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IX2120BTR

型号：

IX2120BTR

品牌：

LITTELFUSE[ LITTELFUSE ]

页数：

13 页

PDF大小：

258 K

下载PDF手册
IX2120  
1200V High and Low Side  
Gate Driver  
INTEGRATED  
C
IRCUITS  
D
IVISION  
Driver Characteristics  
Description  
The IX2120 is a high voltage integrated circuit that can  
drive high speed MOSFETs and IGBTs that operate at  
up to +1200V. The IX2120 is configured with  
independent high-side and low-side referenced output  
channels, both of which can source and sink 2A. The  
floating high-side channel can drive an N-channel  
power MOSFET or IGBT 1200V from the common  
reference.  
Parameter  
VOFFSET  
Rating  
Units  
1200  
2/2  
V
A
IO +/- (Source/Sink)  
V
15-20  
250/210  
V
OUT  
t
/t  
ns  
on off  
Features  
Manufactured on IXYS Integrated Circuits Division's  
proprietary high-voltage BCDMOS on SOI (silicon on  
insulator) process, the IX2120 is extremely robust, and  
is virtually immune to negative transients. The UVLO  
circuit prevents turn-on of the MOSFET or IGBT until  
• Floating Channel for Bootstrap Operation to +1200V  
• Outputs Capable of Sourcing and Sinking 2A  
• Gate Drive Supply Range From 15V to 20V  
• Enhanced Robustness due to SOI Process  
• Tolerant to Negative Voltage Transients:  
dV/dt Immune  
there is sufficient V or V supply voltage.  
BS  
CC  
• 3.3V Logic Compatible  
• Undervoltage Lockout for Both High-Side and  
Low-Side Outputs  
The IX2120 is available in a 28-pin SOIC package.  
Ordering Information  
Part  
Description  
IX2120B  
28-Pin SOIC (28/Tube)  
28-Pin SOIC (1000/Reel)  
IX2120BTR  
IX2120 Functional Block Diagram  
VB  
UVLO  
High  
VDD  
Voltage  
Level  
Shift  
C
R
Buffer  
Level  
Shift  
VDD / VCC  
Q
HO  
VS  
Mid  
Voltage  
Level  
Shift  
S
HIN  
SD  
Pulse  
Generator  
VSS / COM  
Input Control Logic  
&
Cycle-by-Cycle  
Edge-Triggered  
Shutdown  
VBM  
VSM  
UVLO  
VCC  
LIN  
VSS  
Level  
Shift  
DD / VCC  
VSS / COM  
LS Delay  
Control  
Buffer  
LO  
V
COM  
DS-IX2120-R02  
www.ixysic.com  
1
IX2120  
INTEGRATED  
C
IRCUITS  
D
IVISION  
1. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
1.1 Package Pinout: 28-Pin SOIC Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
1.2 Pin Description: 28-Pin SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
1.3 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4  
1.4 Thermal Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4  
1.5 Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4  
1.6 Dynamic Electrical Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5  
1.7 Static Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5  
1.8 Test Waveforms. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
1.9 IX2120 Typical Application. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7  
2. Typical Performance Data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8  
3. Manufacturing Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12  
3.1 Moisture Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12  
3.2 ESD Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12  
3.3 Soldering Profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12  
3.4 Board Wash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12  
3.5 Mechanical Dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
2
www.ixysic.com  
R02  
IX2120  
INTEGRATED  
C
IRCUITS  
D
IVISION  
1 Specifications  
Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are  
provided for information purposes only, and are not part of the manufacturing testing requirements.  
