The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
I/O Card Interface Connectors
NX Series
3. ESD Secure
Thermoplastic molded covers assures insulation
of the connections and shields from ESD.
4. Secure Latching
A built-in latch assures correct and secure
mating of connector.
5. Reliable Conductor Termination
Reliable termination of conductors is
accomplished by proven IDC termination.
6. Sequential Mating
The 0.8mm pitch contacts are engaging the
corresponding parts in sequence: Ground-
Power & Signal
7. Rugged Construction
Securely attached to the board with optional
screws.
■Features
1. Low Profile
8. Card Frame Kits
Protorusion above the PCB board is only 2.9mm, and the
connectors can be mounted to type I and II I/O cards.
Available as a separate part number.
2. EMI/RFI protection
Full metal shielding. Shield connects first, ahead of
contacts.
■Applications
Used with I/O cards, portable personal computers,and the external connections of various small-sized portable
terminals.
■Specifications
Current rating 0.5 A
Operating temperature
Operating humidity
-30ç to +70ç (Note 1) Storage temperature range -10ç to +60ç (Note 2)
Ratings
95% R.H. or less
(No condensation)
Voltage rating 125 V AC
Storage humidity range
40 to 70% (Note 2)
Item
Specification
Conditions
1. Insulation resistance
2. Withstanding voltage
3. Contact resistance
100 V DC
250 Mø min.
300 V AC / 1 minute
100 mA
No flashover or insulation breakdown.
40 mø max.
No electrical discontinuity of 10µs or
more
Frequency: 10 to 55 Hz, single amplitude of 0.75 mm,
2 hours in each of the 3 directions.
4. Vibration
5. Humidity (Steady state) Insulation resistance: 100 Mø min.
96 hours at temperature of 60ç and humidity of 90% to 95%
-55ç, 30 min./15 to 30ç, within 5 min/85ç, 30 min
/15 to 35ç, within 5 min, for 5 cycles
6. Temperature cycle
No damage, cracks, or parts looseness.
7. Durability
(Insertion/withdrawal)
3000 cycles
60 mø max.
Reflow: At the recommended temperature profile
Manual soldering: 300ç for 3 seconds
8. Resistance to
Soldering heat
No deformation of components affecting
performance.
Note 1: Includes temperature rise caused by current flow.
Note 2: The term "storage" refers to products stored for long period of time prior to mounting and use. Operating Temperature
Range and Humidity range covers non- conducting condition of installed connectors in storage, shipment or during
transportation.
B8
