IXTP60N10TM
Symbol
Test Conditions
Characteristic Values
OVERMOLDED TO-220 W/ FORMED
LEAD (IXTP...M)
(TJ = 25°C unless otherwise specified)
Min.
Typ.
42
Max.
gfs
VDS= 10V, ID = 0.5 • ID25, Note 1
VGS = 0V, VDS = 25V, f = 1MHz
25
S
pF
pF
pF
ns
ns
ns
ns
nC
nC
nC
Ciss
Coss
Crss
td(on)
tr
2650
335
60
27
Resistive Switching Times
2 3
1
40
V
GS = 10V, VDS = 0.5 • VDSS, ID = 10A
td(off)
tf
43
RG = 15Ω (External)
37
Qg(on)
Qgs
Qgd
RthJC
49
VGS= 10V, VDS = 0.5 • VDSS, ID = 10A
15
Terminals: 1 - Gate
2 - Collector
11
3 - Emitter
2.5 °C/W
Source-Drain Diode
Symbol
Test Conditions
Characteristic Values
TJ = 25°C unless otherwise specified)
Min.
Typ.
Max.
IS
VGS = 0V
60
A
A
ISM
VSD
trr
Repetitive, pulse width limited by TJM
IF = 25A, VGS = 0V, Note 1
240
1.2
V
59
3.8
ns
A
IF = 30A, VGS = 0V
-di/dt = 100A/μs
VR = 50V
IRM
QRM
112
nC
Notes 1. Pulse test, t ≤ 300 μs; duty cycle, d ≤ 2%.
2. On through-hole packages, RDS(on) Kelvin test contact location must be
5mm or less from the package body.
PRELIMINARY TECHNICAL INFORMATION
The product presented herein is under development. The Technical Specifications offered are derived
from data gathered during objective characterizations of preliminary engineering lots; but also may yet
contain some information supplied during a pre-production design evaluation. IXYS reserves the right
to change limits, test conditions, and dimensions without notice.
IXYS reserves the right to change limits, test conditions, and dimensions.
IXYS MOSFETs and IGBTs are covered
by one or moreof the following U.S. patents: 4,850,072 5,017,508
4,881,106 5,034,796
4,835,592 4,931,844
5,049,961
5,063,307
5,187,117
5,237,481
5,381,025
5,486,715
6,162,665
6,259,123 B1
6,306,728 B1
6,404,065 B1 6,683,344
6,534,343
6,583,505
6,727,585
6,710,405 B2 6,759,692
6,710,463
7,005,734 B2 7,157,338B2
7,063,975 B2
6,771,478 B2 7,071,537