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SZW07A0A

型号:

SZW07A0A

品牌:

SEOUL[ Seoul Semiconductor ]

页数:

23 页

PDF大小:

566 K

Specification  
Z7  
SSC  
Customer  
Drawn Approval  
Approval  
Z7  
January. 2013  
www.seoulsemicon.com  
Document number : SSC- QP- 7- 07- 25 (Rev.00)  
[ Contents ]  
1. Description  
------- 3  
2. Full code of Z7 series  
3. Outline dimension  
4. Characteristics of Z7  
5. Characteristic diagrams  
6. CIE Chromaticity Diagram  
7. Binning Table  
------- 4  
------- 5  
------- 6  
------- 8  
------- 15  
------- 17  
8. Labeling  
------- 18  
------- 19  
9. Reel Packing  
8. Recommended solder pad  
9. Soldering profile  
10. Precaution for Use  
11. Revision Profile  
------- 20  
------- 21  
------- 22  
------- 24  
Z7  
January. 2013  
www.seoulsemicon.com  
Document number : SSC- QP- 7- 07- 25 (Rev.00)  
Z7  
Z7  
Description  
Features  
• Super high Flux output  
and high Luminance  
• Designed for high  
current operation  
The Z-Power series is designed for high  
current operation and high flux output  
applications. It incorporates state of the  
art SMD design and low thermal resistant  
material.  
• SMT solderable  
• Lead Free product  
• RoHS compliant  
The Z Power LED is ideal light sources for general illumination  
applications, custom designed solutions, automotive, large LCD  
backlights and high performance torches.  
Applications  
• General Torch  
• Architectural lighting  
• Task lighting  
• Decorative / Pathway  
lighting  
• Remote / Solar  
powered lighting  
• Street lighting  
* The appearance and specifications of the product can be changed  
for improvement without notice.  
Z7  
January. 2013  
www.seoulsemicon.com  
Full code of Z7 series  
1. Part Number Form : X1X2X3X4X5X6X7X8 – X9X10X11X12X13  
X1  
X2  
Company  
S
Z
W
0
7
A
0
A
-
SSC  
Package series  
Z-Power  
X3  
Color  
Pure White  
X4  
X5  
Z-Power series number  
Lens type  
Z7 series  
X6  
Dome-Wide  
X7  
PCB type  
Emitter  
X8  
Revision No.  
Luminous flux  
Color bin  
Rev0  
X9X10  
X11X12  
X13  
-
-
-
-
Forward Voltage  
-
2. Sticker Diagram on Reel & Aluminum Vinyl Bag  
Rank :  
X9  
X10  
X11  
X12  
X13  
QUANTITY : 500  
Lot No : # # # # # # # # #  
SSC PART NUMBER :  
X1  
X2  
X3  
X4  
X5  
X6  
X7  
X8  
X1  
X2  
X3  
X4  
X5  
X6  
X7  
X8  
Z7  
January. 2013  
www.seoulsemicon.com  
Outline dimensions  
Notes :  
[1] All dimensions are in millimeters.  
[2] Scale : none  
[3] Undefined tolerance is 0.2mm  
Z7  
January. 2013  
www.seoulsemicon.com  
Characteristics of Z7 (SZW07A0A)  
1. Pure white  
1-1 Electro-Optical characteristics at 1400mA  
(Ta=25 , RH30%)  
Value  
Typ  
550  
6000  
70  
Parameter  
Symbol  
Unit  
Max  
Min  
440  
4700  
65  
[1]  
[2]  
Luminous Flux  
ФV  
600  
8200  
75  
lm  
K
[3]  
Correlated Color Temperature  
CRI  
CCT  
Ra  
-
[4]  
Forward Voltage  
VF  
-
3.3  
4
V
[6]  
Thermal resistance (J to S)  
View Angle  
J-S  
2Θ ½  
1.6  
K/W  
deg.  
130  
1-2 Absolute Maximum Ratings  
Parameter  
Forward Current  
Symbol  
Value  
Unit  
I
F  
V
2800 (each chip 700mA)  
mA  
V
Reverse Voltage  
5
Power Dissipation  
Junction Temperature  
Operating Temperature  
Storage Temperature  
Pd  
Tj  
11  
W
135  
Topr  
Tstg  
-
-40 ~ +85  
-40 ~ +100  
3,000V HBM  
[5]  
ESD Sensitivity  
-
*Notes :  
[1] SSC maintains a tolerance of 10% on flux and power measurements.  