1.1 Package Pinout: 28-Pin SOIC Package  
1.2 Pin Description: 28-Pin SOIC Package  
Pin#  
Name  
Description  
28  
VS - 1  
VB - 2  
3
27  
26  
25  
24 - VSM  
23 - VBM  
22 - VSM  
21  
20  
19 - VCC  
18  
V
1
2
High-Side Floating Supply Return  
High-Side Floating Supply  
No Connection  
S
V
B
HO - 4  
5
6
7
3
-
4
HO  
High-Side Gate Drive Output  
No Connection  
5
-
-
-
-
-
8
9
6
No Connection  
V
DD - 10  
HIN - 11  
SD - 12  
LIN - 13  
VSS - 14  
7
Internal Connection, Do Not Use  
No Connection  
17 - COM  
16  
15 - LO  
8
9
Internal Connection, Do Not Use  
Logic Supply  
V
10  
DD  
Logic Input for High-Side Gate Drive  
Output (HO), In-Phase  
11  
12  
13  
HIN  
SD  
Logic Input for Shutdown  
Logic Input for Low-Side Gate Driver  
Output (LO), In-Phase  
LIN  
V
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
Logic Ground  
SS  
LO  
Low-Side Gate Drive Output  
No Connection  
-
COM  
-
Low-Side Return  
No Connection  
V
Low-Side Supply  
CC  
-
-
Internal Connection, Do Not Use  
No Connection  
V
Middle Floating Return  
Middle Floating Supply  
Middle Floating Return  
No Connection  
SM  
V
BM  
V
SM  
-
-
-
-
No Connection  
No Connection  
No Connection  
R02  
www.ixysic.com  
3
IX2120  
INTEGRATED  
C
IRCUITS  
D
IVISION  
1.3 Absolute Maximum Ratings  
Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage  
parameters are absolute voltages referenced to COM.  
Parameter  
High-Side Floating Supply Voltage  
High-Side Floating Supply Offset Voltage  
High-Side Floating Output Voltage  
Middle Floating Supply Voltage  
Middle Floating Supply Offset Voltage  
Low-Side Fixed Supply Voltage  
Low-Side Output Voltage  
Symbol  
Min  
Max  
Units  
V
-0.3  
1400  
V
V
B
V
VB-20  
VB+0.3  
S
V
VS-0.3  
VB+0.3  
HO  
V
V
-0.3  
700  
V
BM  
V
VBM-20  
VBM+0.3  
SM  
V
V
-0.3  
-0.3  
20  
V
CC  
V
V
CC+0.3  
LO  
V
V
Logic Supply Voltage  
VSS+20  
DD  
-0.3  
V
V
Logic Supply Offset Voltage  
VCC-20  
VCC+0.3  
VDD+0.3  
SS  
V
V
Logic Input Voltage (HIN, LIN, SD)  
Allowable Offset Supply Voltage Transient  
Package Power Dissipation @25°C  
Junction Temperature  
VSS-0.3  
IN  
V
dV /dt  
S
-
50  
V/ns  
W
P
-
1.3  
D
T
-40  
-55  
+150  
+150  
°C  
°C  
J
T
Storage Temperature  
S
1.4 Thermal Characteristics  
Parameter  
Symbol  
Rating  
Units  
Thermal Impedance, Junction to Ambient  
JA  
74  
°C/W  
1.5 Recommended Operating Conditions  
For proper operation, the device should be used within the recommended conditions. The V , V , and V offset  
S
SM  
SS  
ratings are tested with all supplies biased at a 15V differential.  
Parameter  
High-Side Floating Supply Absolute Voltage  
High-Side Floating Supply Offset Voltage  
High-Side Floating Output Voltage  
Middle Floating Supply Absolute Voltage  
Middle Floating Supply Offset Voltage  
Low-Side Fixed Supply Voltage  
Low-Side Output Voltage  
Symbol  
Min  
Max  
Units  
V
V
VS+15  
VS+20  
B
S
-
1200  
VB  
V
V
V
VS  
HO  
BM  
SM  
VSM+15  
VSM+20  
-
600  
20  
V
V
15  
CC  
V
V
VCC  
LO  
0
Logic Supply Voltage  
VSS+3  
VSS+20  
DD  
V
Logic Supply Offset Voltage  
-5  
+5  
SS  
V
Logic Input Voltage (HIN, LIN, SD)  
VSS  
VDD  
IN  
4
www.ixysic.com  
R02  
IX2120  
INTEGRATED  
C
IRCUITS  
D
IVISION  
1.6 Dynamic Electrical Characteristics  
, V =15V; V , V =13.5V; C =1000 pF; and V =COM unless otherwise specified. See “Test  
V
CC DD  
BS BMSM  
L
SS  
Waveforms” on page 6.  
