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LYG5162-PF

型号：

LYG5162-PF

描述：

双极型LED灯[ BIPOLAR TYPE LED LAMPS ]

品牌：

LIGITEK[ LIGITEK ELECTRONICS CO., LTD. ]

页数：

7 页

PDF大小：

123 K

下载PDF手册
LIGITEK ELECTRONICS CO.,LTD.  
Property of Ligitek Only  
BIPOLAR TYPE LED LAMPS  
Pb  
Lead-Free Parts  
LYG5162-PF  
DATA SHEET  
DOC. NO : QW0905-LYG5162-PF  
REV.  
: A  
DATE  
: 31 - Oct. - 2007  
LIGITEK ELECTRONICS CO.,LTD.  
Property of Ligitek Only  
PART NO. LYG5162-PF  
Page 1/6  
Package Dimensions  
2.8  
5.0  
2.0  
7.0  
1.5  
MAX  
G
Y
0.7  
25.0MIN  
□0.5  
TYP  
1
2
2
1
1.0MIN  
2.54TYP  
Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted.  
2.Specifications are subject to change without notice.  
Directivity Radiation  
0°  
-30°  
30°  
-60°  
60°  
100% 75% 50% 25% 0 25% 50% 75% 100%  
LIGITEK ELECTRONICS CO.,LTD.  
Property of Ligitek Only  
Page 2/6  
PART NO. LYG5162-PF  
Absolute Maximum Ratings at Ta=25 ℃  
Absolute Maximum Ratings  
Symbol  
Parameter  
UNIT  
Y
G
20  
80  
60  
10  
30  
IF  
Forward Current  
mA  
mA  
mW  
Peak Forward Current  
Duty 1/10@10KHz  
IFP  
PD  
Ir  
120  
100  
10  
Power Dissipation  
Reverse Current @5V  
Operating Temperature  
Storage Temperature  
μA  
Topr  
Tstg  
-40 ~ +85  
-40 ~ +100  
℃
℃
Typical Electrical & Optical Characteristics (Ta=25 ℃)  
Forward  
voltage  
@20mA(V)  
Luminous Viewing  
Peak  
wave  
length  
λPnm  
Spectral  
halfwidth  
△λnm  
intensity  
angle  
2θ 1/2  
(deg)  
COLOR  
@10mA(mcd)  
PART NO  
MATERIAL  
Typ.  
Min.  
Emitted  
Yellow  
Lens  
Max.  
2.6  
Min.  
1.7  
GaAsP/GaP  
GaP  
585  
565  
35  
30  
3
3
8
144  
144  
LYG5162-PF  
White Diffused  
Green  
1.7  
2.6  
6.5  
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.  
2. The luminous intensity data did not including ±15% testing tolerance.  
LIGITEK ELECTRONICS CO.,LTD.  
Property of Ligitek Only  
Page  
3/6  
PART NO. LYG5162-PF  
Typical Electro-Optical Characteristics Curve  
Y CHIP  
Fig.1 Forward current vs. Forward Voltage  
Fig.2 Relative Intensity vs. Forward Current  
1000  
3.0  
2.5  
2.0  
100  
10  
1.5  
1.0  
1.0  
0.5  
0.0  
0.1  
1.0  
2.0  
3.0  
4.0  
5.0  
1.0  
10  
100  
1000  
Forward Current(mA)  
Forward Voltage(V)  
Fig.3 Forward Voltage vs. Temperature  
Fig.4 Relative Intensity vs. Temperature  
1.2  
3.0  
2.5  
2.0  
1.1  
1.0  
0.9  
0.8  
1.5  
1.0  
0.5  
0.0  
-40  
-20  
0
20  
40  
60  
80  
100  
-40  
-20  
0
20  
40  
60  
80  
100  
Ambient Temperature(℃)  
Ambient Temperature(℃)  
Fig.5 Relative Intensity vs. Wavelength  
1.0  
0.5  
0.0  
500  
550  
600  
650  
700  
Wavelength (nm)  
LIGITEK ELECTRONICS CO.,LTD.  
Property of Ligitek Only  
Page 4/6  
PART NO. LYG5162-PF  
Typical Electro-Optical Characteristics Curve  
G CHIP  
Fig.1 Forward current vs. Forward Voltage  
Fig.2 Relative Intensity vs. Forward Current  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
1000  
100  
10  
1.0  
0.5  
0.0  
0.1  
1.0  
2.0  
3.0  
4.0  
5.0  
1.0  
10  
100  
1000  
Forward Current(mA)  
Forward Voltage(V)  
