IXTK 33N50 VDSS = 500 V
ID(cont) = 33 A
High Current
MegaMOSTMFET
RDS(on) = 0.17 Ω
N-ChannelEnhancementMode
Preliminarydata
Symbol Test conditions
Maximumratings
TO-264AA
VDSS
VDGR
TJ = 25°C to 150°C
500
500
V
TJ = 25°C to 150°C; RGS = 1.0 MΩ
V
VGS
Continuous
Transient
±20
±30
V
V
VGSM
D(TAB)
G
D
S
ID25
IDM
TC = 25°C
33
A
A
TC = 25°C, pulse width limited by TJM
132
G = Gate
S = Source
D = Drain
TAB = Drain
PD
TC = 25°C
416
W
T
-55 ... +150
150
°C
°C
°C
J
TJM
T
-55 ... +150
stg
Md
Mountingtorque
1.13/10 Nm/lb.in.
Weight
10
g
Maxleadtemperatureforsoldering
1.6 mm (0.062 in.) from case for 10 s
300
°C
Features
• Low RDS (on) HDMOSTM process
• Ruggedpolysilicongatecell
structure
• Internationalstandardpackage
• Fast switching times
Symbol
Test Conditions
Characteristic Values
(TJ = 25°C unless otherwise specified)
Min.
Typ. Max.
Applications
VDSS
VGS = 0 V, ID = 5 mA
500
2.0
V
• Motorcontrols
• DC choppers
• UninterruptablePowerSupplies
(UPS)
• Switch-modeandresonant-mode
BVDSS temperaturecoefficient
0.087
%/K
VGS(th)
VDS = VGS, ID = 250 µA
4.0
V
VGS(th) temperature coefficient
-0.25
%/K
IGSS
IDSS
VGS = ±20 V DC, VDS = 0
±100 nA
Advantages
VDS = 0.8 VDSS
VGS = 0 V
TJ = 25°C
200 µA
• Easy to mount with one screw
(isolated mounting screw hole)
• Space savings
TJ = 125°C
3
mA
RDS(on)
VGS = 10 V, ID = 0.5 ID25
0.17
Ω
• High power density
IXYS reserves the right to change limits, test conditions, and dimensions.
© 2000 IXYS All rights reserved
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