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EXC3BP600H

型号:

EXC3BP600H

描述:

片式磁珠芯[ Chip Bead Cores ]

品牌:

PANASONIC[ PANASONIC ]

页数:

8 页

PDF大小:

287 K

Chip Bead Cores  
Chip Bead Cores  
Type:  
EXCCL  
EXCML  
EXC3B  
Features  
Recommended Applications  
Effective noise suppression for power lines and high  
speed signal lines  
Easy pattern layout on PC Board  
Digital equipment such as PCs, word processors,  
printers, HDD, PCC, CD-ROMs, DVD-ROMs.  
Digital audio and video equipment such as VCRs,  
DVC, CD Players, DVD Players.  
Type: EXCCL, EXCML  
AC adapters, and switching power supplies.  
Electronic musical instruments, and other digital  
equipment.  
Low DC Resistance 3 to 8 mȑ typical: Rated  
current (3 and 4 Amperes) (type: EXCML)  
Low impedance  
Type: EXC3B  
High impedance for high speed signal line noise  
Increased attenuation  
60 ȑ-1 A, 120 ȑ-0.5 A are achieved by using 1608  
size (type: EXC3BP)  
Type: EXCCL  
Explanation of Part Numbers  
1
2
3
4
5
6
7
8
9
10  
11  
12  
E
X
C
C
L
3
2
1
6
U
1
Product Code  
Type Part kind  
Size  
Form  
Suffix  
Code  
U
Packing  
Embossed Carrier Taping  
Noise Filter  
Chip type  
Bead core  
Code Dimensions (mm)  
4532  
3225  
3216  
4.5x3.2x1.8  
3.2x2.5x1.6  
3.2x1.6x1.6  
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.  
Should a safety concern arise regarding this product, please be sure to contact us immediately.  
Mar. 2008  
Chip Bead Cores  
Construction  
Dimensions in mm (not to scale)  
A
A
L
Mass  
Dimensions (mm)  
Type  
(inches)  
Ferrite core  
(Weight)  
[mg/pc.]  
Electrode  
L
W
H
A
EXCCL4532  
(1812)  
4.5 0.4 3.2 0.3 1.8 0.2 0.5 0.2 125.8  
EXCCL3225  
(1210)  
EXCCL3216  
(1206)  
3.2 0.3 2.5 0.3 1.6 0.3 0.5 0.3  
3.2 0.3 1.6 0.3 1.6 0.3 0.5 0.3  
60.5  
37  
Type: EXCML  
Explanation of Part Numbers  
1
2
3
4
5
6
7
8
9
10  
11  
12  
E
X
C
M
L
2
0
A
3
9
0
U
Product Code  
Type Part kind  
Size  
Material  
Nominal Impedance  
Form  
Molded  
Chip type  
The first two digits are  
significant figure of  
impedance value and the  
third one denotes the  
Code  
U
Packing  
Noise Filter  
Bead core  
Code Dimensions (mm)  
45  
32  
20  
16  
4.5x1.6 x1.1  
3.2x1.6 x0.9  
2.0x1.25x0.9  
1.6x0.8 x0.8  
Embossed Carrier Taping  
(EXCML16 to 32)  
number of zeros following  
Embossed Carrier Taping  
(EXCML45)  
H
Construction  
Dimensions in mm (not to scale)  
T
e
W
L
Ferrite core  
Mass  
Dimensions (mm)  
Type  
(inches)  
(Weight)  
[mg/pc.]  
L
W
T
e
Conductor  
Electrode  
EXCML16  
(0603)  
EXCML20  
(0805)  
EXCML32  
(1206)  
EXCML45  
(1806)  
1.6 0.2  
0.8 0.2  
0.8 0.2  
(0.4)  
(0.5)  
(0.6)  
(0.6)  
4.5  
10.5  
21.5  
36.0  
2.0 0.2 1.25 0.20 0.9 0.2  
3.2 0.3  
4.5 0.3  
1.6 0.3  
1.6 0.3  
0.9 0.2  
1.1 0.2  
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.  
Should a safety concern arise regarding this product, please be sure to contact us immediately.  
Mar. 2008  
Chip Bead Cores  
Type: EXC3B  
Explanation of Part Numbers  
1
2
3
4
5
6
7
8
9
10  
11  
12  
E
X
C
3
B
B
2
2
1
H
Product Code  
Size  
Type Characteristics  
Nominal Impedance  
Form  
Suffix  
Multilayer  
Chip type  
Bead Core  
High frequency  
High attenuation  
for signal Lines  
High frequency  
High attenuation  
for Power Lines  
The first two digits are  
significant figure of  
impedance value and the  
third one denotes the  
number of zeros following  
Code  
H
Packing  
Noise Filter  
Code Dimensions (mm)  
1.6x0.8x0.8  
B
P
3
Embossed Carrier Taping  
Construction  
Dimensions in mm (not to scale)  
T
e
Ferrite core  
W
L
Inner Conductor  
Electrode  
Mass  
Dimensions (mm)  
Type  
(inches)  
(Weight)  
[mg/pc.]  
L
W
T
e
EXC3BB  
(0603)  
EXC3BP  
(0603)  
1.6 0.2  
1.6 0.2  
0.8 0.2  
0.8 0.2 0.30 0.15  
0.8 0.2 0.30 0.15  
4.5  
4.5  
0.8 0.2  
Ratings  
Impedance  
Rated Current  
(mA DC)  
DC Resistance  
Type  
Part Number  
( ) max.  
ȑ
( ) at 100 MHz  
tol.(%)  
ȑ
4532  
3225  
