC can directly drive LEDs with series  
resistors. The LEDs should be connected with anodes to the  
outputs and cathodes towards Vss, so that it lights when the  
sensor is active.  
See Table 2-1 for options. Note that the timings shown are  
depend inversely on the oscillator frequency: Doubling the  
recommended frequency will halve the timeouts.  
2.3 AKS™ - Adjacent Key suppression  
The QT160 (not QT161) features adjacent key suppression  
for use in applications where keys are tightly spaced. If keys  
are very close and a large finger touches one key, the keys  
on either side might also activate. AKS stops detections on  
adjacent keys by comparing relative signal levels among  
them and choosing the key with the largest signal strength.  
3.3 POWER SUPPLY, PCB LAYOUT  
The power supply can range from 4.5 to 5.5 volts. If this  
fluctuates slowly with temperature, the QT160/161 will track  
and compensate for these changes automatically with only  
minor changes in sensitivity.  
If the power supply is shared with another electronic system,  
care should be taken to assure that the supply is free of  
digital spikes, sags, and surges which can adversely affect  
the IC. The QT160/161 will track slow changes in Vdd, but it  
can be seriously affected by rapid voltage steps.  
Key number 1 will cause a suppression of keys 6 and 2. Key  
number 2 will cause a suppression of keys 1 and 3. Key 3  
will cause a suppression of keys 2 and 4 and so on.  
When a touch is detected on a key, but just before the  
corresponding OUT pin is activated, a check is made for a  
detection on the adjacent keys. If OUT is active on one or  
both of the adjacent keys, or if a signal of greater strength is  
found on them, the key is suppressed. This means that it is  
not possible to activate both keys 3 and 4 for example; if 4 is  
already on when 3 is touched, key 3 will be suppressed.  
Likewise, if keys 3 and 4 are both touched, but 3 has a  
weaker signal than 4 at the moment the decision is made,  
then only key 4 will detect and 3 will be suppressed. Once  
the detected key is released, the other key is free to detect.  
The supply is best locally regulated using a conventional  
78L05 type regulator, or almost any 3-terminal LDO device  
from 3V to 5V.  
For proper operation a 0.1µF or greater bypass capacitor  
should be used between Vdd and Vss; the bypass cap  
should be placed very close to the device’s power pins.  
3.4 OSCILLATOR  
The oscillator should be a 10MHz resonator with ceramic  
capacitors to ground on each side. 3-pin resonators with  
built-in capacitors designed for the purpose are inexpensive  
and commonly found. Manufacturers include AVX, Murata,  
Panasonic, etc.  
Drift compensation also ceases for the key or keys which  
have been suppressed, so long the signal on it is greater  
than its threshold level.  
This feature is also very effective on water films which bridge  
over adjacent keys. When touching one key a water film will  
‘transport’ the touch to the adjacent keys covered by the  
same film. These side keys will receive less signal strength  
than the key actually being touched, and so they will be  
suppressed even if the signal they are detecting is large  
enough to otherwise cause an output.  
Alternatively an external clock source can be used in lieu of  
a resonator. The OSC_I pin should be connected to the  
external clock, and OSC_O should be left unconnected.  
These ICs are fully synchronous, clocked devices that  
operate all sections from the OSC_I clock. If the frequency of  
OSC_I is changed, all timings will also change in direct  
proportion, from the charge and transfer times to the  
detection response times and the max on-duration timings.  
3 - CIRCUIT GUIDELINES  
3.1 SAMPLE CAPACITOR  
3.5 UNUSED CHANNELS  
Charge sampler caps Cs can be virtually any plastic film or  
low to medium-K ceramic capacitor. The acceptable Cs  
range is from 10nF to 47nF depending on the sensitivity  
required; larger values of Cs demand higher stability to  
ensure reliable sensing. Acceptable capacitor types include  
polyester film, PPS film, or NP0 / C0G ceramic.  
Unused signal channels should not be left open. They  
should have a small value non-critical dummy Cs capacitor  
connected to their SNS pins to allow the internal circuit to  
continue to function properly. A nominal value of 1nF  
(1,000pF) X7R will suffice.  
Unused channels should not have sense traces or  
electrodes connected to them.  
lQ  
6
QT160/161 1.07/0904  
3.6 ESD PROTECTION  
3.7 RFI PROTECTION  
In cases where the electrode is placed behind a dielectric  
panel, the IC will be protected from direct static discharge.  
However even with a panel, transients can still flow into the  
electrodes via induction, or in extreme cases via dielectric  
breakdown. Porous materials may allow a spark to tunnel  
right through the material. Testing is required to reveal any  
problems. The device does have diode protection on its SNS  
pins which absorb and protect the device from most induced  
discharges, up to 20mA; the usefulness of the internal  
clamping will depending on the dielectric properties, panel  
thickness, and rise time of the ESD transients.  
