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SZWW5A0B

型号：

SZWW5A0B

品牌：

SEOUL[ Seoul Semiconductor ]

页数：

22 页

PDF大小：

873 K

下载PDF手册
PCWM_4828539:WP_0000001WP_0000001  
Specification  
SSC-Z5 series  
August 2012  
www.seoulsemicon.com  
Document No. : SSC- QP- 7- 07- 12  
1
PCWM_4828539:WP_0000001WP_0000001  
Z5 series  
Z5  
Features  
Description  
• Super high Flux output  
and high Luminance  
• Designed for high  
current operation  
The Z-Power series is designed for  
high current operation and high flux  
output applications.  
• SMT solderable  
It incorporates state of the art SMD  
• Lead Free product  
• RoHS compliant  
design and low thermal resistant material.  
The Z Power LED is ideal light sources for general illumination  
applications, custom designed solutions, large backlights and  
high performance torches.  
Applications  
• General Torch  
• Architectural lighting  
• Projector light source  
• Traffic signals  
• Task lighting  
• Decorative / Pathway  
lighting  
• Remote / Solar  
powered lighting  
August 2012  
www.seoulsemicon.com  
2
Document No. : SSC- QP- 7- 07- 12  
PCWM_4828539:WP_0000001WP_0000001  
Contents  
1. Full code of Z5 series  
2. Outline dimensions  
3. Characteristics of SZWW5A0B (Warm)  
4. Characteristic diagrams  
5. CIE Chromaticity Diagram (Warm)  
6. Bin Code Description  
7. Labeling  
8. Packing  
9. Recommended solder pad  
10. Soldering  
11. Precaution for use  
12. Handling of Silicone Resin LEDs  
August 2012  
www.seoulsemicon.com  
3
Document No. : SSC- QP- 7- 07- 12  
PCWM_4828539:WP_0000001WP_0000001  
1. Full code of Z5 series  
Full code form : X1 X2 X3X4 X5X6 X7X8  
1. Part Number  
X1  
Company  
X2  
Z-Power LED series number  
X3X4  
W0  
Color Specification  
Pure White  
WN  
Neutral White  
Warm White  
WW  
X5  
PKG Series  
5
Z5 series  
X6  
Lens type  
PCB Type  
X7  
2. Internal Number  
X8  
Revision No.  
August 2012  
www.seoulsemicon.com  
4
Document No. : SSC- QP- 7- 07- 12  
PCWM_4828539:WP_0000001WP_0000001  
2. Outline dimensions  
Notes :  
[1] All dimensions are in millimeters.  
[2] Scale : none  
[3] Undefined tolerance is 0.1mm  
August 2012  
www.seoulsemicon.com  
5
Document No. : SSC- QP- 7- 07- 12  
PCWM_4828539:WP_0000001WP_0000001  
3. Characteristics of SZWW5A0B (Warm)  
Warm White  
1-1 Electro-Optical characteristics at 350mA  
(Ta=25 , RH30%)  
Value  
Typ  
100  
89  
Parameter  
Symbol  
Unit  
Min  
Max  
[2]  
ФV  
-
-
-
[1]  
Luminous Flux  
lm  
K
ФV (Tj=100 )  
CCT  
-
Correlated Color  
Temperature  
-
3000  
-
[3]  
[6]  
CRI  
Ra  
VF  
80  
-
-
-
-
-
[4]  
Forward Voltage  
3.30  
V
Thermal resistance  
(J to S)  
RθJ-S  
6.5  
K/W  
deg.  
View Angle  
2Θ ½  
120  
1-2 Absolute
 
