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7WBD3305

型号：

7WBD3305

描述：

2位转换总线开关[ 2-Bit Translating Bus Switch ]

品牌：

ONSEMI[ ONSEMI ]

页数：

13 页

PDF大小：

177 K

下载PDF手册
7WBD3305  
2-Bit Translating Bus  
Switch  
The 7WBD3305 is an advanced high−speed low−power 2−bit  
translating bus switch in ultra−small footprints.  
Features  
http://onsemi.com  
• High Speed: t = 0.25 ns (Max) @ V = 4.5 V  
PD  
CC  
MARKING  
DIAGRAMS  
• 3 W Switch Connection Between 2 Ports  
• Power Down Protection Provided on Inputs  
• Zero Bounce  
UDFN8  
MU SUFFIX  
CASE 517AJ  
8
AJM  
G
• TTL−Compatible Control Inputs  
• Ultra−Small Pb−Free Packages  
• These are Pb−Free Devices  
1
ULLGA8  
1.45 x 1.0  
CASE 613AA  
4M  
G
1
ULLGA8  
1.6 x 1.0  
CASE 613AB  
AMM  
G
1
ULLGA8  
1.95 x 1.0  
CASE 613AC  
AMM  
G
1
1
UQFN8  
MU SUFFIX  
CASE 523AN  
AG M*G  
G
8
1
8
US8  
US SUFFIX  
CASE 493  
AE M*G  
G
1
8
Micro8]  
DM SUFFIX  
CASE 846A  
D305  
AYWG  
G
1
A
= Assembly Location  
= Year  
= Work Week  
= Date Code  
Y
W
M
G
= Pb−Free Package  
(Note: Microdot may be in either location)  
*Date Code orientation may vary depending  
upon manufacturing location.  
This document contains information on some products that are still under development.  
ON Semiconductor reserves the right to change or discontinue these products without  
notice.  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 6 of this data sheet.  
© Semiconductor Components Industries, LLC, 2010  
1
Publication Order Number:  
February, 2010 − Rev. 0  
7WBD3305/D  
7WBD3305  
OE1  
A1  
1
2
3
4
8
7
6
5
V
CC  
A1  
6
B1  
5
OE1  
7
OE2  
B2  
8
4
V
CC  
GND  
B1  
1
2
3
OE2  
B2  
A2  
GND  
A2  
Figure 2. UQFN8  
(Top Thru−View)  
Figure 1. ULLGA8/UDFN8  
(Top Thru−View)  
V
CC  
OE1  
A1  
1
2
3
4
8
7
6
5
OE2  
B2  
B1  
GND  
A2  
Figure 3. US8/Micro8  
(Top View)  
A1  
B1  
B2  
FUNCTION TABLE  
Input OEn  
Function  
Disconnect  
Bn = An  
OE1  
A2  
L
H
OE2  
Figure 4. Logic Diagram  
http://onsemi.com  
2
7WBD3305  
MAXIMUM RATINGS  
Symbol  
Parameter  
Value  
−0.5 to +7.0  
−0.5 to +7.0  
−0.5 to +7.0  
−50  
Unit  
V
V
CC  
DC Supply Voltage  
V
Control Pin Input Voltage  
Switch Input / Output Voltage  
V
IN  
I/O  
IK  
V
V
I
Control Pin DC Input Diode Current  
Switch I/O Port DC Diode Current  
ON−State Switch Current  
V
< GND  
< GND  
mA  
mA  
mA  
mA  
mA  
mA  
°C  
IN  
I
V
−50  
OK  
I/O  
I
O
$128  
Continuous Current Through V or GND  
$150  
CC  
I
DC Supply Current Per Supply Pin  
DC Ground Current per Ground Pin  
Storage Temperature Range  
$150  
CC  
I
$150  
GND  
T
STG  
−65 to +150  
260  
T
Lead Temperature, 1 mm from Case for 10 Seconds  
Junction Temperature Under Bias  
Thermal Resistance  
°C  
L
T
150  
°C  
J
q
US8 (Note 1)  
UDFN8  
251  
111  
208  
455  
392  
°C/W  
JA  
UQFN8  
ULLGA8  
Micro8  
P
D
Power Dissipation in Still Air at 85°C  
US8  
UDFN8  
UQFN8  
ULLGA8  
Micro8  
498  
1127  
601  
274  
319  
mW  
MSL  
Moisture Sensitivity  
Level 1  
F
R
Flammability Rating Oxygen Index: 28 to 34  
UL 94 V−0 @ 0.125 in  
V
ESD  
ESD Withstand Voltage  
Human Body Mode (Note 2)  
Machine Model (Note 3)  
Charged Device Model (Note 4)  
> 2000  
> 200  
N/A  
V
I
Latchup Performance Above V and Below GND at 125°C (Note 5)  
$200  
mA  
LATCHUP  
CC  
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the  
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect  
device reliability.  
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace no air flow.  
2. Tested to EIA / JESD22−A114−A.  
3. Tested to EIA / JESD22−A115−A.  
4. Tested to JESD22−C101−A.  
5. Tested to EIA / JESD78.  
RECOMMENDED OPERATING CONDITIONS  
Symbol  
Parameter  
Min  
4.0  
0
Max  
5.5  
Unit  
V
V
CC  
Positive DC Supply Voltage  
Control Pin Input Voltage  
V
IN  
5.5  
V
V
Switch Input / Output Voltage  
Operating Free−Air Temperature  
Input Transition Rise or Fall Rate  
0
5.5  
V
I/O  
T
−55  
+125  
°C  
nS/V  
A
Dt/DV  
Control Input  
Switch I/O  
0
0
5
DC  
http://onsemi.com  
3
 
