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WV3EG6437S403D4MG

型号:

WV3EG6437S403D4MG

描述:

256MB - 2x16Mx64 DDR SDRAM SO- DIMM ,无缓冲[ 256MB - 2x16Mx64 DDR SDRAM SO-DIMM, UNBUFFERED ]

品牌:

WEDC[ WHITE ELECTRONIC DESIGNS CORPORATION ]

页数:

11 页

PDF大小:

304 K

WV3EG6437S-D4  
White Electronic Designs  
ADVANCED*  
256MB – 2x16Mx64 DDR SDRAM SO-DIMM, UNBUFFERED  
FEATURES  
DESCRIPTION  
Unbuffered Double-data-rate architecture  
The WV3EG6437S is a 2x16Mx64 Double Data Rate  
SDRAM memory module based on 256Mb DDR SDRAM  
components. The module consists of eight 16Mx16 DDR  
SDRAMs in 66 pin TSOP package mounted on a 200 Pin  
FR4 substrate.  
DDR300 and DDR400  
• JEDEC design specications  
Bi-directional data strobes (DQS)  
Differential clock inputs (CK & CK#)  
Programmable Read Latency 2.5, 3  
Programmable Burst Length (2,4,8)  
Programmable Burst type (sequential & interleave)  
Edge aligned data output, center aligned data input  
Auto and self refresh, (8K/64ms Refresh)  
Serial presence detect with EEPROM  
Dual Rank  
* This product is under development, is not qualied or characterized and is subject to  
change without notice.  
Power Supply: VCC = VCC: 2.5V ± 0.2V (DDR300)  
V
CC = VCCQ: 2.6V ± 0.1V (DDR400)  
JEDEC standard 200 pin SO-DIMM package  
• Package height options:  
D4: 31.75mm (1.25") TYP  
NOTE: Consult factory for availability of:  
• RoHS compliant products  
• Vendor source control options  
• Industrial temperature option  
OPERATING FREQUENCIES  
DDR400@CL=3  
200MHz  
DDR333@CL=2.5  
166MHz  
Clock Speed  
CL-tRCD-tRP  
3-3-3  
2.5-3-3  
White Electronic Designs Corp. reserves the right to change products or specications without notice.  
June 2006  
Rev. 0  
1
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com  
WV3EG6437S-D4  
White Electronic Designs  
ADVANCED  
PIN CONFIGURATIONS  
PIN NAMES  
Pin  
1
Symbol  
VREF  
VREF  
VSS  
Pin  
51  
52  
53  
54  
55  
56  
57  
58  
59  
60  
61  
62  
63  
64  
65  
66  
67  
68  
69  
70  
71  
72  
73  
74  
75  
76  
77  
78  
79  
80  
81  
82  
83  
84  
85  
86  
87  
88  
89  
90  
91  
92  
93  
94  
95  
96  
97  
98  
99  
100  
Symbol  
Pin  
101  
102  
103  
104  
105  
106  
107  
108  
109  
110  
111  
112  
113  
114  
115  
116  
117  
118  
119  
120  
121  
122  
123  
124  
125  
126  
127  
128  
129  
130  
131  
132  
133  
134  
135  
136  
137  
138  
139  