Maximum Ratings  
Parameter  
Symbol  
Value  
Unit  
700  
Forward Current  
IF  
mA  
1500 (100ms, 1/10duty)  
Reverse Voltage  
Power Dissipation  
Vr  
Pd  
5
2.6  
V
W
Junction Temperature  
Operating Temperature  
Storage Temperature  
Tj  
145(@ IF ≤ 700mA)  
-40 ~ +85  
-40 ~ +100  
2
ºC  
ºC  
ºC  
kV  
Topr  
Tstg  
-
[5]  
ESD Sensitivity(HBM)  
*Notes :  
[1] SSC maintains a tolerance of 7% on flux and power measurements.  
[2] ФV is the total luminous flux output as measured with an integrating sphere.  
[3] Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram.  
Color coordinate : 0.005, CCT 5% tolerance.  
[4] Tolerance is 0.06V on forward voltage measurements  
[5] A zener diode is included to protect the product from ESD.  
[6] Tolerance is 2.0 on CRI measurements  
August 2012  
www.seoulsemicon.com  
6
Document No. : SSC- QP- 7- 07- 12  
PCWM_4828539:WP_0000001WP_0000001  
4. Characteristic diagrams  
Color Spectrum  
(IF=350mA, Ta=25 , RH30%)  
3.0  
2.8  
2.6  
2.4  
2.2  
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
SZWW5A0B  
350  
400  
450  
500  
550  
600  
650  
700  
750  
800  
Wavelength[nm]  
August 2012  
www.seoulsemicon.com  
Document No. : SSC- QP- 7- 07- 12  
7
PCWM_4828539:WP_0000001WP_0000001  
Forward Current Characteristics  
Forward Current vs. Forward Voltage, Ta=25  
0.8  
SZWW5A0B  
0.6  
0.4  
0.2  
0.0  
2.0  
2.5  
3.0  
3.5  
4.0  
Forward Voltage[V]  
Forward Current vs. Normalized Relative Luminous Flux, Ta=25  
200  
SZWW5A0B  
150  
100  
50  
0
0.0  
0.2  
0.4  
0.6  
0.8  
Forward Current [A]  
August 2012  
www.seoulsemicon.com  
8
Document No. : SSC- QP- 7- 07- 12  
PCWM_4828539:WP_0000001WP_0000001  
Forward Current Characteristics  
Forward Current vs. Chromaticity Coordinate, Ta=25  
0.015  
SZWW5A0B  
CIE X  
0.010  
0.005  
0.000  
-0.005  
-0.010  
-0.015  
CIE Y  
0.0  
0.2  
0.4  
0.6  
0.8  
Forward Current [A]  
Forward Current vs. CCT, Ta=25  
500  
SZWW5A0B  
250  
0
-250  
-500  
0.0  
0.2  
0.4  
0.6  
0.8  
Forward Current [A]  
August 2012  
www.seoulsemicon.com  
9
Document No. : SSC- QP- 7- 07- 12  
PCWM_4828539:WP_0000001WP_0000001  
Junction Temperature Characteristics  
Junction Temperature vs. Relative Light Output at IF=350mA  
120  
SZWW5A0B  
100  
80  
60  
40  
20  
0
25  
50  
75  
100  
125  
150  
Junction Temperature[oC]  
Junction Temperature vs. Forward Voltage at IF=350mA  
0.2  
0.0  
-0.2  
-0.4  
-0.6  
25  
50  
75  
100  
125  
150  
Junction Temperature[oC]  
August 2012  
www.seoulsemicon.com  
Document No. : SSC- QP- 7- 07- 12  
10  
PCWM_4828539:WP_0000001WP_0000001  
Junction Temperature Characteristics  
Junction Temperature vs. Chromaticity Coordinate at IF=350mA  
0.02  
SZWW5A0B  
CIE X  
CIE Y  
0.01  
0.00  
-0.01  
-0.02  
25  
50  
75  
100  
125  
150  
Junction Temperature [
o
C]  
CCT vs. Junction Temperature at IF=350mA  
500  
SZWW5A0B  
250  
0
-250  
-500  
25  
50  
75  
100  
125  
150  
Junction Temperature [oC]  
August 2012  
www.seoulsemicon.com  
Document No. : SSC- QP- 7- 07- 12  
11  
PCWM_4828539:WP_0000001WP_0000001  
Characteristic diagrams  
Ambient Temperature vs. Allowable Forward Current (Tjmax = 145 , @0.7A)  
800  
600  
400  
Rj-a=10oC/W  
Rj-a=15oC/W  
Rj-a=20oC/W  
200  
0
0
20  
40  
60  
80  
100  
120  
140  
Ambient Temperature [oC]  
Radiation pattern at 350mA  
0
1.0  
30  
0.8  
0.6  
0.4  
0.2  
0.0  
60  
90  
-80  
-60  
-40  
-20  
0
Angle [deg]  
August 2012  
www.seoulsemicon.com  
Document No. : SSC- QP- 7- 07- 12  
12  
PCWM_4828539:WP_0000001WP_0000001  
5. CIE Chromaticity Diagram (Warm)  
[Ta = 25 IF = 350mA]  
Energy star rank  
August 2012  
www.seoulsemicon.com  
13  
Document No. : SSC- QP- 7- 07- 12  
PCWM_4828539:WP_0000001WP_0000001  
6. Bin Code Description  
Bin Code  
Color Chromaticity  
Coordinate  
Luminous Flux (lm)  
Forward Voltage (V)  
@ IF = 350mA  
@ IF = 350mA  
@ IF = 350mA  
U2  
G3  
H
Color Chromaticity  
Coordinate  
Forward Voltage (V)  
Luminous Flux (lm)  
@ IF = 350mA  
@ IF = 350mA  
@ IF = 350mA  
Bin  
Code  
Bin  
Code  
Bin  
Code  
Min.  
Max.  
Min.  
80  
Max.  
Min.  
Max.  
T2  
91  
100  
H
3.00  
3.25  
3.50  
3.25  
3.50  
3.75  
Ref. 13 pages  
U1  
U2  
U3  
91  
I
J
100  
109  
109  
118.5  
August 2012  
www.seoulsemicon.com  
14  
Document No. : SSC- QP- 7- 07- 12  
PCWM_4828539:WP_0000001WP_0000001  
7. Labeling  
X10X11X12X13  
1000  
###############  
SZWW5A0B  
SZWW5A0B  
Full code form  
X1X2X3X4X5X6X7X8  
-X1  
: Company  
-X2  
: Z-Power LED series number  
: Color Specification  
: PKG Series  
-X3 X4  
-X
5  
-X6  
: Lens type  
-X7  
: PCB Type  
-X8  
: Revision No.  
Rank  
X10X11X12X13  
-X10  
: Luminous Flux : LF [lm]  
-X11X12: Color coordinates : x, y  
-X13  
Lot No  
#1#2#3#4#5#6 - #7#8#9#10 - #11#12#13  
: Forward Voltage : VF [V]  
- #1 #2  
- #3 #4  
- #5 #6  
: Year  
: Month  
: Day  
- #7 #8 #9 #10  
- #11 #12 #13  
: Mass order  
: Tray No.  
August 2012  
www.seoulsemicon.com  
15  
Document No. : SSC- QP- 7- 07- 12  
                                                                                                                                          
