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LZ34B1B

型号:

LZ34B1B

描述:

四分之一型彩色CMOS图像与350的k个像素传感器[ 1/4-type Color CMOS Image Sensor with 350 k Pixels ]

品牌:

SHARP[ SHARP ELECTRIONIC COMPONENTS ]

页数:

15 页

PDF大小:

144 K

BACK  
LZ34B1B  
1/4-type Color CMOS Image Sensor with  
350 k Pixels  
LZ34B1B  
DESCRIPTION  
PIN CONNECTIONS  
The LZ34B1B is a 1/4-type (4.5 mm) solid-state  
color image sensor that consists of PN photo-  
diodes and CMOS (Complementary Metal Oxide  
Semiconductor) devices. The sensor further  
includes a timing generator (TG), a correlated  
double sampling (CDS) circuit, an auto gain control  
(AGC) circuit and an analog-to-digital converter  
(ADC) circuit. With approximately 350 000 pixels  
(703 horizontal x 499 vertical), the sensor provides  
a stable digital color image with extremely low  
power consumption.  
36-PIN LCC  
TOP VIEW  
27 SDI  
26 VD  
25 HD  
24 CLK  
23 D7  
22 D6  
21 D5  
20 D4  
19 D3  
BIAS1  
AGCOUT  
AGND  
AVDD  
1
2
3
4
5
6
7
8
9
OFS  
ADL  
ADH  
FEATURES  
• Progressive scan  
NC  
STBY  
• Square pixel  
• Compatible with VGA standard  
• Number of image pixels : 655 (H) x 493 (V)  
• Number of optical black pixels  
– Horizontal : 24 front and 24 rear  
– Vertical : 3 front and 3 rear  
• Pixel pitch : 5.6 µm (H) x 5.6 µm (V)  
• R, G, and B primary color mosaic filters  
• Image inversion function (horizontally and/or  
vertically)  
(N-LCC036-S425B)  
PRECAUTIONS  
• Refer to "PRECAUTIONS FOR CMOS IMAGE  
SENSORS".  
• Available for two types of power save mode  
– AGC and AD circuits become power-off with  
serial data  
– All circuits become power-off with STBY pin  
• Monitoring mode  
• Analog output and 8-bit digital output  
• Variable gain control (3 to 30 dB)  
• Variable electronic focal plane shutter (1/15 to  
1/7 875 s)  
• Single +2.8 V power supply  
• Package : 36-pin LCC* (N-LCC036-S425B)  
* Leadless Chip Carrier  
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in  
catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.  
1
LZ34B1B  
BLOCK DIAGRAM  
HD, VD  
CLK  
AGC  
CONTROL  
8-BIT  
D/A  
TG  
DATA  
8-BIT  
A/D  
DIGITAL  
VIDEO OUT  
CMOS  
AGC  
IMAGE  
SENSOR  
AGC OUT  
ANALOG  
VIDEO OUT  
2
LZ34B1B  
PIN DESCRIPTION  
PIN NO. SYMBOL  
I/O  
O
I
A/D  
DESCRIPTION  
1
2
3
4
5
6
7
8
9
BIAS1  
AGCOUT  
AGND  
AVDD  
OFS  
Analog Analog bias voltage 1 for image sensor  
Analog AGC output  
Analog Analog ground  
Analog Analog power supply  
Analog Offset bias voltage for AGC output  
Analog Bottom ADC reference voltage  
Analog Top ADC reference voltage  
ADL  
ADH  
NC  
No connection  
Standby control mode*  
STBY  
Digital  
10 AGND  
11 AVDD  
12 DGND  
13 DVDD  
14 CKI  
15 CKO  
16 D0  
I
Analog Analog ground  
Analog Analog power supply  
Digital Digital ground  
Digital Digital power supply  
Digital Clock input for oscillator (12.27 MHz)  
Digital Clock output for oscillator  
Digital ADC signal output (LSB)  
Digital ADC signal output  
O
O
O
O
O
O
O
O
O
O
I
17 D1  
18 D2  
Digital ADC signal output  
19 D3  
Digital ADC signal output  
20 D4  
Digital ADC signal output  
21 D5  
Digital ADC signal output  
22 D6  
Digital ADC signal output  