140  
141  
142  
143  
144  
145  
146  
147  
148  
149  
150  
Symbol  
Pin  
151  
152  
153  
154  
155  
156  
157  
158  
159  
160  
161  
162  
163  
164  
165  
166  
167  
168  
169  
170  
171  
172  
173  
174  
175  
176  
177  
178  
179  
180  
181  
182  
183  
184  
185  
186  
187  
188  
189  
190  
191  
192  
193  
194  
195  
196  
197  
198  
199  
200  
Symbol  
DQ42  
DQ46  
DQ43  
DQ47  
VCC  
A0 – A12  
BA0-BA1  
DQ0-DQ63  
DQS0-DQS7  
CK0, CK1  
CK0#, CK1#  
CKE0, CKE1  
CS0#, CS1#  
RAS#  
Address input  
VSS  
A9  
Bank Select Address  
Data Input/Output  
Data Strobe Input/Output  
2
VSS  
A8  
3
DQ19  
DQ23  
DQ24  
DQ28  
VCC  
VSS  
4
VSS  
VSS  
5
DQ0  
DQ4  
DQ1  
DQ5  
VCC  
A7  
Clock Inputs  
6
A6  
VCC  
Clock Enable Inputs  
Chip select Inputs  
Row Address Strobe  
Column Address Strobe  
Write Enable  
7
A5  
VCC  
8
VCC  
A4  
CK1#  
VSS  
9
DQ25  
DQ29  
DQS3  
DM3  
VSS  
A3  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
30  
31  
32  
33  
34  
35  
36  
37  
38  
39  
40  
41  
42  
43  
44  
45  
46  
47  
48  
49  
50  
VCC  
A2  
CK1  
CAS#  
DQS0  
DM0  
DQ2  
DQ6  
VSS  
A1  
VSS  
WE#  
A0  
VSS  
DM0-DM7  
VCC  
Data Mask  
VCC  
DQ48  
DQ52  
DQ49  
DQ53  
VCC  
Power Supply  
VSS  
VCC  
VSS  
Ground  
DQ26  
DQ30  
DQ27  
DQ31  
VCC  
A10  
VSS  
BA1  
BA0  
RAS#  
WE#  
CAS#  
CS0#  
CS1#  
NC  
VREF  
Reference Power Supply  
Serial EEPROM Power Supply  
Serial data I/O  
DQ3  
DQ7  
DQ8  
DQ12  
VCC  
VCCSPD  
VCC  
SDA  
DQS6  
DM6  
DQ50  
DQ54  
VSS  
SCL  
SPD clock input  
SPD address  
VCC  
SA0-SA2  
NC  
NC  
No Connect  
VCC  
NC  
DQ9  
DQ13  
DQS1  
DM1  
VSS  
NC  
NC  
NC  
VSS  
VSS  
VSS  
DQ51  
DQ55  
DQ56  
DQ60  
VCC  
VSS  
VSS  
NC  
DQ32  
DQ36  
DQ33  
DQ37  
VCC  
VSS  
NC  
DQ10  
DQ14  
DQ11  
DQ15  
VCC  
NC  
NC  
VCC  
VCC  
DQ57  
DQ61  
DQS7  
DM7  
VSS  
VCC  
VCC  
NC  
DQS4  
DM4  
DQ34  
DQ38  
VSS  
VCC  
NC  
CK0  
VCC  
NC  
NC  
VSS  
CK0#  
VSS  
VSS  
DQ58  
DQ62  
DQ59  
DQ63  
VCC  
VSS  
VSS  
VSS  
NC  
DQ35  
DQ39  
DQ40  
DQ44  
VCC  
VSS  
VSS  
DQ16  
DQ20  
DQ17  
DQ21  
VCC  
NC  
VCC  
VCC  
VCC  
SDA  
SA0  
VCC  
VCC  
CKE1  
CKE0  
NC  
DQ41  
DQ45  
DQS5  
DM5  
VSS  
SCL  
VCC  
SA1  
DQS2  
DM2  
DQ18  
DQ22  
VCCSPD  
SA2  
NC  
A12  
A11  
NC  
VSS  
NC  
White Electronic Designs Corp. reserves the right to change products or specications without notice.  
