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IX3120

型号：

IX3120

品牌：

IXYS[ IXYS CORPORATION ]

页数：

12 页

PDF大小：

263 K

下载PDF手册
IX3120  
2.5A Output Current Gate Driver  
Optocoupler  
INTEGRATED  
C
IRCUITS  
D
IVISION  
Features  
Description  
• 2.5A Maximum Peak Output Current  
• 25kV/µs Minimum Common Mode Rejection (CMR)  
The IX3120 gate driver includes an input infrared LED  
that is optically coupled to a power output stage. The  
power output stage is capable of sourcing or sinking  
2A of peak current, which is ideal for driving IGBTs  
and MOSFETs in the mid-power range.  
at 1500V  
CM  
• Wide Operating Voltage Range: 15V to 30V  
• Under Voltage Lockout with Hysteresis  
• 3750V  
Input to Output Isolation  
rms  
The gate driver optocoupler with its low input LED  
current, high output peak current, and high noise  
immunity (25kV/s) is ideally suited for use in motor  
control and inverter applications.  
• Wide Temperature Range: -40°C to +100°C  
Applications  
• Isolated IGBT/MOSFET Gate Drive  
• Switch Mode Power Supplies  
• Industrial Inverters  
The IX3120 is provided in an 8-pin DIP package and  
an 8-pin surface mount package.  
• Motor Drivers  
Approvals  
• UL Recognized Component: File E76270  
• IEC/EN/DIN EN 60747-5-5 (“GE” Versions)  
Ordering Information  
Part  
Description  
IX3120G  
8-Pin DIP Package (50/Tube)  
IX3120GS  
8-Pin Surface Mount (50/Tube)  
IX3120GSTR  
IX3120GE  
8-Pin Surface Mount Tape & Reel (1000/Reel)  
8-Pin DIP Package (50/Tube), IEC 60747-5-5 Option  
8-Pin Surface Mount (50/Tube), IEC 60747-5-5 Option  
IX3120GES  
IX3120GESTR  
8-Pin Surface Mount Tape & Reel (1000/Reel), IEC 60747-5-5 Option  
Figure 1. IX3120 Block Diagram  
TRUTH TABLE  
VCC  
1
2
3
4
8
7
6
5
N/C  
VCC-VEE  
VCC-VEE  
VO  
LED Positive Going Negative Going  
(i.e. Turn-On)  
0V - 30V  
(i.e. Turn-Off)  
0V - 30V  
VO  
VO  
ANODE  
CATHODE  
N/C  
LOW  
LOW  
OFF  
ON  
ON  
ON  
0V - 11V  
0V - 9.5V  
9.5V - 12V  
12V - 30V  
11V - 13.5V  
13.5V - 30V  
TRANSITION  
HIGH  
VEE  
Note: A 0.1μF bypass capacitor must  
be connected between pins 5 and 8.  
DS-IX3120-R04  
www.ixysic.com  
1
IX3120  
INTEGRATED  
C
IRCUITS  
D
IVISION  
1. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
1.1 Package Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
1.2 Pin Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
1.3 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
1.4 Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4  
1.5 Electrical Specifications (DC). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4  
1.6 Switching Characteristics (AC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5  
1.7 Safety and Insulation Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
2. Performance Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7  
3. Test Circuits. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9  
4. Manufacturing Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
4.1 Moisture Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
4.2 ESD Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
4.3 Soldering Profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
4.4 Board Wash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
4.5 Package Mechanical Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
4.5.1 IX3120G & IX3120GE 8-Pin DIP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
4.5.2 IX3120GS & IX3120GES 8-Pin Surface Mount . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
4.5.3 IX3120GSTR & IX3120GESTR Tape & Reel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12  
4.6 Device Branding. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12  
2
www.ixysic.com  
R04  
IX3120  
INTEGRATED  
C
IRCUITS  
D
IVISION  
1. Specifications  
1.1 Package Pinout  
1.2 Pin Description  
VCC  
N/C  
8
1
Pin#  
Name  
Description  
No connection  
1
2
3
4
5
N/C  
ANODE  
CATHODE  
N/C  
Anode of input LED  
Cathode of input LED  
No connection  
VO  
VO  
2
3
4
ANODE  
CATHODE  
N/C  
7
6
5
V
Negative Supply Voltage  
EE  
V
6
7
8
Gate Drive Output  
Gate Drive Output  
Positive Supply Voltage  
O
V
O
VEE  
V
CC  
1.3 Absolute Maximum Ratings  
Absolute maximum ratings are at 25°C.  