7WBD3305  
DC ELECTRICAL CHARACTERISTICS  
T
A
=
−555C to +1255C  
T
A
= 255C  
Typ  
V
(V)  
CC  
Min  
Max  
Min  
Max  
Symbol  
Parameter  
Conditions  
Unit  
V
V
IK  
IH  
Clamp Diode Voltage  
I
I/O  
= −18 mA  
4.5  
−1.2  
−1.2  
V
High−Level Input Voltage  
4.0 to  
5.5  
2.0  
2.0  
V
(Control)  
V
IL  
Low−Level Input Voltage  
(Control)  
4.0 to  
5.5  
0.8  
0.8  
V
V
I
Output Voltage High  
See Figure 5  
0 v V v 5.5 V  
OH  
Input Leakage Current  
Power Off Leakage Current  
Quiescent Supply Current  
5.5  
0
0.1  
0.1  
1.0  
1.0  
mA  
mA  
IN  
IN  
I
V
I/O  
= 0 to 5.5 V  
OFF  
I
I
= 0,  
IN  
5.5  
CC  
O
V
= V or 0 V  
CC  
OE1 = OE2 = V  
OE1 = OE2 = GND  
1.0  
0.1  
1.0  
1.0  
mA  
mA  
CC  
DI  
Increase in Supply Current  
(Control Pin)  
One input at 3.4 V;  
5.5  
4.5  
2.5  
mA  
CC  
Other inputs at V  
or GND  
CC  
R
Switch ON Resistance  
V
I/O  
= 0,  
W
ON  
I
I/O  
I
I/O  
= 64 mA  
= 30 mA  
3
3
7
7
7
7
V
I/O  
= 2.4,  
I/O  
I
= 15 mA  
15  
50  
50  
70  
50  
70  
V
I/O  
= 2.4,  
= 15 mA  
4.0  
I/O  
I
AC ELECTRICAL CHARACTERISTICS  
T
A
=
−555C to +1255C  
T
A
= 25 5C  
Typ  
V
(V)  
CC  
Min  
Max  
Min  
Max  
Symbol  
Parameter  
Test Condition  
Unit  
t
Propagation Delay,  
Bus to Bus  
See Figure 6  
4.0 to  
5.5  
0.25  
0.25  
ns  
PD  
t
Output Enable Time  
Output Disable Time  
See Figure 6  
4.5 to  
5.5  
0.8  
2.5  
4.2  
0.8  
4.2  
ns  
ns  
EN  
4.0  
0.8  
0.8  
3.0  
3.0  
4.6  
4.8  
0.8  
0.8  
4.6  
4.8  
t
4.5 to  
5.5  
DIS  
4.0  
5.0  
5.0  
5.0  
0.8  
2.9  
2.5  
10  
5
4.4  
0.8  
4.4  
C
Control Input Capacitance  
Switch On Capacitance  
Switch Off Capacitance  
V
= 5 or 0 V  
pF  
pF  
pF  
IN  
IN  
C
Switch ON  
IO(ON)  
C
Switch OFF  
IO(OFF)  
http://onsemi.com  
4
7WBD3305  
TYPICAL DC CHARACTERISTICS  
3.75  
3.50  
3.25  
3.00  
2.75  
2.50  
2.25  
2.00  
I
=
OH  
−0.1 mA  
−6 mA  
−12 mA  
−24 mA  
T = +85°C  
A
V
IN  
= V  
CC  
4.50  
4.75  
5.00  
5.25  
5.50  
5.75  
V
CC  
, SUPPLY VOLTAGE (V)  
3.75  
3.50  
3.25  
3.00  
2.75  
2.50  
2.25  
2.00  
I
=
OH  
−0.1 mA  
−6 mA  
−12 mA  
−24 mA  
T = +25°C  
A
V
IN  
= V  
CC  
4.50  
4.75  
5.00  
5.25  
5.50  
5.75  
V
CC  
, SUPPLY VOLTAGE (V)  
