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IXTK200N10P

型号:

IXTK200N10P

描述:

PolarHTTM功率MOSFET[ PolarHTTM Power MOSFET ]

品牌:

IXYS[ IXYS CORPORATION ]

页数:

5 页

PDF大小:

565 K

Advanced Technical Information  
PolarHTTM  
Power MOSFET  
VDSS = 100 V  
ID25 = 200 A  
RDS(on) = 7.5mΩ  
IXTK 200N10P  
N-Channel Enhancement Mode  
TO-264(SP) (IXTK)  
Symbol  
TestConditions  
Maximum Ratings  
VDSS  
VDGR  
T
= 25°C to 175°C  
100  
100  
V
V
TJJ = 25°C to 175°C; RGS = 1 MΩ  
VGSM  
20  
V
ID25  
TC = 25°C  
200  
75  
A
A
A
(TAB)  
G
D
S
ID(RMS)  
IDM  
External lead current limit  
TC = 25°C, pulse width limited by TJM  
400  
IAR  
TC = 25°C  
60  
A
G = Gate  
S = Source  
D = Drain  
TAB = Drain  
EAR  
EAS  
TC = 25°C  
TC = 25°C  
100  
4
mJ  
J
Features  
dv/dt  
PD  
IS IDM, di/dt 100 A/µs, VDD VDSS  
TJ 150°C, RG = 4 Ω  
,
10  
V/ns  
z
International standard packages  
Unclamped Inductive Switching (UIS)  
rated  
z
z
TC = 25°C  
800  
W
TJ  
TJM  
Tstg  
-55 ... +175  
175  
-55 ... +150  
°C  
°C  
°C  
Low package inductance  
- easy to drive and to protect  
TL  
1.6 mm (0.062 in.) from case for 10 s  
Mounting torque  
300  
°C  
Advantages  
Md  
1.13/10 Nm/lb.in.  
g
z
Easy to mount  
Space savings  
Weight  
10  
z
z
High power density  
Symbol  
TestConditions  
Characteristic Values  
(TJ = 25°C, unless otherwise specified)  
Min. Typ.  
Max.  
VDSS  
VGS(th)  
IGSS  
VGS = 0 V, ID = 250 µA  
VDS = VGS, ID = 500µA  
VGS = 20 VDC, VDS = 0  
100  
2.5  
V
V
5.0  
200 nA  
IDSS  
VDS = VDSS  
VGS = 0 V  
25 µA  
250 µA  
TJ = 150°C  
RDS(on)  
VGS = 10 V, ID = 0.5 ID25  
VGS = 15 V, ID = 400A  
Pulse test, t 300 µs, duty cycle d 2 %  
7.5 mΩ  
mΩ  
PolarHTTM DMOStransistors  
utilize proprietary designs and  
process. US patent is pending.  
5.5  
DS99186(05/04)  
© 2004 IXYS All rights reserved  
IXTK 200N10P  
Symbol  
gfs  
TestConditions  
Characteristic Values  
TO-264(SP) Outline (IXTK)  
(TJ = 25°C, unless otherwise specified)  
Min.  
Typ.  
Max.  
VDS= 10 V; ID = 0.5 ID25, pulse test  
VGS = 0 V, VDS = 25 V, f = 1 MHz  
60  
97  
S
Ciss  
Coss  
Crss  
7600  
2900  
860  
pF  
pF  
pF  
td(on)  
tr  
td(off)  
tf  
30  
35  
ns  
ns  
ns  
ns  
VGS = 10 V, VDS = 0.5 VDSS, ID = 60 A  
RG = 3.3 (External)  
150  
90  
Qg(on)  
Qgs  
240  
50  
nC  
nC  
nC  
VGS= 10 V, VDS = 0.5 VDSS, ID = 0.5 ID25  
Qgd  
135  
RthJC  
RthCK  
0.18 K/W  
K/W  
0.15  
Source-Drain Diode  
Characteristic Values  
(TJ = 25°C, unless otherwise specified)  
Symbol  
IS  
TestConditions  
Min.  
typ.  
Max.  
VGS = 0 V  
200  
A
A
V
ISM  
Repetitive  
400  
1.5  
VSD  
IF = IS, VGS = 0 V,  
Pulse test, t 300 µs, duty cycle d 2 %  
trr  
IF = 25 A  
-di/dt = 100 A/µs  
VR = 100 V  
120  
3.3  
ns  
QRM  
µC  
IXYS reserves the right to change limits, test conditions, and dimensions.  
IXYSMOSFETs andIGBTsarecovered by  
