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IX6610

型号:

IX6610

品牌:

IXYS[ IXYS CORPORATION ]

页数:

23 页

PDF大小:

3062 K

IX6610  
Transformer Coupled  
Driver Logic Interface  
Features  
Description  
TTL Logic level micro-controller Interface  
Pulse transformer bidirectional data interface  
Short input pulse suppression  
Interlock and dead time control  
Four 1A pulse transformer drivers  
Two 1A drivers for push-pull power converter for the  
secondary side power supply  
Non-overlap operation of high side and low side  
drivers  
Internal startup oscillator  
The IX6610 is a primary side logic interface device  
that implements a dual channel bidirectional  
transformer interface to drive a secondary side  
intelligent IGBT driver. The bidirectional transformer  
interface transmits the primary side input commands,  
secondary side output faults, and power supply faults.  
Asynchronous data transmission is through high  
frequency narrow pulses to avoid duty cycle  
restrictions, to achieve shorter delays, and to prevent  
any transformer core saturation issues. The IX6610  
contains all the necessary blocks to implement a  
power converter that supplies isolated power to the  
secondary side IGBT drivers. IX6610 is a primary side  
device with built-in interlock and dead time control that  
can be interfaced directly to a low voltage  
Primary side fault monitoring  
Secondary side fault monitoring  
Two fault status outputs  
2mA quiescent current (non- switching)  
microcontroller to provide input signal conditioning as  
well as fault management.  
Applications  
Pulse transformer coupled IGBT/MOSFET gate  
driver interface  
The IX6610 operates over a temperature range of  
-40°C to +85°C. The IX6610 is available in either  
28-lead TSSOP with exposed pad or as tested die.  
IX6610 Block Diagram  
28 PGND1  
27 TRDCN  
Ordering Information  
Softstart Control  
PGND1  
TRDCP  
1
Output Power Select  
Part  
Description  
PGND1  
PGND1  
GND  
2
3
Watchdog  
Timer  
IX6610T  
28-Pin TSSOP, in Tubes, Exposed Tab (50/Tube)  
MODE  
IX6610TR 28-Pin TSSOP, Exposed Pad, Tape & Reel (1000/Reel)  
IX6610 Tested Die  
VDD  
RCVAP  
RCVAN  
RCVBP  
26  
POR  
FLTRST  
RESET  
4
5
THSD  
RST  
Reset  
Generator  
25  
24  
Oscillator  
Clock  
Select  
CLK  
6
23 RCVBN  
EN2  
VDD  
Power Supply  
Fault Logic  
FAULT1  
7
OVLO  
UVLO  
22  
VIN  
VDD  
Output Fault  
Logic  
21 VAUX  
FAULT2  
RBIAS  
8
9
Internal  
VREF  
Start-Up  
Regulator  
20 TEST  
Precision  
Current  
Generator  
+
-
VDD  
vbg  
3.3V  
LDO  
vbg  
19  
18  
VDD  
CB  
Soft-Start  
Control  
INB 10  
Dead Time  
Generator  
INA  
11  
TRAP  
12  
13  
17  
TRBP  
Channel A  
Leading Edge Pulse  
Channel B  
Leading Edge Pulse  
PGND2  
PGND2  
PGND2  
16 TRBN  
TRAN  
Channel B  
Trailing Edge Pulse  
Channel A  
Trailing Edge Pulse  
PGND2  
PGND2  
CA  
15  
PGND2 14  
DS-IX6610-R00A  
PRELIMINARY  
1
IX6610  
1. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
1.1 Package Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
1.2 Pin Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
1.3 Absolute Maximum Ratings @ 25°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4  
1.4 ESD Warning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5  
1.5 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5  
1.5.1 Input Power Supply. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5  
1.5.2 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5  
1.5.3 Auxiliary Winding Bootstrap Supply (V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5  
AUX  
1.5.4 Start Up Regulator (V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
CC  
1.5.5 LDO Regulator (V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
DD  
1.5.6 Digital Input Terminals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
1.5.7 Internal Voltage Reference . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
1.5.8 Digital Input Interface and Dead Time Generator. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7  
1.5.9 External Clock and Internal Oscillator. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7  
1.5.10 Thermal Shutdown Circuit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7  
1.5.11 UVLO Circuit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7  
1.5.12 OVLO Circuit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8  
1.5.13 Power Converter Control Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8  
1.5.14 Signal Transformer Primary (Transmit) Switch and Pulse Generator. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9  
1.5.15 Signal Transformer Secondary Receive Inputs and Fault Detect. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9  
1.6 Timing Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
2. Theory of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17  
2.1 Detailed Circuit Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17  
2.1.1 Digital Input Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17  
2.1.2 Short Pulse Filter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18  
2.1.3 Dead Time Generator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18  
2.1.4 Oscillator. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18  
2.1.5 Under Voltage Lockout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18  
2.1.6 Over Voltage Lockout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18  
2.1.7 Signal Transformer Primary Switches and Pulse Generators. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18  
2.1.8 Signal Transformer Secondary Receive Inputs and Fault Detect. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18  
2.1.9 Push-Pull Power Converter Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19  
2.1.10 Watchdog Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19  
2.1.11 Thermal Shutdown (THSD). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19  
2.1.12 5V Startup Regulator (V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19  
CC  
2.1.13 3.3V LDO Regulator (V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20  
DD  
2.1.14 Dead Time Delay Capacitor Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20  
2.1.15 RESET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20  