June 2006  
Rev. 0  
2
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com  
WV3EG6437S-D4  
White Electronic Designs  
ADVANCED  
FUNCTIONAL BLOCK DIAGRAM  
CS1#  
CS0#  
LDQS  
LDM  
DQ0  
LDQS  
LDM  
DQ0  
LDQS  
LDM  
DQ0  
LDQS  
CS#  
DQ0  
DQ1  
DQS0  
DM0  
DQS4  
DM4  
CS#  
CS#  
CS#  
LDM  
DQ0  
DQ32  
DQ1  
DQ2  
DQ1  
DQ2  
DQ1  
DQ2  
DQ1  
DQ2  
DQ3  
DQ4  
DQ5  
DQ6  
DQ7  
DQ33  
DQ34  
DQ35  
DQ36  
DQ37  
DQ38  
DQ39  
DQ2  
DQ3  
DQ4  
DQ5  
DQ6  
DQ7  
UDQS  
UDQM  
DQ8  
DQ9  
DQ10  
DQ11  
DQ3  
DQ4  
DQ5  
DQ6  
DQ7  
UDQS  
UDQM  
DQ8  
DQ9  
DQ10  
DQ11  
DQ3  
DQ4  
DQ5  
DQ6  
DQ7  
UDQS  
UDQM  
DQ8  
DQ9  
DQ10  
DQ11  
DQ3  
DQ4  
DQ5  
DQ6  
DQ7  
UDQS  
UDQM  
DQ8  
DQ9  
DQ10  
DQ11  
DQS1  
DM1  
DQS5  
DM5  
DQ8  
DQ9  
DQ40  
DQ41  
DQ42  
DQ43  
DQ44  
DQ45  
DQ46  
DQ47  
DQ10  
DQ11  
DQ12  
DQ13  
DQ14  
DQ15  
DQ12  
DQ13  
DQ14  
DQ15  
DQ12  
DQ13  
DQ14  
DQ15  
DQ12  
DQ13  
DQ14  
DQ15  
DQ12  
DQ13  
DQ14  
DQ15  
LDQS  
LDM  
DQ0  
LDQS  
LDM  
DQ0  
LDQS  
LDM  
DQ0  
LDQS  
CS#  
DQ0  
DQ1  
DQS2  
DM2  
DQS6  
DM6  
CS#  
CS#  
CS#  
LDM  
DQ16  
DQ17  
DQ18  
DQ19  
DQ20  
DQ21  
DQ22  
DQ23  
DQ48  
DQ1  
DQ2  
DQ1  
DQ2  
DQ1  
DQ2  
DQ49  
DQ50  
DQ51  
DQ52  
DQ53  
DQ54  
DQ55  
DQ2  
DQ3  
DQ4  
DQ5  
DQ6  
DQ7  
UDQS  
UDQM  
DQ8  
DQ9  
DQ10  
DQ11  
DQ3  
DQ4  
DQ5  
DQ6  
DQ7  
UDQS  
UDQM  
DQ8  
DQ9  
DQ10  
DQ11  
DQ3  
DQ4  
DQ5  
DQ6  
DQ7  
UDQS  
UDQM  
DQ8  
DQ9  
DQ10  
DQ11  
DQ3  
DQ4  
DQ5  
DQ6  
DQ7  
UDQS  
UDQM  
DQ8  
DQ9  
DQ10  
DQ11  
DQS3  
DQS7  
DM3  
DM7  
DQ24  
DQ56  
DQ57  
DQ58  
DQ59  
DQ60  
DQ61  
DQ62  
DQ63  
DQ25  
DQ26  
DQ27  
DQ28  
DQ29  
DQ30  
DQ31  
DQ12  
DQ13  
DQ14  
DQ15  
DQ12  
DQ13  
DQ14  
DQ15  
DQ12  
DQ13  
DQ14  
DQ15  
DQ12  
DQ13  
DQ14  
DQ15  
DDR SDRAMs  
DDR SDRAMs  
BA0, BA1: DDR SDRAMs  
A0-A12: DDR SDRAMs  
RAS#: DDR SDRAMs  
CAS#: DDR SDRAMs  
CKE0: DDR SDRAMs  
WE#: DDR SDRAMs  
CKE1: DDR SDRAMs  
BA0, BA1  
A0-A12  
Clock Wiring  
R=120  
Clock  
Input  
RAS#  
CAS#  
CKE0  
WE#  
CKE1  
CK0/1  
CK0/1#  
CK0/CK0#  
CK1/CK1#  
4 SDRAMs  
4 SDRAMs  
DDR SDRAMs  
DDR SDRAMs  
V
CCSPD  
CC  
REF  
SS  
SPD  
SERIAL PD  
SCL  
V
DDR SDRAMs  
DDR SDRAMs  
DDR SDRAMs  
SDA  
V
WP  
A0 A1 A2  
V
SA0 SA1 SA2  
Note: All resistor values are 22 ohms ±5% unless otherwise specied.  
White Electronic Designs Corp. reserves the right to change products or specications without notice.  