3216  
4516  
3216  
2012  
1608  
EXCCL4532U1  
EXCCL3225U1  
EXCCL3216U1  
EXCML45A910H  
EXCML32A680U  
EXCML20A390U  
EXCML16A270U  
EXC3BP600H  
EXC3BP121H  
EXC3BB221H  
EXC3BB601H  
EXC3BB102H  
115  
45  
2000  
2000  
2000  
3000  
3000  
4000  
4000  
1000  
500  
0.1  
0.05  
0.05  
0.016  
0.012  
0.008  
0.006  
0.07  
0.1  
25  
91  
68  
39  
25  
27  
60  
120  
220  
600  
1000  
1608  
200  
0.3  
100  
0.8  
50  
1
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.  
Should a safety concern arise regarding this product, please be sure to contact us immediately.  
Feb. 2006  
Chip Bead Cores  
Impedance Characteristics (Reference Data) Measured by HP4291A  
ȊZȊ : Impedance  
R : Resistance  
X : Reactance  
EXCML16A270U (1608)  
EXCCL4532U1 (4532)  
140  
120  
100  
80  
140  
120  
Z
100  
80  
60  
40  
20  
0
R
60  
X
40  
Z
R
20  
X
0
10  
100  
1000  
10000  
1
1
10  
100  
1000  
10000  
10000  
10000  
Frequency(MHz)  
Frequency(MHz)  
EXCCL3225U1 (3225)  
EXCML20A390U (2012)  
140  
120  
100  
80  
140  
120  
100  
80  
60  
60  
40  
20  
0
Z
Z
40  
20  
0
R
R
X
X
1
10  
100  
1000  
10000  
1
10  
100  
1000  
Frequency(MHz)  
Frequency(MHz)  
EXCML32A680U (3216)  
EXCCL3216U1 (3216)  
140  
120  
100  
140  
120  
100  
80  
Z
80  
60  
40  
20  
0
R
60  
Z
40  
20  
0
X
R
X
1
10  
100  
1000  
10000  
1
10  
100  
1000  
Frequency(MHz)  
Frequency(MHz)  
EXCML45A910H (4516)  
180  
160  
140  
120  
Z
100  
R
80  
60  
40  
20  
0
X
1
10  
100  
1000  
10000  
Frequency(MHz)  
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.  
Should a safety concern arise regarding this product, please be sure to contact us immediately.  
Feb. 2006  
Chip Bead Cores  
Impedance Characteristics (Reference Data) Measured by HP4291A  
ȊZȊ : Impedance  
R : Resistance  
X : Reactance  
EXC3BB221H (1608)  
EXC3BP121H (1608)  
1400  
1200  
1000  
800  
600  
400  
200  
0
200  
150  
100  
50  
Z
R
X
Z
R
0
X
1
10  
100  
1000  
10000  
10000  
10000  
1
10  
100  
1000  
10000  
Frequency(MHz)  
Frequency(MHz)  
EXC3BB601H (1608)  
EXC3BP600H (1608)  
1400  
1200  
1000  
800  
600  
400  
200  
0
200  
150  
100  
50  
Z
R
R
Z
X
X
0
1
10  
100  
1000  
1
10  
100  
1000  
10000  
Frequency(MHz)  
Frequency(MHz)  
EXC3BB102H (1608)  
1400  
1200  
Z
1000  
800  
600  
400  
200  
0
R
X
1
10  
100  
1000  
Frequency(MHz)  
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.  
Should a safety concern arise regarding this product, please be sure to contact us immediately.  
Feb. 2006  
Chip Bead Cores  
Packaging Methods (Taping)  
Standard Quantity  
Part Number  
Kind of Taping  
Pitch (P1)  
8 mm  
Quantity  
EXCCL4532U1  
EXCCL3225U1  
EXCCL3216U1  
EXCML45A910H  
EXCML32A680U  
EXCML20A390U  
EXCML16A270U  
1000 pcs./reel  
2000 pcs./reel  
3000 pcs./reel  
Embossed Carrier Taping  
4 mm  
4000 pcs./reel  
EXC3B  
H
२२२२  
Embossed Carrier Taping  
Taping Reel  
T
t1  
Sprocket hole  
Compartment  
φD0  
φ C  
A
φ D  
E
P1  
P2  
P0  
t2  
Chip component  
Tape running direction  
φ A  
W
t
Embossed Carrier Dimensions (mm)  
Part Number  
A
B
W
F
E
P1  
P2  
P0  
D
t1  
t2  
φ
0
EXCCL4532U1  
EXCCL3225U1  
EXCCL3216U1  
3.6 0.2 4.9 0.2 12.0 0.2 5.5 0.1  
8.0 0.1  
2.4 max.  
2.1 max.  
2.9 0.2 3.6 0.2  
8.0 0.2 3.5 0.1  
2.0 0.2 3.6 0.2  
EXCML45A910H 1.9 0.2 4.8 0.2 12.0 0.2 5.5 0.1 1.75 0.10 4.0 0.1 2.0 0.1 4.0 0.1 1.5 0.1 0.20 0.05 1.8 max.  
EXCML32A680U 1.9 0.2 3.5 0.2  
EXCML20A390U 1.5 0.2 2.3 0.2  
8.0 0.2 3.5 0.1  
1.6 max.  
EXCML16A270U 1.1 0.2 2.1 0.2  
EXC3B 1.0 0.1 1.8 0.1  
H
0.25 0.05  
२२२२  
Standard Reel Dimensions (mm)  
Part Number  
A
B
C
D
φ
E
W
T
t
φ
φ
φ
+0.5  
EXCCL4532U1  
EXCCL3225U1  
EXCCL3216U1  
EXCML45A910H  
EXCML32A680U  
EXCML20A390U  
EXCML16A270U  
13.0  
16.5 max.  
13 max.  
–1.0  
+0.5  
–1.0  
09.5  
180.003.0  
60.0 1.0  
13.0 0.5  
21.0 0.8  
2.0 0.5  
13.0+10..05  
16.5 max.  
1.2 0.5  
+0.5  
09.5  
13 max.  
–1.0  
EXC3B  
H
