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8V18512IDGGREP

型号:

8V18512IDGGREP

品牌:

TI[ TEXAS INSTRUMENTS ]

页数:

36 页

PDF大小:

497 K

ꢐ ꢑꢐ ꢌꢅ ꢒꢓꢆ ꢀꢔ ꢒꢁ ꢆ ꢍꢀꢆ ꢕ ꢍꢅ ꢖ ꢔꢍ  
SCBS790 − NOVEMBER 2003  
D
D
Controlled Baseline  
− One Assembly/Test Site, One Fabrication  
Site  
D
Compatible With the IEEE Std 1149.1-1990  
(JTAG) Test Access Port and  
Boundary-Scan Architecture  
Enhanced Diminishing Manufacturing  
Sources (DMS) Support  
DGG PACKAGE  
(TOP VIEW)  
D
D
D
D
D
Enhanced Product-Change Notification  
Qualification Pedigree  
1
64  
63  
62  
61  
60  
59  
58  
57  
56  
55  
54  
53  
52  
51  
50  
49  
48  
47  
46  
45  
44  
43  
42  
41  
40  
39  
38  
37  
36  
35  
34  
33  
1CLKAB  
1LEAB  
1OEAB  
1A1  
1CLKBA  
1LEBA  
1OEBA  
1B1  
1B2  
GND  
1B3  
2
Members of the Texas Instruments  
SCOPE Family of Testability Products  
Members of the Texas Instruments  
WidebusFamily  
State-of-the-Art 3.3-V ABT Design Supports  
Mixed-Mode Signal Operation (5-V Input  
3
4
5
1A2  
GND  
1A3  
1A4  
1A5  
6
7
8
1B4  
1B5  
and Output Voltages With 3.3-V V  
)
CC  
9
D
D
Support Unregulated Battery Operation  
Down to 2.7 V  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
30  
31  
32  
V
V
CC  
CC  
1A6  
1A7  
1A8  
GND  
1A9  
2A1  
2A2  
2A3  
GND  
2A4  
2A5  
2A6  
1B6  
1B7  
1B8  
GND  
1B9  
2B1  
2B2  
2B3  
GND  
2B4  
2B5  
2B6  
UBT (Universal Bus Transceiver)  
Combines D-Type Latches and D-Type  
Flip-Flops for Operation in Transparent,  
Latched, or Clocked Mode  
D
D
D
Bus Hold on Data Inputs Eliminates the  
Need for External Pullup/Pulldown  
Resistors  
B-Port Outputs of SN74LVTH182512 Device  
Has Equivalent 25-Series Resistors, So  
No External Resistors Are Required  
SCOPE Instruction Set  
V
V
CC  
CC  
− IEEE Std 1149.1-1990 Required  
Instructions and Optional CLAMP and  
HIGHZ  
2A7  
2A8  
2A9  
GND  
2B7  
2B8  
2B9  
GND  
2OEBA  
2LEBA  
2CLKBA  
TDI  
− Parallel-Signature Analysis at Inputs  
− Pseudo-Random Pattern Generation  
From Outputs  
− Sample Inputs/Toggle Outputs  
− Binary Count From Outputs  
− Device Identification  
2OEAB  
2LEAB  
2CLKAB  
TDO  
TMS  
TCK  
− Even-Parity Opcodes  
Component qualification in accordance with JEDEC and industry  
standards to ensure reliable operation over an extended  
temperature range. This includes, but is not limited to, Highly  
Accelerated Stress Test (HAST) or biased 85/85, temperature  
cycle, autoclave or unbiased HAST, electromigration, bond  
intermetallic life, and mold compound life. Such qualification  
testing should not be viewed as justifying use of this component  
beyond specified performance and environmental limits.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
SCOPE, Widebus, and UBT are trademarks of Texas Instruments.  
Copyright 2003, Texas Instruments Incorporated  
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ꢩꢦ ꢨ ꢦ ꢣ ꢤ ꢛ ꢤ ꢨ ꢞ ꢑ  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
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ꢐꢑ ꢐꢌꢅ ꢒ ꢓꢆ ꢀꢔ ꢒ ꢁ ꢆꢍ ꢀ ꢆ ꢕꢍ ꢅ ꢖ ꢔꢍ ꢀ  
ꢗꢖ ꢆ ꢇ ꢈ ꢉꢌ ꢓꢖ ꢆ ꢘ ꢁ ꢖ ꢅꢍ ꢙꢀ ꢒꢄ ꢓꢘ ꢀ ꢆꢙ ꢒꢁ ꢀꢔ ꢍꢖ ꢅꢍꢙꢀ  
SCBS790 − NOVEMBER 2003  
description/ordering information  
The SN74LVTH18512 and SN74LVTH182512 scan test devices with 18-bit universal bus transceivers are  
members of the Texas Instruments SCOPEtestability integrated-circuit family. This family of devices supports  
IEEE Std 1149.1-1990 boundary scan to facilitate testing of complex circuit-board assemblies. Scan access to  
the test circuitry is accomplished via the 4-wire test access port (TAP) interface.  
Additionally, these devices are designed specifically for low-voltage (3.3-V) V  
capability to provide a TTL interface to a 5-V system environment.  
operation, but with the  
CC  
In the normal mode, these devices are 18-bit universal bus transceivers that combine D-type latches and D-type  
flip-flops to allow data flow in transparent, latched, or clocked modes. They can be used either as two 9-bit  
transceivers or one 18-bit transceiver. The test circuitry can be activated by the TAP to take snapshot samples  
of the data appearing at the device pins or to perform a self test on the boundary-test cells. Activating the TAP  
in the normal mode does not affect the functional operation of the SCOPEuniversal bus transceivers.  
Data flow in each direction is controlled by output-enable (OEAB and OEBA), latch-enable (LEAB and LEBA),  
and clock (CLKAB and CLKBA) inputs. For A-to-B data flow, the devices operate in the transparent mode when  
LEAB is high. When LEAB is low, the A data is latched while CLKAB is held at a static low or high logic level.  
Otherwise, if LEAB is low, A data is stored on a low-to-high transition of CLKAB. When OEAB is low, the B  
outputs are active. When OEAB is high, the B outputs are in the high-impedance state. B-to-A data flow is similar  
to A-to-B data flow but uses the OEBA, LEBA, and CLKBA inputs.  
In the test mode, the normal operation of the SCOPEuniversal bus transceivers is inhibited, and the test  
circuitry is enabled to observe and control the I/O boundary of the device. When enabled, the test circuitry  
performs boundary-scan test operations according to the protocol described in IEEE Std 1149.1-1990.  
Four dedicated test pins are used to observe and control the operation of the test circuitry: test data input (TDI),  
test data output (TDO), test mode select (TMS), and test clock (TCK). Additionally, the test circuitry performs  
other testing functions such as parallel-signature analysis (PSA) on data inputs and pseudo-random pattern  
generation (PRPG) from data outputs. All testing and scan operations are synchronized to the TAP interface.  
Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.  
The B-port outputs of SN74LVTH182512, which are designed to source or sink up to 12 mA, include equivalent  
25-series resistors to reduce overshoot and undershoot.  
ORDERING INFORMATION  
ORDERABLE  
PART NUMBER  
TOP-SIDE  
MARKING  
PACKAGE  
T
A
TSSOP − DGG  
TSSOP − DGG  
Tape and reel  
Tape and reel  
8V18512IDGGREP  
−40°C to 85°C  
8V182512IDGGREP  
LH182512EP  
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available  
at www.ti.com/sc/package.  
Product Preview  
2
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SCBS790 − NOVEMBER 2003  
FUNCTION TABLE  
(normal mode, each register)  
INPUTS  
OUTPUT  
B
OEAB  
LEAB  
CLKAB  
A
X
L
B
0
L
L
L
L
L
H
L
L
L
X
X
X
L
H
L
L
H
L
H
H
X
H
X
H
Z
A-to-B data flow is shown. B-to-A data flow is similar,  
but uses OEBA, LEBA, and CLKBA.  
Output level before the indicated steady-state input  
conditions were established  
3
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SCBS790 − NOVEMBER 2003  
functional block diagram  
Boundary-Scan Register  
2
1LEAB  
1
1CLKAB  
V
CC  
3
1OEAB  
1LEBA  
63  
64  
1CLKBA  
1OEBA  
V
CC  
62  
C1  
1D  
C1  
1D  
4
61  
1B1  
1A1  
C1  
1D  
C1  
1D  
One of Nine Channels  
29  
30  
2LEAB  
2CLKAB  
V
CC  
28  
2OEAB  
2LEBA  
36  
35  
2CLKBA  
2OEBA  
V
CC  
37  
C1  
1D  
C1  
1D  
49  
16  
2B1  
2A1  
C1  
1D  
C1  
1D  
One of Nine Channels  
Bypass Register  
Boundary-Control  
Register  
Identification  
Register  
V
31  
CC  
34  
TDO  
Instruction  
Register  
TDI  
V
CC  
32  
TMS  
TCK  
TAP  
Controller  
33  
4
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SCBS790 − NOVEMBER 2003  
Terminal Functions  
TERMINAL NAME  
DESCRIPTION  
1A1−1A9,  
2A1−2A9  
Normal-function A-bus I/O ports. See function table for normal-mode logic.  
Normal-function B-bus I/O ports. See function table for normal-mode logic.  
1B1−1B9,  
2B1−2B9  
1CLKAB, 1CLKBA,  
2CLKAB, 2CLKBA  
Normal-function clock inputs. See function table for normal-mode logic.  
Ground  
GND  
1LEAB, 1LEBA,  
2LEAB, 2LEBA  
Normal-function latch enables. See function table for normal-mode logic.  
1OEAB, 1OEBA,  
2OEAB, 2OEBA  
Normal-function output enables. See function table for normal-mode logic. An internal pullup at each terminal forces the  
terminal to a high level if left unconnected.  
Test clock. One of four terminals required by IEEE Std 1149.1-1990. Test operations of the device are synchronous to  
TCK. Data is captured on the rising edge of TCK and outputs change on the falling edge of TCK.  