23 D7  
Digital ADC signal output (MSB)  
Digital Clock output (6.135 MHz)  
Digital Horizontal drive pulse input  
Digital Vertical drive pulse input  
Digital Control data input (AGC gain, offset, shutter control,  
image inversion, etc.)  
24 CLK  
25 HD  
26 VD  
27 SDI  
I
I
28 SCLK  
29 LOAD  
30 CLP2  
31 CLP1  
32 SIGOUT  
33 SIGIN  
34 BIAS2  
35 REFIN  
36 NC  
I
I
Digital Shift clock for data  
Digital Load pulse for data input  
Analog Analog bias voltage 2 for clamp circuit  
Analog Analog bias voltage 1 for clamp circuit  
Analog Analog image signal output  
Analog Analog image signal input  
Analog Analog bias voltage 2 for image sensor  
Analog Reference voltage for analog input  
O
I
I
No connection  
* Standby mode functions  
High level : Standby mode (all circuits power-off), Low level or open : Normal mode (all circuits active)  
3
LZ34B1B  
ABSOLUTE MAXIMUM RATINGS  
(TA = +25 ˚C)  
PARAMETER  
Power supply voltage  
Input signal voltage  
Storage temperature  
SYMBOL  
RATING  
UNIT  
VDD  
–0.3 to +4.6  
V
VØ  
–0.3 to VDD + 0.3  
–40 to +80  
V
TSTG  
˚C  
RECOMMENDED OPERATING CONDITIONS  
PARAMETER  
Power supply voltage  
Operating temperature  
SYMBOL MIN.  
TYP. MAX. UNIT NOTE  
VDD  
2.6  
2.8  
3.0  
V
TOPR  
–20  
+25  
+50  
˚C  
Oscillation  
frequency  
Normal mode  
FCK  
12.27  
MHz  
Monitoring mode  
LOW level  
HIGH level  
VØL  
VØH  
0
0.2VDD  
VDD  
V
V
Digital input voltage  
Analog input voltage  
1
2
3
0.8VDD  
(Connect to pin  
through a capacitor)  
(Connect to GND  
Analog bias voltage  
through a capacitor)  
NOTES :  
1. Applied to input pins STBY, HD, VD, SDI, SCLK and LOAD.  
2. Applied to input pins SIGIN and REFIN. Do not connect to DC directly.  
3. Applied to pins BIAS1, BIAS2, OFS, ADL, ADH, CLP1 and CLP2.  
Do not connect to GND directly.  
4
LZ34B1B  
CHARACTERISTICS (1/15 s progressive scan readout mode)  
(TA = +25˚C, Operating conditions : The typical values specified in "RECOMMENDED OPERATING CONDITIONS"  
.
Color temperature of light source : 3 200 K, IR cut-off filter (CM-500, 1mmt) is used.)  
• Measurement point : Analog image signal output (pin No.32), before AGC circuit and AD converter.  
PARAMETER  
Standard output voltage  
Photo response non-uniformity  
Saturation output voltage  
Dark output voltage  
SYMBOL  
VO  
MIN.  
TYP.  
MAX.  
14  
UNIT  
mV  
NOTE  
150  
1
2
3
4
5
6
7
8
PRNU  
VSAT  
%
400  
150  
700  
2
mV  
VDARK  
R (G)  
IVDD  
3
mV  
Sensitivity (Green channel)  
Supply current  
250  
13  
1
mV  
mA  
Standby current  
ISTBY  
VFPN  
10  
µA  
Vertical line fixed pattern noise  
0.5  
1.1  
mVp-p  
NOTES :  
1. The average output voltage of G signal under uniform  
illumination. The standard exposure conditions are  
defined as when VO is 150 mV.  
5. The average output voltage of G signal when a 500 lux  
light source with a 90% reflector is imaged by a lens of  
F4, F50 mm.  
2. The image area is divided into 10 x 10 segments under  
the standard exposure conditions. Each segment's  
voltage is the average output voltage of all pixels within  
the segment. PRNU is defined by (Vmax – Vmin)/VO,  
where Vmax and Vmin are the maximum and minimum  
