SPECIFICATIONS
Board to Board Connector
QT01 Series
0.5mm Pitch
For High Speed Application
Mated with QT00 Series
Mechanical
Mating Force: 40kgf max.
Unmating Force: 4.4kgf min.
Durability: 30 Cycles
Electrical
Current Rating: 0.5A max.per contact
Contact Resistance: 55mΩ max.(Initial), 75mΩ max.(After)
Dielectrical Withstanding Voltage: 200 VAC for 1 minute
Insulation Resistance: 100 mega ohms min. at 500 VDC
Physical
Housing: LCP Black Color
Contact: Copper Alloy
Plating: 6u” min. Gold Plating on Contact Area
Metal Ear: Copper Alloy
Operating Temperature: -40℃ to +85℃
DRAWING
ORDERING INFORMATION
All specification & dimensions are subject to change, please call your nearest Foxconn sales representative for update information.