3.75  
3.50  
3.25  
3.00  
2.75  
2.50  
2.25  
2.00  
I
=
OH  
−0.1 mA  
−6 mA  
−12 mA  
−24 mA  
T = −40°C  
A
V
IN  
= V  
CC  
4.50  
4.75  
5.00  
5.25  
5.50  
5.75  
V
CC  
, SUPPLY VOLTAGE (V)  
Figure 5. Output Voltage High vs Supply Voltage  
http://onsemi.com  
5
7WBD3305  
AC LOADING AND WAVEFORMS  
Parameter Measurement Information  
From Output  
Under Test  
7 V  
500 W  
S1  
Test  
S1  
Open  
GND  
t
Open  
7 V  
PD  
C = 50 pF*  
L
t
/t  
PLZ PZL  
500 W  
t
/t  
Open  
PHZ PZH  
*C includes probes and jig capacitance.  
L
3 V  
0 V  
Output  
Control  
1.5 V  
1.5 V  
V
3 V  
0 V  
1.5 V  
1.5 V  
t
t
PZL  
PLZ  
Input  
Output  
3.5 V  
+ 0.3 V  
Waveform 1  
S1 at 7 V  
(Note 6)  
t
1.5 V  
t
OL  
PLH  
t
PHL  
V
OL  
t
PHZ  
V
OH  
PZH  
V
OH  
1.5 V  
1.5 V  
Output  
Waveform 2  
S1 at Open  
(Note 6)  
V
OH  
− 0.3 V  
Output  
1.5 V  
V
OL  
0 V  
Voltage Waveforms  
Propagation Delay Times  
Voltage Waveforms  
Enable and Disable Times  
6. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.  
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control  
7. All input pulses are supplied by generators having the following characteristics: PRR v 10 MHz, Z = 50 W, t v 2.5 ns, t v 2.5 ns.  
O
r
f
8. The outputs are measured one at a time, with one transition per measurement.  
9. t  
10.t  
11. t  
and t  
and t  
are the same as t  
are the same as t  
are the same as t  
.
PLZ  
PZL  
PHL  
PHZ  
DIS  
.
PZH  
and t  
EN  
PD  
.
PLH  
Figure 6. tPD, tEN, tDIS Loading and Waveforms  
ORDERING INFORMATION  
Device  
†
Package  
Shipping  
7WBD3305USG  
US8  
3000 / Tape & Reel  
3000 / Tape & Reel  
(Pb−Free)  
7WBD3305MUTAG  
7WBD3305AMUTCG  
7WBD3305AMX1TCG  
7WBD3305BMX1TCG  
7WBD3305CMX1TCG  
7WBD3305DMR2G  
UDFN8  
(Pb−Free)  
UQFN8  
(Pb−Free)  
3000 / Tape & Reel  
(In Development)  
ULLGA8 – 0.5 mm Pitch  
3000 / Tape & Reel  
(In Development)  
(Pb−Free)  
ULLGA8 – 0.4 mm Pitch  
3000 / Tape & Reel  
(In Development)  
(Pb−Free)  
ULLGA8 – 0.35 mm Pitch  
3000 / Tape & Reel  
(In Development)  
(Pb−Free)  
Micro8  
(Pb−Free)  
4000 / Tape & Reel  
(In Development)  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
http://onsemi.com  
6
 
