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IX2127G

型号：

IX2127G

描述：

高电压功率MOSFET和IGBT驱动器[ High-Voltage Power MOSFET & IGBT Driver ]

品牌：

CLARE[ CLARE ]

页数：

12 页

PDF大小：

1636 K

下载PDF手册
IX2127  
High-Voltage  
Power MOSFET & IGBT Driver  
Driver Characteristics  
Description  
The IX2127 is a high-voltage, high-speed power  
MOSFET and IGBT driver. High-voltage level-shift  
circuitry enables this device to operate up to 600V.  
Clare’s proprietary common-mode design techniques  
provide stable operation in high dV/dt noise  
environments.  
Parameter  
VOFFSET  
Rating  
Units  
600  
250/500  
250  
V
IO +/- (Source/Sink)  
VCSth  
mA  
mV  
ns  
tON / tOFF (Typical)  
100  
An on-board comparator can be used to detect an  
over-current condition in the driven MOSFET or IGBT  
device, and then shut down drive to that device. An  
open-drain output, FAULT, indicates that an  
over-current shutdown has occurred.  
Features  
• Floating Channel Designed for Bootstrap Operation  
up to 600V  
• Tolerant to Negative Transient Voltages; dV/dt  
Immune  
The gate driver output typically can source 250mA  
and sink 500mA, which is suitable for fluorescent lamp  
ballast, motor control, SMPS, and other converter  
drive topologies.  
• Undervoltage Lockout  
• 3.3V, 5V, and 12V Input Logic Compatible  
• Open-Drain FAULT Indicator Pin Shows  
Over-Current Shutdown  
• Output in Phase with the Input  
The IX2127 is provided in 8-pin DIP and 8-pin SOIC  
packages, and is available in Tape & Reel versions.  
See ordering information below.  
Applications  
• High-Speed Gate Driver  
• Motor Drive Inverter  
Ordering Information  
Part  
Description  
RoHS  
2002/95/EC  
Pb  
e3  
IX2127G  
8-Pin DIP (50/Tube)  
IX2127N  
8-Pin SOIC (100/Tube)  
8-Pin SOIC (2000/Reel)  
IX2127NTR  
IX2127 Block Diagram  
VB  
VCC  
Low Side High Side  
Undervoltage Lockout  
Buffer  
VCC  
HO  
VS  
Low-High  
Level Shift  
Data Latch  
Transmitter  
Receiver  
IN  
Enable  
Blanking  
Signal  
Delay  
FAULT  
Enable  
Data Latch  
Q
R
S
High-Low  
Level Shift  
+
_
Receiver  
Transmitter  
CS  
COM  
Comparator  
DS-IX2127 - R02  
www.clare.com  
1
IX2127  
1. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
1.1 Package Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
1.2 Pin Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
1.3 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
1.4 Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4  
1.5 General Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4  
1.6 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4  
1.7 Timing Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5  
2. Performance Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7  
3. Manufacturing Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
3.1 Moisture Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
3.2 ESD Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
3.3 Reflow Profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
3.4 Board Wash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
