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NXPXR70XSS

型号:

NXPXR70XSS

描述:

规格FOR日亚白光LED[ SPECIFICATIONS FOR NICHIA WHITE LED ]

品牌:

NICHIA[ NICHIA CORPORATION ]

页数:

13 页

PDF大小:

426 K

No. STSE-CW5115B  
<Cat.No.070202>  
SPECIFICATIONS FOR NICHIA WHITE LED  
MODEL : NSPWR70ASS  
NICHIA CORPORATION  
Nichia STSE-CW5115B  
<Cat.No.070202>  
1.SPECIFICATIONS  
(1) Absolute Maximum Ratings  
Item  
(Ta=25°C)  
Unit  
mA  
Symbol  
IF  
Absolute Maximum Rating  
Forward Current  
35  
100  
Pulse Forward Current  
Reverse Voltage  
IFP  
mA  
VR  
5
V
Power Dissipation  
Operating Temperature  
Storage Temperature  
Soldering Temperature  
PD  
147  
mW  
°C  
Topr  
Tstg  
Tsld  
-30 ~ + 85  
-40 ~ +100  
°C  
265°C for 5sec.  
<
<
IFP Conditions  
:
Pulse Width 10msec. and Duty 1/10  
=
=
(2) Initial Electrical/Optical Characteristics  
Item Symbol Condition  
Forward Voltage  
(Ta=25°C)  
Typ.  
(3.8)  
-
Max.  
Unit  
V
VF  
IR  
φV  
-
IF=30[mA]  
VR= 5[V]  
4.2  
50  
-
Reverse Current  
Luminous Flux  
µA  
lm  
-
IF=30[mA]  
IF=30[mA]  
IF=30[mA]  
(4.0)  
0.31  
0.32  
½
x
y
-
Chromaticity Coordinate  
-
-
-
½ Please refer to CIE 1931 chromaticity diagram.  
(3) Ranking  
(Ta=25°C)  
Item  
Symbol Condition  
Min.  
4.8  
Max.  
6.8  
Unit  
lm  
Rank Rc  
Rank Rb  
Rank Ra  
φV  
φV  
φV  
IF=30[mA]  
IF=30[mA]  
IF=30[mA]  
Luminous Flux  
3.4  
4.8  
lm  
2.4  
3.4  
lm  
½ Luminous Flux Measurement allowance is ± 10%.  
Color Ranks  
Rank a0  
(IF=30mA,Ta=25°C)  
Rank b3  
x
y
0.280  
0.248  
0.264  
0.267  
0.283  
0.305  
0.296  
0.276  
x
y
0.287  
0.295  
0.283  
0.305  
0.304  
0.330  
0.307  
0.315  
Rank b4  
Rank b5  
x
y
0.307  
0.315  
0.304  
0.330  
0.330  
0.360  
0.330  
0.339  
x
y
0.296  
0.276  
0.287  
0.295  
0.307  
0.315  
0.311  
0.294  
Rank b6  
Rank c0  
x
y
0.311  
0.294  
0.307  
0.315  
0.330  
0.339  
0.330  
0.318  
x
y
0.330  
0.318  
0.330  
0.360  
0.361  
0.385  
0.356  
0.351  
½ Color Coordinates Measurement allowance is ± 0.01.  
-1-  
Nichia STSE-CW5115B  
<Cat.No.070202>  
2.INITIAL OPTICAL/ELECTRICAL CHARACTERISTICS  
Please refer to figure’s page.  
3.OUTLINE DIMENSIONS AND MATERIALS  
Please refer to figure’s page.  
Material as follows ;  
Resin(Mold) :  
Leadframe  
Epoxy Resin (over Silicone Resin + Phosphor)  
Ag plating Copper Alloy  
:
4.PACKAGING  
· The LEDs are packed in cardboard boxes after packaging in stick.  
Please refer to figure’s page.  
The label on the packing unit shows ; Part Number, Lot Number, Ranking, Quantity  
· In order to protect the LEDs from mechanical shock, we pack them in cardboard boxes for transportation.  
· The LEDs may be damaged if the boxes are dropped or receive a strong impact against them,  
so precautions must be taken to prevent any damage.  
· The boxes are not water resistant and therefore must be kept away from water and moisture.  
· When the LEDs are transported, we recommend that you use the same packing method as Nichia.  
5.LOT NUMBER  
The first six digits number shows lot number.  
The lot number is composed of the following characters;  
ꢀꢁꢂꢂꢂ- Uꢃ  
- Year  
( 6 for 2006, 7 for 2007 )  
- Month ( 1 for Jan., 9 for Sep., A for Oct., B for Nov. )  
ꢂꢂꢂꢂ - Nichia's Product Number  
U - Ranking by Color Coordinates  
- Ranking by Luminous Flux  
-2-  
Nichia STSE-CW5115B  
<Cat.No.070202>  
6.RELIABILITY  
(1) TEST ITEMS AND RESULTS  
Standard  
Number of  
Test Item  
Resistance to  
Test Method  
JEITA ED-4701  
300 302  
Test Conditions  
Tsld=260 ± 5°C, 5sec.  
1.6mm from the base of the stopper  
(Pre treatment 30°C,70%,168hrs.)  
Tsld=235 ± 5°C, 5sec.  
(using flux)  