2.1.16 TEST. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20  
3. Manufacturing Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21  
3.1 Moisture Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21  
3.2 ESD Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21  
3.3 Soldering Profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21  
3.4 Board Wash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21  
3.5 Mechanical Dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22  
3.5.1 IX6610T 28-Pin TSSOP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22  
3.5.2 IX6610T 28-Pin TSSOP Tape & Reel. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22  
2
PRELIMINARY  
R00A  
IX6610  
1
Specifications  
1.1 Package Pinout  
28 - PGND1  
27 - TRDCN  
26 - RCVAP  
25 - RCVAN  
24 - RCVBP  
23 - RCVBN  
22 - VIN  
21 - VAUX  
20 - TEST  
19 - VDD  
TRDCP - 1  
GND - 2  
MODE - 3  
FTLTRST - 4  
RESET - 5  
CLK - 6  
FAULT1 - 7  
FAULT2 - 8  
RBIAS - 9  
INB - 10  
18 - CB  
INA - 11  
17 - TRBP  
16 - TRBN  
15 - CA  
TRAP - 12  
TRAN - 13  
PGND2 - 14  
1.2 Pin Description  
Pin#  
Name  
Description  
1
2
TRDCP  
GND  
Power converter transformer primary positive terminal  
Ground terminal; analog ground  
Enable external MCU VDD supply feature  
3
MODE  
FLT RST  
RESET  
CLK  
4
Fault reset input terminal  
5
Global reset input terminal  
6
External clock input terminal  
7
FAULT1  
FAULT2  
RBIAS  
INB  
Primary and secondary side power supply status terminal  
Secondary side IGBT output status terminal  
Bias current setting resistor terminal  
8
9
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
Channel B TTL level logic input terminal  
INA  
Channel A TTL level logic input terminal  
TRAP  
TRAN  
PGND2  
CA  
Channel A transmit signal pulse transformer primary positive terminal  
Channel A transmit signal pulse transformer primary negative terminal  
Ground terminal; transmit signal transformer switch ground  
Channel A dead time capacitor terminal  
TRBN  
TRBP  
CB  
Channel B transmit signal pulse transformer primary negative terminal  
Channel B transmit signal pulse transformer primary positive terminal  
Channel B dead time capacitor terminal  
VDD  
3.3V LDO regulator output terminal  
TEST  
VAUX  
Test configuration terminal  
Auxiliary bootstrap supply winding terminal  
VIN  
22  
23  
24  
25  
26  
27  
28  
Positive power supply input terminal  
RCVBN  
RCVBP  
RCVAN  
RCVAP  
TRDCN  
PGND1  
Channel B receive signal pulse transformer secondary negative terminal  
Channel B receive signal pulse transformer secondary positive terminal  
Channel A receive signal pulse transformer secondary negative terminal  
Channel A receive signal pulse transformer secondary positive terminal  
Power converter transformer primary negative terminal  
Ground terminal. power converter transformer switch ground  
R00A  
PRELIMINARY  
3
IX6610  
1.3 Absolute Maximum Ratings @ 25°C  
Parameter  
Symbol  
VIN  
Limits  
Units  
Supply voltage  
-0.3 to 18  
-0.3 to 6  
V
V
VAUX  
VDD  
Auxiliary winding voltage  
LDO terminal voltage  
-0.3 to 6  
V
-0.3 to VDD+0.3  
-0.3 to VDD+0.3  
-0.3 to VDD+0.3  
-0.3 to VDD+0.3  
-0.3 to VIN+0.3  
-0.3 to (2VIN+4)  
Logic input voltages  
INA, INB, RESET, CLK, FLTRST, TEST, MODE  
V
Analog I/O terminal voltages  
CA, CB  
FAULT1, FAULT2  
RCVAP, RCVAN, RCVBP, RCVBN  
TRAP, TRAN, TRBP, TRBN  
TRDCP, TRDCN  
TJ  
V
Fault output terminal voltages  
V
Pulse Transformer receive input terminal voltages  
Pulse transformer driver output terminal voltages  
Power converter transformer driver output terminal voltage  
Operating junction temperature range  
Storage temperature range  
V
V
V
-55 to +150  
-65 to +150  
°C  
°C  
TSTG  
Absolute maximum ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device.  
Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not  
implied.  
Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for  
information purposes only, and are not part of the manufacturing testing requirements.  
4
PRELIMINARY  
R00A  
IX6610  
1.4 ESD Warning  
ESD (electrostatic discharge) sensitive device. Electrostatic charges can readily accumulate on test equipment and  
the human body in excess of 4000V. This energy can discharge without detection. Although the IX6610 features  
proprietary ESD protection circuitry, permanent damage may be sustained if subjected to high energy electrostatic  
discharges. Proper ESD precautions are recommended to avoid performance degradation or loss of functionality.  
1.5 Electrical Characteristics  
T =-40°C to +85°C unless otherwise noted.  
A
1.5.1 Input Power Supply  
Logic and the output switches are conditioned to be in the appropriate logic state during the supply ramp-up. The  
minimum V required for a stable logic state: V  
= 3V.  
IN  
IN_MIN  
Parameter  
Symbol  
Conditions  
Min  
Typ  
Max Units  
V
Normal operating power supply voltage range  
Nominal operating range  
14  
15  
15.5  
V
IN  
Test mode, V =15V, power converter  
IN  
transformer disconnected, internal  
oscillator, no external load on LDO  
I
Power supply Current 1  
Power supply Current 2  
-
-
1
3
mA  
IN_TST  
Normal mode, V =15V,  
f
IN  
= 200kHz  
I
Note 1  
-
mA  
IN_NORMAL  
CLK  
Note 1: Power supply current will depend on Secondary side power load, as well as transmit clock frequency and  
RLOAD when Pulse transformers are sourced from VDD  
.
1.5.2 Thermal Characteristics  
Parameter  
Rating  
Units  
JA  
JC  
25  
°C/W  
°C/W  
8
1.5.3 Auxiliary Winding Bootstrap Supply (V  
)
AUX  
The LDO pass device shuts off once the V  
voltage has been exceeded. The V  
voltage pin can operate up  
TH_AUX  
AUX  
to ~(V -2V). The V  
pin is only used to supply power to the V regulator pass device.  
DD  
IN  
AUX  
Parameter  
Auxiliary winding voltage  
Symbol  
Conditions  
Min  
Typ  
Max  
Units  
V
= 14V to 15V,  
power converter duty cycle  
IN  
6
(Note 1)  
V
4
5
V
AUX  
D= 35% to 50%  
Transfer the V regulator  
CC  
load current from V to V  
V
switch over threshold  
V
-
4
-
V
CC  
TH_AUX  
IN  
AUX  
Note 1: VAUX can safely go higher than 6V but VAUX cannot exceed the VIN supply voltage.  
