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IXTR62N15P

型号:

IXTR62N15P

品牌:

IXYS[ IXYS CORPORATION ]

页数:

2 页

PDF大小:

202 K

Preliminary Technical Information  
PolarHTTM Power  
MOSFET  
IXTC 62N15P  
IXTR 62N15P  
VDSS = 150  
ID25 = 36  
RDS(on) 45 mΩ  
V
A
(Electrically Isolated Tab)  
N-Channel Enhancement Mode  
Avalanche Rated  
Symbol  
Test Conditions  
Maximum Ratings  
ISOPLUS220 (IXTC)  
E153432  
VDSS  
VDGR  
TJ = 25° C to 150° C  
TJ = 25° C to 150° C; RGS = 1 MΩ  
150  
150  
V
V
VGS  
VGSM  
Continuous  
Transient  
20  
30  
V
V
G
D
S
ID25  
IDM  
TC =25°C  
TC = 25° C, pulse width limited by TJM  
36  
150  
A
A
Isolated back surface  
ISOPLUS247 (IXTR)  
E153432  
IAR  
EAR  
EAS  
TC =25°C  
TC =25°C  
TC =25°C  
50  
30  
1.0  
A
mJ  
J
dv/dt  
PD  
IS IDM, di/dt 100 A/µs, VDD VDSS  
TJ 150° C, RG = 10 Ω  
,
10  
V/ns  
G
TC =25°C  
150  
W
D
Isolated back surface  
S
TJ  
TJM  
Tstg  
-55 ... +175  
150  
-55 ... +150  
°C  
°C  
°C  
G = Gate  
D = Drain  
S = Source  
TAB = Drain  
TL  
FC  
1.6 mm (0.062 in.) from case for 10 s  
300  
°C  
Features  
Mounting force  
ISOPLUS220  
ISOPLUS247  
11..65 / 2.5..15  
20..120 / 4.5..25  
N/lb  
N/lb  
l
International standard isolated  
packages  
UL recognized packages  
l
Weight  
ISOPLUS220  
ISOPLUS247  
3
5
g
g
l
Silicon chip on Direct-Copper-Bond  
substrate  
- High power dissipation  
- Isolated mounting surface  
- 2500V electrical isolation  
Unclamped Inductive Switching (UIS)  
rated  
Low package inductance  
- easy to drive and to protect  
Fast intrinsic diode  
Symbol  
Test Conditions  
Characteristic Values  
(TJ = 25° C unless otherwise specified)  
Min. Typ.  
Max.  
l
l
l
BVDSS  
VGS(th)  
IGSS  
VGS = 0 V, ID = 250 µA  
VDS = VGS, ID = 250 µA  
150  
V
V
3.0  
5.0  
VGS  
=
20 VDC, VDS = 0  
100  
nA  
Advantages  
IDSS  
VDS = VDSS  
VGS = 0 V  
10  
200  
µA  
µA  
l
Easy to mount  
Space savings  
TJ = 125° C  
l
RDS(on)  
VGS = 10 V, ID = 31 A, Note 1  
45 mΩ  
l
High power density  
DS99622E(05/06)  
© 2006 IXYS All rights reserved  
IXTC 62N15P  
IXTR 62N15P  
Symbol  
gfs  
Test Conditions  
Characteristic Values  
ISOPLUS220TM (IXTC) Outline  
(TJ = 25°C unless otherwise specified)  
Min. Typ.  
Max.  
VDS= 20 V; ID = 31 A, Note 1  
14  
24  
S
Ciss  
Coss  
Crss  
2250  
660  
pF  
pF  
pF  
VGS = 0 V, VDS = 25 V, f = 1 MHz  
185  
td(on)  
tr  
td(off)  
tf  
27  
38  
76  
35  
ns  
ns  
ns  
ns  
VGS = 10 V, VDS = 0.5 VDSS, ID = 62 A  
RG = 10 (External)  
Note:  
Bottom heatsink (Pin 4) is  
electrically isolated from Pin  
1,2, or 3.  
Qg(on)  
Qgs  
70  
20  
38  
nC  
nC  
nC  
VGS= 10 V, VDS = 0.5 VDSS, ID = 31 A  
Qgd  
RthJC  
RthCS  
1.0 °C/W  
°C/W  
0.15  
Source-Drain Diode  
Characteristic Values  
TJ = 25° C unless otherwise specified)  
Symbol  
IS  
Test Conditions  
Min. Typ.  
Max.  
VGS = 0 V  
62  
A
A
V
Ref: IXYS CO 0177 R0  
ISM  
Repetitive  
150  
1.5  
ISOPLUS247 (IXTR) Outline  
VSD  
IF = IS, VGS = 0 V, Note 1  
trr  
IF = 25 A, -di/dt = 100 A/µs  
150  
2.0  
ns  
QRM  
VR = 100 V, VGS = 0 V  
µC  
Note 1: Pulse test, t 300 µs, duty cycle d 2 %;  
2: Test current I IT = 62 A.  
PRELIMINARYTECHNICALINFORMATION  
The product presented herein is under development. The Technical Specifications  
offered are derived from data gathered during objective characterizations of preliminary  
engineering lots; but also may yet contain some information supplied during a pre-  
production design evaluation. IXYS reserves the right to change limits, test conditions,  
and dimensions without notice.  
IXYS reserves the right to change limits, test conditions, and dimensions.  
IXYS MOSFETs and IGBTs are covered by 4,835,592 4,931,844  
one or moreof the following U.S. patents: 4,850,072 5,017,508  
4,881,106 5,034,796  
5,049,961  
5,063,307  
5,187,117  
5,237,481  
5,381,025  
5,486,715  
6,162,665  
6,259,123 B1  
6,306,728 B1  
6,404,065 B1 6,683,344  
6,534,343  
6,583,505  
6,727,585  
6,710,405B2 6,759,692  
6,710,463 6771478 B2  
7,005,734B2  
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