TCK  
TDI  
Test data input. One of four terminals required by IEEE Std 1149.1-1990. TDI is the serial input for shifting data through  
the instruction register or selected data register. An internal pullup forces TDI to a high level if left unconnected.  
Test data output. One of four terminals required by IEEE Std 1149.1-1990. TDO is the serial output for shifting data  
through the instruction register or selected data register.  
TDO  
TMS  
Test mode select. One of four terminals required by IEEE Std 1149.1-1990. TMS directs the device through its TAP  
controller states. An internal pullup forces TMS to a high level if left unconnected.  
V
CC  
Supply voltage  
5
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SCBS790 − NOVEMBER 2003  
test architecture  
Serial-test information is conveyed by means of a 4-wire test bus, or TAP, that conforms to IEEE Std  
1149.1-1990. Test instructions, test data, and test control signals all are passed along this serial-test bus. The  
TAP controller monitors two signals from the test bus, TCK and TMS. The TAP controller extracts the  
synchronization (TCK) and state control (TMS) signals from the test bus and generates the appropriate on-chip  
control signals for the test structures in the device. Figure 1 shows the TAP-controller state diagram.  
The TAP controller is fully synchronous to the TCK signal. Input data is captured on the rising edge of TCK and  
output data changes on the falling edge of TCK. This scheme ensures data to be captured is valid for fully  
one-half of the TCK cycle.  
The functional block diagram shows the IEEE Std 1149.1-1990 4-wire test bus and boundary-scan architecture  
and the relationship among the test bus, the TAP controller, and the test registers. As shown, the device contains  
an 8-bit instruction register and four test-data registers: a 48-bit boundary-scan register, a 3-bit  
boundary-control register, a 1-bit bypass register, and a 32-bit device identification register.  
Test-Logic-Reset  
TMS = H  
TMS = L  
TMS = H  
TMS = H  
TMS = H  
Run-Test/Idle  
Select-DR-Scan  
TMS = L  
Select-IR-Scan  
TMS = L  
TMS = L  
TMS = H  
TMS = H  
Capture-DR  
TMS = L  
Capture-IR  
TMS = L  
Shift-DR  
Shift-IR  
TMS = L  
TMS = L  
TMS = H  
TMS = H  
TMS = H  
Exit1-IR  
TMS = H  
Exit1-DR  
TMS = L  
TMS = L  
Pause-DR  
TMS = H  
Pause-IR  
TMS = H  
Exit2-IR  
TMS = L  
TMS = L  
TMS = L  
TMS = L  
Exit2-DR  
TMS = H  
TMS = H  
Update-IR  
Update-DR  
TMS = H  
TMS = L  
TMS = H  
TMS = L  
Figure 1. TAP-Controller State Diagram  
6
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SCBS790 − NOVEMBER 2003  
state diagram description  
The TAP controller is a synchronous finite-state machine that provides test control signals throughout the  
device. The state diagram shown in Figure 1 is in accordance with IEEE Std 1149.1-1990. The TAP controller  
proceeds through its states, based on the level of TMS at the rising edge of TCK.  
As shown, the TAP controller consists of 16 states. There are six stable states (indicated by a looping arrow in  
the state diagram) and ten unstable states. A stable state is a state the TAP controller can retain for consecutive  
TCK cycles. Any state that does not meet this criterion is an unstable state.  
There are two main paths through the state diagram: one to access and control the selected data register and  
one to access and control the instruction register. Only one register can be accessed at a time.  
Test-Logic-Reset  
The device powers up in the Test-Logic-Reset state. In the stable Test-Logic-Reset state, the test logic is reset  
and is disabled so that the normal logic function of the device is performed. The instruction register is reset to  
an opcode that selects the optional IDCODE instruction, if supported, or the BYPASS instruction. Certain data  
registers also can be reset to their power-up values.  
The state machine is constructed such that the TAP controller returns to the Test-Logic-Reset state in no more  
than five TCK cycles if TMS is left high. The TMS pin has an internal pullup resistor that forces it high if left  
unconnected or if a board defect causes it to be open circuited.  
For the SN74LVTH18512 and SN74LVTH182512, the instruction register is reset to the binary value 10000001,  
which selects the IDCODE instruction. Bits 47−44 in the boundary-scan register are reset to logic 1, ensuring  
that these cells, which control A-port and B-port outputs, are set to benign values (i.e., if test mode were invoked  
the outputs would be at the high-impedance state). Reset-value of other bits in the boundary-scan register  
should be considered indeterminate. The boundary-control register is reset to the binary value 010, which  
selects the PSA test operation.  
Run-Test/Idle  
The TAP controller must pass through the Run-Test/Idle state (from Test-Logic-Reset) before executing any test  
operations. The Run-Test/Idle state also can be entered, following data-register or instruction-register scans.  
Run-Test/Idle is a stable state in which the test logic can be actively running a test or can be idle. The test  
operations selected by the boundary-control register are performed while the TAP controller is in the  
Run-Test/Idle state.  
Select-DR-Scan, Select-lR-Scan  
No specific function is performed in the Select-DR-Scan and Select-lR-Scan states, and the TAP controller exits  
either of these states on the next TCK cycle. These states allow the selection of either data-register scan or  
instruction-register scan.  
Capture-DR  
When a data-register scan is selected, the TAP controller must pass through the Capture-DR state. In the  
Capture-DR state, the selected data register captures a data value as specified by the current instruction. Such  
capture operations occur on the rising edge of TCK, upon which the TAP controller exits the Capture-DR state.  
7
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SCBS790 − NOVEMBER 2003  
Shift-DR  
Upon entry to the Shift-DR state, the data register is placed in the scan path between TDI and TDO, and on the  
first falling edge of TCK, TDO goes from the high-impedance state to an active state. TDO enables to the logic  
level present in the least-significant bit of the selected data register.  
While in the stable Shift-DR state, data is shifted serially through the selected data register on each TCK cycle.  
The first shift occurs on the first rising edge of TCK after entry to the Shift-DR state (i.e., no shifting occurs during  
the TCK cycle in which the TAP controller changes from Capture-DR to Shift-DR or from Exit2-DR to Shift-DR).  
The last shift occurs on the rising edge of TCK, upon which the TAP controller exits the Shift-DR state.  
Exit1-DR, Exit2-DR  
The Exit1-DR and Exit2-DR states are temporary states that end a data-register scan. It is possible to return  
to the Shift-DR state from either Exit1-DR or Exit2-DR without recapturing the data register. On the first falling  
edge of TCK after entry to Exit1-DR, TDO goes from the active state to the high-impedance state.  
Pause-DR  
No specific function is performed in the stable Pause-DR state, in which the TAP controller can remain  
indefinitely. The Pause-DR state suspends and resumes data-register scan operations without loss of data.  
Update-DR  
If the current instruction calls for the selected data register to be updated with current data, such update occurs  
on the falling edge of TCK, following entry to the Update-DR state.  
Capture-IR  
When an instruction-register scan is selected, the TAP controller must pass through the Capture-IR state. In  
the Capture-IR state, the instruction register captures its current status value. This capture operation occurs  
on the rising edge of TCK, upon which the TAP controller exits the Capture-IR state. For the SN74LVTH18512  
and SN74LVTH182512, the status value loaded in the Capture-IR state is the fixed binary value 10000001.  
Shift-IR  
Upon entry to the Shift-IR state, the instruction register is placed in the scan path between TDI and TDO. On  
the first falling edge of TCK, TDO goes from the high-impedance state to the active state. TDO enables to the  
logic level present in the least-significant bit of the instruction register.  
While in the stable Shift-IR state, instruction data is shifted serially through the instruction register on each TCK  
cycle. The first shift occurs on the first rising edge of TCK after entry to the Shift-IR state (i.e., no shifting occurs  
during the TCK cycle in which the TAP controller changes from Capture-IR to Shift-IR or from Exit2-IR to  
Shift-IR). The last shift occurs on the rising edge of TCK, upon which the TAP controller exits the Shift-IR state.  
Exit1-IR, Exit2-IR  
The Exit1-IR and Exit2-IR states are temporary states that end an instruction-register scan. It is possible to  
return to the Shift-IR state from either Exit1-IR or Exit2-IR without recapturing the instruction register. On the  
first falling edge of TCK after entry to Exit1-IR, TDO goes from the active state to the high-impedance state.  
Pause-IR  
No specific function is performed in the stable Pause-IR state, in which the TAP controller can remain  
indefinitely. The Pause-IR state suspends and resumes instruction-register scan operations without loss  
of data.  
Update-IR  
The current instruction is updated and takes effect on the falling edge of TCK, following entry to the  
Update-IR state.  
8
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SCBS790 − NOVEMBER 2003  
register overview  
With the exception of the bypass and device-identification registers, any test register can be thought of as a  
serial shift register with a shadow latch on each bit. The bypass and device-identification registers differ in that  
they contain only a shift register. During the appropriate capture state (Capture-IR for instruction register,  
Capture-DR for data registers), the shift register can be parallel loaded from a source specified by the current  
instruction. During the appropriate shift state (Shift-IR or Shift-DR), the contents of the shift register are shifted  
out from TDO while new contents are shifted in at TDI. During the appropriate update state (Update-IR or  
Update-DR), the shadow latches are updated from the shift register.  
instruction register description  
The instruction register (IR) is eight bits long and tells the device what instruction is to be executed. Information  
contained in the instruction includes the mode of operation (either normal mode, in which the device performs  
its normal logic function, or test mode, in which the normal logic function is inhibited or altered), the test operation  
to be performed, which of the four data registers is to be selected for inclusion in the scan path during  
data-register scans, and the source of data to be captured into the selected data register during Capture-DR.  
Table 3 lists the instructions supported by the SN74LVTH18512 and SN74LVTH182512. The even-parity  
feature specified for SCOPEdevices is supported in this device. Bit 7 of the instruction opcode is the parity  
bit. Any instructions that are defined for SCOPEdevices, but are not supported by this device, default to  
BYPASS.  