[2] ФV is the total luminous flux output as measured with an integrating sphere.  
[3] Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram.  
CCT 5% tolerance.  
[4] Tolerance is 0.06V on forward voltage measurements  
[5] A zener diode is included to protect the product from ESD.  
[6] At thermal Resistance, J to S means junction to solder point on metal PCB.  
Z7  
January. 2013  
www.seoulsemicon.com  
Characteristics of Z7 (SZWW7A0A)  
1. Warm white  
1-1 Electro-Optical characteristics at 1400mA  
Value  
Typ  
450  
3000  
80  
Parameter  
Symbol  
Unit  
Min  
340  
2600  
-
Max  
500  
3500  
-
[1]  
[2]  
Luminous Flux  
ФV  
lm  
K
[3]  
Correlated Color Temperature  
CRI  
CCT  
Ra  
-
[4]  
Forward Voltage  
VF  
-
3.3  
4
V
[6]  
Thermal resistance (J to S)  
View Angle  
J-S  
2Θ ½  
1.6  
K/W  
deg.  
130  
1-2 Absolute Maximum Ratings  
Parameter  
Forward Current  
Symbol  
Value  
Unit  
IF  
V
2800 (each chip 700mA)  
mA  
V
Reverse Voltage  
5
Power Dissipation  
Junction Temperature  
Operating Temperature  
Storage Temperature  
Pd  
Tj  
11  
W
135  
Topr  
Tstg  
-
-40 ~ +85  
-40 ~ +100  
3,000V HBM  
[5]  
ESD Sensitivity  
-
*Notes :  
[1] SSC maintains a tolerance of 10% on flux and power measurements.  
[2] ФV is the total luminous flux output as measured with an integrating sphere.  
[3] Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram.  
CCT 5% tolerance.  
[4] Tolerance is 0.06V on forward voltage measurements  
[5] A zener diode is included to protect the product from ESD.  
[6] At thermal Resistance, J to S means junction to solder point on metal PCB.  
Z7  
January. 2013  
www.seoulsemicon.com  
Color Spectrum  
(IF=350mA, Ta=25 , RH 30%)  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
Pure  
Warm  
300  
400  
500  
600  
700  
800  
900  
Wavelength [nm]  
Z7  
January. 2013  
www.seoulsemicon.com  
Forward Current Characteristics  
Forward Voltage vs. Forward Current, Ta=25  
2800  
2400  
2000  
1600  
1200  
800  
400  
0
-400  
0.0  
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
3.5  
4.0  
Forward Voltage [V]  
Forward Current vs. Normalized Relative Luminous Flux, Ta=25  
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
0
400  
800  
1200  
1600  
2000  
2400  
2800  
Z7  
Forward Current (mA)  
January. 2013  
www.seoulsemicon.com  
Chromaticity Coordinate vs. Forward Current, Ta=25  
Pure x-axis  
Pure y-axis  
Warm x-axis  
Warm y-axis  
0.012  
0.009  
0.006  
0.003  
0.000  
-0.003  
-0.006  
0
400  
800  
1200 1600 2000 2400 2800  
Current [mA]  
CCT vs. Forward Current, Ta=25  
7000  
Pure  
Warm  
6000  
5000  
4000  
3000  
0
500  
1000  
1500  
2000  
2500  
3000  
Z7  
Current [mA]  
January. 2013  
www.seoulsemicon.com  
Junction Temperature Characteristics  
Relative Light Output vs. Junction Temperature at IF=1400mA  
100  
80  
60  
40  
20  
0
25  
50  
75  
100  
125  
150  
Junction Temperature [Celcius]  
VF vs. Junction Temperature at IF=350mA  
0.0  
-0.2  
-0.4  
-0.6  
-0.8  
-1.0  
25  
50  
75  
100  
125  
150  
Junction Temperature [Celcius]  
Z7  
January. 2013  
www.seoulsemicon.com  
Chromaticity Coordinate vs. Junction Temperature at IF=350mA  
0.015  
Pure x-axis  
0.012  
0.009  
0.006  
0.003  
0.000  
-0.003  
-0.006  
-0.009  
-0.012  
-0.015  
Pure y-axis  
Warm x-axis  
Warm y-axis  
25  
50  
75  
100  
125  
150  
Junction Temperature [Celcius]  
CCT vs. Junction Temperature at IF=350mA  
8000  
7000  
6000  
5000  
4000  
3000  
Pure  
