找货询价

一对一服务 找料无忧

专属客服

服务时间

周一 - 周六 9:00-18:00

QQ咨询

一对一服务 找料无忧

专属客服

服务时间

周一 - 周六 9:00-18:00

技术支持

一对一服务 找料无忧

专属客服

服务时间

周一 - 周六 9:00-18:00

售后咨询

一对一服务 找料无忧

专属客服

服务时间

周一 - 周六 9:00-18:00

TDA-2009A

型号:

TDA-2009A

描述:

10 10W立体声放大器[ 10 10W STEREO AMPLIFIER ]

品牌:

STMICROELECTRONICS[ ST ]

页数:

12 页

PDF大小:

575 K

TDA2009A  
®
10 +10W STEREO AMPLIFIER  
.
HIGH OUTPUT POWER  
(10 + 10W Min. @ D = 1%)  
.
.
.
.
HIGH CURRENT CAPABILITY (UP TO 3.5A)  
AC SHORT CIRCUIT PROTECTION  
THERMAL OVERLOAD PROTECTION  
SPACE AND COST SAVING : VERY LOW  
NUMBER OF EXTERNAL COMPONENTS  
AND SIMPLE MOUNTING THANKS TO THE  
MULTIWATT PACKAGE.  
MULTIWATT11  
ORDERING NUMBER :  
TDA2009A  
DESCRIPTION  
The TDA2009A is class AB dual Hi-Fi Audio power  
amplifier assembled in Multiwatt package, spe-  
cially designed for high quality stereo application  
as Hi-Fi and music centers.  
PIN CONNECTION  
1/12  
September 2003  
TDA2009A  
SCHEMATIC DIAGRAM  
2/12  
TDA2009A  
ABSOLUTE MAXIMUM RATINGS  
Symbol  
Parameter  
Value  
Unit  
V
Vs  
Io  
Supply Voltage  
28  
3.5  
Output Peak Current (repetitive f 20 Hz)  
Output Peak Current (non repetitive, t = 100 µs)  
Power Dissipation at Tcase = 90 °C  
A
Io  
4.5  
A
Ptot  
Tstg, Tj  
20  
W
°C  
Storage and Junction Temperature  
– 40, + 150  
THERMAL DATA  
Symbol  
Parameter  
Value  
Unit  
Rth j-case  
Thermal Resistance Junction-case  
Max.  
3
°C/W  
ELECTRICAL CHARACTERISTICS  
(refer to the stereo application circuit, Tamb = 25oC, VS = 24V, GV = 36dB, unless otherwise specified)  
Symbol  
Parameter  
Test Conditions  
Min. Typ. Max. Unit  
Vs  
Vo  
Id  
Supply Voltage  
8
28  
V
V
Quiescent Output Voltage  
Total Quiescent Drain Current  
Output Power (each channel)  
Vs = 24V  
11.5  
60  
Vs = 24V  
120  
mA  
Po  
d = 1%, Vs = 24V, f = 1kHz  
RL = 4Ω  
12.5  
7
W
W
RL = 8Ω  
f = 40Hz to 12.5kHz  
RL = 4Ω  
10  
5
W
W
RL = 8Ω  
Vs = 18V, f = 1kHz  
RL = 4Ω  
7
4
W
W
RL = 8Ω  
d
Distortion (each channel)  
Cross Talk (3)  
f = 1kHz, Vs = 24V  
Po = 0.1 to 7W  
Po = 0.1 to 3.5W  
Vs = 18V  
RL = 4Ω  
0.2  
0.1  
%
%
RL = 8Ω  
Po = 0.1 to 5W  
Po = 0.1 to 2.5W  
RL = 4 Ω  
RL = 8Ω  
0.2  
0.1  
%
%
CT  
RL = , Rg = 10kΩ  
f = 1kHz  
f = 10kHz  
dB  
60  
50  
Vi  
Ri  
Input Saturation Voltage (rms)  
Input Resistance  
300  
70  
mV  
kΩ  
Hz  
f = 1kHz, Non Inverting Input  
200  
20  
fL  
Low Frequency Roll off (– 3dB)  
High Frequency Roll off (– 3dB)  
Voltage Gain (closed loop)  
Closed Loop Gain Matching  
Total Input Noise Voltage  
RL = 4Ω  
RL = 4Ω  
f = 1kHz  
fH  
80  
kHz  
dB  
Gv  
Gv  
eN  
35.5  
36  
36.5  
8
0.5  
dB  
Rg = 10k(1)  
Rg = 10k(2)  
1.5  
2.5  
µV  
µV  
SVR  
TJ  
Supply Voltage Rejection (each channel)  
Thermal Shut-down Junction Temperature  
Rg = 10kΩ  
fripple = 100Hz, Vripple = 0.5V  
55  
dB  
145  
°C  
Notes :  
1.  
2.  
Curve A  
22Hz to 22kHz  
3/12  
TDA2009A  
Figure 1 :  
Test and Application Circuit (GV = 36dB)  
Figure 2 :  
P.C. board and component layout of the fig. 1  
4/12  
TDA2009A  
Figure 3 :  
Figure 5 :  
Figure 7 :  
Figure 4 :  
Figure 6 :  
Figure 8 :  
Output Power versus Supply Voltage  
Distortion versus Output Power  
Distortion versus Frequency  
Output Power versus Supply Voltage  
Distortion versus Frequency  
Quiescent Current versus  
Supply Voltage  
5/12  
TDA2009A  
Figure 9 :  
Figure 10 :  
Supply Voltage Rejection versus  
Frequency  
Total Power Dissipation and  
Efficiency versus Output Power  
Figure 11 :  
Total Power Dissipation and  
Efficiency versus Output Power  
APPLICATION INFORMATION  
Figure 12 :  
Example of Muting Circuit  
6/12  
TDA2009A  
Figure 13 :  
10W +10W Stereo Amplifier with Tone Balance and Loudness Control  
Figure 14 :  
Tone Control Response  
(circuit of Figure 13)  
7/12  
TDA2009A  
Figure 15 :  
High Quality 20 + 20W Two Way Amplifier for Stereo Music Center (one channel only)  
Figure 16 :  
18W Bridge Amplifier (d = 1%, GV = 40dB)  
8/12  
TDA2009A  
Figure 17 :  
P.C. BOARD and Components Layout of the Circuit of Figure 16 (1:1 scale)  
APPLICATION SUGGESTION  
The recommended values of the components are those shown on application circuit of fig. 1. Different  