During Capture-IR, the IR captures the binary value 10000001. As an instruction is shifted in, this value is shifted  
out via TDO and can be inspected as verification that the IR is in the scan path. During Update-IR, the value  
that has been shifted into the IR is loaded into shadow latches. At this time, the current instruction is updated,  
and any specified mode change takes effect. At power up or in the Test-Logic-Reset state, the IR is reset to the  
binary value 10000001, which selects the IDCODE instruction. The IR order of scan is shown in Figure 2.  
Bit 7  
Parity  
(MSB)  
Bit 0  
(LSB)  
TDI  
TDO  
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Figure 2. Instruction Register Order of Scan  
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SCBS790 − NOVEMBER 2003  
data register description  
boundary-scan register  
The boundary-scan register (BSR) is 48 bits long. It contains one boundary-scan cell (BSC) for each  
normal-function input pin and one BSC for each normal-function I/O pin (one single cell for both input data and  
output data). The BSR is used to store test data that is to be applied externally to the device output pins, and/or  
to capture data that appears internally at the outputs of the normal on-chip logic and/or externally at the device  
input pins.  
The source of data to be captured into the BSR during Capture-DR is determined by the current instruction. The  
contents of the BSR can change during Run-Test/Idle, as determined by the current instruction. At power up  
or in Test-Logic-Reset, BSCs 47−44 are reset to logic 1, ensuring that these cells, which control A-port and  
B-port outputs, are set to benign values (i.e., if test mode were invoked, the outputs would be at the  
high-impedance state). Reset values of other BSCs should be considered indeterminate.  
The BSR order of scan is from TDI through bits 47−0 to TDO. Table 1 shows the BSR bits and their associated  
device pin signals.  
Table 1. Boundary-Scan Register Configuration  
BSR BIT  
NUMBER  
DEVICE  
SIGNAL  
BSR BIT  
NUMBER  
DEVICE  
SIGNAL  
BSR BIT  
NUMBER  
DEVICE  
SIGNAL  
47  
46  
45  
44  
43  
42  
41  
40  
39  
38  
37  
36  
−−  
−−  
−−  
−−  
−−  
−−  
2OEAB  
1OEAB  
2OEBA  
1OEBA  
2CLKAB  
1CLKAB  
2CLKBA  
1CLKBA  
2LEAB  
1LEAB  
2LEBA  
1LEBA  
−−  
35  
34  
33  
32  
31  
30  
29  
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
2A9-I/O  
2A8-I/O  
2A7-I/O  
2A6-I/O  
2A5-I/O  
2A4-I/O  
2A3-I/O  
2A2-I/O  
2A1-I/O  
1A9-I/O  
1A8-I/O  
1A7-I/O  
1A6-I/O  
1A5-I/O  
1A4-I/O  
1A3-I/O  
1A2-I/O  
1A1-I/O  
17  
16  
15  
14  
13  
12  
11  
10  
9
2B9-I/O  
2B8-I/O  
2B7-I/O  
2B6-I/O  
2B5-I/O  
2B4-I/O  
2B3-I/O  
2B2-I/O  
2B1-I/O  
1B9-I/O  
1B8-I/O  
1B7-I/O  
1B6-I/O  
1B5-I/O  
1B4-I/O  
1B3-I/O  
1B2-I/O  
1B1-I/O  
8
7
6
5
−−  
4
−−  
3
−−  
2
−−  
1
−−  
0
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SCBS790 − NOVEMBER 2003  
boundary-control register  
The boundary-control register (BCR) is three bits long. The BCR is used in the context of the boundary-run test  
(RUNT) instruction to implement additional test operations not included in the basic SCOPEinstruction set.  
Such operations include PRPG, PSA, and binary count up (COUNT). Table 4 shows the test operations that  
are decoded by the BCR.  
During Capture-DR, the contents of the BCR are not changed. At power up or in Test-Logic-Reset, the BCR is  
reset to the binary value 010, which selects the PSA test operation. The BCR order of scan is shown in Figure 3.  
Bit 2  
(MSB)  
Bit 0  
(LSB)  
TDI  
TDO  
Bit 1  
Figure 3. Boundary-Control Register Order of Scan  
bypass register  
The bypass register is a 1-bit scan path that can be selected to shorten the length of the system scan path,  
reducing the number of bits per test pattern that must be applied to complete a test operation. During  
Capture-DR, the bypass register captures a logic 0. The bypass register order of scan is shown in Figure 4.  
TDI  
TDO  
Bit 0  
Figure 4. Bypass Register Order of Scan  
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SCBS790 − NOVEMBER 2003  
device-identification register  
The device-identification register (IDR) is 32 bits long. It can be selected and read to identify the manufacturer,  
part number, and version of this device.  
For the SN74LVTH18512, the binary value 00000000000000111011000000101111 (0003B02F, hex) is  
captured (during Capture-DR state) in the IDR to identify this device as Texas Instruments SN74LVTH18512.  
For the SN74LVTH182512, the binary value 00000000000000111100000000101111 (0003C02F, hex) is  
captured (during Capture-DR state) in the device-identification register to identify this device as Texas  
Instruments SN74LVTH182512.  
The IDR order of scan is from TDI through bits 31−0 to TDO. Table 2 shows the IDR bits and their significance.  
Table 2. Device-Identification Register Configuration  
IDR BIT  
NUMBER  
IDENTIFICATION  
SIGNIFICANCE  
IDR BIT  
NUMBER  
IDENTIFICATION  
SIGNIFICANCE  
IDR BIT  
NUMBER  
IDENTIFICATION  
SIGNIFICANCE  
31  
30  
29  
28  
−−  
−−  
−−  
−−  
−−  
−−  
−−  
−−  
−−  
−−  
−−  
−−  
VERSION3  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
14  
13  
12  
PARTNUMBER15  
PARTNUMBER14  
PARTNUMBER13  
PARTNUMBER12  
PARTNUMBER11  
PARTNUMBER10  
PARTNUMBER09  
PARTNUMBER08  
PARTNUMBER07  
PARTNUMBER06  
PARTNUMBER05  
PARTNUMBER04  
PARTNUMBER03  
PARTNUMBER02  
PARTNUMBER01  
PARTNUMBER00  
11  
10  
9
MANUFACTURER10  
MANUFACTURER09  
MANUFACTURER08  
MANUFACTURER07  
MANUFACTURER06  
MANUFACTURER05  
MANUFACTURER04  
MANUFACTURER03  
MANUFACTURER02  
MANUFACTURER01  
MANUFACTURER00  
VERSION2  
VERSION1  
VERSION0  
8
−−  
−−  
−−  
−−  
−−  
−−  
−−  
−−  
−−  
−−  
−−  
−−  
7
6
5
4
3
2
1
0
LOGIC1  
−−  
−−  
−−  
−−  
−−  
−−  
−−  
−−  
Note that, for TI products, bits 11−0 of the device-identification register always contain the binary value 000000101111  
(02F, hex).  
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SCBS790 − NOVEMBER 2003  
instruction-register opcode description  
The instruction-register opcodes are shown in Table 3. The following descriptions detail the operation of  
each instruction.  
Table 3. Instruction-Register Opcodes  
BINARY CODE  
BIT 7 BIT 0  
MSB LSB  
SELECTED DATA  
REGISTER  
SCOPE OPCODE  
DESCRIPTION  
MODE  
00000000  
10000001  
10000010  
00000011  
10000100  
00000101  
00000110  
10000111  
10001000  
00001001  
00001010  
10001011  
00001100  
10001101  
10001110  
00001111  
All others  
EXTEST  
IDCODE  
Boundary scan  
Identification read  
Boundary scan  
Device identification  
Boundary scan  
Bypass  
Test  
Normal  
Normal  
Normal  
Normal  
Normal  
Modified test  
Test  
SAMPLE/PRELOAD  
Sample boundary  
BYPASS  
BYPASS  
BYPASS  
HIGHZ  
Bypass scan  
Bypass scan  
Bypass  
Bypass scan  
Bypass  
Control boundary to high impedance  
Control boundary to 1/0  
Bypass scan  
Bypass  
CLAMP  
Bypass  
BYPASS  
Bypass  
Normal  
Test  
RUNT  
Boundary-run test  
Bypass  
READBN  
READBT  
CELLTST  
TOPHIP  
SCANCN  
SCANCT  
BYPASS  
Boundary read  
Boundary scan  
Boundary scan  
Boundary scan  
Bypass  
Normal  
Test  
Boundary read  
Boundary self test  
Boundary toggle outputs  
Boundary-control register scan  
Boundary-control register scan  
Bypass scan  
Normal  
Test  
Boundary control  
Boundary control  
Bypass  
Normal  
Test  
Normal  
Bit 7 is used to maintain even parity in the 8-bit instruction.  
The BYPASS instruction is executed in lieu of a SCOPEinstruction that is not supported in the SN74LVTH18512 or SN74LVTH182512.  
boundary scan  
This instruction conforms to the IEEE Std 1149.1-1990 EXTEST instruction. The BSR is selected in the scan  
path. Data appearing at the device input and I/O pins is captured in the associated BSCs. Data that has been  
scanned into the I/O BSCs for pins in the output mode is applied to the device I/O pins. Data present at the device  
pins, except for output enables, is passed through the BSCs to the normal on-chip logic. For I/O pins, the  
operation of a pin as input or output is determined by the contents of the output-enable BSCs (bits 47−44 of the  
BSR). When a given output enable is active (logic 0), the associated I/O pins operate in the output mode.  
Otherwise, the I/O pins operate in the input mode. The device operates in the test mode.  
identification read  
This instruction conforms to the IEEE Std 1149.1-1990 IDCODE instruction. The IDR is selected in the scan  
path. The device operates in the normal mode.  
sample boundary  
This instruction conforms to the IEEE Std 1149.1-1990 SAMPLE/PRELOAD instruction. The BSR is selected  
in the scan path. Data appearing at the device input pins and I/O pins in the input mode is captured in the  
associated BSCs, while data appearing at the outputs of the normal on-chip logic is captured in the BSCs  
associated with I/O pins in the output mode. The device operates in the normal mode.  