Parameter  
Supply Voltage  
Symbol  
Limit  
Units  
V
V - V  
CC EE  
0 to 35  
0 to V  
V
Output Voltage  
V
O(PEAK)  
CC  
1
I
- 2.5  
2.5  
5
A
“High” Peak Output Current  
OH(PEAK)  
1
I
A
“Low” Peak Output Current  
Reverse Input Voltage  
Average Input Current  
OL(PEAK)  
V
V
R
I
20  
mA  
F(AVG)  
Peak Transient Input Current  
(<1s pulse width, 300pps)  
I
1
A
F(TRAN)  
2
P
50  
mW  
mW  
Input Power Dissipation  
IN  
3
P
800  
Total Power Dissipation  
T
V
V
Isolation Voltage, Input to Output  
Operating Temperature  
3750  
IO  
rms  
T
-40 to +100  
-55 to +125  
°C  
°C  
A
T
Storage Temperature  
STG  
Notes:  
1 Maximum pulse width=10s, maximum duty cycle=0.2%.  
2 Derate linearly 1.33mW/°C  
3 Derate linearly 7.5mW/°C  
Absolute maximum ratings are stress ratings. Stresses in  
excess of these ratings can cause permanent damage to  
the device. Functional operation of the device at conditions  
beyond those indicated in the operational sections of this  
data sheet is not implied.  
R04  
www.ixysic.com  
3
IX3120  
INTEGRATED  
C
IRCUITS  
D
IVISION  
1.4 Recommended Operating Conditions  
Parameter  
Power Supply Voltage  
Input Current (ON)  
Symbol  
Min  
15  
Max  
30  
Units  
V
- V  
EE  
V
mA  
V
CC  
I
7
16  
F(on)  
V
Input Voltage (OFF)  
-3.6  
-40  
0.8  
100  
F(off)  
T
Operating Temperature  
°C  
A
1.5 Electrical Specifications (DC)  
Over recommended operating conditions unless otherwise specified. Typical values are at T =25°C,V =30V, and  
A
CC  
V
=Ground.  
EE  
Parameter  
Conditions  
Symbol Min  
Typ  
-1.5  
-
Max  
Units  
1
High Level Output Current  
- 0.5  
-
-
-
V =(V -4V)  
CC  
O
I
A
OH  
2
- 2  
V =(V -15V)  
CC  
O
1
Low Level Output Current  
0.5  
1.4  
-
V =(V +2.5V)  
EE  
O
I
A
OL  
2
2
-
V =(V +15V)  
EE  
O
I =-100mA  
O
V
V
- 4  
V - 3  
CC  
High Level Output Voltage  
Low Level Output Voltage  
-
0.5  
6
V
V
OH  
CC  
I =100mA  
O
V
OL  
-
0.1  
Output Open, I =7 to 16mA  
F
I
CCH  
High Level Supply Current  
Low Level Supply Current  
-
-
-
4.5  
2.6  
0.7  
-
mA  
Output Open, V =- 3 to +0.8V  
F
I
CCL  
6
I =0mA, V >5V  
O
I
FLH  
Threshold Input Current, Low-to-High  
Threshold Input Voltage, High-to-Low  
Input Forward Voltage  
5
mA  
V
O
V
-
0.8  
1
-
FHL  
I =10mA  
F
V
1.24  
-1.6  
-
1.5  
-
V
F
I =10mA  
F
V /T  
Temperature Coefficient of Forward Voltage  
Input Reverse Breakdown Voltage  
Input Capacitance  
-
mV/°C  
V
F
A
I =10A  
BV  
5
-
R
R
f=1MHz, V =0V  
F
C
-
60  
-
pF  
IN  
V
UVLO Threshold  
11  
9.5  
-
12.3  
10.7  
1.6  
13.5  
12  
-
UVLO+  
V >5V, I =10mA  
F
V
V
O
V
UVLO-  
V >5V, I =10mA  
F
UVLO  
HYS  
UVLO Hysteresis  
O
1
Maximum pulse width = 50s, maximum duty cycle = 0.5%.  