3.5 Mechanical Dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
2
www.clare.com  
R02  
IX2127  
1.2 Pin Description  
1 Specifications  
1.1 Package Pinout  
Pin#  
Name  
Description  
Logic Supply Voltage  
V
1
2
3
4
5
CC  
VCC  
IN  
1
2
3
4
8
7
6
5
VB  
HO  
CS  
VS  
IN  
Logic Input  
FAULT  
COM  
Fault Indicator Output  
Logic Ground  
FAULT  
COM  
V
High Side Return  
S
Comparator Input,  
Over-Current Detect  
6
CS  
HO  
7
8
High Side Gate Drive Output  
High Side Supply Voltage  
V
B
1.3 Absolute Maximum Ratings  
Unless otherwise specified, ratings are provided at T =25°C and all bias levels are with respect to COM.  
A
Parameter  
Symbol  
Minimum  
Maximum  
Units  
V
Logic Supply Voltage  
-0.3  
-0.3  
15  
625  
CC  
V
High Side Floating Supply Voltage  
High Side Floating Offset Voltage  
Logic Input Voltage  
B
V
VB-12  
VB+0.3  
S
V
VCC+0.3  
VB+0.3  
VB+0.3  
IN  
-0.3  
V
V
High Side Floating Output Voltage  
Current Sense Voltage  
VS-0.3  
HO  
V
VS-0.3  
CS  
V
FAULT Output Voltage  
Allowable Offset Supply Voltage Transient  
Package Power Dissipation  
8-Lead DIP  
V
CC+0.3  
FLT  
-0.3  
-
dV /dt  
S
50  
V/ns  
-
-
1
P
W
D
8-Lead SOIC  
0.625  
150  
T
Junction Temperature  
Storage Temperature  
-
J
°C  
T
-55  
150  
S
Absolute maximum electrical ratings are at 25°C  
Absolute maximum ratings are stress ratings. Stresses in  
excess of these ratings can cause permanent damage to  
the device. Functional operation of the device at conditions  
beyond those indicated in the operational sections of this  
data sheet is not implied.  
R02  
www.clare.com  
3
IX2127  
1.4 Recommended Operating Conditions  
Parameter  
Logic Supply  
Symbol  
Minimum  
Maximum  
Units  
V
9
12  
CC  
V
High Side Floating Supply  
High Side Offset Voltage  
Logic Input Voltage  
VS+9  
VS+12  
B
V
-5  
600  
VCC  
S
V
V
IN  
0
V
High Side Floating Output  
Current Sense Signal Voltage  
FAULT Output Voltage  
VS  
VB  
HO  
V
VS  
VS+5  
VCC  
CS  
V
FLT  
0
T
Ambient Temperature  
-40  
+125  
°C  
A
1.5 General Conditions  
Typical values are characteristic of the device at 25°C  
and are the result of engineering evaluations. They are  
provided for information purposes only and are not  
part of the manufacturing testing requirements.  
Unless otherwise noted, all electrical specifications  
are listed for T =25°C.  
A
1.6 Electrical Characteristics  
Unless otherwise specified, the test conditions are: V =V =12V; V , IN, FAULT, and Leakage voltages and  
CC  
BS  
CC  
currents are referenced to COM; V , HO, and CS voltages and currents are referenced to V .  
B
S
1.6.1 Power Supply Specifications  
Parameter  
Conditions  
Symbol  
IQCC  
Minimum  
Typical Maximum Units  
Quiescent V Supply Current  
CC  
V =0V  
IN  
-
-
280  
500  
7.7  
7.2  
-
400  
1000  
8.6  
8.1  
2
A  
Quiescent V Supply Current  
BS  
V =0V  
IN  
IQBS  
V
V
UVLO Positive-Going Threshold  
UVLO Negative-Going Threshold  
-
VBS_UV+  
VBS_UV-  
ILKG  
BS  
BS  
6.8  
6.3  
-
V
-
V =V =600V  
S
Offset Supply Leakage Current  