June 2006  
Rev. 0  
3
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com  
WV3EG6437S-D4  
White Electronic Designs  
ADVANCED  
ABSOLUTE MAXIMUM RATINGS  
Parameter  
Symbol  
Value  
-0.5 to 3.6  
-0.5 to 3.6  
-55 to +150  
0 - 70  
Units  
V
Voltage on any pin relative to VSS  
Voltage on VCC supply relative to VSS  
Storage Temperature  
VIN, VOUT  
VCC, VCCQ  
TSTG  
V
°C  
°C  
W
Operating Temperature  
TA  
Power Dissipation  
PD  
8
Short Circuit Current  
IOS  
50  
mA  
Note:  
Permanent device damage may occur if "ABSOLUTE MAXIMUM RATINGS" are exceeded.  
Functional operation should be restricted to recommended operating condition.  
Exposure to higher than recommended voltage for extended periods of time could affect device reliability.  
DC CHARACTERISTICS  
0°C TA 70°C  
Parameter  
Symbol  
VCC  
Min  
2.3  
2.3  
2.5  
2.5  
Max  
Unit  
V
Supply voltage DDR333  
2.7  
I/O Supply voltage DDR333  
Supply Voltage DDR400  
VCCQ  
VCC  
2.7  
V
2.7  
2.7  
V
I/O Supply Voltage DDR400  
I/O Reference voltage  
VCCQ  
VREF  
V
0.49 + VCC  
0.51 + VCC  
VREF + 0.04  
VCC + 0.30  
VREF - 0.15  
VCC + 0.30  
VCC + 0.60  
VCC + 0.60  
16  
V
I/O Termination voltage  
VTT  
VREF - 0.04  
V
Input logic high voltage  
VIH(DC)  
VIL(DC)  
VIn(DC)  
VID(DC)  
VIX(DC)  
VREF + 0.15  
V
Input logic low voltage  
-0.3  
-0.3  
0.36  
0.3  
-16  
-8  
V
Input voltage level, CK and CK#  
Input differential voltage, CK and CK#  
Input crossing point voltage, CK and CK#  
V
V
V
Addr, CAS#, RAS#, WE#  
CS#, CKE  
µA  
µA  
µA  
µA  
µA  
8
Input leakage current  
II  
CK, CK#  
-8  
8
DM  
-4  
4
Output leackage current  
DQ, DQS  
IOZ  
IOH  
-10  
10  
Output high surrent (normal strength)  
VOUT = VTT + 0.84V  
-16.8  
16.8  
-9  
-
-
-
-
mA  
mA  
mA  
mA  
Output high surrent (normal strength)  
IOL  
IOH  
IOL  
V
OUT = VTT - 0.84V  
Output high surrent (half strength)  
OUT = VTT + 0.45V  
V
Output high surrent (half strength)  
VOUT = VTT - 0.45V  
9
Notes:  
1.  
V
REF is expected to equal 0.5*VCCQ of the transmitting device and to track variations in the DC level of the same. Peak-to-peak noise on VREF may not exceed +/-2 percent of the  
DC value.  
2.  
3.  
4.  
V
V
V
TT in sot applied directly to the device. VTT is a system supply for signal termination resistors, is expected to be set equal to VREF and must track variations in the DC level of VREF  
ID is the magnitude of the difference between the input level on CK and the input level of CK#.  
CCQ of all IC's are ited to VCC  
.
.
White Electronic Designs Corp. reserves the right to change products or specications without notice.  
June 2006  
Rev. 0  
4
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com  
WV3EG6437S-D4  
White Electronic Designs  
ADVANCED  
AC OPERATING CONDITIONS  
All voltages referenced to VSS  
Parameter  
Symbol  
VIH(AC)  
VIL(AC)  
VID(AC)  
VIX(AC)  
Min.  
Max.  
Units  
Notes  
Input High (Logic1) Voltage  
Input Low (Logic0) Voltage  
Input Differential Voltage, CK and CK# input  
Input Crossing Point Voltage, CK and CK# input  
Notes:  
VREF + 0.31  
V
V
V
V
1
1
VREF - 0.31  
VCCQ + 0.6  
0.7  
0.5*VCC - 0.2  
0.5*VCC + 0.2  
1. VIH overshoot: VIN = VCC + 1.5V for a pulse width 3ns and the pulse can not be greater than 1/3 of the cycle rate.  
VIL undershoot: VIL = -1.5V for a pulse width 3ns and the pulse can not be greater than 1/3 of the cycle rate.  
