IXTP230N04T4M
Symbol
Test Conditions
Characteristic Values
Min. Typ. Max.
OVERMOLDED TO-220
(IXTP...M)
(TJ = 25C, Unless Otherwise Specified)
gfs
VDS = 10V, ID = 60A, Note 1
Gate Input Resistance
100
170
1.2
S
RGi
Ciss
Coss
Crss
7400
1115
760
pF
pF
pF
VGS = 0V, VDS = 25V, f = 1MHz
1
2
3
td(on)
tr
td(off)
tf
40
143
85
ns
ns
ns
ns
Resistive Switching Times
V
GS = 10V, VDS = 0.5 • VDSS, ID = 0.5 • ID25
RG = 10 (External)
82
Qg(on)
Qgs
140
35
nC
nC
nC
VGS = 10V, VDS = 0.5 • VDSS, ID = 0.5 • ID25
Qgd
53
Terminals: 1 - Gate
2 - Drain
RthJC
RthCS
3.75 C/W
C/W
3 - Source
0.50
Source-Drain Diode
Symbol
Test Conditions
Characteristic Values
(TJ = 25C, Unless Otherwise Specified)
Min. Typ.
Max.
230
920
1.4
IS
VGS = 0V
A
A
V
ISM
VSD
Repetitive, Pulse width limited by TJM
IF = 100A, VGS = 0V, Note 1
trr
32
1.6
ns
A
IF = 115A, VGS = 0V
IRM
QRM
-di/dt = 100A/s
VR = 30V
25.6
nC
Notes: 1. Pulse test, t 300s, duty cycle, d 2%.
2. On through-hole packages, RDS(on) Kelvin test contact location must be 5mm
or less from the package body.
ADVANCE TECHNICAL INFORMATION
The product presented herein is under development. The Technical Specifications offered are
derived from a subjective evaluation of the design, based upon prior knowledge and experi-
ence, and constitute a "considered reflection" of the anticipated result. IXYS reserves the right
to change limits, test conditions, and dimensions without notice.
IXYS Reserves The Right to Change Limits, Test Conditions, and Dimensions.
IXYS MOSFETs and IGBTs are covered
by one or moreof the following U.S. patents: 4,860,072 5,017,508
4,881,106 5,034,796
4,835,592 4,931,844
5,049,961
5,063,307
5,187,117
5,237,481
5,381,025
5,486,715
6,162,665
6,259,123 B1
6,306,728 B1
6,404,065 B1 6,683,344
6,534,343
6,583,505
6,727,585
6,710,405 B2 6,759,692
6,710,463 6,771,478 B2 7,071,537
7,005,734 B2 7,157,338B2
7,063,975 B2