Maximum pulse width = 10s, maximum duty cycle = 0.2%.  
2
See “Test Circuits” on page 9 for more information.  
4
www.ixysic.com  
R04  
IX3120  
INTEGRATED  
C
IRCUITS  
D
IVISION  
1.6 Switching Characteristics (AC)  
Over recommended operating conditions, unless otherwise specified.  
Parameter  
Conditions  
Symbol Min  
Typ  
Max  
Units  
Propagation Delay Time  
to High Output Level  
tPLH  
0.1  
0.1  
-
0.3  
0.5  
Propagation Delay Time  
to Low Output Level  
tPHL  
0.3  
0.5  
0.3  
Pulse Width Distortion  
PWD  
|tPHL-tPLH  
RG=10, CG=10nF  
f=10kHz, Duty Cycle=50%  
-
-
s  
|
Propagation Delay Difference  
Between any Two Parts1  
Rise Time  
PDD  
(tPHL-tPLH  
-0.35  
0.35  
)
tr  
-
-
-
-
0.1  
0.1  
0.8  
0.6  
-
-
-
-
Fall Time  
tf  
UVLO Turn-On Delay  
UVLO Turn-Off Delay  
VO>5V, IF=10mA  
VO<5V, IF=10mA  
tUVLO(on)  
tUVLO(off)  
s  
Output High Level  
Common Mode Transient Immunity  
IF=10 to 16mA, VCM=1500V,  
VCC=30V, TA=25°C  
|CMH|  
|CML|  
25  
25  
35  
35  
-
-
kV/s  
Output Low Level  
Common Mode Transient Immunity  
VF=0V, VCM=1500V, VCC=30V,  
TA=25°C  
1 The difference between tPHL and tPLH of any two IX3120 devices operating under the same conditions and temperature.  
Figure 2. Timing Waveforms  
IF  
tr  
tf  
90%  
50%  
10%  
VOUT  
tPLH  
tPHL  
R04  
www.ixysic.com  
5
IX3120  
INTEGRATED  
C
IRCUITS  
D
IVISION  
1.7 Safety and Insulation Ratings  
As per IEC 60747-5-5.  
Parameter  
Conditions  
Symbol Rating  
Units  
Minimum External Air Gap (Clearance)  
Measured from input terminals to output  
terminals, shortest distance through air.  
L(101)  
7.62  
mm  
Minimum External Tracking (Creepage)  
Measured from input terminals to output  
terminals, shortest distance path along  
body.  