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SCBS790 − NOVEMBER 2003  
bypass scan  
This instruction conforms to the IEEE Std 1149.1-1990 BYPASS instruction. The bypass register is selected in  
the scan path. A logic 0 value is captured in the bypass register during Capture-DR. The device operates in the  
normal mode.  
control boundary to high impedance  
This instruction conforms to the IEEE Std 1149.1a-1993 HIGHZ instruction. The bypass register is selected in  
the scan path. A logic 0 value is captured in the bypass register during Capture-DR. The device operates in a  
modified test mode in which all device I/O pins are placed in the high-impedance state, the device input pins  
remain operational, and the normal on-chip logic function is performed.  
control boundary to 1/0  
This instruction conforms to the IEEE Std 1149.1a-1993 CLAMP instruction. The bypass register is selected in  
the scan path. A logic 0 value is captured in the bypass register during Capture-DR. Data in the I/O BSCs for  
pins in the output mode is applied to the device I/O pins. The device operates in the test mode.  
boundary-run test  
The bypass register is selected in the scan path. A logic 0 value is captured in the bypass register during  
Capture-DR. The device operates in the test mode. The test operation specified in the BCR is executed during  
Run-Test/Idle. The five test operations decoded by the BCR are: sample inputs/toggle outputs (TOPSIP),  
PRPG, PSA, simultaneous PSA and PRPG (PSA/PRPG), and simultaneous PSA and binary count up  
(PSA/COUNT).  
boundary read  
The BSR is selected in the scan path. The value in the BSR remains unchanged during Capture-DR. This  
instruction is useful for inspecting data after a PSA operation.  
boundary self test  
The BSR is selected in the scan path. All BSCs capture the inverse of their current values during Capture-DR.  
In this way, the contents of the shadow latches can be read out to verify the integrity of both shift-register and  
shadow-latch elements of the BSR. The device operates in the normal mode.  
boundary toggle outputs  
The bypass register is selected in the scan path. A logic 0 value is captured in the bypass register during  
Capture-DR. Data in the shift-register elements of the selected output-mode BSCs is toggled on each rising  
edge of TCK in Run-Test/Idle and is then updated in the shadow latches and thereby applied to the associated  
device I/O pins on each falling edge of TCK in Run-Test/Idle. Data in the input-mode BSCs remains constant.  
Data appearing at the device input or I/O pins is not captured in the input-mode BSCs. The device operates in  
the test mode.  
boundary-control-register scan  
The BCR is selected in the scan path. The value in the BCR remains unchanged during Capture-DR. This  
operation must be performed before a boundary-run test operation to specify which test operation is to  
be executed.  
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SCBS790 − NOVEMBER 2003  
boundary-control-register opcode description  
The BCR opcodes are decoded from BCR bits 2−0 as shown in Table 4. The selected test operation is performed  
while the RUNT instruction is executed in the Run-Test/Idle state. The following descriptions detail the operation  
of each BCR instruction and illustrate the associated PSA and PRPG algorithms.  
Table 4. Boundary-Control Register Opcodes  
BINARY CODE  
BIT 2 BIT 0  
MSB LSB  
DESCRIPTION  
X00  
X01  
X10  
011  
111  
Sample inputs/toggle outputs (TOPSIP)  
Pseudo-random pattern generation/36-bit mode (PRPG)  
Parallel-signature analysis/36-bit mode (PSA)  
Simultaneous PSA and PRPG/18-bit mode (PSA/PRPG)  
Simultaneous PSA and binary count up/18-bit mode (PSA/COUNT)  
While the control input BSCs (bits 47−36) are not included in the toggle, PSA, PRPG, or COUNT algorithms,  
the output-enable BSCs (bits 47−44 of the BSR) control the drive state (active or high impedance) of the selected  
device output pins. These BCR instructions are valid only when both bytes of the device are operating in one  
direction of data flow (i.e., 1OEAB 1OEBA and 2OEAB 2OEBA) and in the same direction of data flow (i.e.,  
1OEAB = 2OEAB and 1OEBA = 2OEBA). Otherwise, the bypass instruction is operated.  
sample inputs/toggle outputs (TOPSIP)  
Data appearing at the selected device input-mode I/O pins is captured in the shift-register elements of the  
associated BSCs on each rising edge of TCK. Data in the shift-register elements of the selected output-mode  
BSCs is toggled on each rising edge of TCK, updated in the shadow latches, and applied to the associated  
device I/O pins on each falling edge of TCK.  
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SCBS790 − NOVEMBER 2003  
pseudo-random pattern generation (PRPG)  
A pseudo-random pattern is generated in the shift-register elements of the selected BSCs on each rising edge  
of TCK, updated in the shadow latches, and applied to the associated device output-mode I/O pins on each  
falling edge of TCK. Figures 5 and 6 show the 36-bit linear-feedback shift-register algorithms through which the  
patterns are generated. An initial seed value should be scanned into the BSR before performing this operation.  
A seed value of all zeroes does not produce additional patterns.  
2A9-I/O 2A8-I/O 2A7-I/O 2A6-I/O 2A5-I/O 2A4-I/O 2A3-I/O 2A2-I/O 2A1-I/O  
1A9-I/O 1A8-I/O 1A7-I/O 1A6-I/O 1A5-I/O 1A4-I/O 1A3-I/O 1A2-I/O 1A1-I/O  
2B9-I/O 2B8-I/O 2B7-I/O 2B6-I/O 2B5-I/O 2B4-I/O 2B3-I/O 2B2-I/O 2B1-I/O  
=
1B9-I/O 1B8-I/O 1B7-I/O 1B6-I/O 1B5-I/O 1B4-I/O 1B3-I/O 1B2-I/O 1B1-I/O  
Figure 5. 36-Bit PRPG Configuration (1OEAB = 2OEAB = 0, 1OEBA = 2OEBA = 1)  
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SCBS790 − NOVEMBER 2003  
2B9-I/O 2B8-I/O 2B7-I/O 2B6-I/O 2B5-I/O 2B4-I/O 2B3-I/O 2B2-I/O 2B1-I/O  
1B9-I/O 1B8-I/O 1B7-I/O 1B6-I/O 1B5-I/O 1B4-I/O 1B3-I/O 1B2-I/O 1B1-I/O  
2A9-I/O 2A8-I/O 2A7-I/O 2A6-I/O 2A5-I/O 2A4-I/O 2A3-I/O 2A2-I/O 2A1-I/O  
=
1A9-I/O 1A8-I/O 1A7-I/O 1A6-I/O 1A5-I/O 1A4-I/O 1A3-I/O 1A2-I/O 1A1-I/O  
Figure 6. 36-Bit PRPG Configuration (1OEAB = 2OEAB = 1, 1OEBA = 2OEBA = 0)  
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SCBS790 − NOVEMBER 2003  
parallel-signature analysis (PSA)  
Data appearing at the selected device input-mode I/O pins is compressed into a 36-bit parallel signature in the  
shift-register elements of the selected BSCs on each rising edge of TCK. Data in the shadow latches of the  
selected output-mode BSCs remains constant and is applied to the associated device I/O pins. Figures 7 and 8  
show the 36-bit linear-feedback shift-register algorithms through which the signature is generated. An initial  
seed value should be scanned into the BSR before performing this operation.  
2A9-I/O 2A8-I/O 2A7-I/O 2A6-I/O 2A5-I/O 2A4-I/O 2A3-I/O 2A2-I/O 2A1-I/O  
1A9-I/O 1A8-I/O 1A7-I/O 1A6-I/O 1A5-I/O 1A4-I/O 1A3-I/O 1A2-I/O 1A1-I/O  
2B9-I/O 2B8-I/O 2B7-I/O 2B6-I/O 2B5-I/O 2B4-I/O 2B3-I/O 2B2-I/O 2B1-I/O  
=
=
1B9-I/O 1B8-I/O 1B7-I/O 1B6-I/O 1B5-I/O 1B4-I/O 1B3-I/O 1B2-I/O 1B1-I/O  
Figure 7. 36-Bit PSA Configuration (1OEAB = 2OEAB = 0, 1OEBA = 2OEBA = 1)  
18  
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SCBS790 − NOVEMBER 2003  
2B9-I/O 2B8-I/O 2B7-I/O 2B6-I/O 2B5-I/O 2B4-I/O 2B3-I/O 2B2-I/O 2B1-I/O  
1B9-I/O 1B8-I/O 1B7-I/O 1B6-I/O 1B5-I/O 1B4-I/O 1B3-I/O 1B2-I/O 1B1-I/O  
2A9-I/O 2A8-I/O 2A7-I/O 2A6-I/O 2A5-I/O 2A4-I/O 2A3-I/O 2A2-I/O 2A1-I/O  
=
=
1A9-I/O 1A8-I/O 1A7-I/O 1A6-I/O 1A5-I/O 1A4-I/O 1A3-I/O 1A2-I/O 1A1-I/O  
Figure 8. 36-Bit PSA Configuration (1OEAB = 2OEAB = 1, 1OEBA = 2OEBA = 0)  
19  
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ꢐꢑ ꢐꢌꢅ ꢒ ꢓꢆ ꢀꢔ ꢒ ꢁ ꢆꢍ ꢀ ꢆ ꢕꢍ ꢅ ꢖ ꢔꢍ ꢀ  
ꢗꢖ ꢆ ꢇ ꢈ ꢉꢌ ꢓꢖ ꢆ ꢘ ꢁ ꢖ ꢅꢍ ꢙꢀ ꢒꢄ ꢓꢘ ꢀ ꢆꢙ ꢒꢁ ꢀꢔ ꢍꢖ ꢅꢍꢙꢀ  
SCBS790 − NOVEMBER 2003  
simultaneous PSA and PRPG (PSA/PRPG)  
Data appearing at the selected device input-mode I/O pins is compressed into an 18-bit parallel signature in  
the shift-register elements of the selected input-mode BSCs on each rising edge of TCK. At the same time, an  
18-bit pseudo-random pattern is generated in the shift-register elements of the selected output-mode BSCs on  
each rising edge of TCK, updated in the shadow latches, and applied to the associated device I/O pins on each  
falling edge of TCK. Figures 9 and 10 show the 18-bit linear-feedback shift-register algorithms through which  
the signature and patterns are generated. An initial seed value should be scanned into the BSR before  
performing this operation. A seed value of all zeroes does not produce additional patterns.  
