206DV06(A)
WT-
Zener Diode Chips for ESD Protection
1. Feature:
1-2 Silicon Zener diode chips for electrostatic discharge (ESD) protection application.
2. Structure:
2-1 Planar type: Silicon Diode
2-2 Electrodes:
Top side:Aluminum Alloy.
Back side:Gold Layer.
3. Size:
3-1. Wafer Form Die Size : 7mils x 7mils (180µm x 180µm ).
3-2. Chip Form Die Size : 5.98mils x 5.98mils (152µm x 152µm ).
3-3. Pad Size : 5.12mils x 5.12mils (130µm x 130µm ).
3-4. Chip Thickness : 4mils (102µm ).
3-5. Pattern drawing : Refer to the attached drawing.
4. Electrical Characteristics (Ta=25ºC)
Parameter
Symbol
Condition
Min.
Typ. Max. Unit
V
-
-
5.5
5.3
7.0
6.8
ZF
Zener Voltage
I =5mA
Z
V
V
ZR
I
I
-
-
-
-
100
100
DF
Leakage Current
nA
V =4V
R
DR
Electrostatic
Discharge
HBM
MIL-STD 883
KV
ESD
-
-
8.0
5. Drawing:
Pad Size
Top side
Passivation
LED
Protection
Zener
N
P
EPI Layer
N-sub
Back side
WEITRON TECHNOLOGY CO., LTD.
TEL:886-2-29148158
FAX:886-2-29106796
Http://www.weitron.com.tw
09-Jun-10