A  
B
1.6.2 Gate Drive and Shutdown Specifications  
Parameter  
Conditions  
Symbol  
VOH  
Minimum  
Typical Maximum Units  
High Level Output Voltage, V -V  
B
I
=0A  
HO  
HO  
HO  
-
-
-
-
100  
100  
mV  
Low Level Output Voltage, V  
I
=0A  
VOL  
HO  
Output Short Circuit Pulsed Current  
V
=0V, V =5V, PW<10s,  
HO  
IN  
I
-200  
420  
-250  
500  
-
-
HO+  
R
=20* (see Figure 1)  
GATE  
mA  
V
=12V, V =0V, PW<10s,  
HO  
IN  
I
HO-  
R
=20* (see Figure 1)  
GATE  
V
=9V to 12V  
CS Input, Positive-Going Threshold  
“High” CS Bias Current  
VCS_TH+  
ICS+  
CC  
180  
260  
320  
1
mV  
V
=3V  
=0V  
CS  
CS  
-
-
-
-
A  
V
ICS-  
-1  
* R  
4
value must be 20or greater.  
GATE  
www.clare.com  
R02  
IX2127  
1.6.3 Logic I/O Specifications  
Parameter  
Logic “1” Input Voltage  
Conditions  
Symbol  
VIH  
Minimum  
Typical Maximum Units  
V
V
=9V to 12V  
CC  
3.0  
-
-
-
0.8  
15  
-1  
-
V
=9V to 12V  
Logic “0” Input Voltage  
VIL  
CC  
-
-
-
-
V =5V  
IN  
Logic “1” Input Bias Current  
Logic “0” Input Bias Current  
FAULT On-Resistance  
IIN+  
2.6  
-
A  
V =0V  
IN  
IIN-  
-
FLT, RON  
72  
1.6.4 Thermal Specifications  
Parameter  
Conditions  
Symbol  
Minimum  
Typical Maximum Units  
Thermal Resistance, Junction to Ambient:  
8-Lead DIP  
-
-
-
-
125  
200  
R
-
°C/W  
JA  
8-Lead SOIC  
1.7 Timing Characteristics  
Parameter  
Conditions  
Symbol  
ton  
Minimum  
Typical Maximum Units  
Turn-On Propagation Delay  
Turn-Off Propagation Delay  
Turn-On Rise Time  
-
100  
73  
200  
200  
130  
65  
toff  
-
tr  
-
23  
V
=V =12V,  
CC BS  
C =1nF,  
L
Turn-Off Fall Time  
tf  
ns  
-
20  
T =25°C  
A
Start-Up Blanking Delay  
CS Shutdown Propagation Delay  
CS to FLT Propagation Delay  
tblk  
tCS  
tFLT  
550  
766  
220  
236  
950  
360  
510  
-
-
Figure 1. Typical Connection Diagram  
VCC  
IN  
VCC  
1
2
3
4
8
7
6
5
VB  
IN  
HO  
CS  
VS  
RGATE  
FAULT  
FAULT  
COM  
R02  
www.clare.com  
5
IX2127  
1.7.1 I/O Timing Diagram  
1.7.4 CS Shutdown Waveforms  
IN  
VCS_TH+  
CS  
CS  
HO  
FAULT  
HO  
tcs  
90%  
1.7.2 Switching Time Waveforms  
50%  
IN  
1.7.5 CS to FLT Waveforms  
90%  
VCS_TH+  
10%  
HO  
CS  
tflt  
ton  
tr  
toff  
tf  
90%  
FAULT  
1.7.3 Startup Blanking Time Waveforms  
50%  
IN  
tblk  
CS  
90%  
HO  
FAULT  
6
www.clare.com  
R02  
IX2127  
2 Performance Data  
VBS Undervoltage Lockout  
Positive-Going Threshold UVLO+  
Quiescent VCC Supply Current IQCC  
vs. Voltage  
Quiescent VBS Supply Current IQBS  
vs. Voltage  
vs.Temperature  
250  
200  
150  
100  
50  
500  
400  
300  
200  
100  
0
10  
8
6
4
2
0
0
9.0  
9.5  
10.0  
10.5  
11.0  
11.5  
12.0  
9.0  
9.5  
10.0  
10.5  
11.0  
11.5  
12.0  
-50  
-25  
0
25  
50  
75  
100 125  
Temperature (ºC)  
VCC Supply Voltage (V)  
VBS Supply Voltage (V)  
VBS Undervoltage Lockout  
Negative-Going Threshold UVLO-  
vs.Temperature  
Quiescent VCC Supply Current IQCC  
vs.Temperature  
Quiescent VBS Supply Current IQBS  
vs.Temperature  
300  
250  
200  
150  
100  
50  
500  
400  
300  
200  