PCB layout, grounding, and the structure of the input circuitry  
have a great bearing on the success of a design that can  
withstand strong RF interference.  
The circuit is remarkably immune to RFI provided that certain  
design rules be adhered to:  
1. Use SMT components to minimize lead lengths.  
2. Always use a ground plane under and around the circuit  
and along the sense lines, that is as unbroken as  
possible except for relief under and beside the sense  
lines to reduce total Cx. Relieved rear ground planes  
should be ‘mended’ by bridging over them at 1cm  
intervals with 0.5mm ‘rungs’ like a ladder.  
In extreme cases ESD dissipation can be aided further with  
added series resistors in line with the electrodes as shown in  
Figure 1-1. Because the charge time is 1.2 µs, the circuit can  
tolerate large values of series-R, up to 20k ohms in cases  
where electrode Cx load is below 10pF. Extra diode  
3. Ground planes should be connected only to a common  
point near the Vss pins of the IC.  
protection at the electrodes can also be used, but this often  
leads to additional RFI problems as the diodes will rectify RF  
signals into DC which will disturb the measurement.  
4. Route sense traces away from other traces or wires that  
are connected to other circuits.  
5. Sense electrodes should be kept away from other  
circuits and grounds which are not directly connected to  
the sensor’s own circuit ground; other grounds will  
appear to float at high frequencies and couple RF  
currents into the sense lines.  
Directly placing semiconductor transient protection devices  
or MOV's on the sense leads is not advised; these devices  
have extremely large amounts of nonlinear parasitic C which  
will swamp the capacitance of the electrode.  
Series-R’s should be low enough to permit at least 6 RC  
time-constants to occur during the charge and transfer  
phases, where R is the added series-R and C is the load Cx.  
6. Keep the 6 Cs sampling capacitors and all series-R  
components close to the IC.  
7. Use a 0.1µF minimum ceramic bypass cap very close to  
the QT160/161 supply pins.  
If the device is connected to an external control circuit via a  
cable or long twisted pair, it is possible for ground-bounce to  
cause damage to the Out pins and/or interfere with key  
sensing. Noise current injection into the power supply is best  
dealt with by shunting the noise aside to chassis ground with  
capacitors, and limited using resistors or ferrites.  
8. Use series-R’s in the sense lines, of as large a value as  
the circuit can tolerate.  
9. Bypass input power to chassis ground and again at  
circuit ground to reduce line-injected noise effects.  
Ferrites over the power wiring may be required to  
attenuate line injected noise.  
Achieving RF immunity mostly requires diligence and a good  
working knowledge of grounding, shielding, and layout  
techniques.  
lQ  
7
QT160/161 1.07/0904  
4.1 ABSOLUTE MAXIMUM SPECIFICATIONS  
Operating temp. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . as designated by suffix  
Storage temp. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55OC to +125OC  
V
DD. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 to +7.0V  
Max continuous pin current, any control or drive pin. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20mꢀ  
Short circuit duration to ground, any pin. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . infinite  
Short circuit duration to VDD, any pin. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . infinite  
Voltage forced onto any pin. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.6V to (Vdd + 0.6) Volts  
4.2 RECOMMENDED OPERATING CONDITIONS  
VDD. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +3.0 to 5.5V  
Operating temperature range, 4.5V - 5.5V (QT160-ꢀS, QT161-ꢀS). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40 - +105C  