Parameter  
Conditions  
V =0V  
Symbol  
ton  
Min  
Typ  
Max  
Units  
Turn-On propagation Delay  
Turn-Off propagation Delay  
Shutdown propagation Delay  
Turn-On Rise Time  
S
-
-
-
-
254  
213  
207  
9.4  
-
-
-
-
V
=600V  
toff  
SM  
V =1200V  
S
tSD  
tr  
ns  
-
-
-
Turn-Off Fall Time  
tf  
-
-
9.7  
-
-
Delay Matching, HS & LS Turn-On/Off  
MT  
60  
1.7 Static Electrical Characteristics  
, V , V , V =15V, and V =COM unless otherwise specified. The V , V , and I parameters are  
V
CC BMSM BS DD  
SS  
IN TH  
IN  
referenced to V and are applicable to all three logic input leads: HIN, LIN, and SD. The V and I parameters are  
SS  
O
O
referenced to COM and are applicable to the respective output leads: HO or LO.  
Parameter  
Logic “1” Input Voltage  
Conditions  
Symbol  
VIH  
Min  
Typ  
Max  
Units  
9.5  
-
-
-
6
V =15V  
DD  
V
Logic “0” Input Voltage  
VIL  
-
Logic “1” Input Voltage  
VIH  
2.5  
-
-
V =3V  
DD  
V
Logic “0” Input Voltage  
VIL  
-
-
-
-
-
-
0.8  
2.5  
0.15  
60  
60  
High-Level Output Voltage, V -V  
BIAS  
I =0A  
O
VOH  
O
1.6  
-
V
Low-Level Output Voltage, V  
I =20mA  
O
VOL  
O
V =V =600V  
S
High Offset Supply Leakage Current  
Middle Offset Supply Leakage Current  
IHLK  
B
32  
32  
V
=V =600V  
IMLK  
IQBS  
IQBMSM  
IQCC  
IQDD  
IIN+  
BM SM  
Quiescent V Supply Current  
BS  
V =0V or V  
IN  
DD  
DD  
DD  
DD  
-
-
187  
487  
300  
-
310  
730  
420  
1
A  
Quiescent V  
Supply Current  
V =0V or V  
BMSM  
IN  
Quiescent V Supply Current  
CC  
V =0V or V  
IN  
-
Quiescent V Supply Current  
DD  
V =0V or V  
IN  
-
V =V  
IN DD  
Logic “1” Input Bias Current  
Logic “0” Input Bias Current  
-
22  
-
40  
5
A  
V
V =0V  
IN  
IIN-  
-
V
V
V
V
Supply Undervoltage Positive Going Threshold  
Supply Undervoltage Negative Going Threshold  
Supply Undervoltage Positive Going Threshold  
Supply Undervoltage Negative Going Threshold  
-
-
-
-
VBSUV+  
VBSUV-  
VCCUV+  
VCCUV-  
IO+  
BS  
BS  
CC  
CC  
7.5  
7
8.4  
7.8  
8.4  
7.8  
-
9.7  
9.4  
9.6  
9.4  
-
7.4  
7
V =0V, V =V , PW10s  
Output High Short Circuit Pulsed Current  
Output Low Short Circuit Pulsed Current  
O
IN DD  
2
A
V =15V, V =0V, PW10s  
IO-  
O
IN  
2
-
-
R02  
www.ixysic.com  
5
IX2120  
INTEGRATED  
C
IRCUITS  
D
IVISION  
1.8 Test Waveforms  
1.8.1 Switching Time Test Circuit  
V
CC=15V  
VB  
10µF 0.1µF  
+
0.1µF 10µF  
10 19  
2
13.5V  
-
1
VDD VCC VB  
VS  
VS  
CL  
10µF  
(0 to 1000V/1200V)  
11  
4
HO  
HIN  
12  
23  
VBM  
SD  
VBM  
+
0.1µF 10µF  
10µF  
13.5V  
22  
24  
-
VSM  
VSM  
VSM  
(0 to 500V/600V)  
15  
13  
LO  
LIN  
CL  
VSS COM  
14  
17  
1.8.2 Input/Output Timing Waveform  
1.8.4 Shutdown Waveform Definitions  