R00A  
PRELIMINARY  
5
IX6610  
1.5.4 Start Up Regulator (V  
)
CC  
Parameter  
Regulator output voltage  
Input line regulation  
Symbol  
Conditions  
Min  
Typ  
Max  
4.3  
0.5  
0.5  
2
Units  
V
V
V =14V to 16V  
IN  
3.9  
4.1  
CC  
V  
V =8V to 16V  
IN  
-
-
-
-
-
-
-
-
V
CC_VIN  
V  
V =15V, I =1mA to 20mA  
VCC  
Output load regulation  
Dropout voltage  
V
CC_IL  
IN  
V
V
=(V -V ), I =10mA  
IN CC VDD  
V
DROP  
DROP  
I
V =15V  
IN  
Short circuit output current  
150  
mA  
CC_Short  
1.5.5 LDO Regulator (V  
)
DD  
LDO is powered from the V  
pin (Either Startup Regulator or Auxiliary Winding Voltage V  
). LDO to supply the  
AUX  
AUX  
MCU startup current of 50mA for 100ms.  
Parameter  
LDO output voltage  
Symbol  
Conditions  
Min  
Typ  
Max  
3.6  
50  
50  
100  
1
Units  
V
V
V
= 15V, V =5V, C =22F  
3
3.3  
DD  
IN  
AUX  
OUT  
V  
V
=4V to 5.5V, I =1mA  
AUX VDD  
Input line regulation  
-
-
-
-
-
-
-
mV  
mV  
mA  
V
DD_VCC  
V  
V =15V, V =5V, I =1mA to 50mA  
IN AUX VDD  
Output load regulation  
Short circuit output current  
Dropout voltage  
DD_IL  
I
V =15V, V =5V  
IN AUX  
-
DD_Short  
V
V
=V -V , V =15V, I =50mA  
DROP AUX DD IN VDD  
-
DROP  
C
C
=22F, 1 m A < I < 50mA  
VDD  
Output bypass capacitance ESR  
0.3  
-
VDD_ESR  
VDD  
1.5.6 Digital Input Terminals  
Parameter  
Input leakage current  
Symbol  
Conditions  
Min  
-1  
75  
-1  
2
Typ  
Max  
1
Units  
A  
A  
A  
V
I
CLK, RESET, INA, INB, TEST=GND  
-
INLKG  
I
CLK, RESET, INA, INB, TEST=V  
Input pull-down current (25k)  
Input leakage current  
130  
300  
1
INPD  
DD  
I
FLTRST=GND or V  
-
-
-
FLTRST  
DD  
V
Minimum high level input voltage  
Maximum low level input voltage  
INA, INB, RESET, FLTRST, CLK, TEST  
INA, INB, RESET, FLTRST, CLK, TEST  
-
IH  
V
-
0.8  
V
IL  
1.5.7 Internal Voltage Reference  
Parameter  
Symbol  
Conditions  
Min Typ Max Units  
V
Measured @ RBIAS pin, V =15V, V =4.6V  
IN CC  
Internal voltage reference  
1.21 1.26 1.31  
-4 +4  
V
V
REF_INTERNAL  
V
Internal voltage reference tolerance  
-
-
REF_TOL  
6
PRELIMINARY  
R00A  
IX6610  
1.5.8 Digital Input Interface and Dead Time Generator.  
Parameter  
INA, INB frequency  
Symbol  
Conditions  
Min  
0
Typ  
Max  
Units  
kHz  
ns  
f f  
INA, INB  
-
-
-
250  
t
t
PW_INA, PW_INB  
INA, INB input pulse width  
INA, INB dead time no cap  
INA,INB dead time programmable range  
Reset pulse width  
(Note 1)  
500  
20  
-
t
No capacitors at CA and CB pins  
30  
-
50  
ns  
INDEAD_NOCAP  
INDEAD_RANGE  
t
CA=CB=0nF  
200  
200  
200  
(Note 2)  
ns  
t
-
-
-
-
-
ns  
PW_RESET  
t
Fault reset pulse width  
-
ns  
PW_FLTRST  
Note 1: INA will override INB and tPW is reduced by tINDEAD when INA overlaps INB.  
Note 2: The formula for tINDEAD is 2000*CA or 2000*CB (CA or CB is the capacitor value in Farads). Example  
2000*200e-12 = 400nS. The maximum value of tINDEAD is only limited by the application  
1.5.9 External Clock and Internal Oscillator  
To protect power converter switches, the power converter shuts down if the external converter clock (CLK) is high for  
greater than t  
(40s). The power converter will remain shut down until eight valid clocks are received.  
DOG_OSC  
Parameter  
Symbol  
Conditions  
Input from MCU  
Min  
180  
10  
-
Typ  
200  
-
Max  
220  
50  
-
Units  
kHz  
%
f
External clock  
CLK  
D
External clock duty cycle  
Input from MCU  
CLK  
t
External clock watchdog time out  
Internal oscillator frequency  
Information parameter  
Information parameter  
40  
s  
DOG_CLK  
f
-
200  
-
kHz  
OSC  
Measured at the power converter  
driver output  
f
Internal oscillator divider output frequency  
65  
100  
140  
kHz  
DC_OSC  
1.5.10 Thermal Shutdown Circuit  
Specifications are characterized and guaranteed by design. All units are not production tested.  
Parameter  
Symbol  
Conditions  
Min  
+130  
-
Typ  
+145  
20  
Max  
+160  
-
Units  
°C  
t
Thermal shutdown rising threshold  
Thermal shutdown hysteresis  
-
-
SHDN_RISE  
t
°C  
SHDN_HYS  
1.5.11 UVLO Circuit  
Parameter  
Symbol  
Conditions  
Min  
10  
-
Typ  
11  
Max  
12  
-
Units  
V
UVLO rising threshold is measured by  
monitoring state change at FAULT1  
terminal.  
