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IXTK250N10

型号:

IXTK250N10

描述:

高电流MegaMOSFET[ High Current MegaMOSFET ]

品牌:

IXYS[ IXYS CORPORATION ]

页数:

2 页

PDF大小:

71 K

Advance Technical Information  
IXTK 250N10  
VDSS = 100 V  
High Current  
MegaMOSTMFET  
ID25  
= 250 A  
RDS(on)  
= 5 mΩ  
N-Channel Enhancement Mode  
Symbol  
Testconditions  
Maximum ratings  
TO-264AA(IXTK)  
VDSS  
VDGR  
TJ = 25°C to 150°C  
100  
100  
V
V
TJ = 25°C to 150°C; RGS = 1.0 MΩ  
VGS  
Continuous  
Transient  
±20  
±30  
V
V
VGSM  
D (TAB)  
G
ID25  
ID(RMS)  
IDM  
TC = 25°C MOSFET chip capability  
External lead current limit  
TC = 25°C, pulse width limited by TJM  
TC = 25°C  
250  
75  
1000  
90  
A
D
S
A
A
A
IAR  
G = Gate  
D
= Drain  
S = Source  
Tab = Drain  
EAR  
EAS  
TC = 25°C  
TC = 25°C  
80  
4.0  
mJ  
J
dv/dt  
IS IDM, di/dt 100 A/µs, VDD VDSS  
TJ 150°C, RG = 2 Ω  
5
V/ns  
PD  
TJ  
TC = 25°C  
730  
W
-55 ... +150  
°C  
TJM  
Tstg  
150  
-55 ... +150  
°C  
°C  
Features  
Low RDS (on) HDMOSTM process  
Rugged polysilicon gate cell structure  
International standard package  
Fast switching times  
TL  
1.6 mm (0.063 in.) from case for 10 s  
Mountingtorque  
300  
0.7/6  
10  
°C  
Nm/lb.in.  
g
Md  
Weight  
TO-264  
Applications  
Motor controls  
DC choppers  
Symbol Test Conditions  
Characteristic Values  
Switched-mode power supplies  
DC-DC Converters  
Linear Regulators  
(TJ = 25°C unless otherwise specified)  
Min. Typ.  
Max.  
VDSS  
VGS(th)  
IGSS  
VGS = 0 V, ID = 1 mA  
100  
V
V
Advantages  
VDS = VGS, ID = 250 µA  
VGS = ±20 V DC, VDS = 0  
2.0  
4.0  
Easy to mount with one screw  
(isolated mounting screw hole)  
Space savings  
±200 nA  
High power density  
IDSS  
VDS = VDSS  
VGS = 0 V  
TJ = 25°C  
TJ = 125°C  
50 µA  
1
mA  
RDS(on)  
VGS = 10 V, ID = 90 A  
5 mΩ  
Pulse test, t 300 ms, duty cycle d 2%  
© 2003 IXYS All rights reserved  
DS99022(03/03)  
IXTK 250N10  
Symbol  
Test Conditions  
Characteristic values  
Min. Typ. Max.  
TO-264 AA Outline  
(TJ = 25°C unless otherwise specified)  
gfs  
VDS = 10 V; ID = 90 A, pulse test  
VGS = 0 V, VDS = 25 V, f = 1 MHz  
75  
110  
S
Ciss  
Coss  
Crss  
7800  
3200  
1300  
pF  
pF  
pF  
td(on)  
tr  
td(off)  
tf  
35  
40  
ns  
ns  
ns  
ns  
VGS = 10 V, VDS = 0.5 VDSS, ID = 90 A  
RG = 1.0 (External)  
120  
55  
Dim.  
Millimeter  
Inches  
Max.  
Min.  
Max.  
Min.  
.190  
A
A1  
A2  
4.82  
2.54  
2.00  
5.13  
2.89  
2.10  
.202  
.114  
.083  
Qg(on)  
Qgs  
390  
60  
nC  
nC  
nC  
.100  
.079  
VGS = 10 V, VDS = 0.5 VDSS, ID = 0.5 ID25  
b
b1  
b2  
1.12  
2.39  
2.90  
1.42  
2.69  
3.09  
.044  
.094  
.114  
.056  
.106  
.122  
Qgd  
180  
c
D
0.53  
25.91  
19.81  
0.83  
26.16  
19.96  
.021  
1.020  
.780  
.033  
1.030  
.786  
RthJC  
RthCK  
0.17 K/W  
K/W  
E
e
5.46BSC  
.215BSC  
0.15  
J
K
0.00  
0.00  
0.25  
0.25  
.000  
.000  
.010  
.010  
L
L1  
20.32  
2.29  
20.83  
2.59  
.800  
.090  
.820  
.102  
P
3.17  
3.66  
.125  
.144  
Q
Q1  
6.07  
8.38  
6.27  
8.69  
.239  
.330  
.247  
.342  
R
R1  
3.81  
1.78  
4.32  
2.29  
.150  
.070  
.170  
.090  
S
T
6.04  
1.57  
6.30  
1.83  
.238  
.062  
.248  
.072  
Source-Drain Diode  
Ratings and Characteristics  
(TJ = 25°C unless otherwise specified)  
Symbol  
IS  
Test Conditions  
Min.  
Typ.  
Max.  
VGS = 0V  
250  
A
A
V
ISM  
Repetitive; pulse width limited by TJM  
1000  
1.2  
VSD  
IF = 90 A, VGS = 0 V,  
Pulse test, t 300 µs, duty cycle d 2 %  
trr  
IF = 30A, -di/dt = 100 A/µs, VR = 50 V  
150  
2
ns  
Qrr  
µC  
IXYS reserves the right to change limits, test conditions, and dimensions.  
IXYSMOSFETs andIGBTsarecovered byoneormore  
ofthefollowingU.S.patents:  
4,835,592 4,881,106 5,017,508 5,049,961 5,187,117 5,486,715 6,306,728B1 6,259,123B1 6,306,728B1  
4,850,072 4,931,844 5,034,796 5,063,307 5,237,481 5,381,025 6,404,065B1 6,162,665 6,534,343  
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