7WBD3305  
PACKAGE DIMENSIONS  
UDFN8 1.8 x 1.2, 0.4P  
CASE 517AJ−01  
ISSUE O  
NOTES:  
A B  
E
D
1. DIMENSIONING AND TOLERANCING PER  
ASME Y14.5M, 1994.  
0.10  
C
2. CONTROLLING DIMENSION: MILLIMETERS.  
3. DIMENSION b APPLIES TO PLATED  
TERMINAL AND IS MEASURED BETWEEN  
0.15 AND 0.30 mm FROM TERMINAL TIP.  
4. MOLD FLASH ALLOWED ON TERMINALS  
ALONG EDGE OF PACKAGE. FLASH MAY  
NOT EXCEED 0.03 ONTO BOTTOM  
SURFACE OF TERMINALS.  
L1  
PIN ONE  
REFERENCE  
DETAIL A  
NOTE 5  
0.10  
C
TOP VIEW  
(A3)  
5. DETAIL A SHOWS OPTIONAL  
CONSTRUCTION FOR TERMINALS.  
MILLIMETERS  
0.05  
C
C
DIM MIN  
0.45  
A1 0.00  
MAX  
0.55  
0.05  
A
A
0.05  
A3  
b
b2  
D
E
e
0.127 REF  
0.15  
0.25  
A1  
SEATING  
PLANE  
C
0.30 REF  
SIDE VIEW  
1.80 BSC  
1.20 BSC  
0.40 BSC  
e/2  
DETAIL A  
8X L  
L
0.45  
0.55  
0.03  
e
L1 0.00  
L2  
(b2)  
0.40 REF  
4
5
1
MOUNTING FOOTPRINT*  
SOLDERMASK DEFINED  
(L2)  
8
8X  
0.66  
8X b  
7X  
0.22  
M
C A B  
0.10  
BOTTOM VIEW  
NOTE 3  
C
M
0.05  
1.50  
1
0.32  
0.40 PITCH  
DIMENSIONS: MILLIMETERS  
*For additional information on our Pb−Free strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
http://onsemi.com  
7
7WBD3305  
PACKAGE DIMENSIONS  
ULLGA8 1.45x1.0, 0.35P  
CASE 613AA−01  
ISSUE A  
NOTES:  
A
B
D
1. DIMENSIONING AND TOLERANCING PER  
ASME Y14.5M, 1994.  
2. CONTROLLING DIMENSION: MILLIMETERS.  
3. DIMENSION b APPLIES TO PLATED TERMINAL  
AND IS MEASURED BETWEEN 0.15 AND  
0.30 mm FROM THE TERMINAL TIP.  
4. A MAXIMUM OF 0.05 PULL BACK OF THE  
PLATED TERMINAL FROM THE EDGE OF THE  
PACKAGE IS ALLOWED.  
PIN ONE  
E
REFERENCE  
MILLIMETERS  
DIM MIN  
−−−  
A1 0.00  
MAX  
0.40  
0.05  
0.25  
0.10  
C
A
TOP VIEW  
SIDE VIEW  
b
D
E
e
0.15  
1.45 BSC  
1.00 BSC  
0.35 BSC  
0.25  
0.10  
C
0.05  
0.05  
C
C
L
0.35  
0.40  
L1 0.30  
A
SEATING  
PLANE  
8X  
MOUNTING FOOTPRINT  
SOLDERMASK DEFINED*  
C
A1  
7X  
8X  
0.48  
0.22  
e/2  
e
NOTE 4  
7X L  
4
1
8
1.18  
L1  
1
0.53  
0.35  
PITCH  
PKG  
5
OUTLINE  
8X b  
DIMENSIONS: MILLIMETERS  
0.10 C A B  
*For additional information on our Pb−Free strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
NOTE 3  
C
0.05  
BOTTOM VIEW  
http://onsemi.com  
8
7WBD3305  
PACKAGE DIMENSIONS  
ULLGA8 1.6x1.0, 0.4P  
CASE 613AB−01  
ISSUE A  
NOTES:  
A
B
D
1. DIMENSIONING AND TOLERANCING PER  
ASME Y14.5M, 1994.  