२२२२  
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.  
Should a safety concern arise regarding this product, please be sure to contact us immediately.  
Feb. 2006  
Chip Bead Cores  
Recommended Land Pattern Dimensions in mm (not to scale)  
(mm)  
Part Number  
EXCCL4532U1  
EXCCL3225U1  
A
3
B
C
5.4  
4.1  
4.1  
2.8  
2.1  
1.2  
1.7  
EXCCL3216U1  
EXCML45A910H  
EXCML32A680U  
EXCML20A390U  
EXCML16A270U  
1.7  
A
B
2.6 to 3  
1.6 to 2  
0.8 to 1.2  
0.6 to 1  
0.8 to 1  
5.5 to 6.5  
4 to 5  
1.2 to 1.6  
1.2 to 1.6  
1 to 1.2  
0.8 to 1  
0.8 to 1  
3 to 4  
2 to 3  
C
EXC3B  
H
2 to 2.6  
२२२२  
Recommended Soldering Conditions  
Recommendations and precautions are described below.  
Recommended soldering conditions for reflow  
· Reflow soldering shall be performed a maximum of  
two times.  
· Please contact us for additional information when  
used in conditions other than those specified.  
· Please measure the temperature of the terminals  
and study every kind of solder and printed circuit  
board for solderability before actual use.  
For soldering (Example : Sn-37Pb)  
Temperature  
Time  
Preheating  
Main heating  
Peak  
140 °C to 160 °C  
Above 200 °C  
235 10 °C  
60 s to 120 s  
30 s to 40 s  
max. 10 s  
Peak  
Preheating  
For lead-free soldering (Example : Sn/3Ag/0.5Cu)  
Temperature  
150 °C to 170 °C  
Above 230 °C  
max. 260 °C  
Time  
Heating  
Preheating  
Main heating  
Peak  
60 s to 120 s  
30 s to 40 s  
max. 10 s  
Time  
<Repair with hand soldering>  
Preheat with a blast of hot air or similar method. Use a soldering iron with a tip temperature of 350 °C or less. Solder  
each electrode for 3 seconds or less.  
Never touch this product with the tip of a soldering iron.  
Safety Precautions  
The following are precautions for individual products. Please also refer to the precautions common to EMI Filters,  
ESD Suppressors, Fuses, and MR Sensors shown on page EL113 of this catalog.  
1. Flow soldering may cause this product to come off because the adhesiveness of the product element is low.  
Please consult our sales representative in advance about flow soldering.  
2. Use rosin-based flux or halogen-free flux.  
3. For cleaning, use an alcohol-based cleaning agent. Before using any other type, consult with our sales person  
in advance.  
4. Do not apply shock to Chip Bead Cores (hereafter called the bead cores) or pinch them with a hard tool (e.g.  
pliers and tweezers). Otherwise, their bodies may be chipped, affecting their performance.  
Excessive mechanical stress may damage the bead cores. Handle with care.  
5. Store the bead cores in a location with a temperature ranging from -5 °C to +40 °C and a relative humidity of  
40 % to 60 %, where there are no rapid changes in temperature or humidity.  
6. Use the bead cores within a year (EXC3B Type: within half a year) after the date of the outgoing inspection  
indicated on the packages.  
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.  
Should a safety concern arise regarding this product, please be sure to contact us immediately.  
Jul. 2008  
Safety Precautions (Common precautions for EMI Filters, ESD Suppressors, Fuses, and MR Sensors)  
• When using our products, no matter what sort of equipment they might be used for, be sure to make a written  
agreement on the specifications with us in advance. The design and specifications in this catalog are subject  
to change without prior notice.  
• Do not use the products beyond the specifications described in this catalog.  
• This catalog explains the quality and performance of the products as individual components. Before use, check  
and evaluate their operations when installed in your products.  
• Install the following systems for a failsafe design to ensure safety if these products are to be used in equipment  
where a defect in these products may cause the loss of human life or other significant damage, such as damage to  