L(102)  
7.50  
mm  
Distance Through Insulation  
(Internal Clearance)  
Insulation thickness between emitter and  
detector  
-
0.48  
>175  
IIIa  
mm  
Tracking Resistance  
(Comparative Tracking Index)  
DIN IEC 60112/VDE 0303 Part 1  
CTI  
V
-
Isolation Group  
DIN VDE 0110, 1/89, Table 1  
Material Group  
-
-
Installation classification  
DIN VDE 0110/1.89, Table 1  
Rated mains voltage < 300Vrms  
I-IV  
-
DIN VDE 0110/1.89, Table 1  
Rated mains voltage < 1000Vrms  
-
-
I-III  
-
-
Climatic Classification  
-
55/100/21  
Input to Output Test Voltage  
IEC EN 60747-5-5 Method b,  
VIORM x 1.875 = VPR, 100% Production Test  
with tm = 1 sec., Partial Discharge < 5pC  
3750  
3200  
VPR  
VPEAK  
IEC EN 60747-5-5 Method a,  
VIORM x 1.6 = VPR, Type and Sample Test  
with tm = 10 sec., Partial Discharge < 5pC  
TS, VIO = 500VDC  
109  
2
Insulation Resistance  
RS  
-
Pollution Degree  
DIN VDE 0109  
Transient Over-Voltage  
Recurring Voltage  
DIN EN 60747-5-5 Method B  
-
-
Highest Allowable Over-Voltage  
VIOTM  
VP  
6000  
Maximum Working Insulation Voltage  
Partial Discharge Test Voltage  
Isolation Test Voltage  
VIORM  
VPR  
VP  
VP  
2000  
3750  
3750  
VISO  
Vrms  
Input-Output Momentary Withstand  
Voltage  
RH < 50%, t = 1 min,  
TA = 25°C  
VISO  
Vrms  
3750  
1012  
0.6  
Resistance (Input-Output), Typical  
Capacitance (Input-Output), Typical  
VI-O = 500VDC  
f = 1 MHz  
RI-O  
CI-O  
pF  
6
www.ixysic.com  
R04  
IX3120  
INTEGRATED  
C
IRCUITS  
D
IVISION  
2. Performance Data  
VOL vs.Temperature  
(IF=0mA, IOUT=100mA, VCC=15V, VEE=0V)  
Output High Current vs.Temperature  
(VCC=15V, VEE=0V, IF=7mA, VOUT=VCC-4V)  
VOH vs.Temperature  
(IF=7mA, IOUT=-100mA, VCC=15V, VEE=0V)  
0.22  
0.20  
0.18  
0.16  
0.14  
0.12  
0.10  
3.0  
2.5  
2.0  
1.5  
1.0  
-0.10  
-0.12  
-0.14  
-0.16  
-0.18  
-0.20  
-40  
-20  
0
20  
40  
60  
80  
100  
-40  
0.0  
-40  
-20  
0
20  
40  
60  
80  
100  
-40  
-20  
0
20  
Temperature (ºC)  
40  
60  
80  
100  
Temperature (ºC)  
Temperature (ºC)  
Output Low Current vs.Temperature  
(VCC=15V, VEE=0V, VOUT=2.5V)  
(VF(off)=-3.0 to 0.8V)  
VOH vs. IOH  
VOL vs. IOL  
(IF=7mA, VCC=15V, VEE=0V)  
(VCC=15V, VEE=0V, VF(off)=-3.0 to 0.8V)  
2.4  
2.2  
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0
-2  
12  
10  
8
-40ºC  
25ºC  
100ºC  
100ºC  
25ºC  
-40ºC  
-4  
6
-6  
4
-8  
2
-10  
0
-40  
-20  
0
20  
40  
60  
80  
100  
0.5  
1.0  
IOH (A)  
1.5  
2.0  
2.5  
0.0  
0.5  
1.0  
IOL (A)  
1.5  
2.0  
2.5  
Temperature (ºC)  
ICC vs. VCC  
ICC vs.Temperature  
IFLH vs.Temperature  
(VCC=30V, VEE=0V, Output=OPEN)  
(IF=10mA, VEE=0V,TA=25ºC)  
(VCC=30V, VEE=0V, Output=Open)  
5.0  
4.5  
4.0  
3.5  
3.0  
2.5  
2.0  
5.0  
4.5  
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.74  
0.72  
0.70  
0.68  
0.66  
0.64  
0.62  
0.60  
ICCH  
ICCH: IF=10mA  
ICCL  
ICCL: IF=0mA  
-40  
-20  
0
20  
40  
60  
80  
100  
15  
20  
25  
30  
-20  
0
20  
40  
60  
80  
100  
Temperature (ºC)  
Supply Voltage (V)  
Temperature (ºC)  
Propagation Delay vs. VCC  
(IF=10mA, RG=10Ω, CG=10nF)  
(Duty Cycle=50%, f=10kHz,TA=25ºC)  
LED Forward Current  
vs. Forward Voltage  
(TA=25ºC)  
Propagation Delay vs. RG  
(IF=10mA, VCC=30V, VEE=0V, CG=10nF)  
(Duty Cycle=50%, f=10kHz,TA=25ºC)  
160  
140  
120  
100  
80  
100  
80  
60  
40  
20  
0
160  
140  
120  
100  
80  
tPHL  
tPHL  
tPLH  
tPLH  
60  
60  
10  
15  
20  
25  
30  
35  
40  
45  
50  
15  
20  
25  
30  
1.10 1.15 1.20 1.25 1.30 1.35 1.40 1.45 1.50  
RG (Ω)  
VCC - Supply Voltage (V)  
LED Forward Voltage (V)  
R04  
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7
IX3120  
INTEGRATED  
C
IRCUITS  
D
IVISION  
Performance Data (Cont.)  