IN  
UVLO  
Under voltage lockout threshold  
Under voltage lockout hysteresis  
V
V
RISE  
UVLO  
-
0.5  
HYST  
R00A  
PRELIMINARY  
7
IX6610  
1.5.12 OVLO Circuit  
Parameter  
Symbol  
Conditions  
Min  
16.25  
-
Typ  
17  
Max  
17.75  
-
Units  
V
OVLO rising threshold is measured by  
monitoring state change at FAULT1 and  
FAULT2 terminals.  
IN  
OVLO  
Over voltage lockout threshold  
Over voltage lockout hysteresis  
V
V
RISE  
OVLO  
-
0.5  
HYST  
1.5.13 Power Converter Control Circuit  
See Figure 2 and Figure 3 for reference.  
Parameter  
Symbol  
Conditions  
Min  
90  
Typ  
100  
40  
-
Max  
110  
50  
Units  
kHz  
%
f
Converter switching clock frequency  
Converter switching clock duty cycle  
Converter switching clock pulse width  
Normal operation, external clock  
Normal operation, external clock  
Normal operation, external clock  
DC_CLK  
D
35  
DC_CLK  
t
900  
-
ns  
PW_CLK  
Converter startup switching clock  
frequency  
Startup operation, internal oscillator  
+ clock divider  
f
80  
-
100  
47  
150  
-
kHz  
%
A
DC_OSC  
Converter startup switching clock  
duty cycle  
Startup operation, internal oscillator  
+ clock divider  
D
DC_OSC  
Converter transformer primary driver  
switch output sink resistance  
Converter transformer primary driver  
switch output sink resistance  
Converter transformer primary driver  
switch output peak sink current  
Converter transformer primary driver  
switch max drain voltage limit  
Normal operation. Measured at TRDCP and  
= 400mA.  
0.4  
Note 2  
R
-
0.7  
5
OUT_DCN  
TRDCN terminals @ I  
SINK  
Startup operation. Measured at TRDCP and  
= 200mA  
R
-
2.5  
OUT_DCS  
TRDCN terminals @ I  
SINK  
I
-
-
-
-
1
PEAK  
V
-
-
40  
V
DSMAX  
t
Converter transformer primary driver  
output fall time  
F_TRDCP  
V =15V, R =1k, C =50pF  
-
-
50  
ns  
IN  
L
L
t
F_TRDCN  
Note 1: Power converter needs to deliver 2 Watts of power @20V to the secondary side IGBT drivers, ~ 0.275 watts power  
@5.5V to the LDO. If the VCC (5V) regulator is also powered from VAUX then the converter power delivery needs to increase to  
accommodate VCC regulator.  
Note 2: Package and board resistance must be minimized to achieve this ROUT_DCN specification.  
8
PRELIMINARY  
R00A  
IX6610  
1.5.14 Signal Transformer Primary (Transmit) Switch and Pulse Generator  
Parameter  
Symbol  
Conditions  
Min  
Typ  
Max  
Units  
V
/ V = 5V / 15V,  
CC IN  
Transmit signal transformer primary  
switch sink resistance  
R
Measured at terminals TRAP, TRAN, TRBP,  
TRBN@ V = 3.3V, I = 100mA  
-
0.5  
1
OUTS  
DD  
SINK  
V
/ V = 5V / 15V,  
CC IN  
Measured at terminals TRAP, TRAN, TRBP,  
Transmit signal transformer primary  
switch peak sink current  
I
0.7  
1
-
A
PEAKS  
TRBN@ V = 3.3V, 200ns Pulse  
DD  
V
/ V = 5V / 15V,  
CC IN  
Transmit signal transformer primary  
switch low level output voltage  
V
Measured at terminals TRAP, TRAN, TRBP,  
TRBN@ V = 3.3V, R = 5  
-
-
0.3  
-
1
V
V
OLS  
DD  
L
Transmit signal transformer primary  
switch max drain voltage limit  
V
@ I  
= 1A  
15  
DSMAX  
DS_LEAK  
Measured at terminals  
TRAP, TRBP @ V = 3.3V, R = 1k,  
Leading edge pulse width related to  
the input signals INA, INB  
T
100  
200  
300  
ns  
DD  
C =50pF  
L
PWL  
L
Measured at terminals  
TRAN, TRBN@ V = 3.3V, R = 1k,  
Trailing edge pulse width related to  
the input signals INA, INB  
T
100  
-
200  
20  
300  
-
ns  
ns  
DD  
C =50pF  
L
PWT  
L
Measured at terminals  
TRAP, TRAN, TRBP, TRBN @ V = 3.3V  
Channel A vs Channel B pulse width  
distortion  
T
DD  
DST  
R = 1k, C = 50pF  
L
L
1.5.15 Signal Transformer Secondary Receive Inputs and Fault Detect  
Parameter  
Symbol  
Conditions  
Min  
Typ  
Max  
Units  
Measured at terminals @ RCVAP, RCVAN,  
RCVBP, RCVBN  
R
Receive input resistance  
0.7  
1
1.3  
k  
IN  
Receive input positive threshold  
voltage  
Measured at terminals  
V
2.2  
0.5  
-
-
-
THP  
RCVAP, RCVAN, RCVBP, RCVBN by monitoring  
the state change at FAULT1 and FAULT2  
terminals @ V = 3.3V  
V
V
Receive input hysteresis  
1
HYS  
DD  
V
OH_FLT1  
V
V
= 3.3V, I  
= 3.3V, I  
= 10mA  
= 10mA  
V -0.2  
DD  
FAULT1, FAULT2 output high voltage  
-
-
-
V
V
DD  
SOURCE  
V
OH_FLT2  
V
OL_FLT1  
FAULT1, FAULT2 output low voltage  
-
0.2  
DD  
SOURCE  
V
OL_FLT2  
V
= 3.3V, Measured from  
DD  
FAULT1, FAULT2 signal propagation  
delay  
t
-
-
50  
ns  
RCVAP, RCVBP to FAULT2 and from RCVAN,  
RCVBN to FAULT1  
FD  
R00A  
PRELIMINARY  
9
IX6610  
1.6 Timing Diagrams  
Figure 1 Input Signal Timing  