INPUT/OUTPUT CAPACITANCE  
TA = 25°C, f = 100MHz  
Parameter  
Symbol  
CIN1  
Min  
20  
12  
12  
12  
12  
12  
Max  
28  
Units  
Input Capacitance (A0~A12, BA0~BA1, RAS#, CAS#, WE#)  
Input Capacitance (CKE0, CKE1)  
pF  
pF  
pF  
pF  
pF  
pF  
CIN2  
16  
Input Capacitance (CS0#, CS1#)  
CIN3  
16  
Input Capacitance CK, CK0#, CK1, CK1#)  
Input Capacitance (DM0 ~ DM7), (DQS0 ~ DQS7)  
Input Capacitance (DQ0 ~ DQ63)  
CIN4  
16  
CIN5  
14  
COUT1  
14  
White Electronic Designs Corp. reserves the right to change products or specications without notice.  
June 2006  
Rev. 0  
5
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com  
WV3EG6437S-D4  
White Electronic Designs  
ADVANCED  
ICC SPECIFICATIONS AND TEST CONDITIONS  
DDR403  
@CL=3  
Max  
DDR333  
@CL=2.5  
Max  
Parameter  
Symbol Conditions  
Units  
One device bank; Active - Precharge; tRC=tRC(MIN); tCK=tCK(MIN); DQ,DM  
Operating Current  
Operating Current  
ICC0* and DQS inputs changing once per clock cycle; Address and control inputs  
changing once every two cycles.  
456  
372  
mA  
One device bank; Active-Read-Precharge; Burst = 2; tRC=tRC(MIN);tCK=tCK(MIN)  
; Iout = 0mA; Address and control inputs changing once per clock cycle.  
ICC1*  
616  
32  
512  
24  
mA  
mA  
mA  
mA  
Precharge Power-  
Down Standby Current  
ICC2P** All device banks idle; Power- down mode; tCK=tCK(MIN); CKE=(low)  
CS# = High; All device banks idle; tCK=tCK(MIN); CKE = high; Address and other  
ICC2F**  
Idle Standby Current  
240  
400  
240  
280  
control inputs changing once per clock cycle. Vin = Vref for DQ, DQS and DM.  
Active Power-Down  
Standby Current  
ICC3P** One device bank active; Power-down mode; tCK(MIN); CKE=(low)  
CS# = High; CKE = High; One device bank; Active-Precharge; tRC=tRAS(MAX);  
Active Standby Current ICC3N** tCK=tCK(MIN); DQ, DM and DQS inputs changing twice per clock cycle; Address  
and other control inputs changing once per clock cycle.  
520  
736  
736  
440  
652  
652  
mA  
mA  
mA  
Burst = 2; Reads; Continous burst; One device bank active;Address and control  
inputs changing once per clock cycle; tCK=tCK(MIN); Iout = 0mA.  
Operating Current  
ICC4R*  
Burst = 2; Writes; Continous burst; One device bank active; Address and  
Operating Current  
ICC4W** control inputs changing once per clock cycle; tCK=tCK(MIN); DQ,DM and DQS  
inputs changing twice per clock cycle.  
Auto Refresh Current  
Self Refresh Current  
ICC5** tRC=tRC(MIN)  
1,600  
24  
1,440  
24  
mA  
mA  
ICC6** CKE 0.2V  
Four bank interleaving Reads (BL=4) with auto precharge with tRC=tRC (MIN);  
ICC7* tCK=tCK(MIN); Address and control inputs change only during Active Read or  
Write commands.  
Operating Current  
1,416  
1,332  
mA  
Note: ICC specication is based on SAMSUNG components. Other DRAM Manufacturers specication may be different.  
* Value calculated as one module rank in this operation condition, and all other module ranks in ICC2P (CKE LOW) mode.  
** Value calculated reects all module ranks in the operating condition.  
White Electronic Designs Corp. reserves the right to change products or specications without notice.  