values of each segment's voltage respectively.  
6. Total current of analog and digital power supplies, in the  
dark and at the standard load conditions.  
7. Total current of power supply in standby mode. (Pin  
No.9 (STBY) is fixed to "H" level and other input pins are  
fixed to "H" level or "L" level.)  
8. One mean horizontal line signal <bi> is obtained by  
adding all the horizontal line signals <aij> vertically and  
dividing them by the line number. <xi> is the deviation of  
the center pixel from the average of successive 5 pixels  
in <bi>. VFPN is the maximum absolute value of <xi>.  
3. The image area is divided into 10 x 10 segments. Each  
segment's voltage is the average output voltage of all  
pixels within the segment. VSAT is the minimum  
segment's voltage under 10 times exposure of the  
standard exposure conditions.  
4. The difference between average output voltage of the  
image area and that of the OB area, under non-  
exposure conditions.  
5
LZ34B1B  
PIXEL STRUCTURE  
OPTICAL BLACK  
(3 PIXELS)  
OPTICAL BLACK  
(24 PIXELS)  
OPTICAL BLACK  
(24 PIXELS)  
655 (H) x 493 (V)  
1 pin  
OPTICAL BLACK  
(3 PIXELS)  
COLOR FILTER ARRAY  
(1, 493)  
(655, 493)  
R
G
R
G
R
G
G
B
G
B
G
B
R
G
R
G
R
G
G
B
G
B
G
B
R
G
R
G
R
G
R
G
R
G
R
G
G
B
G
B
G
B
R
G
R
G
R
G
G
B
G
B
G
B
R
G
R
G
R
G
G
B
G
B
G
B
G
G
R
G
R
G
R
B
G
B
G
B
G
G
R
G
R
G
R
G
R
G
R
G
R
B
G
B
G
B
G
G
R
G
R
G
R
B
G
B
G
B
G
G
R
G
R
G
R
R
G
R
G
R
(1, 1)  
(655, 1)  
6
LZ34B1B  
TIMING CHART  
[Normal Mode]  
HORIZONTAL PULSE TIMING  
HD  
776 780  
012  
4
8
12 16 20 24 28 32 36 40 44 48 52 56 60 64 68 72 76 80 84 88 92  
CLK  
Normal  
Mirror  
ADOUT  
(D0-D7)  
645 650 655OB  
OB  
OB  
πππππππππππππππ  
1OB  
πππππππππππππππ  
10  
5
HD  
74 78 82 86 90 94 98 102 106 110 114 118 122 126 130 134 138 142 146 150 154 158 162 166 170  
CLK  
Normal  
Mirror  
ADOUT  
(D0-D7)  
OBππππππππππππππ OB 1  
5
10  
15  
20  
25  
30  
35  
40  
OBππππππππππππππ OB655 650 645 640 635 630 625 620 615  
• The rising edge of the HD pulse must be between two rising edges of CLK (0) and CLK (1).  
• The falling edge of the HD pulse must be between two rising edges of CLK (78) and CLK (79).  
PHASE RELATIONS BETWEEN DIGITAL OUTPUT (ADOUT) AND CLOCK (CLK)  
CLK  
SYMBOL MIN. TYP. MAX. UNIT  
∆t  
∆t  
45  
ns  
ADOUT  
(D0-D7)  
SDI, SCLK, LOAD  
Forbidden Period  
VERTICAL PULSE TIMING  
VD  
HD  
523 524 525  
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39  
Normal  
Mirror  
ADOUT  
(D0-D7)  
492 493 OB OB OB  
OB OB OB  
1
2
3
4
5
6
7
2
1
OB OB OB  
OB OB OB 493 492 491 490 489 488 487  
• The rising edge and falling edge of the VD pulse must be in high period of the HD pulses.  
SERIAL DATA TIMING (SDI, SCLK, LOAD)  
Fixed  
Gain  
Offset  
AGC  
Shutter  
D0  
D10  
D20  
D30  
D37  
SDI  
SCLK  
LOAD  
• Data in SDI are taken at the rising edge of SCLK.  
• Clock frequency of SCLK should be less than 1/2 of that of CLK.  
• Do not insert the SDI, SCLK and LOAD pulses between 28H* and 29H*. Refer to "VERTICAL PULSE TIMING".  
• Refer to "SERIAL DATA INPUTS" for the contents of serial data from D0 to D37.  
* It means ordinal number of the HD pulse.  
7
LZ34B1B  
[Monitoring Mode]  