100  
0
10  
8
6
4
2
0
0
-50  
-25  
0
25  
50  
75  
100 125  
-50  
-25  
0
25  
50  
75  
100 125  
-50  
-25  
0
25  
50  
75  
100 125  
Temperature (ºC)  
Temperature (ºC)  
Temperature (ºC)  
CS Input Positive Going Threshold  
Logic "0" Input Threshold Voltage  
Logic "1" Input Threshold Voltage  
vs. VCC  
vs. VCC  
vs. VCC  
350  
300  
250  
200  
150  
100  
50  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
0
9.0  
9.5  
10.0  
10.5  
11.0  
11.5  
12.0  
9.0  
9.5  
10.0  
10.5  
11.0  
11.5  
12.0  
9.0  
9.5  
10.0  
10.5  
11.0  
11.5  
12.0  
VCC Supply Voltage (V)  
VCC Supply Voltage (V)  
VCC Supply (V)  
Logic "0" Input Threshold Voltage  
vs.Temperature  
CS Input Positive Going Threshold  
vs.Temperature  
Logic "1" Input Threshold Voltage  
vs.Temperature  
(VCC=12V)  
(VCC=12V)  
(VCC=12V)  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
350  
300  
250  
200  
150  
100  
50  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
0
-50  
-25  
0
25  
50  
75  
100 125  
-50  
-25  
0
25  
50  
75  
100 125  
-50  
-25  
0
25  
50  
75  
100 125  
Temperature (ºC)  
Temperature (ºC)  
Temperature (ºC)  
R02  
www.clare.com  
7
IX2127  
Turn-On Rise Time  
vs. Supply Voltage  
Logic "1" Input Current IIN+  
vs. Voltage  
Turn-On Time vs. Supply Voltage  
200  
175  
150  
125  
100  
75  
5
4
3
2
1
0
200  
175  
150  
125  
100  
75  
50  
50  
25  
25  
0
0
9.0  
9.5  
10.0  
10.5  
11.0  
11.5  
12.0  
9.0  
9.5  
10.0  
10.5  
Voltage (V)  
11.0  
11.5  
12.0  
9.0  
-50  
9.0  
-50  
9.5  
10.0  
10.5  
11.0  
11.5  
12.0  
Supply Voltage (V)  
VBIAS Supply Voltage (V)  
Logic "1" Input Current IIN+  
Turn-On Time vs.Temperature  
(VCC=VBS=12V)  
Turn-On Rise Time vs.Temperature  
(VCC=VBS=12V)  
vs.Temperature  
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
200  
175  
150  
125  
100  
75  
200  
150  
100  
50  
50  
25  
0
0
-50  
-25  
0
25  
50  
75  
100 125  
-25  
0
25  
50  
75  
100 125  
-50  
-25  
0
25  
50  
75  
100 125  
Temperature (ºC)  
Temperature (ºC)  
Temperature (ºC)  
Logic "0" Input Current IIN-  
vs. Voltage  
Turn-Off Fall Time  
vs. Supply Voltage  
Turn-Off Time vs. Supply Voltage  
1.0  
0.5  
25  
20  
15  
10  
5
200  
175  
150  
125  
100  
75  
0.0  
-0.5  
-1.0  
50  
25  
0
0
9.0  
9.5  
10.0  
10.5  
11.0  
11.5  
12.0  
9.0  
9.5  
10.0  
10.5  
11.0  
11.5  
12.0  
9.5  
10.0  
10.5  
11.0  
11.5  
12.0  
Voltage (V)  
VBIAS Supply Voltage (V)  
Supply Voltage (V)  
Logic "0" Input Current IIN-  
Turn-Off Time vs.Temperature  
(VCC=VBS=12V)  
Turn-Off Fall Time vs.Temperature  
(VCC=VBS=12V)  
vs.Temperature  
1.0  
0.5  
200  
175  
150  
125  
100  
75  
50  
40  
30  
20  
10  
0
0.0  
-0.5  
-1.0  
50  
25  
0
-50  
-25  
0
25  
50  
75  
100 125  
-25  
0
25  
50  
75  
100 125  
-50  
-25  
0
25  
50  
75  
100 125  
Temperature (ºC)  
Temperature (ºC)  
Temperature (ºC)  
8
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R02  
IX2127  
Output Sink Current  
vs. V Bias Voltage  
(VCC=VBS=VBIAS, VIN=0V, PW≤10μs)  