2A9-I/O 2A8-I/O 2A7-I/O 2A6-I/O 2A5-I/O 2A4-I/O 2A3-I/O 2A2-I/O 2A1-I/O  
1A9-I/O 1A8-I/O 1A7-I/O 1A6-I/O 1A5-I/O 1A4-I/O 1A3-I/O 1A2-I/O 1A1-I/O  
2B9-I/O 2B8-I/O 2B7-I/O 2B6-I/O 2B5-I/O 2B4-I/O 2B3-I/O 2B2-I/O 2B1-I/O  
=
=
1B9-I/O 1B8-I/O 1B7-I/O 1B6-I/O 1B5-I/O 1B4-I/O 1B3-I/O 1B2-I/O 1B1-I/O  
Figure 9. 18-Bit PSA/PRPG Configuration (1OEAB = 2OEAB = 0, 1OEBA = 2OEBA = 1)  
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SCBS790 − NOVEMBER 2003  
2B9-I/O 2B8-I/O 2B7-I/O 2B6-I/O 2B5-I/O 2B4-I/O 2B3-I/O 2B2-I/O 2B1-I/O  
1B9-I/O 1B8-I/O 1B7-I/O 1B6-I/O 1B5-I/O 1B4-I/O 1B3-I/O 1B2-I/O 1B1-I/O  
2A9-I/O 2A8-I/O 2A7-I/O 2A6-I/O 2A5-I/O 2A4-I/O 2A3-I/O 2A2-I/O 2A1-I/O  
=
=
1A9-I/O 1A8-I/O 1A7-I/O 1A6-I/O 1A5-I/O 1A4-I/O 1A3-I/O 1A2-I/O 1A1-I/O  
Figure 10. 18-Bit PSA/PRPG Configuration (1OEAB = 2OEAB = 1, 1OEBA = 2OEBA = 0)  
21  
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ꢐꢑ ꢐꢌꢅ ꢒ ꢓꢆ ꢀꢔ ꢒ ꢁ ꢆꢍ ꢀ ꢆ ꢕꢍ ꢅ ꢖ ꢔꢍ ꢀ  
ꢗꢖ ꢆ ꢇ ꢈ ꢉꢌ ꢓꢖ ꢆ ꢘ ꢁ ꢖ ꢅꢍ ꢙꢀ ꢒꢄ ꢓꢘ ꢀ ꢆꢙ ꢒꢁ ꢀꢔ ꢍꢖ ꢅꢍꢙꢀ  
SCBS790 − NOVEMBER 2003  
simultaneous PSA and binary count up (PSA/COUNT)  
Data appearing at the selected device input-mode I/O pins is compressed into an 18-bit parallel signature in  
the shift-register elements of the selected input-mode BSCs on each rising edge of TCK. At the same time, an  
18-bit binary count-up pattern is generated in the shift-register elements of the selected output-mode BSCs on  
each rising edge of TCK, updated in the shadow latches, and applied to the associated device I/O pins on each  
falling edge of TCK. Figures 11 and 12 show the 18-bit linear-feedback shift-register algorithms through which  
the signature is generated. An initial seed value should be scanned into the BSR before performing  
this operation.  
2A9-I/O 2A8-I/O 2A7-I/O 2A6-I/O 2A5-I/O 2A4-I/O 2A3-I/O 2A2-I/O 2A1-I/O  
1A9-I/O 1A8-I/O 1A7-I/O 1A6-I/O 1A5-I/O 1A4-I/O 1A3-I/O 1A2-I/O 1A1-I/O  
MSB  
2B9-I/O 2B8-I/O 2B7-I/O 2B6-I/O 2B5-I/O 2B4-I/O 2B3-I/O 2B2-I/O 2B1-I/O  
LSB  
=
=
1B9-I/O 1B8-I/O 1B7-I/O 1B6-I/O 1B5-I/O 1B4-I/O 1B3-I/O 1B2-I/O 1B1-I/O  
Figure 11. 18-Bit PSA/COUNT Configuration (1OEAB = 2OEAB = 0, 1OEBA = 2OEBA = 1)  
22  
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SCBS790 − NOVEMBER 2003  
2B9-I/O 2B8-I/O 2B7-I/O 2B6-I/O 2B5-I/O 2B4-I/O 2B3-I/O 2B2-I/O 2B1-I/O  
1B9-I/O 1B8-I/O 1B7-I/O 1B6-I/O 1B5-I/O 1B4-I/O 1B3-I/O 1B2-I/O 1B1-I/O  
MSB  
2A9-I/O 2A8-I/O 2A7-I/O 2A6-I/O 2A5-I/O 2A4-I/O 2A3-I/O 2A2-I/O 2A1-I/O  
LSB  
=
=
1A9-I/O 1A8-I/O 1A7-I/O 1A6-I/O 1A5-I/O 1A4-I/O 1A3-I/O 1A2-I/O 1A1-I/O  
Figure 12. 18-Bit PSA/COUNT Configuration (1OEAB = 2OEAB = 1, 1OEBA = 2OEBA = 0)  
23  
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ꢐꢑ ꢐꢌꢅ ꢒ ꢓꢆ ꢀꢔ ꢒ ꢁ ꢆꢍ ꢀ ꢆ ꢕꢍ ꢅ ꢖ ꢔꢍ ꢀ  
ꢗꢖ ꢆ ꢇ ꢈ ꢉꢌ ꢓꢖ ꢆ ꢘ ꢁ ꢖ ꢅꢍ ꢙꢀ ꢒꢄ ꢓꢘ ꢀ ꢆꢙ ꢒꢁ ꢀꢔ ꢍꢖ ꢅꢍꢙꢀ  
SCBS790 − NOVEMBER 2003  
timing description  
All test operations of the SN74LVTH18512 and SN74LVTH182512 are synchronous to the TCK signal. Data  
on the TDI, TMS, and normal-function inputs is captured on the rising edge of TCK. Data appears on the TDO  
and normal-function output pins on the falling edge of TCK. The TAP controller is advanced through its states  
(as shown in Figure 1) by changing the value of TMS on the falling edge of TCK and then applying a rising edge  
to TCK.  
A simple timing example is shown in Figure 13. In this example, the TAP controller begins in the  
Test-Logic-Reset state and is advanced through its states, as necessary, to perform one instruction-register  
scan and one data-register scan. While in the Shift-IR and Shift-DR states, TDI is used to input serial data, and  
TDO is used to output serial data. The TAP controller is then returned to the Test-Logic-Reset state. Table 5  
details the operation of the test circuitry during each TCK cycle.  
Table 5. Explanation of Timing Example  
TCK  
CYCLE(S)  
TAP STATE  
AFTER TCK  
DESCRIPTION  
TMS is changed to a logic 0 value on the falling edge of TCK to begin advancing the TAP controller toward  
the desired state.  
1
Test-Logic-Reset  
2
3
4
Run-Test/Idle  
Select-DR-Scan  
Select-IR-Scan  
The IR captures the 8-bit binary value 10000001 on the rising edge of TCK as the TAP controller exits the  
Capture-IR state.  
5
6
Capture-IR  
Shift-IR  
TDO becomes active and TDI is made valid on the falling edge of TCK. The first bit is shifted into the TAP  
on the rising edge of TCK as the TAP controller advances to the next state.  
One bit is shifted into the IR on each TCK rising edge. With TDI held at a logic 1 value, the 8-bit binary value  
11111111 is serially scanned into the IR. At the same time, the 8-bit binary value 10000001 is serially scanned  
out of the IR via TDO. In TCK cycle 13, TMS is changed to a logic 1 value to end the IR scan on the next  
TCK cycle. The last bit of the instruction is shifted as the TAP controller advances from Shift-IR to Exit1-IR.  
7−13  
Shift-IR  
14  
15  
16  
Exit1-IR  
Update-IR  
TDO becomes inactive (goes to the high-impedance state) on the falling edge of TCK.  
The IR is updated with the new instruction (BYPASS) on the falling edge of TCK.  
Select-DR-Scan  
The bypass register captures a logic 0 value on the rising edge of TCK as the TAP controller exits the  
Capture-DR state.  
17  
18  
Capture-DR  
Shift-DR  
TDO becomes active and TDI is made valid on the falling edge of TCK. The first bit is shifted into the TAP  
on the rising edge of TCK as the TAP controller advances to the next state.  
19−20  
21  
Shift-DR  
Exit1-DR  
The binary value 101 is shifted in via TDI, while the binary value 010 is shifted out via TDO.  
TDO becomes inactive (goes to the high-impedance state) on the falling edge of TCK.  
The selected data register is updated with the new data on the falling edge of TCK.  
22  
Update-DR  
23  
Select-DR-Scan  
Select-IR-Scan  
Test-Logic-Reset  
24  
25  
Test operation completed  
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SCBS790 − NOVEMBER 2003  
1
2
3
4
5
6
7
8
9
10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25  
TCK  
TMS  
TDI  
TDO  
TAP  
Controller  
State  
3-State (TDO) or Don’t Care (TDI)  
Figure 13. Timing Example  
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)  
Supply voltage range, V  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 4.6 V  
CC  
Input voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V  
I
Voltage range applied to any output in the high or power-off state, V (see Note 1) . . . . . . . . . −0.5 V to 7 V  
O
Current into any output in the low state, I : SN74LVTH18512 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA  
O
SN74LVTH182512 (A port or TDO) . . . . . . . . . . . . . . . . . 128 mA  
SN74LVTH182512 (B port) . . . . . . . . . . . . . . . . . . . . . . . . . 30 mA  
Current into any output in the high state, I (see Note 2): SN74LVTH18512 . . . . . . . . . . . . . . . . . . . . . 64 mA  
O
SN74LVTH182512 (A port or TDO) . . . . . . 64 mA  
SN74LVTH182512 (B port) . . . . . . . . . . . . . 30 mA  
Input clamp current, I (V < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA  
IK  
OK  
I
Output clamp current, I  
(V < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA  
O
Package thermal impedance, θ (see Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73°C/W  
JA  
stg  
Storage temperature range, T  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C  
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and  
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not  
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
NOTES: 1. The input and output negative-voltage ratings can be exceeded if the input and output clamp-current ratings are observed.  