HORIZONTAL PULSE TIMING  
HD  
776 780  
012  
4
8
12 16 20 24 28 32 36 40 44 48 52 56 60 64 68 72 76 80 84 88 92  
CLK  
Normal  
Mirror  
ADOUT  
(D0-D7)  
645 650 655OB  
OB  
OB  
ππππππππππππππ  
1OB  
ππππππππππππππ  
10  
5
HD  
74 78 82 86 90 94 98 102 106 110 114 118 122 126 130 134 138 142 146 150 154 158 162 166 170  
CLK  
Normal  
Mirror  
ADOUT  
(D0-D7)  
OBππππππππππππππ OB 1  
5
10  
15  
20  
25  
30  
35  
40  
OBππππππππππππππ OB655 650 645 640 635 630 625 620 615  
• The rising edge of the HD pulse must be between two rising edges of CLK (0) and CLK (1).  
• The falling edge of the HD pulse must be between two rising edges of CLK (78) and CLK (79).  
PHASE RELATIONS BETWEEN DIGITAL OUTPUT (ADOUT) AND CLOCK (CLK)  
CLK  
SYMBOL MIN. TYP. MAX. UNIT  
∆t  
∆t  
45  
ns  
ADOUT  
(D0-D7)  
VERTICAL PULSE TIMING  
SDI, SCLK, LOAD Forbidden Period  
VD  
HD  
260 261 262  
1
2
3
4
5
6
7
8
9
10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38  
Normal  
Mirror  
ADOUT  
(D0-D7)  
486 489 490 493 OB  
OB  
1
2
5
6
9 10 13 14 17 18 21 22 25 26 29 30 33 34 37 38 41 42  
8
5
4
1
OB  
OB 493 492 489 488 485 484 481 480 477 476 473 472 469 468 465 464 461 460 457 456 453 452  
• The rising edge and falling edge of the VD pulse must be in high period of the HD pulses.  
SERIAL DATA TIMING (SDI, SCLK, LOAD)  
Fixed  
Gain  
Offset  
AGC  
Shutter  
D0  
D10  
D20  
D30  
D37  
SDI  
SCLK  
LOAD  
• Data in SDI are taken at the rising edge of SCLK.  
• Clock frequency of SCLK should be less than 1/2 of that of CLK.  
• Do not insert the SDI, SCLK and LOAD pulses between 15H* and 16H*. Refer to "VERTICAL PULSE TIMING".  
• Refer to "SERIAL DATA INPUTS" for the contents of serial data from D0 to D37.  
* It means ordinal number of the HD pulse.  
8
LZ34B1B  
SERIAL DATA INPUTS  
DATA  
NAME  
FUNCTION  
D0  
AGC6 (MSB)  
AGC5  
Auto gain control  
(0 to 20 dB)  
D1  
D2  
AGC4  
D3  
AGC3  
D4  
AGC2  
D5  
AGC1  
D6  
AGC0 (LSB)  
D7  
Not used. (Fix to low level.)  
Selection of fixed gain  
(3 to 10 dB)  
D8  
MAX2 (MSB)  
MAX1  
D9  
D10  
D11  
D12  
D13  
D14  
D15  
D16  
D17  
D18  
D19  
D20  
D21  
D22  
D23  
D24  
D25  
D26  
D27  
D28  
D29  
D30  
D31  
D32  
D33  
D34  
D35  
MAX0 (LSB)  
OFS7 (MSB)  
OFS6  
Offset level control of ADC  
(0.9 to 1.5 V)  
OFS5  
OFS4  
OFS3  
OFS2  
OFS1  
OFS0 (LSB)  
SHT9 (MSB)  
SHT8  
Shutter speed control  
(Normal mode : Exposure time is 1 to 1/525 frame period.)  
(Monitoring mode : Exposure time is 1 to 1/262 frame period.)  
SHT7  
SHT6  
SHT5  
SHT4  
SHT3  
SHT2  
SHT1  
SHT0 (LSB)  
MIRH  
H : Horizontal mirror inversion image, L : Normal image  
H : Vertical mirror inversion image, L : Normal image  
H : Monitoring mode, L : Normal mode  
MIRV  
MON  
SAD2 (MSB)  
SAD1  
Phase selection of AD clock  
D32/D33/D34 = L/L/L : –30˚  
D32/D33/D34 = L/L/H : –15˚  
D32/D33/D34 = L/H/H : +15˚  
SAD0 (LSB)  
LPMD1  
LPMD0  
D32/D33/D34 = L/H/L :  
Power save mode  
0˚  
D35/D36 = L/L : Normal mode D35/D36 = L/H : AD and AGC off  
D35/D36 = H/L : AD off D35/D36 = H/H : Inhibited mode  
D36  
D37  
USB  
H : Inhibited mode, L : Normal mode  
9
LZ34B1B  
Setting of Auto Gain Control  
