Advance Technical Infomation
IXTQ 80N28T
IXTQ 80N28T
VDSS = 280
ID25 = 80
RDS(on) = 49 mΩ
V
A
Trench Gate
Power MOSFET
N-Channel Enhancement Mode
For Plasma Display Applications
Symbol
TestConditions
Maximum Ratings
TO-3P(IXTQ)
VDSS
VDGR
TJ = 25°C to 150°C
TJ = 25°C to 150°C; RGS = 1 MΩ
280
280
V
V
VGSM
30
V
ID25
TC = 25°C
80
75
A
A
A
G
IDRMS
IDM
External lead current limit
TC = 25°C, pulse width limited by TJM
D
(TAB)
S
240
dv/dt
IS ≤ IDM, di/dt ≤ 100 A/μs, VDD ≤ VDSS
TJ ≤ 150°C, RG = 4 Ω
,
5
V/ns
G = Gate
D = Drain
S = Source
TAB = Drain
PD
TC = 25°C
500
W
TJ
TJM
Tstg
-55 ... +150
150
-55 ... +150
°C
°C
°C
Features
z Trench gate construction for low RDS(on)
z International standard package
z Low package inductance
TL
1.6 mm (0.062 in.) from case for 10 s
300
°C
- easy to drive and to protect
Md
Mounting torque
(TO-3P)
1.13/10 Nm/lb.in.
5.5
Weight
g
Advantages
z
Easy to mount
Space savings
High power density
z
z
Symbol
TestConditions
Characteristic Values
(TJ = 25°C, unless otherwise specified)
Min. Typ.
Max.
BVDSS
VGS(th)
IGSS
VGS = 0 V, ID =1mA
VDS = VGS, ID = 1mA
VGS = 20 VDC, VDS = 0
280
3.0
300
V
V
5.0
200
nA
IDSS
VDS = VDSS
VGS = 0 V
1
200
μA
μA
TJ = 125°C
RDS(on)
VGS = 10 V, ID = 0.5 ID25
42
49 mΩ
Pulse test, t ≤ 300 μs, duty cycle d ≤ 2 %
DS99355B(03/06)
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