Note  
Damaged  
0/50  
1 time  
Soldering Heat  
Solderability  
JEITA ED-4701  
300 303  
1 time  
0/50  
0/50  
0/50  
0/50  
0/50  
0/50  
0/50  
0/50  
0/50  
0/50  
0/50  
0/50  
0/50  
over 95%  
100 cycles  
Thermal Shock  
JEITA ED-4701  
300 307  
0°C ~ 100°C  
15sec. 15sec.  
Temperature Cycle  
Moisture Resistance Cyclic  
JEITA ED-4701  
100 105  
-40°C ~ 25°C ~ 100°C ~ 25°C  
30min. 5min. 30min. 5min.  
25°C ~ 65°C ~ -10°C  
90%RH 24hrs./1cycle  
Load 5N (0.5kgf)  
100 cycles  
10 cycles  
JEITA ED-4701  
200 203  
Terminal Strength  
(bending test)  
JEITA ED-4701  
400 401  
No noticeable  
damage  
0° ~ 90° ~ 0° bend 2 times  
Load 10N (1kgf)  
Terminal Strength  
(pull test)  
JEITA ED-4701  
400 401  
No noticeable  
damage  
10 ± 1 sec.  
High Temperature Storage  
JEITA ED-4701  
200 201  
Ta=100°C  
1000hrs.  
Temperature Humidity  
Storage  
JEITA ED-4701  
100 103  
Ta=60°C, RH=90%  
Ta=-40°C  
1000hrs.  
1000hrs.  
1000hrs.  
1000hrs.  
500hrs.  
Low Temperature Storage  
JEITA ED-4701  
200 202  
Steady State Operating Life  
Condition 1  
Ta=25°C, IF=35mA  
Ta=35°C, IF=30mA  
60°C, RH=90%, IF=20mA  
Ta=-30°C, IF=30mA  
Steady State Operating Life  
Condition 2  
Steady State Operating Life  
of High Humidity Heat  
Steady State Operating Life  
of Low Temperature  
1000hrs.  
(2) CRITERIA FOR JUDGING DAMAGE  
Criteria for Judgement  
Item  
Forward Voltage  
Reverse Current  
Luminous Flux  
Symbol Test Conditions  
Min.  
Max.  
VF  
IR  
IF=30mA  
VR=5V  
-
U.S.L.*)1.1  
U.S.L.*)2.0  
-
-
φV  
IF=30mA  
L.S.L.**)0.7  
*) U.S.L. : Upper Standard Level  
**) L.S.L. : Lower Standard Level  
-3-  
Nichia STSE-CW5115B  
<Cat.No.070202>  
7.CAUTIONS  
The LEDs are devices which are materialized by combining Blue LEDs and special phosphors.  
Consequently, the color of the LEDs is changed a little by an operating current.  
Care should be taken after due consideration when using LEDs.  
(1) Storage  
· Storage Conditions  
Before opening the package :  
The LEDs should be kept at 30°C or less and 90%RH or less. The LEDs should be used within a  
year.  
When storing the LEDs, moisture proof packaging with absorbent material (silica gel)  
is recommended.  
After opening the package :  
The LEDs should be kept at 30°C or less and 70%RH or less.  
The LEDs should be soldered  
within 168 hours (7days) after opening the package.  
If unused LEDs remain, they should be  
stored in moisture proof packages, such as sealed containers with packages of moisture absorbent  
material (silica gel). It is also recommended to return the LEDs to the original moisture proof bag  
and to reseal the moisture proof bag again.  
· If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage  
time, baking treatment should be performed using the following conditions.  
Baking treatment : more than 24 hours at 85°C  
· Nichia LED leadframes are silver plated copper alloy. The silver surface may be affected by  
environments which contain corrosive substances. Please avoid conditions which may cause the LED  
to corrode, tarnish or discolor. This corrosion or discoloration may cause difficulty during soldering  
operations. It is recommended that the LEDs be used as soon as possible.  
· Please avoid rapid transitions in ambient temperature, especially, in high humidity environments where  
condensation can occur.  
(2) Static Electricity  
· Static electricity or surge voltage damages the LEDs.  
It is recommended that a wrist band or an anti-electrostatic glove be used when handling the LEDs.  
· All devices, equipment and machinery must be properly grounded. It is recommended that precautions  
