3 2 1 6 1 1 J S
版数
VER.
年月日
D A T E
ꢀꢀꢀꢀꢀꢀꢀꢀ変 更 内 容
ꢀꢀꢀꢀꢀꢀꢀꢀDESCRIPTION
製ꢀ図
DR.
担ꢀ当
CHK.
査ꢀ閲
APPD.
承ꢀ認
APPD.
CN NO.
9.39
) . O N G N I W A R D ( 号 番 面 図
1
8.2
LOT NO.(NOTE.4)
2-1.1 ±0.05
7.2 ±0.05
2-0.6 ±0.05
A
A1
A12
1 5 1 6 5
0.05 X Y Z
0
1.4
6.9
+0.06
8.34 -0.02
0.8
4.4
8
A1
6
A12
4
6.05
X
2-0.6 ±0.05
0.05 X Y Z
2-1.1 ±0.05
5
B12
B1
1
8.2
0.6 ±0.025
4-0.2 ±0.03
0.35 M A-B C D
APPLICABLE P.C.B DIMENSION(REF.)
適合基板寸法(参考）
2-1.2 ±0.05
0.3 M A-B
7.2 ±0.08
8.2
1.4
1
C
2-1.2 ±0.05
0.3 M A-B
4.4
0.8
A2
A1
12-0.3 ±0.03
0.05 X Y Z
0.95 ±0.05
12-0.15 ±0.05
0.15 M A-B C
Y
7
Z
0.66
0
9
0.65
3
1.35
1.35
0.65
MOUNTING CONDITION
(5 : 1)
2
0
0.91 ±0.15
0.65 ±0.05
6.65 ±0.1
5.5 ±0.2
B
0.75 ±0.025
A
1
12- 0.4 ±0.05
0.05 X Y Z
1.15
MATING BOTTOM FACE
12-0.2 ±0.05
A
0.1 M A-B C D
(10 : 1)
10 REAR SHIELD
9 LOCATOR
1
1
1
STAINLESS STEEL
NICKEL PLATING
PLATING THICKNESS:1μm Min.
HALOGEN-FREE
TABLE 2. PIN DEFINE
THERMOPLASTIC RESIN COLOR:BLACK
A12
A11
A10
A9
GND
SSRXp2
SSRXn2
VBUS
B1
B2
GND
SSTXp2
SSTXn2
VBUS
8 BRACKET
STAINLESS STEEL
STAINLESS STEEL
STAINLESS STEEL
STAINLESS STEEL
NICKEL PLATING
PLATING THICKNESS:1μm Min.
B3
7 SHELL
1
2
BLACK NICKEL PLATING
NICKEL PLATING
PLATING THICKNESS:1μm Min.
PLATING THICKNESS:0.8μm Min.
3.35
6.05
B4
6 GND PLATE
A8
SUB1
B5
B6
CC2
Dp2
MATED CONDITION
(5 : 1)
2.8
A7
Dn1
5 GND MID PLATE
4 INSULATOR
1
1
6
NICKEL PLATING
PLATING THICKNESS:1μm Min.
HALOGEN-FREE
10
A6
Dp1
B7
Dn2
THERMOPLASTIC RESIN COLOR:BLACK
A5
CC1
B8
SUB2
3 CONTACT C
COPPER ALLOY
COPPER ALLOY
TABLE 1
TABLE 1
TABLE 1
A4
VBUS
B9
VBUS
A3
A2
SSTXn1
SSTXp1
GND
B10
B11
B12
PIN
SSRXn1
SSRXp1
GND
2 CONTACT B
1 CONTACT A
6
NOTE 1.COPLANARITY OF SMT TERMINAL IS 0.1 MAX
NOTE 2.RECOMMENDED METAL MASK THICKNESS:120 um
NOTE 3.THE SHELL LENGTH IS LESS THAN THE MINIMUM SPECIFIED BY THE USB STANDARD.
12 COPPER ALLOY
A1
PIN
符号
NO.
名ꢀꢀꢀ称
DESCRIPTION
個ꢀ数
QTY.
材ꢀꢀ料
MATERIAL
仕ꢀ上
FINISH
備ꢀꢀ考
REMARKS
SIGNAL NAME
SIGNAL NAME
AS SUCH IT CANNOT INDEPENDENTLY BE GUARANTEED TO MEET ALL TYPE C MECHANICAL REQUIREMENTS.
TABLE 1
THE SYSTEM IMPLEMENTER IS RESPONSIBLE FOR ACHIEVING PRODUCT RELIABILITY AND PASSING USB COMPLIANCE TESTING.
REFERENCE THE USB TYPE C SPECIFICATION RELEASE 1.1,SECTION 3.2.1,NOTE7.
NOTE 4.LOT NUMBER IS MARKED AS INDIDATED.
仕様書(SPECIFICATION)
第1版(ORIGINAL DATE)
尺度(SCALE)
シリーズ(SERIES)
16/JUN/2015
DX07
日本航空電子工業株式会社
5:1
FINISH
PLATING THICKNESS
NICKEL:2μm MIN.
製図
DR.
名称(TITLE)
GOLD FLASH
CONTACT AREA OVER PLLADIUM-NICKEL PALLADIUM-NICKEL:0.75μm MIN.
(EX) 5 6 15 1
JAPAN AVIATION
ELECTRONICS
INDUSTRY,LTD.
一般公差(GENERAL TOLERANCE)
担当
CHK.
M.SASAKI
―
DX07S024XJ1
EQUIPMENT No. (NUMBER OR ALPHABET)
寸法(DIMENSION)
角度(ANGLES)
OVER NICKEL
GOLD FLASH:0.05μm MIN.
査閲
APPD.
DAY (TWO-DIGITS NUMBER)
±
±0.8
．
°
°
NICKEL:2μm MIN.
GOLD FLASH:0.03μm MIN.
版数
(VER.)
MONTH (NUN. TO SEP.:1 TO 9, OCT.:O, NOV.:X, DEC.:Y)
YEAR (END OF DIGIT AT CHRISTIAN ERA)
承認
APPD.
SOLDER TALES GOLD FLASH OVER NICKEL
図面番号(DRAWING NO.)
SJ116123
±0.4
±
．
±
’
T.MASUMOTO
．
．
質量(MASS)
0.1
1
単位(UNIT)：㎜
±
S/W
0
70
80
90
30
40
50
10
20
60
100
JAEConnectorDIV. Proprietary.Copyright(C)2015, JapanAviationElectronicsIndustry, LTD.