tIN  
INA  
tINDEAD  
INB  
tINDEAD  
INA_DEAD_TIME  
tINDEAD  
tINDEAD  
INB_DEAD_TIME  
TRAP  
tPWL  
tPWT  
TRAN  
TRBP  
tPWL  
tPWT  
TRBN  
Figure 2  
Power Converter Timing (Internal Oscillator)  
tOFF  
DC_OSC_INT  
DDC_OSC = tON / (tON+tOFF  
)
PHASE_SELECT1  
PHASE_SELECT2  
fDC_OSC = (1 / tDC_OSC  
)
TRDCP  
TRDCN  
tON  
tDC OSC  
10  
PRELIMINARY  
R00A  
IX6610  
Figure 3  
Power Converter Timing (External Clock)  
tON  
tOFF  
CLK  
2 • VIN  
DCLK = tON / (tON + tOFF  
f
)
CLK = (1 / tCLK)  
DC CLK = (2 • tCLK  
TRDCP  
GND  
t )  
DDC CLK = (1-DCLK  
tDC ON  
tDC OFF  
)
2 • VIN  
TRDCN  
GND  
tDC CLK  
Figure 4  
Input Signal Interlock Timing (A Channel has Priority)  
INA  
INB  
tPW  
To IX6611A  
TRAP  
TRAN  
To IX6611B  
TRBP  
TRBN  
R00A  
PRELIMINARY  
11  
IX6610  
Figure 5  
Secondary Side Under Voltage Condition FAULT1 Signal Timing  
From MCU  
INA  
tINDEAD  
tINDEAD  
INB  
To IX6611A  
TRAP  
tPW  
TRAN  
To IX6611B  
TRBP  
TRBN  
tFLT_DLY  
From IX6611A  
RCVAN  
From IX6611B  
RCVBN  
tFLT1  
To MCU  
FAULT1  
tFLT RST  
tFLT RST  
From MCU  
FLT RST  
From IX6611A  
RCVAP  
From IX6611B  
RCVBP  
To MCU  
FAULT2  
12  
PRELIMINARY  
R00A  
IX6610  
Figure 6  
Secondary Side Over Voltage Condition FAULT1 & FAULT2 Signal Timing  
FROM MCU  
INA  
tINDEAD  
tINDEAD  
INB  
TO IX6611A  
TRAP  
tPW  
TRAN  
TO IX6611B  
TRBP  
TRBN  
tFLT_DLY  
FROM IX6611A  
RCVAP  
RCVAN  
FROM IX6611B  
RCVBP  
RCVBP  
tFD1  
TO MCU  
FAULT1  
tFD2  
FAULT2  
tFLT_RST  
FROM MCU  
FLT RST  
R00A  
PRELIMINARY  
13  
IX6610  
Figure 7  
Secondary Side IGBT Over Current Fault Condition FAULT1 & FAULT2 Signal Timing  
FROM MCU  
INA  
tINDEAD  
tINDEAD  
INB  
TO IX6611A  
TRAP  
tPW  
TRAN  
TO IX6611B  
TRBP  
TRBN  
FROM IX6611A  
RCVAN  
FROM IX6611B  
RCVBN  
TO MCU  
FAULT1  
FROM IX6611A  
RCVAP  
FROM IX6611B  
RCVBP  
tPW  
tFLT2  
TO MCU  
FAULT2  
tFLT RST  
FROM MCU  
FLT RST  
14  
PRELIMINARY  
R00A  
IX6610  
Figure 8  
Primary Side UVLO Condition FAULT1 Timing Diagram (FAULT2=0V)  
VIN  
UVLO_COMP  
(INTERNAL_SIGNAL)  
FAULT1  
FLTRST  
Figure 9  
Primary Side OVLO Condition FAULT2 Timing Diagram (FAULT1=0V)  
VIN  
OVLO_COMP  
(INTERNAL_SIGNAL)  
FAULT2  
FLTRST  
Figure 10 Primary Side Overtemp Condition FAULT1 & FAULT2 Timing Diagram  
OVERTEMP_COMP  
(INTERNAL_SIGNAL)  
FAULT1  
FAULT2  
FLTRST  
R00A  
PRELIMINARY  
15  
IX6610  
Figure 11 MCU Fault Handling Flow  
START  
FAULT  
SIGNAL  
SET  
NO  
YES  
FAULT1  
AND / OR  
FAULT2  
FAULT2  
FAULT1  
FAULT1 and FAULT2  
Issue “FLT_RST”  
Issue “FLT_RST”  
Issue “FLT_RST”  
FAULT1  
Cleared  
FAULT1 &  
FAULT2  
Cleared  
FAULT2  
Cleared  
NO  
NO  
NO  
Primary Side “UVLO”  
Primary Side  
“OV”  
Primary Side “OV”  
YES  
YES  
YES  
Issue “INA” Pulse  
Issue “INA” Pulse  
Issue “INA” Pulse  
FAULT1 &  
FAULT2  
Set  
FAULT2  
Set  
YES  
YES  
YES  
FAULT1  
Set  
Channel A  
“Power Stage Fault”  
Channel A “UVLO”  
Channel A “OVLO”  
NO  
NO  
NO  
Issue “INB” Pulse  
Issue “INB” Pulse  
Issue “INB” Pulse  
YES  
YES  
YES  
FAULT1  
Set  
FAULT1 &  
FAULT2  
Set  
FAULT2  
Set  
Channel A  
“Power Stage Fault”  
Channel B “UVLO”  
Channel B “OVLO”  
NO  
NO  
NO  
No “UVLO” Fault on  
Primary or Secondary  
Side  
No “OVLO” Fault on  
Primary or Secondary  
Side  
No Power Stage Fault  
on Secondary Side  
16  
PRELIMINARY  
R00A  
IX6610  
Figure 12 IX6610 Application Diagram  
VP=15V  
VP  
CHAN-A  
22µF  
COM  
VIN  
22µF  
VN  
PGND1  
VN=-5V  
VP=15V  
28  
27  
Softstart Control  
PGND1  
VP  
1
22µF  
TRDCN  
CHAN-B  
COM  
22µF  
TRDCP  
Output Power Select  
GND  
PGND1  
PGND1  
2
22µF  
PGND1  
Watchdog  
Timer  
VN  
VN=-5V  
From MCU  
3
MODE  
RCVAP  
RCVAN  
VDD  
26  
25  
50  
50  
50  
CHAN-A  
POR  
0V  
FLT RST  
From MCU  
50  
4
5
THSD  
RST  
Reset  
Generator  
RESET  
CLK  
Oscillator  
From MCU  
From MCU  
RCVBP  
RCVBN  
24  
23  
Clock  
Select  
50  
50  
CHAN-B  
6
0V  
EN2  
VDD  
FAULT1  
FAULT2  
Power Supply  
Fault Logic  
To MCU  
To MCU  
7
OVLO  
UVLO  
VIN  
15VDC in  
22  
21  
20  
VDD  
22µF  
VAUX  
Output Fault  
Logic  
8
9
Internal  
VREF  
Start-Up  
Regulator  
TEST  
RBIAS  
7.77k  
Precision  
Current  
Generator  
+
VDD  
vbg  
0.2nF  
VDD  
CB  
3.3V  
LDO  
-
vbg  
to MCU power  
19  
18  
22µF  
INB  
Soft-Start  
Control  
From MCU  
From MCU  
10  
0.2nF  
INA  
Dead Time  
Generator  
11  
12  
13  
14  
TRBP  
TRAP  
17  
16  
15  
VDD  
VDD  
Channel A  
Leading Edge Pulse  
Channel B  
Leading Edge Pulse  
50  
