TDA2009A
Figure 17 :
P.C. BOARD and Components Layout of the Circuit of Figure 16 (1:1 scale)
APPLICATION SUGGESTION
The recommended values of the components are those shown on application circuit of fig. 1. Different
values can be used ; the following table can help the designer.
Recommended
Component
Purpose
Larger than
Increase of Gain
Smaller than
Value
1.2kΩ
18kΩ
1Ω
R1, R3
R2, R4
R5, R6
Close Loop Gain
Setting (1)
Decrease of Gain
Increase of Gain
Decrease of Gain
Frequency Stability
Danger of Oscillation at High
Frequency with Inductive Load
C1, C2
2.2µF
Input DC Decoupling High Turn-on Delay
High Turn-on Pop.
Higher Low Frequency
Cut-off. Increase of Noise
C3
22µF
220µF
0.1µF
Ripple Rejection
Better SVR. Increase of the
Switch-on Time
Degradation of SVR
C6, C7
Feedback Input DC
Decoupling
C8, C9
Frenquency Stability
Danger of Oscillation
C10, C11
1000µF to
2200µF
Output DC
Decoupling
Higher Low-frequency
Cut-off
(1) The closed loop gain must be higher than 26dB.
BUILD-IN PROTECTION SYSTEMS
THERMAL SHUT-DOWN
The presence of a thermal limiting circuit offers the
following advantages:
1) an averload on the output (even if it is
permanent), or an excessive ambient
temperature can be easily withstood.
The maximum allowable power dissipation de-
pends upon the size of the external heatsink (i.e.
its thermal resistance); Figure 18 shows this dissi-
pable power as a function of ambient temperature
for different thermal resistance.
2) the heatsink can have a smaller factor of safety
compared with that of a conventional circuit.
There is no device damage in the case of
excessive junction temperature : all that
happens is that Po (and therefore Ptot) and Io are
reduced.
Short circuit (AC Conditions). The TDA2009A can
withstand an accidental short circuit fromthe output
and ground made by a wrong connection during
normal play operation.
9/12