2. CONTROLLING DIMENSION: MILLIMETERS.  
3. DIMENSION b APPLIES TO PLATED TERMINAL  
AND IS MEASURED BETWEEN 0.15 AND  
0.30 mm FROM THE TERMINAL TIP.  
4. A MAXIMUM OF 0.05 PULL BACK OF THE  
PLATED TERMINAL FROM THE EDGE OF THE  
PACKAGE IS ALLOWED.  
PIN ONE  
REFERENCE  
E
MILLIMETERS  
DIM MIN  
−−−  
A1 0.00  
MAX  
0.40  
0.05  
0.25  
0.10  
C
A
TOP VIEW  
SIDE VIEW  
b
D
E
e
0.15  
1.60 BSC  
1.00 BSC  
0.40 BSC  
0.25  
0.10  
C
0.05  
0.05  
C
C
L
0.35  
0.40  
L1 0.30  
A
SEATING  
PLANE  
8X  
MOUNTING FOOTPRINT  
SOLDERMASK DEFINED*  
C
A1  
e
07.4X9  
8X  
0.26  
e/2  
NOTE 4  
7X L  
4
1
8
1.24  
L1  
1
0.53  
0.40  
PITCH  
PKG  
5
OUTLINE  
8X b  
DIMENSIONS: MILLIMETERS  
0.10 C A B  
*For additional information on our Pb−Free strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
NOTE 3  
C
0.05  
BOTTOM VIEW  
http://onsemi.com  
9
7WBD3305  
PACKAGE DIMENSIONS  
ULLGA8 1.95x1.0, 0.5P  
CASE 613AC−01  
ISSUE A  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER  
ASME Y14.5M, 1994.  
A
B
D
2. CONTROLLING DIMENSION: MILLIMETERS.  
3. DIMENSION b APPLIES TO PLATED TERMINAL  
AND IS MEASURED BETWEEN 0.15 AND  
0.30 mm FROM THE TERMINAL TIP.  
4. A MAXIMUM OF 0.05 PULL BACK OF THE  
PLATED TERMINAL FROM THE EDGE OF THE  
PACKAGE IS ALLOWED.  
PIN ONE  
E
REFERENCE  
MILLIMETERS  
DIM MIN  
−−−  
A1 0.00  
MAX  
0.40  
0.05  
0.25  
A
0.10  
C
TOP VIEW  
SIDE VIEW  
b
D
E
e
0.15  
1.95 BSC  
1.00 BSC  
0.50 BSC  
0.25  
0.10  
C
L
0.35  
0.40  
0.05  
0.05  
C
C
L1 0.30  
A
MOUNTING FOOTPRINT  
SOLDERMASK DEFINED*  
SEATING  
PLANE  
8X  
07.4X9  
A1  
C
8X  
0.30  
e/2  
e
4
NOTE 4  
7X L  
1
1.24  
L1  
1
0.53  
0.50  
PITCH  
PKG  
OUTLINE  
8
5
8X b  
DIMENSIONS: MILLIMETERS  
0.10 C A B  
*For additional information on our Pb−Free strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
NOTE 3  
C
0.05  
BOTTOM VIEW  
http://onsemi.com  
10  
7WBD3305  
PACKAGE DIMENSIONS  
UQFN8, 1.6x1.6, 0.5P  
CASE 523AN−01  
ISSUE O  
NOTES:  
A
B
D
MOLD CMPD  
EXPOSED Cu  
1. DIMENSIONING AND TOLERANCING PER  
ASME Y14.5M, 1994.  
2. CONTROLLING DIMENSION: MILLIMETERS.  
3. DIMENSION b APPLIES TO PLATED TERMINAL  
AND IS MEASURED BETWEEN 0.15 AND  
0.30 mm FROM THE TERMINAL TIP.  
PIN ONE  
A3  
REFERENCE  
E
2X  
MILLIMETERS  
A1  
0.10  
C
DETAIL B  
DIM MIN  
0.45  
A1 0.00  
MAX  
0.60  
0.05  
OPTIONAL  
A
2X  
CONSTRUCTION  