Fig.3 Forward Voltage vs. Temperature  
Fig.4 Relative Intensity vs. Temperature  
3.0  
1.2  
2.5  
2.0  
1.5  
1.0  
0.5  
1.1  
1.0  
0.9  
0.8  
0.0  
-40  
-20  
0
20  
40  
60  
80  
100  
-40  
-20  
0
20  
40  
60  
80  
100  
Ambient Temperature(℃)  
Ambient Temperature(℃)  
Fig.5 Relative Intensity vs. Wavelength  
1.0  
0.5  
0.0  
500  
550  
650  
600  
Wavelength (nm)  
LIGITEK ELECTRONICS CO.,LTD.  
Property of Ligitek Only  
Page 5/6  
PART NO. LYG5162-PF  
Soldering Condition(Pb-Free)  
1.Iron:  
Soldering Iron:30W Max  
Temperature 350°C Max  
Soldering Time:3 Seconds Max(One time only)  
Distance:2mm Min(From solder joint to body)  
2.Wave Soldering Profile  
Dip Soldering  
Preheat: 120°C Max  
Preheat time: 60seconds Max  
Ramp-up  
2°C/sec(max)  
Ramp-Down:-5°C/sec(max)  
Solder Bath:260°C Max  
Dipping Time:3 seconds Max  
Distance:2mm Min(From solder joint to body)  
Temp(°C)  
260°C3sec Max  
260°  
5°/sec  
max  
120°  
2°/sec  
25°  
0°  
max  
0
50  
150  
Time(sec)  
100  
Preheat  
60 Seconds Max  
Note: 1.Wave solder should not be made more than one time.  
2.You can just only select one of the soldering conditions as above.  
LIGITEK ELECTRONICS CO.,LTD.  
Property of Ligitek Only  
Page 6/6  
PART NO. LYG5162-PF  
Reliability Test:  
Reference  
Standard  
Description  
Test Item  
Test Condition  
1.Under Room Temperature  
2.If=20mA  
3.t=1000 hrs (-24hrs, +72hrs)  
This test is conducted for the purpose  
of detemining the resistance of a part  
in electrical and themal stressed.  
MIL-STD-750: 1026  
MIL-STD-883: 1005  
JIS C 7021: B-1  
Operating Life Test  
The purpose of this is the resistance of  
the device which is laid under condition  
of high temperature for hours.  
High Temperature  
Storage Test  
1.Ta=105℃±5℃  
2.t=1000 hrs (-24hrs, +72hrs)  
MIL-STD-883:1008  
JIS C 7021: B-10  
The purpose of this is the resistance  
of the device which is laid under  
condition of low temperature for hours.  
Low Temperature  
Storage Test  
1.Ta=-40℃±5℃  
2.t=1000 hrs (-24hrs, +72hrs)  
JIS C 7021: B-12  
1.Ta=65℃±5℃  
2.RH=90%~95%  
3.t=240hrs ±2hrs  
High Temperature  
High Humidity Test  
The purpose of this test is the resistance  
of the device under tropical for hours.  
MIL-STD-202:103B  
JIS C 7021: B-11  
The purpose of this is the resistance of  
the device to sudden extreme changes  
in high and low temperature.  
1.Ta=105℃±5℃&-40℃±5℃  
(10min) (10min)  
2.total 10 cycles  
MIL-STD-202: 107D  
MIL-STD-750: 1051  
MIL-STD-883: 1011  
Thermal Shock Test  
This test intended to determine the  
thermal characteristic resistance  
of the device to sudden exposures  
at extreme changes in temperature  
when soldering the lead wire.  
MIL-STD-202: 210A  
MIL-STD-750: 2031  
JIS C 7021: A-1  
Solder Resistance  
Test  
1.T.Sol=260 ℃±5℃  
2.Dwell time= 10 ±1sec.  
MIL-STD-202: 208D  
MIL-STD-750: 2026  
MIL-STD-883: 2003  
JIS C 7021: A-2  
This test intended to see soldering well  
performed or not.  
1.T.Sol=230 ℃±5℃  
2.Dwell time=5 ±1sec  
Solderability Test  
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