2. This current only flows when the output is in the high state and V > V  
.
CC  
O
3. The package thermal impedance is calculated in accordance with JESD 51.  
25  
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ꢐꢑ ꢐꢌꢅ ꢒ ꢓꢆ ꢀꢔ ꢒ ꢁ ꢆꢍ ꢀ ꢆ ꢕꢍ ꢅ ꢖ ꢔꢍ ꢀ  
ꢗꢖ ꢆ ꢇ ꢈ ꢉꢌ ꢓꢖ ꢆ ꢘ ꢁ ꢖ ꢅꢍ ꢙꢀ ꢒꢄ ꢓꢘ ꢀ ꢆꢙ ꢒꢁ ꢀꢔ ꢍꢖ ꢅꢍꢙꢀ  
SCBS790 − NOVEMBER 2003  
recommended operating conditions (see Note 4)  
SN74LVTH18512-EP  
UNIT  
MIN  
2.7  
2
MAX  
V
V
V
V
Supply voltage  
3.6  
V
V
CC  
High-level input voltage  
Low-level input voltage  
Input voltage  
IH  
0.8  
5.5  
−32  
32  
V
IL  
V
I
I
I
I
High-level output current  
Low-level output current  
Low-level output current  
Input transition rise or fall rate  
Operating free-air temperature  
mA  
mA  
mA  
ns/V  
°C  
OH  
OL  
64  
OL  
t/v  
Outputs enabled  
10  
T
A
−40  
85  
Current duty cycle 50%, f 1 kHz  
NOTE 4: Unused control inputs must be held high or low to prevent them from floating.  
ꢟ ꢤ ꢞ ꢝ ꢯ ꢥ ꢩꢜ ꢦ ꢞ ꢤ ꢠꢧ ꢟꢤ ꢰ ꢤ ꢫ ꢠꢩ ꢣꢤ ꢥ ꢛꢑ ꢔ ꢜꢦ ꢨꢦ ꢡꢛ ꢤꢨ ꢝꢞ ꢛꢝ ꢡ ꢟꢦ ꢛꢦ ꢦꢥ ꢟ ꢠꢛ ꢜꢤꢨ  
ꢡ ꢜ ꢦ ꢥ ꢯꢤ ꢠꢨ ꢟꢝ ꢞ ꢡ ꢠꢥ ꢛꢝ ꢥꢢ ꢤ ꢛ ꢜꢤ ꢞ ꢤ ꢩꢨ ꢠ ꢟꢢꢡ ꢛꢞ ꢭ ꢝꢛꢜ ꢠꢢꢛ ꢥꢠꢛ ꢝꢡꢤ ꢑ  
ꢤꢞ  
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SCBS790 − NOVEMBER 2003  
electrical characteristics over recommended operating free-air temperature range (unless  
otherwise noted)  
SN74LVTH18512-EP  
PARAMETER  
TEST CONDITIONS  
UNIT  
MIN TYP  
MAX  
V
V
V
V
V
= 2.7 V,  
I = −18 mA  
−1.2  
V
IK  
CC  
CC  
CC  
I
= 2.7 V to 3.6 V,  
= 2.7 V,  
I
I
I
I
I
I
I
I
I
= −100 µA  
= −3 mA  
= −8 mA  
= −32 mA  
= 100 µA  
= 24 mA  
= 16 mA  
= 32 mA  
= 64 mA  
V
−0.2  
OH  
OH  
OH  
OH  
OL  
OL  
OL  
OL  
OL  
CC  
2.4  
V
V
OH  
2.4  
2
V
= 3 V  
CC  
CC  
0.2  
0.5  
0.4  
0.5  
0.55  
1
V
= 2.7 V  
V
OL  
V
CC  
= 3 V  
V
V
= 3.6 V,  
V = V or GND  
I CC  
CC  
CLK,  
LE, TCK  
= 0 or 3.6 V,  
V = 5.5 V  
I
10  
CC  
V = 5.5 V  
I
5
OE,  
TDI, TMS  
V = V  
1
V
= 3.6 V  
= 3.6 V  
I
CC  
CC  
CC  
I
I
µA  
V = 0  
I
−25  
−100  
20  
V = 5.5 V  
I
A or B  
ports  
V = V  
1
V
I
CC  
V = 0  
I
−5  
I
I
V
V
= 0,  
V or V = 0 to 4.5 V  
100  
500  
µA  
µA  
off  
CC  
I
O
V = 0.8 V  
I
75  
150  
A or B  
ports  
§
= 3 V  
CC  
I(hold)  
V = 2 V  
I
−75 −150 −500  
I
I
I
I
TDO  
TDO  
TDO  
TDO  
V
CC  
V
CC  
V
CC  
V
CC  
= 3.6 V,  
V
O
V
O
V
O
V
O
= 3 V  
1
−1  
50  
50  
µA  
µA  
µA  
µA  
OZH  
= 3.6 V,  
= 0.5 V  
OZL  
= 0 to 1.5 V,  
= 1.5 V to 0,  
= 0.5 V or 3 V  
= 0.5 V or 3 V  
OZPU  
OZPD  
Outputs high  
Outputs low  
0.6  
18  
2
24  
2
I
V
= 3.6 V, I = 0, V = V  
CC  
or GND  
mA  
CC  
CC  
CC  
O
I
Outputs disabled  
0.6  
V
= 3 V to 3.6 V, One input at V  
CC  
− 0.6 V, Other inputs at V  
or GND  
0.5  
mA  
pF  
pF  
pF  
I  
CC  
CC  
C
C
C
V = 3 V or 0  
I
4
10  
8
i
V
= 3 V or 0  
= 3 V or 0  
io  
o
O
O
V
§
All typical values are at V  
= 3.3 V, T = 25°C.  
A
CC  
Unused pins at V  
or GND  
CC  
The parameter I  
includes the off-state output leakage current.  
I(hold)  
This is the increase in supply current for each input that is at the specified TTL voltage level, rather than V  
or GND.  
CC  
ꢟꢤ ꢞ ꢝ ꢯꢥ ꢩꢜ ꢦ ꢞ ꢤ ꢠꢧ ꢟꢤ ꢰ ꢤ ꢫꢠ ꢩꢣꢤ ꢥꢛꢑ ꢔ ꢜꢦ ꢨꢦ ꢡꢛ ꢤꢨ ꢝꢞ ꢛꢝ ꢡ ꢟꢦ ꢛꢦ ꢦꢥ ꢟ ꢠꢛ ꢜꢤꢨ  
ꢡ ꢜꢦ ꢥ ꢯꢤ ꢠꢨ ꢟꢝ ꢞ ꢡ ꢠꢥ ꢛꢝ ꢥꢢꢤ ꢛ ꢜꢤ ꢞ ꢤ ꢩꢨ ꢠꢟ ꢢꢡꢛ ꢞ ꢭ ꢝꢛꢜ ꢠꢢꢛ ꢥꢠꢛ ꢝꢡꢤ ꢑ  
27  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
ꢀ ꢁꢂ ꢃꢄꢅꢆ ꢇ ꢈ ꢉ ꢊꢈ ꢋꢌ ꢍꢎꢏ ꢀ ꢁꢂ ꢃ ꢄꢅ ꢆꢇ ꢈꢉ ꢋ ꢊ ꢈ ꢋ ꢌꢍ ꢎ  
ꢐꢑ ꢐꢌꢅ ꢒ ꢓꢆ ꢀꢔ ꢒ ꢁ ꢆꢍ ꢀ ꢆ ꢕꢍ ꢅ ꢖ ꢔꢍ ꢀ  
ꢗꢖ ꢆ ꢇ ꢈ ꢉꢌ ꢓꢖ ꢆ ꢘ ꢁ ꢖ ꢅꢍ ꢙꢀ ꢒꢄ ꢓꢘ ꢀ ꢆꢙ ꢒꢁ ꢀꢔ ꢍꢖ ꢅꢍꢙꢀ  
SCBS790 − NOVEMBER 2003  
timing requirements over recommended operating free-air temperature range (unless otherwise  
noted) (normal mode) (see Figure 14)  
SN74LVTH18512-EP  
V = 3.3 V  
CC  
0.3 V  
V
CC  
= 2.7 V  
UNIT  
MIN  
MAX  
MIN  
0
MAX  
f
t
Clock frequency CLKAB or CLKBA  
CLKAB or CLKBA high or low  
0
4.4  
3
100  
80  
MHz  
ns  
clock  
5.6  
3
Pulse duration  
Setup time  
Hold time  
w
LEAB or LEBA high  
A before CLKABor B before CLKBA↑  
2.8  
1.5  
1.6  
1.4  
3.1  
3
CLK high  
CLK low  
0.7  
1.6  
1.1  
3.5  
t
ns  
ns  
su  
h
A before LEABor B before LEBA↓  
A after CLKABor B after CLKBA↑  
A after LEABor B after LEBA↓  
t
timing requirements over recommended operating free-air temperature range (unless otherwise  
noted) (test mode) (see Figure 14)  
SN74LVTH18512-EP  
V = 3.3 V  
CC  
0.3 V  
V
CC  
= 2.7 V  
UNIT  
MIN  
MAX  
MIN  
0
MAX  
f
t
Clock frequency TCK  
0
9.5  
6.5  
2.5  
2.5  
1.7  
1.5  
1.5  
50  
50  
40  
MHz  
ns  
clock  
Pulse duration  
TCK high or low  
10.5  
7
w
A, B, CLK, LE, or OE before TCK↑  
TDI before TCK↑  
3.5  
3.5  
1
t
Setup time  
ns  
ns  
su  
h
TMS before TCK↑  
A, B, CLK, LE, or OE after TCK↑  
TDI after TCK↑  
1
t
Hold time  
TMS after TCK↑  
1
t
t
Delay time  
Rise time  
Power up to TCK↑  
50  
1
ns  
d
V
CC  
power up  
1
µs  