HIN  
LIN  
50%  
SD  
SD  
tsd  
HO  
LO  
90%  
HO  
LO  
1.8.5 Delay Matching Waveform Definitions  
1.8.3 Switching Time Waveform Definition  
50%  
HO  
50%  
HIN  
LIN  
50%  
tr  
50%  
toff  
HIN  
LIN  
ton  
tf  
LO  
90%  
90%  
10%  
HO  
LO  
MT  
MT  
HO  
10%  
10%  
90%  
LO  
6
www.ixysic.com  
R02  
IX2120  
INTEGRATED  
C
IRCUITS  
D
IVISION  
1.9 IX2120 Typical Application  
VHV  
M1  
1200V  
R11  
47  
DG2  
25V  
R12  
4.7  
DR2  
1200V  
CB2  
0.33µF  
25V  
IX2120  
RB2  
5
DB2  
600V  
1
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
VS  
N/C  
RD2  
5M  
DD2  
600V  
2
3
VB  
N/C  
N/C  
N/C  
VSM  
CB1  
0.33µF  
25V  
N/C  
HO  
N/C  
N/C  
N/C  
N/C  
N/C  
VDD  
HIN  
SD  
4
5
6
RD1  
5M  
DD1  
600V  
VBM  
RB1  
5
7
VSM  
8
N/C  
N/C  
VCC  
VDD  
VCC  
DB1  
600V  
9
10  
11  
12  
13  
14  
HIN  
SD  
N/C  
COM  
N/C  
LO  
C3  
1µF  
25V  
DR1  
1200V  
M2  
1200V  
LIN  
R21  
47  
LIN  
VSS  
C1  
1µF  
25V  
DG1  
25V  
R22  
4.7  
VSS  
COM  
The IX2120 is a 1200V half bridge gate driver for high  
voltage IGBTs and MOSFETs. Three input signals  
(HIN, LIN, and SD) determine the state of the gate  
driver outputs (HO and LO). HIN controls HO via a  
high voltage interface. The high voltage interface is  
integrated into the bootstrap supply by using two 600V  
diodes (DD1 and DD2).  
The high side bootstrap capacitor selection is a  
function of the switching frequency and the on-time  
(t  
) of the high side source driver. The quiescent  
ONTIME  
V
current (I  
) is supplied by bootstrap capacitor  
BS  
QBS  
CB2, and the quiescent V  
supply current  
BMSM  
(I  
) is supplied by bootstrap capacitor CB1. To  
QBMSM  
insure adequate supply current:  
tONTIME  
A two-stage bootstrap supplies current to the high side  
and mid level circuitry. The two bootstrap circuits are  
identical, and careful board layout and positioning of  
the bootstrap components are required. Resistors  
RD1 and RD2 form a resistive divider to keep the mid  
supply very near the center of the high voltage supply  
range. High value resisters (5M) are recommended  
to minimize power dissipation. The two-stage  
---------------------------------------------------------------------------------------------  
CB1 IQBS  
VCC – VBSUV+ + 2VF + VCEsatM2  
and:  
CB2 IQBMSM  
tONTIME  
---------------------------------------------------------------------------------------------  
VCC – VBSUV+ + 2VF + VCEsatM2  
bootstrap supply reduces the high side gate drive  
voltage (V -V ) by two diode forward voltage drops  
B
S
(2V ). Therefore, the V supply range for the  
F
CC  
application circuit shown is:  
20V VCC  VBSUV+ + 2VF + VCEsatM2  
Where V  
M2.  
