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QX2010

型号:

QX2010

品牌:

ETC[ ETC ]

页数:

7 页

PDF大小:

80 K

QX2010  
QXpander Processor  
Device Specifications - Preliminary Information  
General Description  
Applications  
The QXpander QX2010 is a bipolar analog  
stereo enhancement processor. This device is  
part of the QX chip family offered by  
QSound Labs, and uses the patented  
·
·
·
·
Television sound systems (Stereo).  
Semi-professional audio equipment.  
Personal/portable audio.  
Multimedia applications for PCs and  
laptops.  
Multimedia speaker systems.  
Video Games.  
QXpandertechnology to produce  
a
spatially widened stereo image from ordinary  
left and right channel inputs.  
·
·
Pin Assignment  
This audio enhancement is achieved while  
using normal stereo signals and standard  
stereo audio equipment. No special initial  
encoding of the input signals is required, no  
additional speakers are required, and no  
special hardware is needed to produce  
QXpanded audio.  
1
2
20  
19  
18  
17  
16  
15  
14  
13  
12  
11  
VCC  
LIN  
VREF  
FA1  
FA2  
RIN  
BYP  
FB1  
FB2  
FB3  
3
4
5
6
FA3  
FA4  
FA5  
FA6  
LOUT  
FB4  
FB5  
7
8
FB6  
9
ROUT  
GND  
A TTL-compatible control input is provided  
to select QXpanded audio or a normal stereo  
signal (bypass). The QX2010 is fabricated in  
bipolar technology, and is offered in a 22 pin  
SDIP standard package. A 20 pin plastic  
SSOP package is available on request.  
10  
Figure 1: SSOP pinout  
1
RIN  
BYP  
FB1  
FB2  
FB3  
22  
21  
20  
19  
18  
17  
16  
15  
14  
13  
12  
VCC  
LIN  
VREF  
FA1  
FA2  
NC  
FA3  
FA4  
FA5  
FA6  
LOUT  
2
3
Features  
4
·
·
Produce a wide sound image from  
normal stereo input.  
No encoding of input signals, no special  
equipment required to QXpand audio.  
TTL-compatible bypass control.  
5
6
NC  
FB4  
FB5  
FB6  
ROUT  
GND  
7
8
9
·
·
·
·
·
10  
11  
Low noise: 55 uVRMS  
.
High signal-to-noise ratio: 85 dB.  
single supply voltage.  
Few external components, low cost.  
Figure 2: SDIP Pin Assignment  
Ref: 2010V253.DOC  
Rev: 2.53  
QX2010 Data Sheet -- Preliminary -- Confidential  
QSound Labs, Inc.  
Date: 97.01.29  
Page 1 of 7  
QX2010 QXpander Processor  
Device Specifications  
Principles of Operation.  
In ordinary stereo systems, the stereo image  
is formed between the left and right  
speakers, and is confined by the speaker  
positions (i.e., the "sound stage" is located  
between the two speakers). The QXpander™  
is designed to form the stereo image beyond  
the speakers, thus enlarging the "sound  
stage".  
BYP  
(GND)  
(2.4 ~ VCC)  
MODE  
Bypass - Normal Stereo  
QXpanded Audio  
0
1
Table 1: Mode Selection  
Normally, the QXpanderis used in the  