                                                                                                                                             
                                                                                                                                               
                                                                                                                                                 
                                                                                                                                                    
                                                                                                                                                       
                                                                                                                                                         
                                                                                                                                                            
                                                                                                                                                               
                                                                                                                                                                  
                                                                                                                                                                    
PCWM_4828539:WP_0000001WP_0000001  
8. Packing  
CATHODE MARK  
22  
13  
(1) Quantity : 1000pcs/Reel  
(2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be 0.2mm  
(3) Adhesion Strength of Cover Tape : Adhesion strength to be 10-60g when the cover tape  
is turned off from the carrier tape at the angle of 10º to the carrier tape  
(4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp  
proof Package  
August 2012  
www.seoulsemicon.com  
16  
Document No. : SSC- QP- 7- 07- 12  
PCWM_4828539:WP_0000001WP_0000001  
8. Packing  
Reel Packing Structure  
X10X11X12X13  
1000  
###############  
SZWW5A0B  
SZWW5A0B  
X10X11X12X13  
1000  
2
###############  
SZWW5A0B  
SZWW5A0B  
*******  
*******  
*******  
*******  
*******  
August 2012  
www.seoulsemicon.com  
17  
Document No. : SSC- QP- 7- 07- 12  
PCWM_4828539:WP_0000001WP_0000001  
9. Recommended solder pad  
Notes :  
[1] All dimensions are in millimeters.  
[2] Scale : none  
[3] This drawing without tolerances are for reference only  
[4] Undefined tolerance is 0.1mm  
August 2012  
www.seoulsemicon.com  
18  
Document No. : SSC- QP- 7- 07- 12  
PCWM_4828539:WP_0000001WP_0000001  
10. Soldering  
IPC/JEDEC J-STD-020  
Profile Feature  
Sn-Pb Eutectic Assembly  
Pb-Free Assembly  
Average ramp-up rate (Tsmax to Tp)  
3°C/second max.  
3°C/second max.  
Preheat  
- Temperature Min (Tsmin)  
- Temperature Max (Tsmax)  
- Time (Tsmin to Tsmax) (ts)  
100 °C  
150 °C  
60-120 seconds  
150 °C  
200 °C  
60-180 seconds  
Time maintained above:  
- Temperature (TL)  
- Time (tL)  
183 °C  
60-150 seconds  
217 °C  
60-150 seconds  
Peak Temperature (Tp)  
215  
260  
Time within 5°C of actual Peak  
Temperature (tp)2  
10-30 seconds  
20-40 seconds  
Ramp-down Rate  
6 °C/second max.  
6 °C/second max.  
Time 25°C to Peak Temperature  
6 minutes max.  
8 minutes max.  
* Caution  
1. Reflow soldering is recommended not to be done more than two times.  
In the case of more than 24 hours passed soldering after first, LEDs will be  
damaged.  
2. Repairs should not be done after the LEDs have been soldered. When  
repair is unavoidable, suitable tools must be used.  
3. Die slug is to be soldered.  
4. When soldering, do not put stress on the LEDs during heating.  
5. After soldering, do not warp the circuit board.  
August 2012  
www.seoulsemicon.com  
19  
Document No. : SSC- QP- 7- 07- 12  
PCWM_4828539:WP_0000001WP_0000001  
11. Precaution for use  
(1) Storage  
To avoid the moisture penetration, we recommend storing Z5 Series (Z Power) LEDs  
in a dry box with a desiccant . The recommended storage temperature range is 5 to 30  
and a maximum humidity of RH50%.  
(2) Use Precaution after Opening the Packaging  
Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens  
may affect the light output efficiency. Pay attention to the following:  
a. Recommend conditions after opening the package  