Warm  
25  
50  
75  
100  
125  
150  
Junction Temperature [Celcius]  
Z7  
January. 2013  
www.seoulsemicon.com  
Ambient Temperature vs. Allowable Forward Current  
@1400mA  
1600  
1400  
1200  
1000  
Rj-a=10 /W  
800  
Rj-a=15 /W  
600  
Rj-a=20 /W  
400  
200  
0
0
20  
40  
60  
80  
100  
Ambient Temperature(C)  
Ambient Temperature vs. Allowable Forward Current  
@2800mA  
3000  
2500  
2000  
1500  
Rj-a=8 /W  
Rj-a=10 /W  
Rj-a=12 /W  
1000  
500  
0
0
20  
40  
60  
80  
100  
Ambient Temperature(C)  
Z7  
January. 2013  
www.seoulsemicon.com  
Radiation pattern @1400mA  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
-90  
-60  
-30  
0
30  
60  
90  
Angle [degree]  
Z7  
January. 2013  
www.seoulsemicon.com  
CIE Chromaticity Diagram (Pure)  
IF=1400mA, Ta=25  
Z7  
January. 2013  
www.seoulsemicon.com  
CIE Chromaticity Diagram (Warm)  
IF=1400mA, Ta=25  
Z7  
January. 2013  
www.seoulsemicon.com  
Binning Table  
Bin Code  
Luminous Flux (lm)  
Color Chromaticity Coordinate  
Forward Voltage (V)  
@ IF = 1400mA  
@ IF = 1400mA  
@ IF = 1400mA  
V2  
C2  
H
Color Chromaticity Coordinate  
Forward Voltage (V)  
Luminous Flux (lm)  
@ IF = 1400mA  
@ IF = 1400mA  
@ IF = 1400mA  
Bin  
Code  
Bin  
Code  
Bin  
Code  
Min.  
340  
390  
440  
490  
540  
590  
Max.  
Min.  
Max.  
Min.  
Max.  
G
H
I
2.75  
3.0  
3.00  
3.25  
3.5  
Z1  
390  
440  
490  
540  
590  
640  
Ref. 15, 16 pages  
Z2  
A1  
A2  
B1  
B2  
3.25  
3.5  
J
3.75  
3.8  
K
3.6  
Available ranks  
Z7  
January. 2013  
www.seoulsemicon.com  
Label  
Rank :  
X9  
X10  
X11  
X12  
X13  
QUANTITY : 500  
Lot No : # # # # # # # # #  
: SZW07A0A  
SSC PART NUMBER
SZDW7A0A  
Full code form :  
X1X2X3X4X5X6X7X8  
- X1 : Company  
- X2 : Z-Power LED series number  
- X3X4 : Color  
- X5 : Series number  
- X6 : Lens type  
- X7 : PCB type  
- X8 : Revision number  
Rank  
X9X10X11X12X13  
- X9X10 : Luminous Flux : LF [lm]  
- X11X12 : Color Coordinates : x, y  
- X13 : Forward Voltage : VF [V]  
Z7  
January. 2013  
www.seoulsemicon.com  
Emitter Carrier & Reel Packaging  
Z7  
January. 2013  
www.seoulsemicon.com  
Recommended solder pad  
Solder Pad  
Isolation  
Notes :  
[1] All dimensions are in millimeters.  
[2] Scale : none  
[3] This drawing without tolerances are for reference only  
[4] Recommended solder paste height : ≥ 30um  
Z7  
January. 2013  
www.seoulsemicon.com  
Reflow Soldering Conditions / Profile  
IPC/JEDEC J-STD-020C  
Profile Feature  
Sn-Pb Eutectic Assembly  
Pb-Free Assembly  
Average ramp-up rate (Tsmax to Tp)  
3°C/second max.  
3°C/second max.  
Preheat  
- Temperature Min (Tsmin)  
- Temperature Max (Tsmax)  
- Time (Tsmin to Tsmax) (ts)  
100 °C  
150 °C  
60-120 seconds  
150 °C  
200 °C  
60-180 seconds  
Time maintained above:  
- Temperature (TL)  
- Time (tL)  
183 °C  
60-150 seconds  
217 °C  
60-150 seconds  
Peak Temperature (Tp)  
215  
260  
Time within 5°C of actual Peak  
Temperature (tp)2  
10-30 seconds  
20-40 seconds  
Ramp-down Rate  
6 °C/second max.  
6 °C/second max.  
Time 25°C to Peak Temperature  
6 minutes max.  
8 minutes max.  
* Caution  
1. Reflow soldering should not be done more than one time.  
2. Repairs should not be done after the LEDs have been soldered. When  
repair is unavoidable, suitable tools must be used.  
3. Die slug is to be soldered.  
4. When soldering, do not put stress on the LEDs during heating.  
5. After soldering, do not warp the circuit board.  