be taken against surge voltage to the equipment that mounts the LEDs.  
· When inspecting the final products in which LEDs were assembled, it is recommended to check  
whether the assembled LEDs are damaged by static electricity or not.  
It is easy to find  
static-damaged LEDs by a light-on test or a VF test at a lower current (below 1mA is recommended).  
· Damaged LEDs will show some unusual characteristics such as the leak current remarkably  
increases, the forward voltage becomes lower, or the LEDs do not light at the low current.  
Criteria : (VF > 2.0V at IF=0.5mA)  
-4-  
Nichia STSE-CW5115B  
<Cat.No.070202>  
(3) Soldering Conditions  
· Nichia LEDs uses a copper alloy lead frame which provides a high thermal conductivity.  
stress such as soldering heat may reduce the reliability of the product; particular caution should be  
Thermal  
used to avoid damage prior to and during soldering.  
listed in the following table.  
The recommended soldering conditions are  
· Solder the LED no closer than 1.6mm from the base of the stopper.  
· The mechanical stress by clinching will cause degradation of the reliability on the LEDs. It is  
important to minimize the mechanical stress on the LEDs.  
that it will not cause any problem when using it.  
· Recommended soldering conditions  
Dip Soldering  
It should be confirmed beforehand  
Hand Soldering  
Pre-Heat  
120°C Max.  
Temperature  
350°C Max.  
Pre-Heat Time  
Solder Bath  
Temperature  
Dipping Time  
60 seconds Max.  
260°C Max.  
Soldering Time  
Position  
3 seconds Max.  
No closer than 1.6 mm from the  
base of the stopper.  
5 seconds Max.  
Dipping Position No lower than 1.6 mm from the  
base of the stopper.  
· Although the recommended soldering conditions are specified in the above table, dip or hand  
soldering at the lowest possible temperature is desirable for the LEDs.  
· A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature.  
· Dip soldering should not be done more than one time.  
· Hand soldering should not be done more than one time.  
· Do not apply any stress to the lead particularly when heated.  
· The LEDs must not be repositioned after soldering.  
· After soldering the LEDs, the epoxy bulb should be protected from mechanical shock or vibration until  
the LEDs return to room temperature.  
· Direct soldering onto a PC board should be avoided.  
from warping of the PC board or from the clinching and cutting of the leadframes.  
absolutely necessary, the LEDs may be mounted in this fashion but the User will assume responsibility  
for any problems. Direct soldering should only be done after testing has confirmed that no damage,  
such as wire bond failure or resin deterioration, will occur. Nichia’s LEDs should not be soldered  
Mechanical stress to the resin may be caused  
When it is  
directly to double sided PC boards because the heat will deteriorate the epoxy resin.  
· When it is necessary to clamp the LEDs to prevent soldering failure, it is important to minimize  
the mechanical stress on the LEDs.  
· Cut the LED leadframes at room temperature.  
cause failure of the LEDs.  
Cutting the leadframes at high temperatures may  
(4) Heat Generation  
· Thermal design of the end product is of paramount importance.  
Please consider the heat generation  
of the LED when making the system design. The coefficient of temperature increase per input  
electric power is affected by the thermal resistance of the circuit board and density of LED  
placement on the board, as well as other components. It is necessary to avoid intense heat generation  