values can be used ; the following table can help the designer.  
Recommended  
Component  
Purpose  
Larger than  
Increase of Gain  
Smaller than  
Value  
1.2kΩ  
18kΩ  
1Ω  
R1, R3  
R2, R4  
R5, R6  
Close Loop Gain  
Setting (1)  
Decrease of Gain  
Increase of Gain  
Decrease of Gain  
Frequency Stability  
Danger of Oscillation at High  
Frequency with Inductive Load  
C1, C2  
2.2µF  
Input DC Decoupling High Turn-on Delay  
High Turn-on Pop.  
Higher Low Frequency  
Cut-off. Increase of Noise  
C3  
22µF  
220µF  
0.1µF  
Ripple Rejection  
Better SVR. Increase of the  
Switch-on Time  
Degradation of SVR  
C6, C7  
Feedback Input DC  
Decoupling  
C8, C9  
Frenquency Stability  
Danger of Oscillation  
C10, C11  
1000µF to  
2200µF  
Output DC  
Decoupling  
Higher Low-frequency  
Cut-off  
(1) The closed loop gain must be higher than 26dB.  
BUILD-IN PROTECTION SYSTEMS  
THERMAL SHUT-DOWN  
The presence of a thermal limiting circuit offers the  
following advantages:  
1) an averload on the output (even if it is  
permanent), or an excessive ambient  
temperature can be easily withstood.  
The maximum allowable power dissipation de-  
pends upon the size of the external heatsink (i.e.  
its thermal resistance); Figure 18 shows this dissi-  
pable power as a function of ambient temperature  
for different thermal resistance.  
2) the heatsink can have a smaller factor of safety  
compared with that of a conventional circuit.  
There is no device damage in the case of  
excessive junction temperature : all that  
happens is that Po (and therefore Ptot) and Io are  
reduced.  
Short circuit (AC Conditions). The TDA2009A can  
withstand an accidental short circuit fromthe output  
and ground made by a wrong connection during  
normal play operation.  
9/12  
TDA2009A  
MOUNTING INSTRUCTIONS  
The power dissipated in the circuit must be re-  
moved by adding an external heatsink.  
the heatsink is very simple, a screw or a compres-  
sion spring (clip) being sufficient. Between the  
heatsinkand the package itis better to inserta layer  
of silicon grease, to optimize the thermal contact ;  
no electrical isolation is needed between the two  
Thanks to the MULTIWATT package attaching  
Figure 18 :  
Figure 19 :  
Maximum Allowable Power Dissipa-  
tion versus Ambient Temperature  
Output Power versus Case  
Temperature  
Figure 20 :  
Output Power and Drain Current ver-  
sus Case Temperature  
10/12  
TDA2009A  
mm  
inch  
DIM.  
OUTLINE AND  
MIN. TYP. MAX. MIN. TYP. MAX.  
MECHANICAL DATA  
A
B
5
0.197  
0.104  
0.063  
2.65  
1.6  
C
D
1
0.039  
E
0.49  
0.88  
1.45  
16.75  
19.6  
0.55 0.019  
0.95 0.035  
0.022  
0.037  
F
G
1.7  
17  
1.95 0.057 0.067 0.077  
17.25 0.659 0.669 0.679  
0.772  
G1  
H1  
H2  
L
20.2  
0.795  
21.9  
21.7  
17.4  
22.2  
22.1  
22.5 0.862 0.874 0.886  
22.5 0.854 0.87 0.886  
L1  
L2  
L3  
L4  
L7  
M
18.1 0.685  
0.713  
17.25 17.5 17.75 0.679 0.689 0.699  
10.3  
2.65  
4.25  
4.73  
1.9  
10.7  
10.9 0.406 0.421 0.429  
2.9 0.104 0.114  
4.55  
5.08  
4.85 0.167 0.179 0.191  
5.43 0.186 0.200 0.214  
M1  
S
2.6  
2.6  
0.075  
0.075  
0.102  
0.102  
0.152  
S1  
Dia1  
1.9  
Multiwatt11 V  
3.65  
3.85 0.144  
11/12  
TDA2009A  
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the  
consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from  
its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications  
mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information  
previously supplied.STMicroelectronics productsarenot authorizedforuseas critical components in life supportdevicesorsystems  
without express written approval of STMicroelectronics.  
The ST logo is a registered trademark of STMicroelectronics.  
All other names are the property of their respective owners  
© 2003 STMicroelectronics - All rights reserved  
STMicroelectronics GROUP OF COMPANIES  
Australia – Belgium - Brazil - Canada - China – Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Ja-  
pan - Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States  
www.st.com  
12/12  
厂商 型号 描述 页数 下载