50  
50  
50  
50  
CHAN-A  
CHAN-B  
VEE  
VEE  
PGND2  
PGND2  
50  
TRBN  
CA  
TRAN  
Channel B  
Trailing Edge Pulse  
Channel A  
Trailing Edge Pulse  
PGND2  
PGND2  
PGND2  
PGND2  
0.2nF  
2
Theory of Operation  
The IX6610 is a PWM logic signal interface IC used on the primary side of a transformer coupled IGBT gate driver.  
2.1 Detailed Circuit Description  
2.1.1 Digital Input Interface  
function is implemented to prevent the simultaneous  
conduction of the secondary side High side and Low  
side IGBT’s. Figure 4 shows the behavior of the  
interlock function.  
The external MCU provides TTL level compatible input  
signals INA and INB. These input signals are fed  
through the Schmitt trigger buffers to control the  
secondary side IGBT drivers. An input signal interlock  
R00A  
PRELIMINARY  
17  
IX6610  
2.1.2 Short Pulse Filter  
2.1.6 Over Voltage Lockout  
A narrow pulse detector is implemented in the IX6610  
to prevent transmission of very narrow false PWM  
input signals to the IGBT drivers due to noise coupling  
at the input pins. Input signal pulse widths narrower  
than 100ns will be suppressed and pulse widths  
greater than 350ns will be transferred to the IGBT  
drivers.  
The over voltage lockout (OVLO) circuit holds both  
PWM logic control signals INA and INB low and  
disables the power converter control block during any  
V
over voltage condition. When V supply voltage  
IN  
IN  
falls below the OVLO threshold, the OVLO circuit  
allows the PWM inputs to control the drivers and  
enables the power converter control block. FAULT1  
and FAULT2 outputs are driven high during the OVLO  
condition. Figure 9 illustrates the OVLO function.  
2.1.3 Dead Time Generator  
In the half bridge driver configuration, dead time needs  
to be added to the incoming input signals to prevent  
shoot through due to overlap of the high side and low  
side drivers. The required dead time is programmed  
by the external MCU.  
2.1.7 Signal Transformer Primary Switches and Pulse  
Generators  
The signal transformer primary terminals are  
connected to high current switches. Gate drive to the  
high current switches is controlled by the logic input  
signals INA and INB, which, when active, produce a  
high current pulse on the rising edge and falling edge  
of the input signals at the TRAP (TRBP) and TRAN  
(TRBN) outputs respectively. Narrow pulses are used  
to drive the transformer switches, see Figure 1.  
The IX6610 also contains a dead time circuit that adds  
dead time to the input signals INA and INB after the  
input signal interlock function. This dead time applies  
only if the programmed MCU dead time is shorter than  
the IX6610 dead time. The IX6610 dead time can be  
programmed by changing the external capacitors at  
the CA and CB terminals. Figure 1 shows the dead  
time insertion.  
2.1.8 Signal Transformer Secondary Receive Inputs and  
Fault Detect  
2.1.4 Oscillator  
The IX6610 has four single ended receiver  
comparators which sense the presence of signals that  
are more positive than a fixed positive threshold value.  
A 1kpull down resistor to ground is connected to  
each of the receiver inputs. An external low pass filter  
can be implemented to prevent impulse noise from  
triggering the receivers. Receiver comparators are  
high speed Schmitt Trigger buffers with 1V typical  
hysteresis.  
The IX6610 includes a 200kHz internal oscillator  
circuit that provides a 100kHz, 47% duty cycle clock to  
the power converter control circuit. The oscillator  
circuit provides the necessary high frequency clock  
signals to the watchdog timer. The power converter  
begins operation using the internal oscillator, and  
switches over to the MCU CLK input once it has  
detected a valid clock. Note that if the MCU CLK  
stops, then the power converter will be clocked by the  
internal oscillator. Figure 3 shows the relationship of  
external CLK to the power converter clock. Duty cycle  
of CLK pin input determines the duty cycle of the  
power converter operation using the following formula:  
Secondary side power supply faults and IGBT power  
stage faults are transmitted back to the IX6610  
(primary side) through a pulse transformer. The  
FAULT1 output is used to signal power supply under  
voltage fault events on either the secondary side or the  
primary side. The FAULT2 output is used to signal a  
secondary side power stage fault. FAULT1 and  
FAULT2 outputs together signal primary and  
secondary side over voltage fault events.  
