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IXTH41N25

型号:

IXTH41N25

品牌:

IXYS[ IXYS CORPORATION ]

页数:

4 页

PDF大小:

559 K

IXTH 41N25  
VDSS = 250 V  
Standard  
Power MOSFET  
ID(cont) = 41 A  
RDS(on) = 72 mΩ  
N-Channel Enhancement Mode  
Preliminary Data Sheet  
Symbol Testconditions  
Maximum ratings  
TO-247 AD  
VDSS  
VDGR  
TJ = 25°C to 150°C  
TJ = 25°C to 150°C; RGS = 1.0 MΩ  
250  
250  
V
V
VGS  
Continuous  
Transient  
±20  
±30  
V
V
VGSM  
D (TAB)  
G
ID25  
IDM  
IAR  
T
= 25°C MOSFET chip capability  
41  
164  
41  
A
A
A
TCC = 25°C, pulse width limited by TJM  
D
S
G = Gate  
S = Source  
D
= Drain  
EAR  
EAS  
T
= 25°C  
30  
1.0  
mJ  
J
TCC = 25°C  
Tab = Drain  
dv/dt  
IS IDM, di/dt 100 A/µs, VDD VDSS  
TJ 150°C, RG = 2 Ω  
5
V/ns  
PD  
TJ  
TC = 25°C  
300  
W
-55 ... +150  
°C  
Features  
TJM  
Tstg  
150  
°C  
°C  
Low RDS (on) HDMOSTM process  
Rugged polysilicon gate cell structure  
International standard package  
JEDEC TO-247 AD  
-55 ... +150  
Md  
Mounting torque  
TO-264  
1.13/10 Nm/lb.in.  
Weight  
6
g
Fast switching times  
Maximum lead temperature for soldering  
1.6 mm (0.062 in.) from case for 10 s  
300  
°C  
High commutating dv/dt rating  
Applications  
Motor controls  
DC choppers  
Symbol Test Conditions  
Characteristic Values  
Switched-mode and resonant-mode  
power supplies  
(TJ = 25°C unless otherwise specified)  
Min. Typ.  
Max.  
Uninterruptible Power Supplies (UPS)  
VDSS  
VGS = 0 V, I = 250 µA  
VDS = VGS, IDD = 250 µA  
250  
2.0  
V
V
VGS(th)  
4.0  
Advantages  
IGSS  
IDSS  
VGS = ±20 V DC, VDS = 0  
±100 nA  
Easy to mount with one screw  
(isolated mounting screw hole)  
Space savings  
VDS = V  
25 µA  
250 µA  
VGS = 0 DVSS  
TJ = 125°C  
High power density  
RDS(on)  
VGS = 10 V, I = 15A  
60  
72 mΩ  
Pulse test, t D300 ms, duty cycle d 2%  
© 2003 IXYS All rights reserved  
DS98954B(08/03)  
IXTH 41N25  
Symbol  
Test Conditions  
Characteristic values  
Min. Typ. Max.  
TO-247 AD Outline  
(TJ = 25°C unless otherwise specified)  
gfs  
VDS = 10 V; ID = 0.5 ID25, pulse test  
VGS = 0 V, VDS = 25 V, f = 1 MHz  
20  
28  
S
Ciss  
Coss  
Crss  
3200  
510  
180  
pF  
pF  
pF  
1
2
3
td(on)  
tr  
td(off)  
tf  
19  
19  
79  
17  
ns  
ns  
ns  
ns  
VGS = 10 V, VDS = 0.5 VDSS, ID = 0.5 ID25  
RG = 3.6 (External)  
Terminals: 1 - Gate  
3 - Source  
2 - Drain  
Tab - Drain  
Dim.  
Millimeter  
Min. Max.  
Inches  
Qg(on)  
Qgs  
110  
18  
48  
nC  
nC  
nC  
Min. Max.  
A
4.7  
2.2  
2.2  
5.3  
2.54  
2.6  
.185 .209  
.087 .102  
.059 .098  
VGS = 10 V, VDS = 0.5 VDSS, ID = 0.5 ID25  
A
A12  
Qgd  
b
b12  
1.0  
1.65  
2.87  
1.4  
2.13  
3.12  
.040 .055  
.065 .084  
.113 .123  
b
RthJC  
RthCK  
0.42 K/W  
K/W  
0.25  
C
D
E
.4  
.8  
.016 .031  
.819 .845  
.610 .640  
20.80 21.46  
15.75 16.26  
e
5.20  
5.72 0.205 0.225  
L
19.81 20.32  
4.50  
.780 .800  
.177  
L1  
P 3.55  
3.65  
.140 .144  
Q
5.89  
4.32  
6.40 0.232 0.252  
R
S
5.49  
.170 .216  
242 BSC  
6.15 BSC  