preamplifier stage between the stereo source  
and the amplifier stages used to drive the  
speakers. Figure 4 shows the functional  
elements of the QX2010.  
If the center channel is defined as the  
monaural or common component of the left  
and right channels, then Figure 3 shows the  
spatial response of the QXpanderwhen  
operating, and for normal stereo bypass.  
Power Amp  
Pre Amp  
L
L
Stereo  
Switch  
Spatial  
Enhancement  
Stereo In  
Stereo Out  
R
R
BYP  
Figure 4: QXpanderSimplified Block Diagram  
Figure 3: QXpanderSpatial Response  
The QXpanderenhancements can be  
disabled using the BYP bypass control pin,  
allowing the unchanged stereo signal to pass  
through to the outputs. The BYP control pin  
requires VCC and 0 VDC as logic levels 1  
and 0 respectively (see Table 1).  
QSound applications engineers can assist  
customers in integrating the QX2010 into  
their application designs.  
Ref: 2010V253.DOC  
Rev: 2.53  
QX2010 Data Sheet -- Preliminary -- Confidential  
QSound Labs, Inc.  
Date: 97.01.29  
Page 2 of 7  
QX2010 QXpander Processor  
Device Specifications  
1
2
3
4
C1  
1000 pF  
D
D
C
B
A
C2  
R6  
R3  
R12  
R5  
1000 pF  
120K 68K  
68K  
160K  
VCC  
R7  
120K  
C11  
0.1 uF  
+
C6  
22 uF  
U1  
12  
20  
17  
16  
15  
14  
13  
C
B
A
QX2010-S20C  
C7  
C9  
22 uF  
VCC  
FA1  
FA2  
FA3  
FA4  
FA5  
FA6  
22 uF  
RCHIN  
LCHIN  
RCHOUT  
LCHOUT  
RIN  
LIN  
ROUT  
LOUT  
1
9
AUDIO  
QXPANDER PROCESSOR  
19  
11  
C8  
22 uF  
C10  
22 uF  
2
BYP  
FB1  
FB2  
FB3  
FB4  
FB5  
FB6  
VREF  
18  
3
4
5
6
7
8
VCC  
10  
S1  
R4  
+
C5  
33K  
C12  
0.1 uF  
47uF  
R11  
150K  
C4  
R8  
150K  
R9  
R13  
R10  
NOTES:  
68K 68K  
10K  
R3, R5 - R13:  
1000 pF  
Tolerance: +/- 1%  
Type: Metal Film  
C1 - C4:  
C3  
1000 pF  
Tolerance: +/- 5%  
Title  
Temperature Coefficient: 0 +/- 60ppm/°C  
BYP: Stereo Bypass BYP = 0  
QXpanded Audio BYP = 1  
QXPANDER PROCESSOR QX2010-S20C  
Number:  
A
Size:  
File:  
Drawn By: KLS  
Revision:  
4.0  
of  
Date:  
Sheet  
4
1
1
Time:  
1
2
3
Figure 5: QX2010 QXpanderTypical Application  
Ref: 2010V253.DOC  
Rev: 2.53  
QX2010 Data Sheet -- Preliminary -- Confidential  
QSound Labs, Inc.  
Date: 97.01.29  
Page 3 of 7  
QX2010 QXpander Processor  
Device Specifications  
Absolute Maximum Ratings*  
(TA = +25 °C)  
Parameter  
Supply Voltage  
Input Voltage  
Symbol  
VCC,max  
VIN,max  
IC,max  
Pd  
Rating  
12  
GND £ VIN £ VCC  
10  
Unit  
V
V
mA  
mW  
°C  
Output Current  
Power dissipation  
Operating Temperature  
Storage Temperature  
500  
-20 ~ +75  
-40 ~ +125  
Topr  
Tstg  
°C  
Warning: Operation of the device at or beyond these limits may result in permanent damage to the  
device. Normal operation is not guaranteed at these extremes.  