June 2006  
Rev. 0  
6
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com  
WV3EG6437S-D4  
White Electronic Designs  
ADVANCED  
DDR SDRAM COMPONENT ELECTRICAL CHARACTERISTICS AND  
RECOMMENDED AC OPERATING CONDITIONS  
AC CHARACTERISTICS  
403  
335  
UNITS  
PARAMETER  
SYMBOL  
tAC  
MIN  
-0.65  
0.45  
0.45  
5
MAX  
+0.65  
0.55  
0.55  
10  
MIN  
-0.7  
0.45  
0.45  
MAX  
+0.7  
0.55  
0.55  
Access window of DQs from CK/CK#  
CK high-level width  
ns  
tCK  
tCK  
ns  
ns  
ns  
ns  
ns  
ns  
tCK  
tCK  
ns  
tCK  
tCK  
tCK  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
tCK  
tCK  
ns  
tCK  
ns  
tCH  
CK low-level width  
tCL  
CL = 3  
tCK (3)  
tCK (2.5)  
tDH  
Clock cycle time  
CL = 2.5  
6
12  
DQ and DM input hold time relative to DQS  
DQ and DM input setup time relative to DQS  
DQ and DM input pulse width (for each input)  
Access window of DQS from CK/CK#  
DQS input high pulse width  
0.40  
0.40  
1.75  
-0.55  
0.35  
0.35  
0.40  
0.40  
1.75  
-0.60  
0.35  
0.35  
tDS  
tDIPW  
tDQSCK  
tDQSH  
tDQSL  
tDQSQ  
tDQSS  
tDSS  
tDSH  
tHP  
+0.65  
+0.60  
DQS input low pulse width  
DQS-DQ skew, DQS to last DQ valid, per group, per access  
Write command to rst DQS latching transition  
DQS falling edge to CK rising - setup time  
DQS falling edge from CK rising - hold time  
Half clock period  
0.40  
1.28  
0.45  
1.25  
0.72  
0.20  
0.20  
0.75  
0.20  
0.20  
tCH(MIN) or tCL(MIN)  
tCH(MIN) or (MIN)  
Data-out high-impedance window from CK/CK#  
Data-out low-impedance window from CK/CK#  
Address and control input hold time (1 V/ns)  
Address and control input setup time (1 V/ns)  
Address and control input hold time (0.5 V/ns)  
Address and control input setup time (0.5 V/ns)  
Address and Control input pulse width (for each input)  
LOAD MODE REGISTER command cycle time  
DQ-DQS hold, DQS to rst DQ to go non-valid, per access  
Data hold skew factor  
tHZ  
+0.65  
+0.70  
tLZ  
-0.65  
0.60  
-0.70  
tIHF  
0.75  
0.75  
tISF  
0.60  
tIHS  
0.70  
0.80  
tISS  
0.70  
0.75  
tIPW  
2.20  
2.20  
tMRD  
tQH  
10  
10  
tHP - tQHS  
tHP - tQHS  
tQHS  
tRAS  
tRAP  
tRC  
0.50  
0.55  
70K  
ACTIVE to PRECHARGE command  
ACTIVE to READ with Auto precharge command  
ACTIVE to ACTIVE/AUTO REFRESH command period  
AUTO REFRESH command period  
40  
15  
70K  
42  
18  
55  
60  
tRFC  
tRCD  
tRP  
70  
72  
ACTIVE to READ or WRITE delay  
15  
18  
PRECHARGE command period  
15  
18  
DQS read preamble  
tRPRE  
tRPST  
tRRD  
tWPRE  
tWPRES  
0.90  
0.40  
10  
1.10  
0.60  
0.9  
0.4  
12  
1.10  
0.60  
DQS read postamble  
ACTIVE bank a to ACTIVE bank b command  
DQS write preamble  
0.25  
0
0.25  
0
DQS write preamble setup time  
Note: AC specication is based on SAMSUNG components. Other DRAM manufactures specication may be different.  
Continued on next page  
White Electronic Designs Corp. reserves the right to change products or specications without notice.  