• One LSB of the gain code represents approximately 0.156 dB.  
• Nominal gain values at typical codes are shown below.  
AUTO GAIN CONTROL  
D0  
D1  
D2  
D3  
D4  
D5  
D6  
(dB)  
0
L
L
L
L
L
L
L
L
L
H
H
L
L
H
L
L
L
1
2
L
L
L
H
L
H
H
H
L
3
L
L
H
H
L
H
L
4
L
L
H
L
L
5
L
H
H
H
H
H
L
L
L
6
L
L
L
H
H
L
H
L
L
7
L
L
H
L
L
8
L
H
H
L
H
L
H
H
L
9
L
H
L
L
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
H
H
H
H
H
H
H
H
H
H
H
L
L
L
L
L
H
H
L
H
L
L
L
L
H
L
L
L
H
H
H
L
H
L
H
H
H
L
L
H
H
L
L
L
H
H
H
L
H
H
L
H
H
H
H
H
L
H
L
L
H
H
H
H
L
H
H
H
H
H
L
H
H
Setting of Fixed Gain  
• One LSB of the gain code represents 1 dB.  
FIXED GAIN  
D8  
D9  
D10  
(dB)  
3
L
L
L
L
L
H
L
4
5
L
H
H
L
6
L
H
L
7
H
H
H
H
8
L
H
L
9
H
H
10  
H
10  
LZ34B1B  
Setting of Offset Level  
• One LSB of the offset code represents approximately 0.002 V.  
• Nominal offset values at typical codes are shown below.  
OFFSET LEVEL (V)  
D11  
L
D12  
L
D13  
L
D14  
L
D15  
L
D16  
L
D17  
L
D18  
L
0.9  
1.0  
1.1  
1.2  
1.3  
1.4  
1.5  
L
L
H
L
L
H
L
L
H
L
H
H
L
L
H
L
H
L
H
L
H
H
H
H
L
L
L
L
H
L
L
H
L
L
H
L
L
H
H
H
H
H
H
H
H
H
H
H
Setting of Shutter Speed  
• One LSB of the shutter speed code represents 1H, where 1H is the HD pulse period.  
• Shutter speed values at typical codes are shown below in normal mode, monitoring mode and USB mode.  
SHUTTER SPEED  
(Exposure Time Unit : H)  
D19  
D20  
D21  
D22  
D23  
D24  
D25  
D26  
D27  
D28  
Normal  
Monitoring  
525  
262  
L
L
L
L
L
L
L
L
L
L
265  
264  
263  
2
L
L
L
H
H
H
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
H
H
H
L
L
L
H
L
1
262  
H
27  
26  
25  
262  
262  
262  
L
L
L
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
L
L
L
L
L
H
H
L
L
H
L
H
2
262  
262  
262  
H
H
H
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
H
H
H
L
H
H
H
L
L
H
L
1
525  
H
525  
262  
H
H
H
H
H
H
H
H
H
H
Setting of Driving Modes  
FUNCTION  
D31  
D37  
Normal mode  
L
L
L
Monitoring mode  
H
11  
LZ34B1B  
EXAMPLE OF OPERATION CIRCUIT  
D3  
D4  
STBY  
NC  
D5  
ADH  
D6  
ADL  
D7  
OFS  
CLK  
HD  
VD  
SDI  
AVDD  
AGND  
AGCOUT  
BIAS1  
+
10 µF  
12  
LZ34B1B  
PACKAGE OUTLINES  
36 LCC (N-LCC036-S425B)  
(Unit : mm)  
Center of effective  
imaging area  
TYP.  
28  
R±.ꢀ5  
±±.ꢀ  
TYP.  
9.8  
(◊2)  
±.7  
TYP.  
±.4  
ꢀ9  
27  
27  
ꢀ9  
28  
ꢁ6  
ꢀ8  
ꢀ±  
ꢀ8  
ꢀ±  
¬
A
A'  
Index mark  
ꢁ6  
±±.ꢀ2  
TYP.  
R±.4  
ꢀ.2  
9
9
CCeenntteerr ooff ddiiee.  
±±.ꢁ5  
±.5  
±±.2  
ꢀ.9  
TYP.  
TYP.  
±.6  
P-ꢀ.±  
±±.±75  
5.4  
TYP.  
±.ꢀ  
Refractivea index : nd = ꢀ.5  
MAX.  
Rotation error of die : ¬ ꢀ.5˚  
(◊ꢀ : Effective imaging area)  
(◊2 : Lid' size)  
±.±4  
(◊ꢀ)  
A
Glass Lid  
A'  
Package  
±.±4  
(◊ꢀ)  
CMOS  
13  
LZ34B1B  
2) When directly handling the device with the  
fingers, hold the part without pins and do not  
touch any pin.  
PRECAUTIONS FOR CMOS IMAGE SENSORS  
1. Package Breakage  
3) To avoid generating static electricity,  
a. do not scrub the glass surface with cloth or  
plastic.  
In order to prevent the package from being broken,  
observe the following instructions :  
1) The CMOS image sensor is a precise optical  
component and the package material is  
ceramic.  
b. do not attach any tape or labels.  