Operating temperature range, 3.0V - 4.5V (QT160-ꢀS, QT161-ꢀS). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40 - +85C  
Operating temperature range (QT160-D, QT161-D). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 - +70C  
Operating frequency, 4.5V - 5.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 - 20MHz  
Operating frequency, 3.0V - 5.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 - 10MHz  
Short-term supply ripple+noise. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5mVꢁs  
Long-term supply stability. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100mV  
Cs value. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1nF to 200nF  
Cx value. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 to 100pF  
4.3 AC SPECIFICATIONS Vdd = 5.0, Ta = recommended, Cx = 5pF, Cs = 39nF, Fosc = 10MHz  
Parameter  
Description  
Min  
Typ  
Max  
Units  
Notes  
T
RC  
PC  
Recalibration time  
330  
ms  
µs  
T
Charge duration  
1.2  
1.6  
33  
T
T
T
PT  
BS  
BL  
Transfer duration  
µs  
Burst spacing interval  
Burst duration, each channel  
Burst length, each channel  
Allowable burst duration range  
Response time  
ms  
3
ms  
N
BL  
1,000  
counts  
ms  
TBLMR  
0.1  
5.5  
Before all timings degrade  
T
R
99  
ms  
Including detection integrator  
4.4 DC SPECIFICATIONS  
Vdd = 5.0V, Cs = 39nF, Cx = 5pF, Fosc = 10MHz, Ta = recommended range, unless otherwise noted  
Parameter  
Description  
Supply current  
Min  
Typ  
Max  
Units  
Notes  
IDD  
2.5  
8
mA  
V/s  
V
V
DDS  
Supply turn-on slope  
Low input logic level  
High input logic level  
Low output voltage  
High output voltage  
Input leakage current  
Acquisition resolution  
100  
2
Req’d for startup, w/o reset circuit  
OPT1, OPT2  
V
IL  
0.7  
0.6  
V
HL  
V
OPT1, OPT2  
V
OL  
V
OUTn, 4mA sink  
OUTn, 1mA source  
OPT1, OPT2  
VOH  
Vdd-0.7  
V
I
IL  
1
µA  
bits  
A
R
10  
14  
lQ  
8
QT160/161 1.07/0904  
4.5 SIGNAL PROCESSING  
Description  
Min  
Typ  
Max  
Units  
Notes  
Threshold differential  
6
counts  
counts  
samples  
ms/level  
ms/level  
secs  
Hysteresis  
2
Consensus filter length (Detection integrator)  
Positive drift compensation rate  
Negative drift compensation rate  
Post-detection recalibration timer duration  
3
990  
231  
10, 60, infinite  
Option pin selected  
All curves at Vdd = 5.0V  
Burst Duration vs. Cs, Cx  
Burst Duration vs. Cs, Cx  
4000  
3500  
3000  
2500  
2000  
1500  
1000  
500  
18000  
16000  
14000  
12000  
10000  
8000  
6000  
4000  
2000  
0
Cs = 220nF  
Cs = 100nF  
Cs = 47nF  
Cs = 39nF  
Cs = 22nF  
Cs = 10nF  
Cs = 47nF  
Cs = 39nF  
Cs = 22nF  
Cs = 10nF  
0
0
0
10  
20  
30  
40  
50  
10  
20  
30  
40  
50  
Cx  
Cx  
Figure 4-1  
Figure 4-2  
Burst Duration cs. Cs, Cx  
18000  
16000  
14000  
12000  
10000  
8000  
Cx = 5pF  
Cx = 10pF  
Cx = 15pF  
Cx = 22pF  
Cx = 33pF  
Cx = 47pF  
6000  
4000  
2000  
0
0
50  
100  
150  
200  
250  
Cs, nF  
Figure 4-3  
lQ  
9
QT160/161 1.07/0904  
5 - PACKAGE OUTLINES  
Package type: 28-Pin Dual-In-Line  
Notes  
Millimeters  
Inches  
SYMBOL  
Min  
7.112  
7.874  
34.163  
33.02  
0.584  
0.406  
0.203  
1.016  
2.54  
Max  
7.493  
8.382  
Min  
0.28  
Max  
0.295  
0.33  
1.395  
1.3  
Notes  
a
A
0.31  
M
m
Q
P
35.179  
33.02  
1.22  
1.385  
1.3  
BSC  
BSC  
0.023  
0.016  
0.008  
0.04  
0.048  
0.022  
0.02  
0.065  
0.1  
0.559  
0.508  
1.651  
2.54  
L
4 places  
Typical  
BSC  
4 places  
Typical  
BSC  
L1  
F
0.1  
R
r
3.175  
0.381  
3.175  
3.632  
7.874  
8.128  
0.203  
3.556  
-
0.125  
0.015  
0.125  
0.143  
0.31  
0.14  
-
S
3.683  
3.632  
7.874  
9.906  
0.203  
0.145  
0.18  
0.31  
0.39  
0.013  
S1  
Aa  
x
0.32  
Y
Typical  
0.008  
Typical  
D
L
2a  
W
e
ø
E
M
Base level  
Seating level  
h H  
Package type: 28-pin SSOP  
Millimeters  
Inches  
SYMBOL  
Min  
10.070  
7.650  
5.200  
0.650  
0.250  
0.550  
0.130  
0º  
Max  
10.33  
7.9  
Notes  
Min  
0.396  
0.301  
0.205  
0.026  
0.010  
0.022  
0.005  
0º  
Max  
0.407  