- Sealing  
- Temperature : 5 ~ 40  
Humidity : less than RH30%  
b. If the package has been opened more than 1 year (MSL 2) or the color of  
the desiccant changes, components should be dried for 10-12hr at 60 5  
(3) Do not apply mechanical force or excess vibration during the cooling process to normal  
temperature after soldering.  
(4) Do not rapidly cool device after soldering.  
(5) Components should not be mounted on warped (non coplanar) portion of PCB.  
(6) Radioactive exposure is not considered for the products listed here in.  
(7) Gallium arsenide is used in some of the products listed in this publication. These products are  
dangerous if they are burned or shredded in the process of disposal. It is also dangerous to  
drink the liquid or inhale the gas generated by such products when chemically disposed of.  
(8) This device should not be used in any type of fluid such as water, oil, organic solvent and etc.  
When washing is required, IPA (Isopropyl Alcohol) should be used.  
(9) When the LEDs are in operation the maximum current should be decided after measuring the  
package temperature.  
(10) LEDs must be stored properly to maintain the device. If the LEDs are stored for 3 months or  
more after being shipped from SSC, a sealed container with a nitrogen atmosphere should be  
used for storage.  
(11) The appearance and specifications of the product may be modified for improvement without  
notice.  
(12) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration.  
August 2012  
www.seoulsemicon.com  
20  
Document No. : SSC- QP- 7- 07- 12  
PCWM_4828539:WP_0000001WP_0000001  
11. Precaution for use  
(13) VOCs (Volatile organic compounds) emitted from materials used in the construction of  
fixtures can penetrate silicone encapsulants of LEDs and discolor when exposed to heat and  
photonic energy. The result can be a significant loss of light output from the fixture.  
Knowledge of the properties of the materials selected to be used in the construction of  
fixtures can help prevent these issues.  
(14) The slug is isolated from anode electrically.  
Therefore, we recommend that you don’t isolate the heat sink.  
(15) Attaching LEDs, do not use adhesives that outgas organic vapor.  
(16) The driving circuit must be designed to allow forward voltage only when it is ON or OFF.  
If the reverse voltage is applied to LED, migration can be generated resulting in LED damage.  
August 2012  
www.seoulsemicon.com  
21  
Document No. : SSC- QP- 7- 07- 12  
PCWM_4828539:WP_0000001WP_0000001  
12. Handling of Silicone Resin LEDs  
(1) During processing, mechanical stress on the surface should be minimized as much  
as possible. Sharp objects of all types should not be used to pierce the sealing  
compound.  
(2) In general, LEDs should only be handled from the side. By the way, this also applies  
to LEDs without a silicone sealant, since the surface can also become scratched.  
(3) When populating boards in SMT production, there are basically no restrictions  
regarding the form of the pick and place nozzle, except that mechanical pressure  
on the surface of the resin must be prevented.  
This is assured by choosing a pick and place nozzle which is larger than the LED’s  
reflector area.  
(4) Silicone differs from materials conventionally used for the manufacturing of LEDs.  
These conditions must be considered during the handling of such devices.  
Compared to standard encapsulants, silicone is generally softer,  
and the surface is more likely to attract dust.  
As mentioned previously, the increased sensitivity to dust requires special care  
during processing. In cases where a minimal level of dirt and dust particles  
cannot be guaranteed, a suitable cleaning solution must be applied to the surface  
after the soldering of components.  
(5) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used,  
it must be assured that these solvents do not dissolve the package or resin.  
Ultrasonic cleaning is not recommended.  
Ultrasonic cleaning may cause damage to the LED.  
(6) Please do not mold this product into another resin (epoxy, urethane, etc) and  
do not handle this product with acid or sulfur material in sealed space.  
(7) Avoid leaving fingerprints on silicone resin parts.  
August 2012  
www.seoulsemicon.com  
22  
Document No. : SSC- QP- 7- 07- 12  
厂商 型号 描述 页数 下载

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