High-Level Output Voltage VOH (VB-VHO  
)
Output Source Current vs. Voltage  
(VCC=VBS=VBIAS, VIN=5V, PW≤10μs)  
vs.Temperature  
600  
500  
400  
300  
200  
100  
0
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
300  
250  
200  
150  
100  
50  
Ref. Fig. 1: RGATE=20Ω  
Ref. Fig. 1: RGATE=20Ω  
-10  
0
10.0  
10.0  
10.5  
11.0  
11.5  
12.0  
-50  
-50  
9.0  
-25  
0
25  
50  
75  
100 125  
10.5  
11.0  
11.5  
12.0  
VBIAS Voltage (V)  
Temperature (ºC)  
VBIAS Voltage (V)  
Output Source Current  
vs.Temperature  
(VCC=VBS=12V, VIN=5V, PW≤10μs)  
Output Sink Current  
vs.Temperature  
(VCC=VBS=12V, VIN=0V, PW≤10μs)  
Low-Level Output Voltage VOL  
vs.Temperature  
350  
300  
250  
200  
150  
100  
50  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
600  
500  
400  
300  
200  
100  
0
Ref. Fig. 1: RGATE=20Ω  
Ref. Fig. 1: RGATE=20Ω  
0
-10  
-50  
-25  
0
25  
50  
75  
100 125  
-50  
9.0  
-50  
-25  
0
25  
50  
75  
100 125  
-25  
0
25  
50  
75  
100 125  
Temperature (ºC)  
Temperature (ºC)  
Temperature (ºC)  
Start-Up Blanking Delay  
vs. Input Voltage  
CS to FLT Propagation Delay  
vs. VCC Supply Voltage  
CS Shutdown Propagation Delay  
vs. Input Voltage  
700  
600  
500  
400  
300  
200  
100  
0
350  
300  
250  
200  
150  
100  
50  
250  
200  
150  
100  
50  
0
0
9.5  
10.0  
10.5  
11.0  
11.5  
12.0  
9.5  
10.0  
10.5  
11.0  
11.5  
12.0  
9.0  
9.5  
10.0  
10.5  
11.0  
11.5  
12.0  
Input Voltage (V)  
VCC Supply Voltage (V)  
Input Voltage (V)  
Start-Up Blanking Delay  
vs.Temperature  
CS to FLT Propagation Delay  
vs.Temperature  
CS Shutdown Propogation Delay  
vs.Temperature  
(VCC=VBS=12V)  
(VCC=VBS=12V)  
800  
700  
600  
500  
400  
300  
200  
100  
0
300  
250  
200  
150  
100  
50  
350  
300  
250  
200  
150  
100  
50  
0
0
-50  
-25  
0
25  
50  
75  
100 125  
-50  
-25  
0
25  
50  
75  
100 125  
-25  
0
25  
50  
75  
100 125  
Temperature (ºC)  
Temperature (ºC)  
Temperature (ºC)  
R02  
www.clare.com  
9
IX2127  
3 Manufacturing Information  
3.1 Moisture Sensitivity  
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. Clare classified  
all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint  
industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our  
products to the maximum conditions set forth in the standard, and guarantee proper operation of our  
devices when handled according to the limitations and information in that standard as well as to any limitations set  
forth in the information or standards referenced below.  
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced  
product performance, reduction of operable life, and/or reduction of overall reliability.  
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to  
the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.  
Device  
Moisture Sensitivity Level (MSL) Rating  
IX2127G / IX2127N  
MSL 1  
3.2 ESD Sensitivity  
This product is ESD Sensitive, and should be handled according to the industry standard  
JESD-625.  
3.3 Reflow Profile  