M2 is the saturation voltage of IGBT,  
CE(sat)  
R02  
www.ixysic.com  
7
IX2120  
INTEGRATED  
C
IRCUITS  
D
IVISION  
2 Typical Performance Data  
Turn-On Delay Time  
Turn-On Delay Time  
vs.Temperature  
Turn-Off Delay Time vs.Temperature  
vs. Supply Voltage  
500  
500  
400  
300  
200  
100  
0
350  
300  
250  
200  
150  
100  
50  
400  
300  
200  
100  
0
0
-50  
-25  
0
25  
50  
75  
100 125  
-50  
-50  
-50  
0
-25  
0
25  
50  
75  
100 125  
10  
12  
14  
16  
18  
20  
20  
20  
Temperature (ºC)  
Temperature (ºC)  
Supply Voltage (V)  
Turn-Off Delay Time  
Shutdown Delay Time  
vs.Temperature  
Shutdown Delay Time  
vs. VDD Supply Voltage  
vs. Supply Voltage  
500  
400  
300  
200  
100  
0
350  
300  
250  
200  
150  
100  
50  
350  
300  
250  
200  
150  
100  
50  
0
0
10  
12  
14  
16  
18  
20  
-25  
0
25  
50  
75  
100 125  
0
5
10  
15  
Supply Voltage (V)  
Temperature (ºC)  
Supply Voltage (V)  
Turn-On Rise Time vs.Temperature  
Turn-Off Fall Time vs.Temperature  
Turn-On Rise Time vs. Voltage  
50  
40  
30  
20  
10  
0
50  
40  
30  
20  
10  
0
35  
30  
25  
20  
15  
10  
5
0
-50  
-25  
0
25  
50  
75  
100 125  
-25  
0
25  
50  
75  
100 125  
10  
12  
14  
16  
18  
Temperature (ºC)  
Temperature (ºC)  
Supply Voltage (V)  
Turn-Off Fall Time vs. Voltage  
Logic “0” Input Threshold vs. VDD  
Logic “1” Input Threshold vs. VDD  
12  
10  
8
12  
10  
8
35  
30  
25  
20  
15  
10  
5
6
6
4
4
2
2
0
0
0
10  
12  
14  
16  
18  
20  
3
6
9
12  
15  
18  
21  
0
3
6
9
12  
15  
18  
21  
Supply Voltage (V)  
VDD (V)  
VDD (V)  
8
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R02  
IX2120  
INTEGRATED  
C
IRCUITS  
D
IVISION  
Logic "0" Input Threshold  
Logic "1" Input Threshold  
Logic "0" Input Current  
vs.Temperature  
vs.Temperature  
vs.Temperature  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
15  
12  
9
15  
12  
9
6
6
3
3
0
0
-50  
-25  
0
25  
50  
75  
100 125  
-50  
-25  
0
25  
50  
75  
100 125  
-50  
-25  
0
25  
50  
75  
100 125  
Temperature (ºC)  
Temperature (ºC)  
Temperature (ºC)  
Logic "1" Input Current  
VCC Supply Current vs.Temperature  
vs.Temperature  
VDD Supply Current vs.Temperature  
100  
80  
60  
40  
20  
0
20  
15  
10  
5
600  
500  
400  
300  
200  
100  
0
0
-50  
-25  
0
25  
50  
75  
100 125  
-50  
-25  
0
25  
50  
75  
100 125  
-50  
-50  
10  
-25  
0
25  
50  
75  
100 125  
Temperature (ºC)  
Temperature (ºC)  
Temperature (ºC)  
VBMSM Supply Current  
vs.Temperature  
VBS Supply Current vs.Temperature  
VDD Supply Current vs. Voltage  
500  
400  
300  
200  
100  
0
550  
500  
450  
400  
350  
300  
250  
200  
150  
100  
50  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
0
-50  
-25  
0
25  
50  
75  
100 125  
-25  
0
25  
50  
75  
100 125  
0
5
10  
15  
20  
Temperature (ºC)  
Temperature (ºC)  
