Advanced Technical Information
High Voltage
MOSFET
IXTA 1N100
IXTP 1N100
VDSS = 1000 V
ID25 = 1.5 A
RDS(on) = 11 Ω
N-Channel Enhancement Mode
Avalanche Energy Rated
Symbol
TestConditions
MaximumRatings
TO-220AB (IXTP)
VDSS
VDGR
TJ = 25°C to 150°C
1000
1000
V
V
TJ = 25°C to 150°C; RGS = 1 MΩ
VGS
Continuous
Transient
±20
±30
V
V
D (TAB)
G
VGSM
D
S
ID25
IDM
TC = 25°C
1.5
6
A
A
TC = 25°C, pulse width limited by TJM
TO-263 AA (IXTA)
IAR
1.5
A
EAR
EAS
TC = 25°C
TC = 25°C
6
mJ
mJ
200
G
S
dv/dt
IS ≤ IDM, di/dt ≤ 100 A/µs, VDD ≤ VDSS
TJ ≤ 150°C, RG = 18 Ω
,
3
V/ns
D (TAB)
PD
TC = 25°C
54
W
G = Gate,
S = Source,
D = Drain,
TAB = Drain
TJ
-55 ... +150
150
°C
°C
°C
TJM
Tstg
-55 ... +150
Md
Mountingtorque
1.13/10 Nm/lb.in.
Features
Weight
4
g
Internationalstandardpackages
High voltage, Low RDS (on) HDMOSTM
process
Maximumleadtemperatureforsoldering
1.6 mm (0.062 in.) from case for 10 s
300
°C
Rugged polysilicon gate cell structure
Fast switching times
Applications
Symbol
TestConditions
CharacteristicValues
(TJ = 25°C, unless otherwise specified)
min. typ. max.
Switch-modeandresonant-mode
powersupplies
Flyback inverters
VDSS
VGS = 0 V, ID = 250 µA
VDS = VGS, ID = 25 µA
1000
2.5
V
V
VGS(th)
4.5
DC choppers
Highfrequencymatching
IGSS
IDSS
VGS = ±20 VDC, VDS = 0
±100 nA
Advantages
VDS = VDSS
VGS = 0 V
TJ = 25°C
TJ = 125°C
25 µA
500 µA
Space savings
High power density
RDS(on)
VGS = 10 V, ID = 1.0A
Pulse test, t ≤ 300 µs, duty cycle d ≤ 2 %
11
Ω
IXYS reserves the right to change limits, test conditions, and dimensions.
© 2000 IXYS All rights reserved
98545A(11/99)
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