6. Recommend to use a convection type reflow machine with 7 ~ 8 zones.  
Z7  
January. 2013  
www.seoulsemicon.com  
Precaution for use  
• Storage  
To avoid the moisture penetration, we recommend storing Z Power LEDs in a dry box  
with a desiccant . The recommended storage temperature range is 5C to 30C and a maximum  
humidity of 50%.  
• Use Precaution after Opening the Packaging  
Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens may  
affect the light output efficiency.  
Pay attention to the following:  
a. Soldering should be done immediately after opening the package (within 24Hrs).  
b. Required conditions after opening the package  
- Sealing  
- Temperature : 5 ~ 40  
Humidity : less than 30%  
c. If the package has been opened more than 1 week or the color of the desiccant changes,  
components should be dried for 10-12hr at 60 5  
• Do not apply mechanical force or excess vibration during the cooling process to normal  
temperature after soldering.  
• Do not rapidly cool device after soldering.  
• Components should not be mounted on warped (non coplanar) portion of PCB.  
• Radioactive exposure is not considered for the products listed here in.  
• Gallium arsenide is used in some of the products listed in this publication. These products are  
dangerous if they are burned or shredded in the process of disposal. It is also dangerous to  
drink the liquid or inhale the gas generated by such products when chemically disposed of.  
• This device should not be used in any type of fluid such as water, oil, organic solvent and etc.  
When washing is required, IPA (Isopropyl Alcohol) should be used.  
• When the LEDs are in operation the maximum current should be decided after measuring the  
package temperature.  
• LEDs must be stored properly to maintain the device. If the LEDs are stored for 3 months or  
more after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used  
for storage.  
• The appearance and specifications of the product may be modified for improvement without  
notice.  
• Long time exposure of sunlight or occasional UV exposure will cause lens discoloration.  
• The slug is isolated from anode electrically.  
Therefore, we recommend that you don’t isolate the heat sink.  
Z7  
• Attaching LEDs, do not use adhesives that outgas organic vapor.  
January. 2013  
www.seoulsemicon.com  
Handling of Silicone resin LEDs  
The Z-Power LED is encapsulated with a silicone resin for the highest flux efficiency.  
Notes for handling:  
• Avoid touching silicone resin parts especially with sharp tools such as Pincette  
(Tweezers)  
• Avoid leaving fingerprints on silicone resin parts.  
• Silicone resin will attract dust so use covered containers for storage.  
• When populating boards in SMT production, there are basically no restrictions  
regarding the form of the pick and place nozzle, except that excessive mechanical  
pressure on the surface of the resin must be prevented.  
• It is not recommend to cover the silicone resin of the LEDs with other resin  
(epoxy, urethane, etc)  
• Especially, if a reverse voltage is continuously applied to the product, such operation can  
cause the electro-migration resulting in LED damage.  
Z7  
January. 2013  
www.seoulsemicon.com  
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SZWN5A0A [ Single Color LED, Natural White, T-1, 2.9mm, ROHS COMPLIANT, SMD, 2 PIN ] 17 页

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