CK-COMPONENTS

TDA 超微型表面贴装半间距DIP开关[ Ultra-miniature Surface Mount Half-pitch DIP Switches ] 2 页

INFINEON

TDA 16846 控制器的开关电源支持低功耗待机和功率因数校正[ Controller for Switch Mode Power Supplies Supporting Low Power Standby and Power Factor Correction ] 28 页

NXP

TDA 8920 - 12号的铝制车身绘( RAL 7032 ) 36 页

NXP

TDA 8922 - 12号的铝制车身绘( RAL 7032 ) 36 页

ADAM-TECH

TDA-06 屏障端子排[ BARRIER TERMINAL STRIPS ] 1 页

STMICROELECTRONICS

TDA-7296 70V - 60W DMOS音频放大器,具有静音/ ST- BY[ 70V - 60W DMOS AUDIO AMPLIFIER WITH MUTE/ST-BY ] 15 页

ETC

TDA0077001 [ OSC MEMS 100MHZ 1.8V SMD ] 1 页

STMICROELECTRONICS

TDA0161 接近探测器[ PROXIMITY DETECTORS ] 6 页

STMICROELECTRONICS

TDA0161CM [ SPECIALTY ANALOG CIRCUIT, MBCY8 ] 4 页

STMICROELECTRONICS

TDA0161DP 接近探测器[ PROXIMITY DETECTORS ] 6 页

PDF索引:

A

B

C

D

E

F

G

H

I

J

K

L

M

N

O

P

Q

R

S

T

U

V

W

X

Y

Z

0

1

2

3

4

5

6

7

8

9

IC型号索引:

A

B

C

D

E

F

G

H

I

J

K

L

M

N

O

P

Q

R

S

T

U

V

W

X

Y

Z

0

1

2

3

4

5

6

7

8

9

Copyright 2024 gkzhan.com Al Rights Reserved 京ICP备06008810号-21 京

0.250985s