This product has a maximum body temperature and time rating as shown below. All other guidelines of  
J-STD-020 must be observed.  
Device  
Maximum Temperature x Time  
IX2127G  
IX2127N  
250°C for 30 seconds  
260°C for 30 seconds  
3.4 Board Wash  
Clare recommends the use of no-clean flux formulations. However, board washing to remove flux residue is  
acceptable, and the use of a short drying bake may be necessary. Chlorine-based or Fluorine-based solvents or  
fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used.  
RoHS  
2002/95/EC  
Pb  
e3  
10  
www.clare.com  
R02  
IX2127  
3.5 Mechanical Dimensions  
3.5.1 8-Pin DIP Through-Hole Package  
9.652 0.381  
(0.380 0.015)  
PCB Hole Pattern  
7.620 0.254  
(0.300 0.010)  
2.540 0.127  
(0.100 0.005)  
8-0.800 DIA.  
2.540 0.127  
(8-0.031 DIA.)  
(0.100 0.005)  
9.144 0.508  
(0.360 0.020)  
6.350 0.127  
(0.250 0.005)  
6.350 0.127  
(0.250 0.005)  
3.302 0.051  
(0.130 0.002)  
0.457 0.076  
(0.018 0.003)  
7.620 0.127  
(0.300 0.005)  
7.239 TYP.  
(0.285)  
0.254 TYP  
(0.01)  
7.620 0.127  
(0.300 0.005)  
4.064 TYP  
(0.160)  
Dimensions  
0.889 0.102  
mm  
(0.035 0.004)  
(inches)  
3.5.2 8-Pin SOIC Package  
PCB Land Pattern  
0.1905 / 0.2489  
(0.0075 / 0.0098)  
3.810 / 3.988  
(0.150 / 0.157)  
5.30  
(0.209)  
5.8014 / 6.1976  
(0.2284 / 0.2440)  
1.50  
(0.059)  
0.406 / 1.270  
(0.016 / 0.050)  
1.372 / 1.575  
(0.054 / 0.062)  
1.27 TYP  
(0.05 TYP)  
0.60  
(0.024)  
0.356 / 0.457  
(0.014 / 0.018)  
1.27  
(0.050)  
4.801 / 4.978  
(0.189 / 0.196)  
0.1016 / 0.2489  
(0.0040 / 0.0098)  
Dimensions  
mm MIN / mm MAX  
(inches MIN / inches MAX)  
0.533 REF  
(0.021 REF)  
1.524 / 1.727  
(0.060 / 0.068)  
R02  
www.clare.com  
11  
IX2127  
3.5.3 Tape & Reel Packaging for 8-Pin SOIC Package  
330.2 DIA.  
(13.00 DIA.)  
Top Cover  
W=12.00  
(0.472)  
Tape Thickness  
B0=5.30  
(0.209)  
0.102 MAX.  
(0.004 MAX.)  
A0=6.50  
(0.256)  
P=8.00  
(0.315)  
K0= 2.10  
(0.083)  
Dimensions  
mm  
(inches)  
User Direction of Feed  
Embossed Carrier  
Embossment  
NOTE: Tape dimensions not shown comply with JEDEC Standard EIA-481-2  
For additional information please visit our website at: www.clare.com  
Clare, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and  
product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in Clare’s Standard Terms and Conditions of Sale,  
Clare, Inc. assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for  
a particular purpose, or infringement of any intellectual property right.  
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other  
applications intended to support or sustain life, or where malfunction of Clare’s product may result in direct physical harm, injury, or death to a person or severe property or environmental  
damage. Clare, Inc. reserves the right to discontinue or make changes to its products at any time without notice.  
Specification: DS-IX2127-R02  
©Copyright 2011, Clare, Inc.  
All rights reserved. Printed in USA.  
8/8/2011  
12  
www.clare.com  
R02  
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