DutyCycleCLK  
DutyCycleDC_CLK = 0.5 -------------------------------------  
2.015  
2.1.5 Under Voltage Lockout  
Primary side and secondary side power supply faults  
are latched, and fault flags are asserted logic high.  
The Under Voltage Lockout (UVLO) circuit holds both  
PWM logic control signals INA and INB low during the  
V
supply ramp-up. When the supply voltage rises  
If the FAULT1 and FAULT2 flags are set by primary  
side power supply or over-temp faults, then the input  
signals to the secondary side drivers are disabled.  
When the device recovers from the primary side  
power supply faults, the auto restart feature or external  
IN  
above the UVLO upper threshold, the UVLO circuit  
allows the PWM inputs to control the drivers. FAULT1  
output is driven high during the UVLO condition.  
Figure 8 illustrates the UVLO function.  
18  
PRELIMINARY  
R00A  
IX6610  
FLTRST clears the fault flags, and normal operation  
resumes.  
power converter operates from the internal oscillator  
or MCU clock with variable duty cycle. In the run mode  
the entire power switch is enabled. The power  
converter switches from startup mode to run mode  
when the IX6610 has detected a reflected voltage  
If the FAULT1 and FAULT2 flags are set by secondary  
side under voltage or over voltage faults, then the input  
signals are not disabled, and the fault flags are reset  
only by a logic high signal at the FLTRST input.  
threshold of 1.9375*V on the TRDCP pin during the  
IN  
driver disabled period. The run mode is held off until  
the reflected voltage threshold detect has been valid  
for 128 clocks or ~1.28ms. Transmit operation is also  
disabled during startup mode to minimize current draw  
in the secondary. Once run mode begins, the IX6610  
will no longer monitor the TRDCP voltage, and will  
continue this mode of operation until a reset occurs  
returning the power converter to startup mode.  
A secondary side IGBT power stage over current fault  
is latched, FAULT2 output is asserted logic high, and  
the input signals are not disabled. The flag is reset  
only by applying a logic high signal to the FLTRST  
input.  
The MCU can continuously monitor the FAULT1 and  
FAULT2 flags. If the fault flags are set, then the MCU  
will determine the fault condition by detecting the fault  
signals and manipulating the FLTRST as shown in  
Figure 5 through Figure 10 and the MCU FAULT  
HANDLING FLOW diagram.  
2.1.10 Watchdog Timer  
The internal oscillator or an external MCU provides a  
clock signal to the push-pull power converter.  
Oscillator failure or MCU clock failure can cause  
excessive DC current in the primary winding of the  
power converter. To prevent excessive power  
dissipation and potential failure of the IC due to clock  
failure, a watchdog timer is included in IX6610.  
Whenever the push-pull converter clock is not  
recognized as a valid clock, the internal clock will take  
over clocking of the power converter until a valid  
external clock is detected.  
FAULT1 FAULT2  
Operational Status  
Normal operation  
0
1
0
0
Primary or secondary side UVLO  
condition  
Primary side OVLO or secondary side  
power stage fault condition  
0
1
1
1
Primary side OVERTEMP or secondary  
side OVLO condition  
2.1.11 Thermal Shutdown (THSD)  
The IX6610 contains a Thermal Shutdown circuit to  
protect the device against damage due to excessive  
die temperature. When the junction temperature  
exceeds 150°C, the power converter is disabled. The  
device resumes normal operation when the junction  
temperature falls below 130°C. Thermal shutdown  
status is transmitted via the FAULT1 and FAULT2 pins  
to the MCU.  
2.1.9 Push-Pull Power Converter Control  
The IX6610 contains all necessary components to  
implement a push-pull power converter. Push-pull  
topology provides a simple solution for making  
isolated power supplies. Push-pull converter topology  
allows multiple isolated outputs, stepup/stepdown  
and/or inverted output with low output ripple.  
2.1.12 5V Startup Regulator (V  
)
The circuit drives two internal high current switches  
connected to an external center tapped transformer  
providing dual isolated secondary side positive and  
negative voltages for the IGBT drivers in addition to an  
isolated bootstrapped 5V supply to the IX6610. The  
transformer’s secondary to primary winding ratio  
determines the isolated output voltages.  
CC  
The IX6610 V startup regulator provides power to  
CC  
the LDO when the auxiliary winding voltage is less  
than 4.1V. To reduce power loss and to improve  
efficiency, the startup regulator is connected to the  
auxiliary winding pin V  
. The V  
pin is sourced  
AUX  
AUX  
from the auxiliary winding when the voltage is greater  
than 4.1V. A large ceramic bypass capacitor is  
pin. Reference voltage to the  
regulator is provided by the internal chopper-stabilized  
bandgap voltage reference circuit.  
The power converter has a startup mode and a run  
mode. In the startup mode, the converter operates  
from the internal oscillator or MCU Clock. In the  
startup mode, to reduce the dynamic current  
consumption/power dissipation, only a portion of the  
power switches are enabled. In the run mode, the  
required at the V  
AUX  
R00A  
PRELIMINARY  
19  
IX6610  
2.1.13 3.3V LDO Regulator (V  
)
2.1.14 Dead Time Delay Capacitor Selection  
DD  
Ceramic capacitors are recommended for CA and CB  
dead time capacitors. They should be located as close  
as possible to the pins and connected to a low noise  
ground.  
The LDO regulator provides 3.3V power to the  
external MCU and most of the IX6610 internal circuits.  
LDO is sourced from the V  
pin, and powers up  
AUX  
along with the startup regulator (V ). LDO is  
CC  
designed for a fixed external load capacitor with a  
predetermined ESR range.  
2.1.15 RESET  
A Logic high level at the external reset pin disables the  
power converter, the LDO, initiates power converter  
startup sequence, and resets the fault flags. Holding  
RESET low for sufficient time will lower the LDO  
voltage to a level that may initiate a POR sequence in  
the MCU. The RESET pin has an internal 20kpull  
down resistor.  