0.10  
C
A3  
b
D
0.13 REF  
0.15  
0.25  
TOP VIEW  
1.60 BSC  
L1  
L3  
E
e
1.60 BSC  
0.50 BSC  
A
(A3)  
DETAIL B  
L
0.35  
0.45  
L1  
L3 0.25  
−−−  
0.15  
0.35  
0.05  
C
C
b
(0.15)  
0.05  
(0.10)  
SIDE VIEW  
SEATING  
PLANE  
DETAIL A  
C
SOLDERING FOOTPRINT*  
A1  
OPTIONAL  
CONSTRUCTION  
1.70  
0.50  
PITCH  
8X  
L3  
1
8X L  
e
5
3
1
0.35  
0.25  
1.70  
7
8
DETAIL A  
8X b  
0.10 C A B  
7X  
8X  
NOTE 3  
C
0.05  
BOTTOM VIEW  
0.53  
DIMENSIONS: MILLIMETERS  
*For additional information on our Pb−Free strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
http://onsemi.com  
11  
7WBD3305  
PACKAGE DIMENSIONS  
US8  
CASE 493−02  
ISSUE B  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER  
ANSI Y14.5M, 1982.  
2. CONTROLLING DIMENSION: MILLIMETERS.  
3. DIMENSION “A” DOES NOT INCLUDE MOLD  
FLASH, PROTRUSION OR GATE BURR.  
MOLD FLASH. PROTRUSION AND GATE  
BURR SHALL NOT EXCEED 0.140 MM  
(0.0055”) PER SIDE.  
−X−  
A
J
8
5
−Y−  
4. DIMENSION “B” DOES NOT INCLUDE  
INTER−LEAD FLASH OR PROTRUSION.  
INTER−LEAD FLASH AND PROTRUSION  
SHALL NOT E3XCEED 0.140 (0.0055”) PER  
SIDE.  
5. LEAD FINISH IS SOLDER PLATING WITH  
THICKNESS OF 0.0076−0.0203 MM.  
(300−800 “).  
DETAIL E  
B
L
6. ALL TOLERANCE UNLESS OTHERWISE  
SPECIFIED 0.0508 (0.0002 “).  
1
4
R
MILLIMETERS  
INCHES  
S
DIM  
A
B
C
D
F
G
H
J
K
L
M
N
P
MIN  
1.90  
2.20  
0.60  
0.17  
0.20  
MAX  
2.10  
2.40  
0.90  
0.25  
0.35  
MIN  
MAX  
0.083  
0.094  
0.035  
0.010  
0.014  
G
P
0.075  
0.087  
0.024  
0.007  
0.008  
U
C
0.50 BSC  
0.40 REF  
0.020 BSC  
0.016 REF  
H
−T−  
0.10 (0.004)  
T
K
0.10  
0.18  
0.10  
3.20  
6
0.004  
0.007  
0.004  
0.126  
6
SEATING  
D
N
0.00  
3.00  
0
0.000  
0.118  
0
PLANE  
M
R 0.10 TYP  
M
0.10 (0.004)  
T
X Y  
_
_
_
_
5
10  
5
10  
_
_
_
_
0.23  
0.23  
0.37  
0.60  
0.34  
0.33  
0.47  
0.80  
0.010  
0.009  
0.015  
0.024  
0.013  
0.013  
0.019  
0.031  
V
R
S
U
V
0.12 BSC  
0.005 BSC  
SOLDERING FOOTPRINT*  
F
3.8  
0.15  
DETAIL E  
1.8  
0.07  
0.50  
0.0197  
0.30  
0.012  
1.0  
0.0394  
mm  
inches  
ǒ
Ǔ
SCALE 8:1  
*For additional information on our Pb−Free strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
http://onsemi.com  
12  
7WBD3305  
PACKAGE DIMENSIONS  
Micro8t  
CASE 846A−02  
ISSUE H  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.  
2. CONTROLLING DIMENSION: MILLIMETER.  
