Standard Shipping Methode
Lage im Gurt
Position in tape
Pin 1
Abwickelrichtung
Unwinding direction
A
X
B
Gurtunterseite
Tape buttom side
K
Gurtoberseite
Tape upper side
*bei W ≤ 24 mm nur untere Lochreihe
∗by W ≤ 24 mm only lower hole line
P
Production tolerance complying DIN IEC 286-3
Enclosure Type
Tape width W [mm] Quantity per meter
Quantity per reel
Dimension P
G218B / G223B
24
83,3
850
12
Recommanded Reflow Profile
Pb-Free Assembly/
Sn-Pb Assembly
Pb-Free Assembly/
Sn-Pb Assembly
Profile Feature
Profile Feature
Average ramp-up rate (TL to Tp)
3°C/second max.
Time 25°C to Peak Temperature
8 minutes max.
Preheat -Temperature Min Tsmin
-Temperature Min Tsmax
150°C
200°C
60-180 seconds
Time maintainted above
-Temperature (TL)
-Time (tL)
217°C
60-150 seconds
-Time (min to max) (ts)
TSmax to TL-Ramp-up Rate
3°C/second max
Time maintainted above
-Temperature (TL)
-Time (tL)
217°C
60-150 seconds
Time within 5°C of actual Peak
20-40 seconds
Temperature (tP)
Peak Temperature (TP)
max 260°C
Ramp-down Rate
6°C/ second max
Note: All temperatures refer to topside of the package, measured on the package body surface.
SMD oscillators must be on the top side of the PCB during the reflow process.
htttp://www.vectron.com
Vectron International•267 LowellRoad, Hudson, New Hampshire 03051•Tel:+1-88-VECTRON-1
Vectron International GmbH & Co. KG • Landstraße, 74924 Neckarbischofsheim, Germany • Tel: +49 7268 801 100
PX-501 page: 6/7