VDD Supply Voltage (V)  
VCC Supply Current vs. Voltage  
VBS Supply Current vs. Voltage  
VBMSM Supply Current vs. Voltage  
500  
400  
300  
200  
100  
0
500  
400  
300  
200  
100  
0
600  
500  
400  
300  
200  
100  
0
10  
12  
14  
16  
18  
20  
12  
14  
16  
18  
20  
10  
12  
14  
16  
18  
20  
VCC Supply Voltage (V)  
VBS Floating Supply Voltage (V)  
VBMSM Supply Voltage (V)  
R02  
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9
IX2120  
INTEGRATED  
C
IRCUITS  
D
IVISION  
High/Middle Supply Leakage Current  
High/Middle Supply Leakage Current  
vs. VB / VBM Voltage  
VCCUV+  
vs.Temperature  
vs.Temperature  
50  
40  
30  
20  
10  
0
500  
400  
300  
200  
100  
0
11  
10  
9
8
7
6
-50  
-50  
-50  
-50  
-25  
0
25  
50  
75  
100 125  
0
100  
200  
300  
400  
500  
600  
-50  
-50  
-50  
10  
-25  
-25  
-25  
0
25  
50  
75  
100 125  
100 125  
100 125  
Temperature (ºC)  
Boost Voltage (V)  
Temperature (ºC)  
VCCUV-  
vs.Temperature  
VBSUV+  
VBSUV-  
vs.Temperature  
vs.Temperature  
11  
10  
9
11  
10  
9
11  
10  
9
8
8
8
7
7
7
6
6
6
-25  
0
25  
50  
75  
100 125  
-50  
-50  
10  
-25  
0
25  
50  
75  
100 125  
0
25  
50  
75  
Temperature (ºC)  
Temperature (ºC)  
Temperature (ºC)  
Low Level Output Voltage  
vs.Temperature  
(IO=20mA)  
High Level Output Voltage  
vs.Temperature  
(IO=0mA)  
Output Source Current  
vs.Temperature  
5
4
3
2
1
0
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
5
4
3
2
1
0
-25  
0
25  
50  
75  
100 125  
-25  
0
25  
50  
75  
100 125  
0
25  
50  
75  
Temperature (ºC)  
Temperature (ºC)  
Temperature (ºC)  
Output Sink Current  
vs.Temperature  
Output Sink Current vs. Voltage  
Output Source Current vs. Voltage  
5
4
3
2
1
0
5
4
3
2
1
0
5
4
3
2
1
0
-25  
0
25  
50  
75  
100 125  
12  
14  
16  
18  
20  
12  
14  
16  
18  
20  
Temperature (ºC)  
Supply Voltage (V)  
Supply Voltage (V)  
10  
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R02  
IX2120  
INTEGRATED  
C
IRCUITS  
D
IVISION  
Low Level Output Voltage  
vs. Supply Voltage  
High Level Output Voltage  
vs. Supply Voltage  
5
4
3
2
1
0
200  
160  
120  
80  
40  
0
10  
12  
14  
16  
18  
20  
10  
12  
14  
16  
18  
20  
Supply Voltage (V)  
VCC Supply Voltage (V)  
R02  
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11  
IX2120  
INTEGRATED  
C
IRCUITS  
D
IVISION  
3 Manufacturing Information  
3.1 Moisture Sensitivity  
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated  
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the  
latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product  
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee  
proper operation of our devices when handled according to the limitations and information in that standard as well as  
to any limitations set forth in the information or standards referenced below.  