Source-Drain Diode  
Ratings and Characteristics  
(TJ = 25°C unless otherwise specified)  
Symbol  
IS  
Test Conditions  
Min.  
Typ.  
Max.  
VGS = 0V  
41  
A
A
V
ISM  
Repetitive; pulse width limited by TJM  
164  
1.5  
VSD  
IF = IS, VGS = 0 V,  
Pulse test, t 300 µs, duty cycle d 2 %  
trr  
IF = 0.5 IS, -di/dt = 100 A/µs, VR = 100V  
300  
3.0  
ns  
µC  
Qrr  
IXYS reserves the right to change limits, test conditions, and dimensions.  
IXYSMOSFETs andIGBTsarecovered byoneormore  
ofthefollowingU.S.patents:  
4,835,592 4,881,106 5,017,508 5,049,961 5,187,117 5,486,715 6,306,728B1 6,259,123B1 6,306,728B1  
4,850,072 4,931,844 5,034,796 5,063,307 5,237,481 5,381,025 6,404,065B1 6,162,665 6,534,343  
IXTH 41N25  
Fig. 2. Extended Output Characteristics  
@ 25 deg. C  
Fig. 1. Output Characteristics  
@ 25 Deg. C  
45  
40  
35  
30  
25  
20  
15  
10  
5
12 0  
10 0  
80  
60  
40  
20  
0
VGS = 10V  
VGS = 10V  
9V  
9V  
8V  
7V  
8V  
7V  
6V  
5V  
6V  
5V  
0
0
0.5  
1
1.5  
2
2.5  
3
3.5  
4
0
4
8
12  
16  
2 0  
VDS - Volts  
VDS - Volts  
Fig. 3. Output Characteristics  
@ 125 Deg. C  
Fig. 4. RDS(on) Normalized to ID25 Value vs.  
Junction Temperature  
45  
40  
35  
30  
25  
20  
15  
10  
5
2.8  
VGS = 10V  
VG S = 10V  
2.5  
2.2  
1. 9  
1. 6  
1. 3  
9V  
8V  
7V  
6V  
I D = 41A  
I D = 20.5A  
5V  
1
0.7  
0.4  
0
-50 -25  
0
25  
50 75 100 125 150  
0
1
2
3
4
5
6
7
8
VDS - Volts  
TJ - Degrees Centigrade  
Fig. 6. Drain Current vs. Case  
Temperature  
Fig. 5. RDS(on) Normalized to ID25  
Value vs. ID  
42  
36  
30  
24  
18  
12  
6
4
3.5  
3
VG S = 10V  
TJ = 125ºC  
2.5  
2
1.5  
1
TJ = 25ºC  
0
0.5  
-50 -25  
0
25 50 75 100 125 150  
0
20  
40  
60  
80  
100  
120  
TC - Degrees Centigrade  
I D - Amperes  
© 2003 IXYS All rights reserved  
IXTH 41N25  
Fig. 8. Transconductance  
Fig. 7. Input Admittance  
80  
70  
60  
50  
40  
30  
20  
10  
60  
50  
40  
30  
20  
10  
TJ = -40ºC  
25ºC  
125ºC  
TJ = 125ºC  
25ºC  
-40ºC  
0
0
3
3.5  
4
4.5  
5
5.5  
6
6.5  
7
0
20  
40  
60  
80  
100  
120 140  
VGS - Volts  
I D - Amperes  
Fig. 9. Source Current vs. Source-To-Drain  
Voltage  
Fig. 10. Gate Charge  
12 0  
10 0  
80  
60  
40  
20  
0
10  
VDS = 125V  
I D= 20.5A  
I G= 10mA  
8
6
4
2
0
TJ = 125ºC  
TJ = 25ºC  
0.4  
0.6  
0.8  
1
1.2  
1.4  
0
20  
40  
60  
80  
100  
120  
VSD - Volts  
Q G - nanoCoulombs  
Fig. 12. Maximum Transient Thermal  
Resistance  
Fig. 11. Capacitance  
10000  
10 0 0  
10 0  
1
f = 1M Hz  
C
C
C
iss  
0.1  
oss  
rss  
0.01  
0
5
10  
15  
20 25 30 35 40  
1
10  
100  
1000  
VDS - Volts  
Pulse Width - milliseconds  
IXYS reserves the right to change limits, test conditions, and dimensions.  
IXYSMOSFETs andIGBTsarecovered byoneormore  
ofthefollowingU.S.patents:  
4,835,592 4,881,106 5,017,508 5,049,961 5,187,117 5,486,715 6,306,728B1 6,259,123B1 6,306,728B1  
4,850,072 4,931,844 5,034,796 5,063,307 5,237,481 5,381,025 6,404,065B1 6,162,665 6,534,343  
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