vehicles (automobile, train, vessel), traffic lights, medical equipment, aerospace equipment, electric heating  
appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment.  
Systems equipped with a protection circuit and a protection device  
Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault  
(1) Precautions for use  
• These products are designed and manufactured for general and standard use in general electronic equipment  
(e.g. AV equipment, home electric appliances, office equipment, information and communication equipment)  
• These products are not intended for use in the following special conditions. Before using the products,  
carefully check the effects on their quality and performance, and determine whether or not they can be used.  
1. In liquid, such as water, oil, chemicals, or organic solvent  
2. In direct sunlight, outdoors, or in dust  
3. In salty air or air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2  
4. Electric Static Discharge (ESD) Environment (except ESD Suppressors)  
These components are sensitive to static electricity and can be damaged under static shock (ESD).  
Please take measures to avoid any of these environments.  
Smaller components are more sensitive to ESD environment.  
5. Electromagnetic Environment  
Avoid any environment where strong electromagnetic waves exist.  
6. In an environment where these products cause dew condensation  
7. Sealing or coating of these products or a printed circuit board on which these products are mounted, with  
resin or other materials  
• These products generate Joule heat when energized. Carefully position these products so that their heat will  
not affect the other components.  
• Carefully position these products so that their temperatures will not exceed the category temperature range due  
to the effects of neighboring heat-generating components. Do not mount or place heat-generating components  
or inflammables, such as vinyl-coated wires, near these products (except Thermal Cutoffs).  
• Note that non-cleaning solder, halogen-based highly active flux, or water-soluble flux may deteriorate the  
performance or reliability of the products.  
• Carefully select a flux cleaning agent for use after soldering. An unsuitable agent may deteriorate the performance  
or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave water  
residues. Otherwise, the insulation performance may be deteriorated.  
(2) Precautions for storage  
The performance of these products, including the solderability, is guaranteed for a year from the date of arrival  
at your company, provided that they remain packed as they were when delivered and stored at a temperature  
of 5 °C to 35 °C and a relative humidity of 45 % to 85 %. (Micro Chip Fuses: Guaranteed for 6 months from the  
date of arrival at your company)  
The performance of EMI Filters is guaranteed for 6 months or a year from the outgoing inspection date indicated on  
the packages, provided that they are stored at a temperature of -5 °C to +40 °C and a relative humidity of 40 %  
to 60 %. Check the guarantee period in the specifications. The performance of Thermal Cutoffs is guaranteed for a  
year from the outgoing inspection date indicated on the packages, provided that they are stored at a temperature of  
-10 °C to +40 °C and a relative humidity of 30 % to 75 %.  
Even within the above guarantee periods, do not store these products in the following conditions. Otherwise,  
their electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping  
materials) may be deformed or deteriorated, resulting in mounting failures.  
1. In salty air or in air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2  
2. In direct sunlight  
<Package markings>  
Package markings include the product number, quantity, and country of origin.  
In principle, the country of origin should be indicated in English.  
Jan. 2008  
– EL113 –  
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