r
28  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
ꢐ ꢑꢐ ꢌꢅ ꢒꢓꢆ ꢀꢔꢒ ꢁ ꢆ ꢍꢀꢆ ꢕ ꢍꢅ ꢖ ꢔꢍ  
SCBS790 − NOVEMBER 2003  
switching characteristics over recommended operating free-air temperature range (unless  
otherwise noted) (normal mode) (see Figure 14)  
SN74LVTH18512-EP  
V
= 3.3 V  
FROM  
(INPUT)  
TO  
(OUTPUT)  
CC  
0.3 V  
V
= 2.7 V  
MAX  
PARAMETER  
UNIT  
CC  
MIN  
MAX  
MIN  
f
t
t
t
t
t
t
t
t
t
t
CLKAB or CLKBA  
A or B  
100  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
2.5  
2.5  
80  
MHz  
ns  
max  
PLH  
PHL  
PLH  
PHL  
PLH  
PHL  
PZH  
PZL  
PHZ  
PLZ  
4.9  
4.9  
5.8  
5.8  
7.4  
5.7  
7.1  
7.1  
7.8  
7.8  
5.6  
5.6  
6.8  
6.8  
8.4  
6.4  
8.3  
8.3  
8.4  
8.4  
B or A  
B or A  
B or A  
B or A  
B or A  
CLKAB or CLKBA  
LEAB or LEBA  
OEAB or OEBA  
OEAB or OEBA  
ns  
ns  
ns  
ns  
switching characteristics over recommended operating free-air temperature range (unless  
otherwise noted) (test mode) (see Figure 14)  
SN74LVTH18512-EP  
V
= 3.3 V  
FROM  
(INPUT)  
TO  
(OUTPUT)  
CC  
0.3 V  
V
= 2.7 V  
MAX  
PARAMETER  
UNIT  
CC  
MIN  
MAX  
MIN  
f
t
t
t
t
t
t
t
t
t
t
t
t
TCK  
50  
2.5  
2.5  
1
40  
MHz  
ns  
max  
PLH  
PHL  
PLH  
PHL  
PZH  
PZL  
PZH  
PZL  
PHZ  
PLZ  
PHZ  
PLZ  
14  
14  
5.5  
6.5  
17  
17  
5.5  
5.5  
18  
17  
7
17  
17  
TCK↓  
A or B  
TDO  
6.5  
7.5  
20  
TCK↓  
TCK↓  
TCK↓  
TCK↓  
TCK↓  
ns  
ns  
ns  
ns  
ns  
1.5  
4
A or B  
TDO  
4
20  
1
6.5  
6.5  
20  
1.5  
4
A or B  
TDO  
4
18.5  
8.5  
8
1.5  
1.5  
7
ꢟꢤ ꢞ ꢝ ꢯꢥ ꢩꢜ ꢦ ꢞ ꢤ ꢠꢧ ꢟꢤ ꢰ ꢤ ꢫꢠ ꢩꢣꢤ ꢥꢛꢑ ꢔ ꢜꢦ ꢨꢦ ꢡꢛ ꢤꢨ ꢝꢞ ꢛꢝ ꢡ ꢟꢦ ꢛꢦ ꢦꢥ ꢟ ꢠꢛ ꢜꢤꢨ  
ꢡ ꢜꢦ ꢥ ꢯꢤ ꢠꢨ ꢟꢝ ꢞ ꢡ ꢠꢥ ꢛꢝ ꢥꢢꢤ ꢛ ꢜꢤ ꢞ ꢤ ꢩꢨ ꢠꢟ ꢢꢡꢛ ꢞ ꢭ ꢝꢛꢜ ꢠꢢꢛ ꢥꢠꢛ ꢝꢡꢤ ꢑ  
29  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
ꢀ ꢁꢂ ꢃꢄꢅꢆ ꢇ ꢈ ꢉ ꢊꢈ ꢋꢌ ꢍꢎꢏ ꢀ ꢁꢂ ꢃ ꢄꢅ ꢆꢇ ꢈꢉ ꢋ ꢊ ꢈ ꢋ ꢌꢍ ꢎ  
ꢐꢑ ꢐꢌꢅ ꢒ ꢓꢆ ꢀꢔ ꢒ ꢁ ꢆꢍ ꢀ ꢆ ꢕꢍ ꢅ ꢖ ꢔꢍ ꢀ  
ꢗꢖ ꢆ ꢇ ꢈ ꢉꢌ ꢓꢖ ꢆ ꢘ ꢁ ꢖ ꢅꢍ ꢙꢀ ꢒꢄ ꢓꢘ ꢀ ꢆꢙ ꢒꢁ ꢀꢔ ꢍꢖ ꢅꢍꢙꢀ  
SCBS790 − NOVEMBER 2003  
recommended operating conditions (see Note 4)  
SN74LVTH182512-EP  
UNIT  
MIN  
2.7  
2
MAX  
V
CC  
V
IH  
V
IL  
V
I
Supply voltage  
3.6  
V
V
V
V
High-level input voltage  
Low-level input voltage  
Input voltage  
0.8  
5.5  
−32  
−12  
32  
A port, TDO  
B port  
I
High-level output current  
Low-level output current  
mA  
mA  
OH  
OL  
A port, TDO  
B port  
I
I
12  
Low-level output current  
A port, TDO  
Outputs enabled  
64  
mA  
ns/V  
°C  
OL  
t/v  
Input transition rise or fall rate  
Operating free-air temperature  
10  
T
−40  
85  
A
Current duty cycle 50%, f 1 kHz  
NOTE 4: Unused control inputs must be held high or low to prevent them from floating.  
30  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
ꢐ ꢑꢐ ꢌꢅ ꢒꢓꢆ ꢀꢔꢒ ꢁ ꢆ ꢍꢀꢆ ꢕ ꢍꢅ ꢖ ꢔꢍ  
SCBS790 − NOVEMBER 2003  
electrical characteristics over recommended operating free-air temperature range (unless  
otherwise noted)  
SN74LVTH182512-EP  
PARAMETER  
TEST CONDITIONS  
UNIT  
MIN TYP  
MAX  
V
V
V
V
= 2.7 V,  
I = −18 mA  
−1.2  
V
IK  
CC  
CC  
CC  
I
A, B, TDO  
= 2.7 V to 3.6 V,  
= 2.7 V,  
I
I
I
I
I
I
I
I
I
I
I
= −100 µA  
= −3 mA  
= −8 mA  
= −32 mA  
= −12 mA  
= 100 µA  
= 24 mA  
= 16 mA  
= 32 mA  
= 64 mA  
= 12 mA  
V
−0.2  
OH  
OH  
OH  
OH  
OH  
OL  
OL  
OL  
OL  
OL  
OL  
CC  
2.4  
A port,  
TDO  
2.4  
2
V
OH  
V
V
V
CC  
= 3 V  
B port  
V
CC  
V
CC  
V
CC  
= 3 V,  
2
A, B, TDO  
= 2.7 V,  
= 2.7 V,  
0.2  
0.5  
0.4  
0.5  
0.55  
0.8  
1
A port,  
TDO  
V
OL  
V
CC  
= 3 V  
B port  
V
CC  
V
CC  
V
CC  
= 3 V,  
= 3.6 V,  
V = V or GND  
I CC  
CLK,  
LE, TCK  
= 0 or 3.6 V,  
V = 5.5 V  
I
10  
V = 5.5 V  
I
5
OE,  
TDI, TMS  
V = V  
1
V
= 3.6 V  
= 3.6 V  
I
CC  
CC  
CC  
I
I
µA  
V = 0  
I
−25  
−100  
20  
V = 5.5 V  
I
A or B  
ports  
V = V  
1
V
I
CC  
V = 0  
I
−5  
I
I
V
V
= 0,  
V or V = 0 to 4.5 V  
100  
500  
µA  
µA  
off  
CC  
I
O
V = 0.8 V  
I
75  
150  
A or B  
ports  
§
= 3 V  
CC  
I(hold)  
V = 2 V  
I
−75 −150 −500  
I
I
I
I
TDO  
TDO  
TDO  
TDO  
V
CC  
V
CC  
V
CC  
V
CC  
= 3.6 V,  
V
O
V
O
V
O
V
O
= 3 V  
1
−1  
50  
50  
µA  
µA  
µA  
µA  
OZH  
= 3.6 V,  
= 0.5 V  
OZL  
= 0 to 1.5 V,  
= 1.5 V to 0,  
= 0.5 V or 3 V  
= 0.5 V or 3 V  
OZPU  
OZPD  
Outputs high  
Outputs low  
0.6  
18  
2
24  
2
I
V
= 3.6 V, I = 0, V = V  
CC  
or GND  
mA  
CC  
CC  
CC  
O
I
Outputs disabled  
0.6  
V
= 3 V to 3.6 V, One input at V  
CC  
− 0.6 V, Other inputs at V  
or GND  
0.5  
mA  
pF  
pF  
pF  
I  
CC  
CC  
C
C
C
V = 3 V or 0  
I
4
10  
8
i
V
= 3 V or 0  
= 3 V or 0  
io  
o
O
O
V
§
All typical values are at V  
= 3.3 V, T = 25°C.  
A
CC  
Unused pins at V  
or GND  
CC  
The parameter I  
includes the off-state output leakage current.  
I(hold)  
This is the increase in supply current for each input that is at the specified TTL voltage level, rather than V  
or GND.  