and operate within the maximum ratings given in this specification.  
· The operating current should be decided after considering the ambient maximum temperature of LEDs.  
-5-  
Nichia STSE-CW5115B  
<Cat.No.070202>  
(5) Cleaning  
· It is recommended that isopropyl alcohol be used as a solvent for cleaning the LEDs. When using  
other solvents, it should be confirmed beforehand whether the solvents will dissolve the resin or not.  
Freon solvents should not be used to clean the LEDs because of worldwide regulations.  
· Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence of ultrasonic  
cleaning on the LEDs depends on factors such as ultrasonic power and the assembled condition.  
Before cleaning, a pre-test should be done to confirm whether any damage to the LEDs will occur.  
(6) Safety Guideline for Human Eyes  
· In 1993, the International Electric Committee (IEC) issued a standard concerning laser product safety  
(IEC 825-1). Since then, this standard has been applied for diffused light sources (LEDs) as well  
as lasers.  
In 1998 IEC 60825-1 Edition 1.1 evaluated the magnitude of the light source.  
In 2001 IEC 60825-1 Amendment 2 converted the laser class into 7 classes for end products.  
Components are excluded from this system. Products which contain visible LEDs are now classified  
as class 1. Products containing UV LEDs are class 1M. Products containing LEDs can be classified  
as class 2 in cases where viewing angles are narrow, optical manipulation intensifies the light, and/or the  
energy emitted is high. For these systems it is recommended to avoid long term exposure.  
It is also recommended to follow the IEC regulations regarding safety and labeling of products.  
(7) Others  
· NSPWR70AS complies with RoHS Directive.  
· Care must be taken to ensure that the reverse voltage will not exceed the absolute maximum rating  
when using the LEDs with matrix drive.  
· Flashing lights have been known to cause discomfort in people; you can prevent this by taking  
precautions during use.  
incorporated into it.  
Also, people should be cautious when using equipment that has had LEDs  
· The LEDs described in this brochure are intended to be used for ordinary electronic equipment (such  
as office equipment, communications equipment, measurement instruments and household appliances).  
Consult Nichia’s sales staff in advance for information on the applications in which exceptional quality  
and reliability are required, particularly when the failure or malfunction of the LEDs may directly  
jeopardize life or health (such as for airplanes, aerospace, submersible repeaters, nuclear reactor  
control systems, automobiles, traffic control equipment, life support systems and safety devices).  
· User shall not reverse engineer by disassembling or analysis of the LEDs without having prior written  
consent from Nichia.  
When defective LEDs are found, the User shall inform Nichia directly before  
disassembling or analysis.  
· The formal specifications must be exchanged and signed by both parties before large volume purchase begins.  
· The appearance and specifications of the product may be modified for improvement without notice.  
-6-  
Nichia STSE-CW5115B  
<Cat.No.070202>  
ICI Chromaticity Diagram  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
520  
530  
540  
510  
500  
550  
560  
570  
580  
590  
600  
b4  
c0  
610  
620  
b3  
a0  
b6  
b5  
490  
630  
480  
470  
460  
0.1  
0.2  
0.3  
0.4  
x
0.5  
0.6  
0.7  
0.8  
0
½ Color Coordinates Measurement allowance is ± 0.01.  
-7-  
Forward Voltage vs.  
Forward Current vs.  
Duty Ratio vs.  
Forward Current  
Relative Luminous Flux  