Propagation Delay vs.Temperature  
(IF=10mA, VCC=30V, VEE=0V, RG=10Ω)  
(CG=10nF, Duty Cycle=50%, f=10kHz)  
Propagation Delay vs. CG  
(IF=10mA, VCC=30V, VEE=0V, RG=10Ω)  
(Duty Cycle=50%, f=10kHz,TA=25ºC)  
Propagation Delay vs. IF  
(VCC=30V, VEE=0V, RG=10Ω, CG=10nF)  
(Duty Cycle=50%, f=10kHz,TA=25ºC)  
160  
140  
120  
100  
80  
160  
160  
140  
120  
100  
80  
tPHL  
tPHL  
tPHL  
140  
120  
100  
tPLH  
tPLH  
tPLH  
80  
60  
60  
60  
0
20  
40  
CG (nF)  
60  
80  
100  
-40  
-20  
0
20  
40  
60  
80  
100  
6
8
10  
12  
14  
16  
Temperature (ºC)  
IF (mA)  
Transfer Characteristics  
35  
30  
25  
20  
15  
10  
5
0
0
1
2
3
4
5
IF - Forward LED Current (mA)  
8
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R04  
IX3120  
INTEGRATED  
C
IRCUITS  
D
IVISION  
3. Test Circuits  
1
8
1
2
3
4
8
0.1μF  
0.1μF  
4V  
IOL  
IF=7 to 16mA  
2
+
-
7
6
5
7
VCC=15 to 30V  
VCC=15 to 30V  
+
-
+
-
2.5V  
+
-
3
4
6
5
IOH  
IOH Test Circuit  
IOL Test Circuit  
1
2
3
4
8
1
2
3
4
8
100mA  
0.1μF  
0.1μF  
IF=7 to 16mA  
VOH  
7
7
V
CC=15 to 30V  
VCC=15 to 30V  
+
-
+
-
6
5
6
5
VOL  
100mA  
VOH Test Circuit  
VOL Test Circuit  
1
2
3
4
8
1
2
3
4
8
IF  
0.1μF  
0.1μF  
IF=10mA  
7
7
VCC  
+
-
+
-
6
5
6
5
VCC=15 to 30V  
VO>5V  
VO>5V  
I
FLH Test Circuit  
UVLO Test Circuit  
1
8
0.1μF  
IF=7 to 16mA  
+
-
2
3
4
7
VCC=15 to 30V  
VO  
+
-
500Ω  
10kHz  
50%  
RG  
10Ω  
Duty Cycle  
6
5
CG  
10nF  
tPLH, tPHL, tr, tf Test Circuit  
R04  
www.ixysic.com  
9
IX3120  
INTEGRATED  
C
IRCUITS  
D
IVISION  
4. Manufacturing Information  
4.1 Moisture Sensitivity  
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated  
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the  
latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product  
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee  
proper operation of our devices when handled according to the limitations and information in that standard as well as  
to any limitations set forth in the information or standards referenced below.  
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced  
product performance, reduction of operable life, and/or reduction of overall reliability.  
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to  
the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.  
Device  
Moisture Sensitivity Level (MSL) Rating  
IX3120G / IX3120GS / IX3120GE / IX3120GES  
MSL 1  
4.2 ESD Sensitivity  
This product is ESD Sensitive, and should be handled according to the industry standard  
JESD-625.  