CC  
31  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
ꢀ ꢁꢂ ꢃꢄꢅꢆ ꢇ ꢈ ꢉ ꢊꢈ ꢋꢌ ꢍꢎꢏ ꢀ ꢁꢂ ꢃ ꢄꢅ ꢆꢇ ꢈꢉ ꢋ ꢊ ꢈ ꢋ ꢌꢍ ꢎ  
ꢐꢑ ꢐꢌꢅ ꢒ ꢓꢆ ꢀꢔ ꢒ ꢁ ꢆꢍ ꢀ ꢆ ꢕꢍ ꢅ ꢖ ꢔꢍ ꢀ  
ꢗꢖ ꢆ ꢇ ꢈ ꢉꢌ ꢓꢖ ꢆ ꢘ ꢁ ꢖ ꢅꢍ ꢙꢀ ꢒꢄ ꢓꢘ ꢀ ꢆꢙ ꢒꢁ ꢀꢔ ꢍꢖ ꢅꢍꢙꢀ  
SCBS790 − NOVEMBER 2003  
timing requirements over recommended operating free-air temperature range (unless otherwise  
noted) (normal mode) (see Figure 14)  
SN74LVTH182512-EP  
V = 3.3 V  
CC  
0.3 V  
V
CC  
= 2.7 V  
UNIT  
MIN  
MAX  
MIN  
0
MAX  
f
t
Clock frequency CLKAB or CLKBA  
CLKAB or CLKBA high or low  
0
4.4  
3
100  
80  
MHz  
ns  
clock  
5.6  
3
Pulse duration  
Setup time  
Hold time  
w
LEAB or LEBA high  
A before CLKABor B before CLKBA↑  
2.8  
1.5  
1.6  
1.4  
3.1  
3
CLK high  
CLK low  
0.7  
1.6  
1.1  
3.5  
t
ns  
ns  
su  
h
A before LEABor B before LEBA↓  
A after CLKABor B after CLKBA↑  
A after LEABor B after LEBA↓  
t
timing requirements over recommended operating free-air temperature range (unless otherwise  
noted) (test mode) (see Figure 14)  
SN74LVTH182512-EP  
V = 3.3 V  
CC  
0.3 V  
V
CC  
= 2.7 V  
UNIT  
MIN  
MAX  
MIN  
0
MAX  
f
t
Clock frequency TCK  
0
9.5  
6.5  
2.5  
2.5  
1.7  
1.5  
1.5  
50  
50  
40  
MHz  
ns  
clock  
Pulse duration  
TCK high or low  
10.5  
7
w
A, B, CLK, LE, or OE before TCK↑  
TDI before TCK↑  
3.5  
3.5  
1
t
Setup time  
ns  
ns  
su  
h
TMS before TCK↑  
A, B, CLK, LE, or OE after TCK↑  
TDI after TCK↑  
1
t
Hold time  
TMS after TCK↑  
1
t
t
Delay time  
Rise time  
Power up to TCK↑  
50  
1
ns  
d
V
CC  
power up  
1
µs  
r
32  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
ꢐ ꢑꢐ ꢌꢅ ꢒꢓꢆ ꢀꢔꢒ ꢁ ꢆ ꢍꢀꢆ ꢕ ꢍꢅ ꢖ ꢔꢍ  
SCBS790 − NOVEMBER 2003  
switching characteristics over recommended operating free-air temperature range (unless  
otherwise noted) (normal mode) (see Figure 14)  
SN74LVTH182512-EP  
V
= 3.3 V  
FROM  
(INPUT)  
TO  
(OUTPUT)  
CC  
0.3 V  
V
= 2.7 V  
MAX  
PARAMETER  
UNIT  
CC  
MIN  
MAX  
MIN  
f
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
CLKAB or CLKBA  
A
100  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
2.5  
2.5  
80  
MHz  
ns  
max  
PLH  
PHL  
PLH  
PHL  
PLH  
PHL  
PLH  
PHL  
PLH  
PHL  
PLH  
PHL  
PZH  
PZL  
PHZ  
PLZ  
5.7  
5.7  
4.9  
4.9  
6.7  
6.7  
5.8  
5.8  
8.2  
6.2  
7.4  
5.7  
7.9  
7.9  
8.4  
8.4  
6.4  
6.4  
5.6  
5.6  
7.7  
7.7  
6.8  
6.8  
9.2  
6.7  
8.4  
6.4  
8.7  
8.7  
8.9  
8.9  
B
B
CLKAB  
A
ns  
ns  
ns  
ns  
ns  
ns  
ns  
B
A
CLKBA  
LEAB  
B
LEBA  
A
OEAB or OEBA  
OEAB or OEBA  
B or A  
B or A  
switching characteristics over recommended operating free-air temperature range (unless  
otherwise noted) (test mode) (see Figure 14)  
SN74LVTH182512-EP  
V
= 3.3 V  
FROM  
(INPUT)  
TO  
(OUTPUT)  
CC  
0.3 V  
V
= 2.7 V  
MAX  
PARAMETER  
UNIT  
CC  
MIN  
MAX  
MIN  
f
t
t
t
t
t
t
t
t
t
t
t
t
TCK  
50  
2.5  
2.5  
1
40  
MHz  
ns  
max  
PLH  
PHL  
PLH  
PHL  
PZH  
PZL  
PZH  
PZL  
PHZ  
PLZ  
PHZ  
PLZ  
14  
14  
5.5  
6.5  
17  
17  
5.5  
5.5  
18  
17  
7
17  
17  
TCK↓  
A or B  
TDO  
6.5  
7.5  
20  
TCK↓  
TCK↓  
TCK↓  
TCK↓  
TCK↓  
ns  
ns  
ns  
ns  
ns  
1.5  
4
A or B  
TDO  
4
20  
1
6.5  
6.5  
20  
1.5  
4
A or B  
TDO  
4
18.5  
8.5  
8
1.5  
1.5  
7
33  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
ꢀ ꢁꢂ ꢃꢄꢅꢆ ꢇ ꢈ ꢉ ꢊꢈ ꢋꢌ ꢍꢎꢏ ꢀ ꢁꢂ ꢃ ꢄꢅ ꢆꢇ ꢈꢉ ꢋ ꢊ ꢈ ꢋ ꢌꢍ ꢎ  
ꢐꢑ ꢐꢌꢅ ꢒ ꢓꢆ ꢀꢔ ꢒ ꢁ ꢆꢍ ꢀ ꢆ ꢕꢍ ꢅ ꢖ ꢔꢍ ꢀ  
ꢗꢖ ꢆ ꢇ ꢈ ꢉꢌ ꢓꢖ ꢆ ꢘ ꢁ ꢖ ꢅꢍ ꢙꢀ ꢒꢄ ꢓꢘ ꢀ ꢆꢙ ꢒꢁ ꢀꢔ ꢍꢖ ꢅꢍꢙꢀ  
SCBS790 − NOVEMBER 2003  
PARAMETER MEASUREMENT INFORMATION  
6 V  
S1  
500 Ω  
Open  
GND  
From Output  
Under Test  
TEST  
S1  
t
t
/t  
Open  
6 V  
PLH PHL  
/t  
C
= 50 pF  
L
t
500 Ω  
PLZ PZL  
/t  
(see Note A)  
GND  
PHZ PZH  
LOAD CIRCUIT  
2.7 V  
0 V  
Timing Input  
Data Input  
1.5 V  
t
w
t
t
h
su  
2.7 V  
0 V  
2.7 V  
0 V  
Input  
1.5 V  
1.5 V  
1.5 V  
1.5 V  
VOLTAGE WAVEFORMS  
PULSE DURATION  
VOLTAGE WAVEFORMS  
SETUP AND HOLD TIMES  
2.7 V  
0 V  
2.7 V  
0 V  
Output  
Control  
1.5 V  
1.5 V  
1.5 V  
1.5 V  
Input  
t
PZL  
t
t
PHL  
PLH  
t
PLZ  
Output  
Waveform 1  
S1 at 6 V  
V
V
3 V  
OH  
1.5 V  
1.5 V  
1.5 V  
1.5 V  
Output  
V
V
+ 0.3 V  
− 0.3 V  
OL  
V
OL  
OL  
(see Note B)  
t
PHZ  
t
PLH  
t
t
PZH  
PHL  
Output  
Waveform 2  
S1 at GND  
V
OH  
V
V
OH  
OH  
1.5 V  
1.5 V  
Output  
0 V  
OL  
(see Note B)  
VOLTAGE WAVEFORMS  
PROPAGATION DELAY TIMES  
INVERTING AND NONINVERTING OUTPUTS  
VOLTAGE WAVEFORMS  
ENABLE AND DISABLE TIMES  
LOW- AND HIGH-LEVEL ENABLING  
NOTES: A.  
C includes probe and jig capacitance.  
L
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.  
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.  
C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, Z = 50 , t 2.5 ns, t 2.5 ns.  
O
r
f
D. The outputs are measured one at a time with one transition per measurement.  
Figure 14. Load Circuit and Voltage Waveforms  
34  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
PACKAGE OPTION ADDENDUM  
www.ti.com  
29-Jun-2006  
PACKAGING INFORMATION  
Orderable Device  
8V182512IDGGREP  
V62/04730-01XE  
Status (1)  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
TSSOP  
DGG  
64  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
TSSOP  
DGG  
64  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 1  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,  
enhancements, improvements, and other changes to its products and services at any time and to discontinue  
any product or service without notice. Customers should obtain the latest relevant information before placing  
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and conditions of sale supplied at the time of order acknowledgment.  
TI warrants performance of its hardware products to the specifications applicable at the time of sale in  
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI  
deems necessary to support this warranty. Except where mandated by government requirements, testing of all  
parameters of each product is not necessarily performed.  
TI assumes no liability for applications assistance or customer product design. Customers are responsible for  
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TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,  
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Use of such information may require a license from a third party under the patents or other intellectual property  
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Following are URLs where you can obtain information on other Texas Instruments products and application  
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Amplifiers  
amplifier.ti.com  
www.ti.com/audio  
Data Converters  
dataconverter.ti.com  
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dsp.ti.com  
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Military  
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Mailing Address:  
Texas Instruments  
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Copyright 2006, Texas Instruments Incorporated  
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