To use the MODE control for an external V the  
DD  
external power supply should be connected to the  
3.3V V output pin only after the IX6610 starts with  
DD  
its internal power supply and MODE pin is set logic  
HIGH with current limiting resistor (~1k) to prevent  
powering logic from a signal source.  
Notes on MODE feature to shut down the internal V  
2.1.16 TEST  
DD  
regulator:  
The TEST pin should be tied to ground.  
To avoid overstress to the device, it is recommended  
to allow the internal regulators to power up prior to  
connecting an external power supply via the MODE  
feature.  
The external supply should not exceed V (4.1V)  
CC  
The following diagram shows the device connections  
of the internal regulator pass devices.  
VIN=15V  
VAUX  
~ 4.1V  
MODE  
VDD  
~ 3.3V  
20  
PRELIMINARY  
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IX6610  
3
Manufacturing Information  
3.1 Moisture Sensitivity  
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Corporation  
classifies its plastic encapsulated devices for moisture sensitivity according to the latest  
version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation.  
We test all of our products to the maximum conditions set forth in the standard, and guarantee proper  
operation of our devices when handled according to the limitations and information in that standard as well as to any  
limitations set forth in the information or standards referenced below.  
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced  
product performance, reduction of operable life, and/or reduction of overall reliability.  
This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled  
according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.  
Device  
Moisture Sensitivity Level (MSL) Classification  
IX6610T / IX6610TR  
MSL 1  
3.2 ESD Sensitivity  
This product is ESD Sensitive, and should be handled according to the industry standard  
JESD-625.  
3.3 Soldering Profile  
Provided in the table below is the Classification Temperature (T ) of this product and the maximum dwell time the  
C
body temperature of this device may be above (T - 5)ºC. The classification temperature sets the Maximum Body  
C
Temperature allowed for this device during lead-free reflow processes. For through hole devices, and any other  
processes, the guidelines of J-STD-020 must be observed.  
Classification Temperature (TC)  
Dwell Time (tp)  
Device  
Max Reflow Cycles  
IX6610T / IX6610TR  
260°C  
30 seconds  
3
3.4 Board Wash  
IXYS Corporation recommends the use of no-clean flux formulations. Board washing to reduce or  
remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to  
prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and  
providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing  
process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature  
and duration necessary to remove the moisture trapped within the package is the responsibility of the user  
(assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be  
used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based.  
R00A  
PRELIMINARY  
21  
IX6610  
3.5 Mechanical Dimensions  
3.5.1 IX6610T 28-Pin TSSOP  
9.70 0.10  
(0.382 0.004)  
See Note 2  
Recommended PCB Land Pattern  
PIN 28  
5.80 3.00  
(0.228) (0.118)  
1.50  
(0.059)  
PIN 1  
0.245 0.055  
(0.010 0.002)  
See Note 4  
0.65 BSC  
(0.026 BSC)  
0º-8º  
0.65  
(0.026)  
5.50  
(0.217)  
0.45  
(0.018)  
0.925 0.125  
(0.036 0.005)  
0.127 TYP  
(0.005 TYP)  
0.20 MIN  
(0.008 MIN)  
1.20 MAX  
(0.047 MAX)  
H
0.25  
(0.01)  
0.10  
0.15 MAX  
(0.004)  
(0.006 MAX)  
GAUGE PLANE  
SEATING PLANE  
0.60 0.15  
(0.024 0.006)  
DIMENSIONS  
mm  
4.96 0.55  
(0.195 0.022)  
(inches)  
1.00 REF  
(0.04 REF)  
NOTES:  
1. JEDEC Outline: MO-153 AET Rev. F  
2. Dimension does not include mold flash protrusions or gate burrs. Mold flash protrusions or  
gate burrs shall not exceed 0.15 per side.  
3. Dimension does not include interlead flash or protrusion. Interlead flash or protrusion shall  
not exceed 0.25 per side.  
2.70 0.30  
(0.106 0.012)  
4. Dimension does not include dambar protrusion. Allowable Dambar protrusion shall be  
0.08mm total in excess of this dimension at maximum material condition. Dambar cannot  
be located on the lower radius of the foot. Minimum space between protrusion and adjacent  
lead is 0.07mm.  
5. Package length and width to be determined at datum plane H.  
3.5.2 IX6610T 28-Pin TSSOP Tape & Reel  
1.5 +0.1 / -0.0 DIA  
(0.059 +0.004 / -0.0 DIA)  
330.2 DIA.  
(13.00 DIA.)  
2.0 0.1  
(0.08 0.004)  
4.0 0.1  
(0.16 0.004)  
1.5 MIN  
(0.06 MIN)  
0.33 0.03  
(0.013 0.001)  
1.75 0.1  
(0.069 0.004)  
2.05  
(0.081)  
W=16.00 0.3  
(0.630 0.012)  
B0=10.30  
(0.406)  
6.00  
(0.236)  
5.00  
(0.197)  
7.50 0.10  
(0.295 0.004)  
P=8.00 0.1  
(0.315 0.004)  
A0=6.50  
(0.256)  
K1=1.80  
(0.071)  
Embossed Carrier  
Dimensions  
mm  
1.45  
(0.057)  
3 PL  
K0=2.31  
(0.091)  
(inches)  
Notes:  
1. Cumulative tolerance for 10 sprocket holes: 0.20mm  
2. Pocket position is true position of pocket relative to sprocket holes, not pocket hole  
3. Camber not to exceed 1mm per 250mm in either direction  
Embossment  
22  
PRELIMINARY  
R00A  
IX6610  
For additional information please visit our website at: www.ixys.com  
IXYS Corporation makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to  
specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Corporation Standard  
Terms and Conditions of Sale, IXYS Corporation assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its  
products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.  
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other  
applications intended to support or sustain life, or where malfunction of IXYS Corporation's product may result in direct physical harm, injury, or death to a person or severe  
property or environmental damage. IXYS reserves the right to discontinue or make changes to its products at any time without notice.  
Specification: DS-IX6610-R00A  
©Copyright 2016, IXYS  
All rights reserved. Printed in USA.  
6/9/2016  
R00A  
PRELIMINARY  
23  
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