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IXTK33N50

型号:

IXTK33N50

描述:

高电流MegaMOSFET[ High Current MegaMOSFET ]

品牌:

IXYS[ IXYS CORPORATION ]

页数:

4 页

PDF大小:

88 K

IXTK 33N50 VDSS = 500 V  
ID(cont) = 33 A  
High Current  
MegaMOSTMFET  
RDS(on) = 0.17 Ω  
N-ChannelEnhancementMode  
Preliminarydata  
Symbol Test conditions  
Maximumratings  
TO-264AA  
VDSS  
VDGR  
TJ = 25°C to 150°C  
500  
500  
V
TJ = 25°C to 150°C; RGS = 1.0 MΩ  
V
VGS  
Continuous  
Transient  
±20  
±30  
V
V
VGSM  
D(TAB)  
G
D
S
ID25  
IDM  
TC = 25°C  
33  
A
A
TC = 25°C, pulse width limited by TJM  
132  
G = Gate  
S = Source  
D = Drain  
TAB = Drain  
PD  
TC = 25°C  
416  
W
T
-55 ... +150  
150  
°C  
°C  
°C  
J
TJM  
T
-55 ... +150  
stg  
Md  
Mountingtorque  
1.13/10 Nm/lb.in.  
Weight  
10  
g
Maxleadtemperatureforsoldering  
1.6 mm (0.062 in.) from case for 10 s  
300  
°C  
Features  
• Low RDS (on) HDMOSTM process  
• Ruggedpolysilicongatecell  
structure  
• Internationalstandardpackage  
• Fast switching times  
Symbol  
Test Conditions  
Characteristic Values  
(TJ = 25°C unless otherwise specified)  
Min.  
Typ. Max.  
Applications  
VDSS  
VGS = 0 V, ID = 5 mA  
500  
2.0  
V
• Motorcontrols  
• DC choppers  
• UninterruptablePowerSupplies  
(UPS)  
• Switch-modeandresonant-mode  
BVDSS temperaturecoefficient  
0.087  
%/K  
VGS(th)  
VDS = VGS, ID = 250 µA  
4.0  
V
VGS(th) temperature coefficient  
-0.25  
%/K  
IGSS  
IDSS  
VGS = ±20 V DC, VDS = 0  
±100 nA  
Advantages  
VDS = 0.8 VDSS  
VGS = 0 V  
TJ = 25°C  
200 µA  
• Easy to mount with one screw  
(isolated mounting screw hole)  
• Space savings  
TJ = 125°C  
3
mA  
RDS(on)  
VGS = 10 V, ID = 0.5 ID25  
0.17  
• High power density  
IXYS reserves the right to change limits, test conditions, and dimensions.  
© 2000 IXYS All rights reserved  
95513C (4/97)  
1 - 4  
IXTK 33N50  
Symbol  
Test Conditions  
Characteristic values  
Min. Typ. Max.  
TO-264 AA Outline  
(TJ = 25°C unless otherwise specified)  
gfs  
VDS = 10 V; ID = 0.5 ID25, pulse test  
VGS = 0 V, VDS = 25 V, f = 1 MHz  
24  
S
Ciss  
Coss  
Crss  
4900  
690  
pF  
pF  
pF  
300  
td(on)  
tr  
td(off)  
tf  
53  
30  
ns  
ns  
ns  
ns  
VGS = 10 V, VDS = 0.5 VDSS, ID = 0.5 ID25  
RG = 1 (External)  
140  
40  
Dim.  
Millimeter  
Min. Max.  
Inches  
Min.  
Max.  
Qg(on)  
Qgs  
250  
30  
nC  
nC  
nC  
A
A1  
A2  
b
b1  
b2  
4.82  
2.54  
2.00  
5.13  
2.89  
2.10  
.190  
.100  
.079  
.202  
.114  
.083  
VGS= 10 V, VDS = 0.5 VDSS, ID = 0.5 ID25  
Qgd  
115  
1.12  
2.39  
2.90  
1.42  
2.69  
3.09  
.044  
.094  
.114  
.056  
.106  
.122  
RthJC  
RthCK  
0.30 K/W  
K/W  
c
0.53  
0.83  
.021  
1.020  
.780  
.033  
1.030  
.786  
D
E
e
25.91 26.16  
19.81 19.96  
5.46 BSC  
0.15  
.215 BSC  
J
0.00  
0.00  
0.25  