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced  
product performance, reduction of operable life, and/or reduction of overall reliability.  
This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled  
according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.  
Device  
Moisture Sensitivity Level (MSL) Classification  
IX2120B  
MSL 1  
3.2 ESD Sensitivity  
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.  
3.3 Soldering Profile  
Provided in the table below is the Classification Temperature (T ) of this product and the maximum dwell time the  
C
body temperature of this device may be above (T - 5)ºC. The classification temperature sets the Maximum Body  
C
Temperature allowed for this device during lead-free reflow processes. For through hole devices, and any other  
processes, the guidelines of J-STD-020 must be observed.  
Classification Temperature (TC)  
Dwell Time (tp)  
Device  
Max Reflow Cycles  
IX2120B  
260°C  
30 seconds  
3
3.4 Board Wash  
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. Board washing to reduce or  
remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to  
prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash and  
providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing  
process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature  
and duration necessary to remove the moisture trapped within the package is the responsibility of the user  
(assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be  
used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based.  
12  
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IVISION  
3.5 Mechanical Dimensions  
3.5.1 IX2120: 28-Pin SOIC Package  
17.70 to 18.10  
Recommended PCB Land Pattern  
(0.697 to 0.713)  
See Note 3  
7.40 to 7.60  
(0.291 to 0.299)  
See Note 4  
9.30  
(0.366)  
10.00 to 10.65  
(0.394 to 0.419)  
2.00  
(0.079)  
1.27  
(0.050)  
0.60  
(0.024)  
0.31 to 0.51 28x  
(0.012 to 0.020) 28x  
Pin 1  
DIMENSIONS  
MIN to MAX mm  
Identifier  
(MIN to MAX inches)  
0.20 to 0.33  
(0.008 to 0.013)  
See Note 6  
0.25 to 0.75 x 45º  
2.35 to 2.65  
(0.093 to 0.104)  
(0.010 to 0.030) x 45º  
See Note 5  
0.10 to 0.30  
(0.004 to 0.012)  
0.10  
(0.004)  
Seating Plane  
1.27 26x  
(0.05) 26x  
5º to 15º 4x  
0.40 to 1.27  
(0.016 to 0.050)  
0º to 8º  
Notes:  
1. All dimensions are in mm / (inches).  
2. This package conforms to JEDEC Standard MS-013, variation AE issue C.  
3. Dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15mm per end.  
4. Dimension does not include interlead flash or protrusion. Interlead flash or protrusion shall not exceed 0.25mm per side.  
5. This chamfer is optional. If it is not present, then a Pin 1 identifier must be located as shown.  
6. The dimension applies to the flat section of the lead between 0.10mm to 0.25mm from the lead tip.  
3.5.2 IX2120 Tape & Reel Information  
P=12.00  
(0.472)  
A0=10.90  
(0.429)  
330.2 DIA.  
(13.00 DIA)  
Top Cover  
Tape Thickness  
0.102 MAX  
(0.004 MAX)  
B0=18.30  
(0.720)  
W=24.00+0.03/-0.01  
(0.945+0.001/-0.0004)  
K0=3.20  
(0.126)  
K1=2.70  
(0.106)  
Dimensions  
mm  
Embossed Carrier  
(inches)  
Notes:  
1. Unless otherwise specified, all dimensional tolerances per EIA standard 481  
2. Unless otherwise specified, all dimensions ±0.10 (0.004)  
Embossment  
For additional information please visit our website at: www.ixysic.com  
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make  
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated  
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its  
products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.  
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other  
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe  
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.  
Specification: DS-IX2120-R02  
©Copyright 2016, IXYS Integrated Circuits Division  
All rights reserved. Printed in USA.  
2/3/2016  
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13  
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