4.3 Soldering Profile  
This product has a maximum body temperature and time rating as shown below. All other guidelines of  
J-STD-020 must be observed.  
Device  
Maximum Temperature x Time  
Maximum Reflow Cycles  
IX3120G / IX3120GS / IX3120GE / IX3120GES  
250°C for 30 seconds  
3
4.4 Board Wash  
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to  
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an  
optical waveguide in many of its optically isolated products, the use of a short drying bake may be necessary if a wash  
is used after solder reflow processes. Chlorine-based or Fluorine-based solvents or fluxes should not be used.  
Cleaning methods that employ ultrasonic energy should not be used.  
10  
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IX3120  
INTEGRATED  
C
IRCUITS  
D
IVISION  
4.5 Package Mechanical Dimensions  
4.5.1 IX3120G & IX3120GE 8-Pin DIP  
9.652 0.381  
PCB Hole Pattern  
7.620 0.254  
(0.300 0.010)  
(0.380 0.015)  
2.540 0.127  
(0.100 0.005)  
8-0.800 DIA.  
2.540 0.127  
(0.100 0.005)  
(8-0.031 DIA.)  
9.144 0.508  
(0.360 0.020)  
6.350 0.127  
(0.250 0.005)  
6.350 0.127  
(0.250 0.005)  
3.302 0.051  
(0.130 0.002)  
Pin 1  
0.457 0.076  
(0.018 0.003)  
7.620 0.127  
(0.300 0.005)  
7.239 TYP.  
(0.285)  
7.620 0.127  
(0.300 0.005)  
4.064 TYP  
(0.160)  
0.254 0.0127  
(0.010 0.0005)  
Dimensions  
0.813 0.102  
mm  
(0.032 0.004)  
(inches)  
4.5.2 IX3120GS & IX3120GES 8-Pin Surface Mount  
9.652 0.381  
(0.380 0.015)  
PCB Land Pattern  
0.635 0.127  
(0.025 0.005)  
2.540 0.127  
(0.100 0.005)  
3.302 0.051  
(0.130 0.002)  
2.54  
(0.10)  
9.525 0.254  
(0.375 0.010)  
6.350 0.127  
(0.250 0.005)  
8.90  
(0.3503)  
1.65  
(0.0649)  
7.620 0.254  
(0.300 0.010)  
Pin 1  
0.457 0.076  
(0.018 0.003)  
0.254 0.0127  
(0.010 0.0005)  
0.65  
(0.0255)  
4.445 0.127  
(0.175 0.005)  
Dimensions  
mm  
(inches)  
0.813 0.102  
(0.032 0.004)  
R04  
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11  
IX3120  
INTEGRATED  
C
IRCUITS  
D
IVISION  
4.5.3 IX3120GSTR & IX3120GESTR Tape & Reel  
330.2 DIA.  
(13.00 DIA.)  
W=16.00  
(0.63)  
Top Cover  
Tape Thickness  
0.102 MAX.  
(0.004 MAX.)  
Bo=10.30  
(0.406)  
Ao=10.30  
(0.406)  
P=12.00  
(0.472)  
K0=4.90  
(0.193)  
K1=4.20  
(0.165)  
User Direction of Feed  
Dimensions  
mm  
Embossed Carrier  
(inches)  
NOTES:  
1. Dimensions carry tolerances of EIA Standard 481-2  
Embossment  
2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2  
4.6 Device Branding  
IX3120G  
YYWW@KKKKK  
IX3120GE  
YYWW@KKKKK  
*
*
IX3120G  
IX3120GE  
IX3120GS  
IX3120GES  
*
YYWW@KKKKK  
YYWW = date code (year/year/week/week)  
@KKKKK = sequentially assigned kit code with assembly location identifier  
For additional information please visit our website at: www.ixysic.com  
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make  
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated  
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its  
products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.  
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other  
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe  
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.  
Specification: DS-IX3120-R04  
©Copyright 2014, IXYS Integrated Circuits Division  
All rights reserved. Printed in USA.  
9/26/2014  
12  
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