June 2006  
Rev. 0  
7
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com  
WV3EG6437S-D4  
White Electronic Designs  
ADVANCED  
DDR SDRAM COMPONENT ELECTRICAL CHARACTERISTICS AND  
RECOMMENDED AC OPERATING CONDITIONS (Continued)  
AC CHARACTERISTICS  
403  
355  
PARAMETER  
SYMBOL  
tWPST  
MIN  
0.40  
15  
MAX  
MIN  
0.40  
15  
MAX  
UNITS  
tCK  
DQS write postamble  
Write recovery time  
0.60  
0.60  
tWR  
ns  
Internal WRITE to READ command delay  
Average periodic refresh interval  
tWTR  
tREFI  
tXSNR  
tXSRD  
2
1
tCK  
µs  
ns  
7.80  
7.80  
Exit SELF REFRESH to non-READ command  
Exit SELF REFRESH to READ command  
75  
200  
75  
200  
tCK  
tWR/tCK  
+tRP/tCK  
tWR/tCK  
+tRP/tCK  
Auto precharge write recovery + precharge time  
tRAL  
tCK  
Note: AC specication is based on SAMSUNG components. Other DRAM manufactures specication may be different.  
White Electronic Designs Corp. reserves the right to change products or specications without notice.  
June 2006  
Rev. 0  
8
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com  
WV3EG6437S-D4  
White Electronic Designs  
ADVANCED  
ORDERING INFORMATION FOR D4  
Part Number  
Speed/Data Rate Frequency  
Height*  
WV3EG6437S403D4xxG  
WV3EG6437S335D4xxG  
200MHz/400Mbps, CL=3  
166MHz/333Mbps, CL=2.5  
31.75 (1.25") TYP  
31.75 (1.25") TYP  
NOTES:  
• Consult Factory for availability of RoHS compliant products. (G = RoHS Compliant)  
• Vendor specic part numbers are used to provide memory components source control. The place holder for this is shown as lower case “x” in the part numbers above and is to  
be replaced with the respective vendors code. Consult factory for qualied sourcing options. (M = Micron, S = Samsung & consult factory for others)  
• Consult factory for availability of industrial temperature (-40°C to 85°C) option  
PACKAGE DIMENSIONS FOR D4  
FRONT VIEW  
67.75 (2.667)  
67.45 (2.656)  
3.81 (0.150)  
MAX  
4.10(0.161)  
3.90(0.154)  
(2X)  
31.90 (1.256)  
31.60 (1.244)  
1.80 (0.071)  
(2X)  
20.00 (0.787)  
TYP  
6.00 (0.240)  
2.55 (0.100)  
1.80 (0.071)  
1.10 (0.043)  
0.90 (0.035)  
2.15 (0.085)  
1.00 (0.039)  
0.45 (0.018)  
TYP  
0.60 (0.024)  
TYP  
PIN 199  
TYP  
PIN 1  
2.504 (63.60)  
TYP  
BACK VIEW  
4.06 (0.160)  
PIN 2  
1.50 (0.059)  
4.2 (0.165)  
TYP  
PIN 200  
47.40 (1.866)  
TYP  
11.40 (0.449)  
TYP  
* ALL DIMENSIONS ARE IN MILLIMETERS AND (INCHES)  
White Electronic Designs Corp. reserves the right to change products or specications without notice.  
June 2006  
Rev. 0  
9
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com  
WV3EG6437S-D4  
White Electronic Designs  
ADVANCED  
PART NUMBERING GUIDE  
WV 3 E G 64 37 S xxx D4 x x G  
WEDC  
MEMORY  
DDR  
GOLD  
BUS WIDTH  
2x16M  
2.5V  
SPEED (Mb/s)  
PACKAGE 200 PIN  
INDUSTRIAL TEMP OPTION  
(For commercial leave "blank"  
for industrial add "I"  
COMPONENT VENDOR NAME  
(M = Micron)  
(S = Samsung)  
(N = Nanya)  
G = RoHS COMPLIANT  
White Electronic Designs Corp. reserves the right to change products or specications without notice.  
June 2006  
Rev. 0  
10  
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com  
WV3EG6437S-D4  
White Electronic Designs  
ADVANCED  
Document Title  
256MB – 32Mx64, DDR SDRAM UNBUFFERED  
DRAM DIE OPTIONS:  
SAMSUNG: H-Die (K4H561638H-UCB3) RoHS  
MICRON: T26A: F-Die  
Revision History  
Rev #  
History  
Release Date Status  
Rev 0  
Created  
June 2006  
Advanced  
White Electronic Designs Corp. reserves the right to change products or specications without notice.  
June 2006  
Rev. 0  
11  
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com  
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