c. do not clean the glass surface with dust-  
cleaning tape.  
Therefore,  
4) When storing or transporting the device, put it in  
a container of conductive material.  
ø Take care not to drop the device when  
mounting, handling, or transporting.  
ø Avoid giving a shock to the package.  
Especially when pins are fixed to the socket  
or the circuit board, small shock could break  
the package more easily than when the  
package isn’t fixed.  
3. Dust and Contamination  
Dust or contamination on the glass surface could  
deteriorate the output characteristics or cause a  
scar. In order to minimize dust or contamination on  
the glass surface, take the following precautions :  
1) Handle the CMOS image sensor in a clean  
environment such as a cleaned booth. (The  
cleanliness level should be, if possible, class  
1 000 at least.)  
2) When mounting the package on the housing,  
be sure that the package is not bent.  
– If a bent package is forced into place  
between a hard plate or the like, the pack-  
age may be broken.  
2) Do not touch the glass surface with the fingers.  
If dust or contamination gets on the glass  
surface, the following cleaning method is  
recommended :  
3) If any damage or breakage occurs on the sur-  
face of the glass cap, its characteristics could  
deteriorate.  
Therefore,  
ø Dust from static electricity should be blown  
off with an ionized air blower. For anti-  
electrostatic measures, however, ground all  
the pins on the device before blowing off the  
dust.  
ø Do not hit the glass cap.  
ø Do not give a shock large enough to cause  
distortion.  
ø Do not scrub or scratch the glass surface.  
– Even a soft cloth or applicator, if dry, could  
cause flaws to scratch the glass.  
ø The contamination on the glass surface  
should be wiped off with a clean applicator  
soaked in isopropyl alcohol. Wipe slowly and  
gently in one direction only.  
2. Electrostatic Damage  
As compared with general MOS-LSI, CMOS image  
sensor has lower ESD. Therefore, take the following  
antistatic measures when handling the CMOS  
image sensor :  
– Frequently replace the applicator and do not  
use the same applicator to clean more than  
one device.  
◊ Note : In most cases, dust and contamination  
are unavoidable, even before the device  
is first used. It is, therefore, recommended  
that the above procedures should be  
taken to wipe out dust and contamination  
before using the device.  
1) Always discharge static electricity by grounding  
the human body and the instrument to be used.  
To ground the human body, provide resistance  
of about 1 M$ between the human body and  
the ground to be on the safe side.  
14  
LZ34B1B  
4. Other  
1) Soldering should be manually performed within  
2 seconds per pin at 400°C maximum at the tip  
of soldering iron.  
2) Avoid using or storing the CMOS image sensor  
at high temperature or high humidity as it is a  
precise optical component. Do not give a  
mechanical shock to the CMOS image sensor.  
3) Do not expose the device to strong light. For  
the color device, long exposure to strong light  
will fade the color of the color filters.  
15  
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