0.25  
.000  
.000  
.010  
.010  
K
L
L1  
20.32 20.83  
.800  
.090  
.820  
.102  
2.29  
2.59  
P
3.17  
3.66  
.125  
.144  
Q
Q1  
6.07  
8.38  
6.27  
8.69  
.239  
.330  
.247  
.342  
R
R1  
S
T
3.81  
1.78  
6.04  
1.57  
4.32  
2.29  
6.30  
1.83  
.150  
.070  
.238  
.062  
.170  
.090  
.248  
.072  
Source-Drain Diode  
Ratings and Characteristics  
(TJ = 25°C unless otherwise specified)  
Min. Typ. Max.  
Symbol  
IS  
Test Conditions  
VGS= 0 V  
33  
132  
1.5  
A
A
V
ISM  
Repetitive; pulse width limited by TJM  
VSD  
IF = IS, VGS = 0 V,  
Pulse test, t 300 µs, duty cycle d 2 %  
trr  
IF = IS, -di/dt = 100 A/µs, VR = 100 V  
850  
ns  
IXYS MOSFETS and IGBTs are covered by one or more of the following U.S. patents:  
© 2000 IXYS All rights reserved  
2 - 4  
4,835,592  
4,850,072  
4,881,106  
4,931,844  
5,017,508  
5,034,796  
5,049,961  
5,063,307  
5,187,117  
5,237,481  
5,486,715  
5,381,025  
IXTK 33N50  
50  
40  
30  
20  
10  
0
80  
70  
60  
50  
40  
30  
20  
10  
0
TJ = 125°C  
VGS = 10 V  
TJ = 25°C  
V
GS = 10 V  
9 V  
8 V  
7 V  
9 V  
8 V  
7V  
6V  
6V  
5V  
5V  
0
4
8
12  
16  
20  
0
4
8
12  
16  
20  
VDS - Volts  
VDS - Volts  
Figure 1. Output Characteristics at 25OC  
Figure 2. Output Characteristics at 125OC  
3.0  
2.8  
2.6  
2.4  
2.2  
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
5.5  
5.0  
4.5  
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
VGS = 10 V  
V
GS = 10 V  
I
D = 33 A  
TJ = 125°C  
ID = 16.5 A  
TJ = 25°C  
0
10 20 30 40 50 60 70 80  
25  
50  
75  
100  
125  
150  
ID - Amperes  
TJ - Degrees C  
Figure 3. RDS(on) normalized to 16.5A/25OC vs. ID  
Figure 4. RDS(on) normalized to 16.5A/25OC vs. TJ  
40  
35  
30  
25  
20  
15  
10  
5
50  
40  
30  
20  
TJ = 125oC  
10  
TJ = 25oC  
0
0
-50 -25  
0
25 50 75 100 125 150  
2
3
4
5
6
7
8
TC - Degrees C  
VGS - Volts  
Figure 5. Drain Current vs. Case Temperature  
Figure 6. Admittance Curves  
© 2000 IXYS All rights reserved  
3 - 4  
IXTK 33N50  
14  
12  
10  
8
4500  
4000  
3500  
3000  
2500  
2000  
1500  
1000  
500  
F = 1MHz  
Vds=300V  
ID=33A  
Ciss  
IG=10mA  
6
Coss  
4
Crss  
2
0
0
0
50  
100  
150  
200  
250  
300  
0
5
10  
15  
20  
25  
Gate Charge - nC  
VDS - Volts  
Figure 7. Gate Charge  
Figure 8. Capacitance Curves  
100  
80  
60  
40  
20  
0
100  
1 ms  
10  
1
10 ms  
TJ = 125°C  
100 ms  
TC = 25°C  
DC  
TJ = 25°C  
0. 1  
0.4  
0.6  
0.8  
VSD - Volts  
1.0  
1.2  
500  
10  
100  
VDS - Volts  
Figure 9. Source Current vs. Source-to-  
Drain Voltage  
Figure 10. Forward Biased SOA  
1.00  
0.10  
Single Pulse  
0.01  
0.001  
0.01  
0.1  
Pulse Width - Seconds  
1
10  
Figure 11. Transient Thermal Resistance  
© 2000 IXYS All rights reserved  
4 - 4  
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