D
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE  
BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED  
0.15 (0.006) PER SIDE.  
4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION.  
INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE.  
5. 846A-01 OBSOLETE, NEW STANDARD 846A-02.  
H
E
E
MILLIMETERS  
INCHES  
NOM  
−−  
0.003  
0.013  
0.007  
0.118  
DIM  
A
A1  
b
c
D
MIN  
−−  
0.05  
0.25  
0.13  
2.90  
2.90  
NOM  
−−  
MAX  
MIN  
−−  
0.002  
0.010  
0.005  
0.114  
0.114  
MAX  
0.043  
0.006  
0.016  
0.009  
0.122  
0.122  
PIN 1 ID  
1.10  
0.15  
0.40  
0.23  
3.10  
3.10  
e
0.08  
b 8 PL  
0.33  
M
S
S
0.08 (0.003)  
T B  
A
0.18  
3.00  
E
3.00  
0.118  
e
L
0.65 BSC  
0.55  
4.90  
0.026 BSC  
0.021  
0.193  
0.40  
4.75  
0.70  
5.05  
0.016  
0.187  
0.028  
0.199  
SEATING  
PLANE  
H
−T−  
E
A
0.038 (0.0015)  
L
A1  
c
SOLDERING FOOTPRINT*  
1.04  
0.38  
8X  
8X 0.041  
0.015  
3.20  
4.24  
5.28  
0.126  
0.167 0.208  
0.65  
6X0.0256  
SCALE 8:1  
mm  
inches  
ǒ
Ǔ
*For additional information on our Pb−Free strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
Micro8 is a trademark of International Rectifier.  
ON Semiconductor and  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice  
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All  
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights  
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications  
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should  
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,  
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal  
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMENT:  
N. American Technical Support: 800−282−9855 Toll Free  
USA/Canada  
Europe, Middle East and Africa Technical Support:  
Phone: 421 33 790 2910  
Japan Customer Focus Center  
Phone: 81−3−5773−3850  
ON Semiconductor Website: www.onsemi.com  
Order Literature: http://www.onsemi.com/orderlit  
Literature Distribution Center for ON Semiconductor  
P.O. Box 5163, Denver, Colorado 80217 USA  
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada  
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada  
Email: orderlit@onsemi.com  
For additional information, please contact your local  
Sales Representative  
7WBD3305/D  
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