Allowable Forward Current  
3.0  
200  
200  
Ta=25°C  
Ta=25°C  
Ta=25°C  
100  
50  
2.5  
100  
2.0  
1.5  
1.0  
0.5  
0
20  
10  
5
50  
30  
20  
1
10  
2.5 3.0 3.5 4.0 4.5 5.0  
Forward Voltage VF (V)  
0
20 40 60 80 100 120  
Forward Current IFP (mA)  
1
5
10 20  
50 100  
Duty Ratio (%)  
Ambient Temperature vs.  
Ambient Temperature vs.  
Ambient Temperature vs.  
Forward Voltage  
Relative Luminous Flux  
Allowable Forward Current  
5.4  
2.0  
50  
40  
30  
20  
IFP=30mA  
IFP=30mA  
5.0  
4.6  
4.2  
3.8  
3.4  
3.0  
2.6  
1.0  
0.5  
10  
9
0.2  
0
-40 -20  
0
20 40 60 80 100  
Ambient Temperature Ta (°C)  
-40 -20  
0
20 40 60 80 100  
Ambient Temperature Ta (°C)  
0
20  
40  
60  
80 100  
Ambient Temperature Ta (°C)  
Model  
NSPWR70AS  
Title CHARACTERISTICS  
NICHIA CORPORATION  
No.  
051208543122  
Forward Current vs.  
Spectrum  
Chromaticity Coordinate  
0.35  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0
Ta=25°C  
Ta=25°C  
IF=30mA  
0.34  
0.33  
0.32  
0.31  
0.30  
1mA  
5mA  
30mA  
50mA  
100mA  
0.29 0.30 0.31 0.32 0.33 0.34  
350  
450  
550  
650  
750  
0°  
Wavelength λ (nm)  
x
Ambient Temperature vs.  
Directivity  
Chromaticity Coordinate  
10°  
1.0  
20°  
0.35  
30°  
Ta=25°C  
IFP=30mA  
40°  
IFP=30mA  
0.34  
50°  
0.33  
60°  
70°  
80°  
90°  
-30°C  
0°C  
0.5  
0.32  
0.31  
0.30  
25°C  
50°C  
85°C  
0
0.29 0.30 0.31 0.32 0.33 0.34  
90°  
60°  
30°  
0°  
0.5  
1.0  
Radiation Angle  
x
Model  
NSPWR70AS  
Title CHARACTERISTICS  
NICHIA CORPORATION  
No.  
050725543131  
7.62 ± 0.5  
7.5 ± 0.5  
4.4  
Internal Circuit  
φ 3  
0.5  
3
2
3A  
2A  
4K  
1K  
4
R 0.69  
1
(C 1.25) 1 Pin Mark  
(5°)  
Stopper  
0.4 ± 0.1  
0.5  
5.08 ± 0.3  
ITEM  
RESIN  
LEAD FRAME  
Remark:  
MATERIALS  
Epoxy Resin  
(over Silicone Resin + Phosphor)  
Ag Plating Copper Alloy  
Unit  
mm  
Model  
NSPWR70AS  
Please note that the bare copper alloy showing at the cut end  
of the lead frame may be corroded under certain conditions.  
LEDs have some sharp edges and points, particularly lead  
frames. Please handle with care so as to avoid injuries.  
5/1  
Title  
No.  
OUTLINE DIMENSIONS  
NICHIA CORPORATION  
Scale  
Allow  
050725543331  
±0.2  
Cross Sectional image of stick  
5.4  
½1 t = 0.6 ± 0.1mm  
½2 Warp : 1mm Max.  
3
9.6  
Whole image of stick  
485 ± 1  
Cap  
NICHIA  
>PC< CAUTION TO ELECTROSTATIC DAMAGE 静電気に注意  
60pcs / stick  
A
K
Unit  
mm  
NxPxR70xSS  
Model  
Title  
STICK DIMENSIONS  
NICHIA CORPORATION  
Scale  
Allow  
±0.2  
No.  
061117436073  
Nichia STSE-CW5115B  
<Cat.No.070202>  
The stick and moisture absorbent material are put in the moisture proof foil bag  
and then heat sealed.  
Stick  
Moisture  
absorbent material  
Label  
Moisture proof foil bag  
NICHIA  
XXXX LED  
TYPE  
LOT  
QTY  
NxPxR70xSS  
xxxxxx-U„  
PCS  
Seal  
NICHIA CORPORATION  
491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN  
Label  
NICHIA  
XXXX LED  
TYPE  
RANK  
QTY  
NxPxR70xSS  
U„  
PCS  
NICHIA CORPORATION  
491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN  
Empty space in the box is filled  
with cushion material.  
Packing unit  
Stick/bag  
Quantity/bag (pcs)  
600 MAX.  
Moisture proof foil bag  
10 stick Max.  
Cardboard box  
Cardboard box M  
Cardboard box 1/2L  
Cardboard box L  
Dimensions (mm)  
Stick/box  
Quantity/box (pcs)  
6,000 MAX.  
590¯277¯120¯4t 100 stick MAX.  
613¯298¯268¯7t 200 stick MAX.  
613¯298¯518¯7t 400 stick MAX.  
12,000 MAX.  
24,000 MAX.  
Model  
Title  
NxPxR70xSS  
PACKING  
NICHIA CORPORATION  
No.  
061117436084  
-12-  
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