0.311  
0.212  
0.026  
0.015  
0.037  
0.009  
8º  
Notes  
M
W
2a  
D
L
5.38  
0.65  
0.38  
0.95  
0.22  
8º  
E
e
Ø
H
h
1.730  
0.050  
1.99  
0.21  
0.068  
0.002  
0.078  
0.008  
lQ  
10  
QT160/161 1.07/0904  
7 - PIN LISTINGS  
Table 7-1 Pin Descriptions - QT160-D  
Table 7-2 Pin Descriptions - QT160-AS  
Pin  
1
Name  
Vdd  
Vdd  
Function  
Positive power  
Positive power  
Pin  
1
Name  
Vss  
Vss  
Function  
Negative power (Ground)  
Negative power (Ground)  
Positive power  
2
2
3
Vss  
Negative power (Ground)  
Negative power (Ground)  
Negative power (Ground)  
Channel 1 pin A to key  
Channel 1 pin B  
3
Vdd  
4
Vss  
Vss  
4
Vdd  
Positive power  
Channel 1 pin A to key  
Channel 1 pin B  
5
5
SNS1A  
SNS1B  
SNS2A  
SNS2B  
SNS3A  
SNS3B  
SNS4A  
SNS4B  
SNS5A  
Vss  
6
SNS1A  
SNS1B  
SNS2A  
SNS2B  
SNS3A  
SNS3B  
SNS4A  
SNS4B  
SNS5A  
SNS5B  
SNS6A  
SNS6B  
OUT1  
OUT2  
OUT3  
OUT4  
OUT5  
OUT6  
OPT1  
OPT2  
OSC_O  
OSC_I  
/RST  
6
7
7
Channel 2 pin A to key  
Channel 2 pin B  
8
Channel 2 pin A to key  
Channel 2 pin B  
8
9
9
Channel 3 pin A to key  
Channel 3 pin B  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
Channel 3 pin A to key  
Channel 3 pin B  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
Channel 4 pin A to key  
Channel 4 pin B  
Channel 4 pin A to key  
Channel 4 pin B  
Channel 5 pin A to key  
Negative power (Ground)  
Channel 5 sense pin B  
Channel 6 sense pin A to key  
Channel 6 sense pin B  
Detection output 1 (active high)  
Detection output 2 (active high)  
Detection output 3 (active high)  
Detection output 4 (active high)  
Detection output 5 (active high)  
Detection output 6 (active high)  
Option input 1  
Channel 5 pin A to key  
Channel 5 pin B  
SNS5B  
SNS6A  
SNS6B  
OUT1  
OUT2  
OUT3  
OUT4  
OUT5  
OUT6  
OPT1  
OPT2  
OSC_O  
OSC_I  
/RST  
Channel 6 pin A to key  
Channel 6 pin B  
Detection output 1 (active high)  
Detection output 2 (active high)  
Detection output 3 (active high)  
Detection output 4 (active high)  
Detection output 5 (active high)  
Detection output 6 (active high)  
Option input 1  
Option input 2  
Oscillator output  
Oscillator input  
Option input 2  
Oscillator output  
Oscillator input  
Reset / recalibrate (active low)  
Reset / recalibrate (active low)  
8 - ORDERING INFORMATION  
PART  
TEMP RANGE  
PACKAGE  
MARKING  
LEAD-FREE  
QT160-D  
QT160-AS  
QT160-ASG  
QT161-D  
0 - 70C  
-40 - 105C  
-40 - 105C  
0 - 70C  
PDIP-28  
SSOP-28  
SSOP-28  
PDIP-28  
SSOP-28  
QT160  
QT160-A  
QT160-AG  
QT161  
NO  
NO  
YES  
NO  
QT161-AS  
-40 - 105C  
QT161-A  
NO  
lQ  
11  
QT160/161 1.07/0904  
lQ  
Copyright © 2002 QRG Ltd. All rights reserved.  
Patented and patents pending  
Corporate Headquarters  
1 Mitchell Point  
Ensign Way, Hamble SO31 4RF  
Great Britain  
Tel: +44 (0)23 8056 5600 Fax: +44 (0)23 8045 3939  
www.qprox.com  
North America  
651 Holiday Drive Bldg. 5 / 300  
Pittsburgh, PA 15220 USA  
Tel: 412-391-7367 Fax: 412-291-1015  
The specifications set out in this document are subject to change without notice. All products sold and services supplied by QRG are subject  
to our Terms and Conditions of sale and supply of services which are available online at www.qprox.com and are supplied with every order  
acknowledgment. QProx, QTouch, QMatrix, QLevel, and QSlide are trademarks of QRG. QRG products are not suitable for medical  
(including life-saving equipment), safety or mission critical applications or other similar purposes. Except as expressly set out in QRG's  
Terms and Conditions, no licenses to patents or other intellectual property of QRG (express or implied) are granted by QRG in connection  
with the sale of QRG products or provision of QRG services. QRG will not be liable for customer product design and customers are entirely  
responsible for their products and applications which incorporate QRG's products.  
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