WT-E17C1BP
The package
Storage
It‟s recommended to store the products in the following conditions:
Humidity: 60 %RH Max.
Temperature: 5 OC ~30 OC (41OF~86 OF)
1
Shelf life in sealed bag: 12 month at<40 OC and <90%RH. (Base on aluminum laminated
moisture barrier bag.)
2
After the bag is opened, devices that will be subjected to infrared reflow, vapor-phase
reflow, or equivalent processing must be:
2.1 Mounted within 72 hours at factory conditions of≦ 30 OC /60% RH, or
2.2 Stored at ≦ 20% RH with zip-lock sealed.
Baking
It‟s recommended to bake before soldering once the pack is unsealed open & re-sealed after
72 hours. The conditions are as followings:
60 ±3OC×(12~24hrs) and < 5% RH, taped reel type
100±3OC×(45min~1hr), bulk type
130±3OC×(15~30min), bulk type
Soldering
Manual soldering (We do not recommend this method strongly.)
Soldering wire: 63/37 Sn/Pb, flux contained.
To prevent cracking, please bake before manual soldering, if the device is subject to moisture.
Temperature at tip of soldering tool : 300 OC±5 OC Max.(25W)
It‟s banned to load any stress on the resin during soldering.
Soldering time : 3±1sec
18-Mar-2013
15/16
WEITRON
http://www.weitron.com.tw