oneormoreofthefollowingU.S.patents:  
4,835,592  
4,850,072  
4,881,106  
4,931,844  
5,017,508  
5,034,796  
5,049,961  
5,063,307  
5,187,117  
5,237,481  
5,381,025  
5,486,715  
6,162,665  
6,404,065B1  
6,534,343  
6,583,505  
6,683,344  
6,710,405B2  
6,710,463  
6,727,585  
6,259,123B1  
6,306,728 B1  
IXTK 200N10P  
Fig. 1. Output Characteristics  
@ 25  
Fig. 2. Extended Output Characteristics  
º
C
@ 25 C  
º
350  
300  
250  
200  
150  
100  
50  
200  
175  
150  
125  
100  
75  
VGS = 10V  
9V  
V
= 10V  
GS  
9V  
8V  
8V  
7V  
7V  
6V  
50  
25  
6V  
0
0
0
0
0
0.2  
0.4  
0.6  
0.8  
1
1.2  
1.4  
1.6  
3.5  
350  
0
0.5  
1
1.5  
2
2.5  
3
3.5  
4
4.5  
5
VD S - Volts  
VD S - Volts  
Fig. 3. Output Characteristics  
Fig. 4. RDS(on Normalized to 0.5 ID25  
Value vs. Junction Temperature  
)
@ 150ºC  
200  
175  
150  
125  
100  
75  
2.4  
2.2  
2
VGS = 10V  
9V  
VGS = 10V  
8V  
1.8  
1.6  
1.4  
1.2  
1
ID = 200A  
7V  
6V  
ID = 100A  
50  
25  
0.8  
0.6  
5V  
0
0.5  
1
1.5  
2
2.5  
3
-50 -25  
0
25  
50  
75 100 125 150 175  
VD S - Volts  
TJ - Degrees Centigrade  
Fig. 5. RDS(on) Normalized to 0.5 ID25  
Value vs. Drain Current  
Fig. 6. Drain Current vs. Case  
Temperature  
80  
70  
60  
50  
40  
30  
20  
10  
0
2.4  
2.2  
2
º
TJ = 175 C  
1.8  
1.6  
1.4  
1.2  
1
VGS = 10V  
V
= 15V  
GS  
0.8  
0.6  
º
TJ = 25 C  
-50 -25  
0
25  
50  
75 100 125 150 175  
50  
100  
150  
200  
250 300  
I D - Amperes  
TC - Degrees Centigrade  
© 2004 IXYS All rights reserved  
IXTK 200N10P  
Fig. 8. Transconductance  
Fig. 7. Input Admittance  
300  
250  
200  
150  
100  
50  
140  
120  
100  
80  
º
TJ = -40 C  
25ºC  
150ºC  
60  
º
TJ = -40 C  
40  
25ºC  
150ºC  
20  
0
0
4
4.5  
5
5.5  
6
6.5  
7
7.5  
8
8.5  
9
0
50  
100  
150  
200  
250  
300  
350  
VG S - Volts  
I D - Amperes  
Fig. 9. Source Current vs.  
Source-To-Drain Voltage  
Fig. 10. Gate Charge  
10  
9
8
7
6
5
4
3
2
1
0
350  
300  
250  
200  
150  
100  
50  
VDS = 50V  
D = 100A  
G = 10mA  
I
I
º
TJ = 150 C  
º
TJ = 25 C  
0
0.4  
0.6  
0.8  
1
1.2  
1.4  
1.6  
0
25 50 75 100 125 150 175 200 225 250  
VS D - Volts  
Q G - nanoCoulombs  
Fig. 12. Forward-Bias  
Safe Operating Area  
Fig. 11. Capacitance  
100,000  
10,000  
1,000  
100  
1000  
100  
10  
º
TJ = 175 C  
f = 1MHz  
RDS(on) Limit  
º
C = 25 C  
T
C
C
iss  
100µs  
oss  
1ms  
C
rss  
10ms  
DC  
0
5
10  
15  
20  
25  
30  
35  
40  
1
10  
100  
1000  
VDS - Volts  
VD S - Volts  
IXYS reserves the right to change limits, test conditions, and dimensions.  
IXTK 200N10P  
Fig . 1 3 . M a x im u m T r a n s ie n t T h e r m a l Re s is ta n c e  
1 . 0 0  
0 . 1 0  
0 . 0 1  
0 . 0 0  
0 . 1  
1
1 0  
1 0 0  
1 0 0 0  
Pu ls e W id th - millis e c o n d s  
© 2004 IXYS All rights reserved  
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