SPECIFICATION FOR APPROVAL
REF :
PAGE: 1
PROD.
NAME
ABC'S DWG NO.
ABC'S ITEM NO.
M□□□□□□□□□L□-□□□
MULTILAYER CHIP BEAD
Ⅰ﹒CONFIGURATION & DIMENSIONS：
A
D
D
I
G
I
( PCB Pattern )
B
C
Unit : m/m
Series
M□1608
M□2029
M□3261
A
B
D
G
H
I
1.6±0.2
2.0±0.2
3.2±0.2
0.8±0.2
1.2±0.2
1.6±0.2
0.8±0.2
0.9±0.2
1.1±0.2
0.30±0.2
0.50±0.3
0.60±0.4
0.7
1.0
2.2
0.7
1.0
1.4
0.7
1.0
1.1
Ⅱ﹒SCHEMATIC DIAGRAM：
Ⅲ﹒MATERIALS：
a
b
c
a﹒Body：Ferrite
b﹒Internal conductor：Silver or Ag / Pd
c﹒Terminal electrode：Ag/Ni/Sn
d﹒Remark：Products comply with RoHS' requirements
Ⅳ﹒GENERAL SPECIFICATION：
a﹒Storage temp.：-40 ---- +105℃
b﹒Operating temp.：-55 ---- +125℃
Peak Temp：260℃ max.
Max time above 230℃ ：50sec max.
Max time above 200℃ ：70sec max.
c﹒Terminal strength：
F
Temperature
Rising Area
Preheat Area
Reflow Area
Forced Cooling Area
+2.0 ~ 4.0℃
/ sec max.
+4.0℃ / sec max.
150 ~ 200℃ / 60 ~ 120sec
-(1.0 ~ 5.0)℃ / sec max.
Type
F ( kgf )
Time ( sec )
Peak Temperature:
260℃
250
200
150
100
50
M□1608
M□2029
M□3261
0.5
0.6
1.0
230℃
50sec max.
30±5
70sec max.
d﹒Solderability：
Solder : Sn96.5 / Ag3 / Cu0.5
or equivalent
Solder temp. : 260±5℃
Flux : Rosin
Dip time : 4±1 seconds
50
100
150
Time ( seconds )
200
250
0
AR-001A