Digital Characteristics  
(TA = +25 °C, VCC = 6.0 ~ 10.0 VDC)  
Parameter  
TC  
Sym  
VIH  
VIL  
IIH  
Min  
2.5  
Typ  
Max  
5.0  
Unit  
V
High-Level Input Voltage  
Low-Level Input Voltage  
High-Level Input Current  
Low-Level Input Current  
0
0.4  
0.8  
TBD  
TBD  
V
uA  
uA  
IIL  
Note: Digital input (BYP, pin 2) should be driven with levels between 0V ~ +5V relative to GND.  
Ref: 2010V253.DOC  
Rev: 2.53  
QX2010 Data Sheet -- Preliminary -- Confidential  
QSound Labs, Inc.  
Date: 97.01.29  
Page 4 of 7  
QX2010 QXpander Processor  
Device Specifications  
Analog Characteristics:  
(TA = +25 °C, VCC = 9.0 VDC)  
Parameter  
Supply Voltage Range  
TC  
Sym  
VCC  
Min  
6.0  
Typ  
Max  
10.0  
Unit  
VDC  
9.0  
Power Supply Rejection Ratio  
Supply Current  
1
PSRR  
ICC  
44  
50  
15  
dB  
mA  
20  
Input Voltage, Analog  
Output Voltage, Analog  
2
3
Vin  
VOUT  
1.0  
2.8  
1.4  
VRMS  
VRMS  
2.0  
5
Output Current, Analog  
Load Resistance  
IOUT  
RL  
mA  
kW  
pF  
±1  
Load Capacitance  
CL  
100  
Input Impedance  
Usable Bandwidth  
RI  
BW  
AV,1  
AV,2  
THD  
SNR  
SNR  
VNOISE  
21  
20  
5.0  
-0.5  
30  
39  
20000  
7.0  
+0.5  
0.7  
kW  
Hz  
dB  
dB  
%
Voltage Gain, QXpanded  
Voltage Gain, bypass  
Total Harmonic Distortion  
Signal-Noise Ratio, QXpander  
Signal-Noise Ratio, Bypass  
Output Noise Voltage  
4
5
6
7
8
9
6.0  
0.0  
0.3  
85  
95  
55  
80  
90  
dB  
dB  
100  
mVRMS  
dB  
dB  
Channel Balance  
Insertion Loss  
10  
CB  
-1.0  
+1.0  
0.5  
Test Conditions:  
1.  
2.  
3.  
4.  
VCC = 9V + 200 mVRMS ,f = 1 kHz, BYP = VCC (QXpanded mode).  
VCC = 9.0 V, BYP = VCC (QXpanded mode).  
BYP = VCC (QXpanded mode), THD = 1%, f = 1 kHz.  
BYP = VCC (QXpanded mode),  
a)  
b)  
LIN = 1 VRMS ,1 kHz, RIN=0 V,  
RIN= 1 VRMS ,1 kHz, LIN=0 V.  
5.  
6.  
BYP = GND (Bypass mode), LIN = RIN = 1 VRMS ,1 kHz.  
Total Harmonic Distortion:  
a)  
THD at LOUT: LIN = 1 VRMS , RIN = 0 V, 1 kHz, BYP = VCC (QXpanded mode).  
b)  
THD at ROUT: RIN = 1 VRMS , LIN = 0 V, 1 kHz, BYP = VCC (QXpanded mode).  
7.  
BW = 20 ~ 20000 Hz, LOUT = ROUT = 1 VRMS, BYP = VCC , A curve.(QXpanded mode).  
8.  
9.  
BW = 20 ~ 20000 Hz, LIN = RIN = 1 VRMS, BYP = GND, A curve. (Bypass mode).  
BW = 20 ~ 20000 Hz, BYP = VCC , A curve. (QXpanded mode).  
10.  
LIN = RIN = 1 VRMS , 1 kHz, BYP = GND (Bypass mode).  
Ref: 2010V253.DOC  
Rev: 2.53  
QX2010 Data Sheet -- Preliminary -- Confidential  
QSound Labs, Inc.  
Date: 97.01.29  
Page 5 of 7  
QX2010 QXpander Processor  
Device Specifications  
Bill of Material  
For low cost implementation  
Item Quantity  
Description  
Reference  
1
2
3
4
5
6
7
8
9
1
1
2
2
2
1
4
2
5
1
1
R10  
R4  
R3, R7  
R9 or R13, R5 or R12  
R8, R11  
R6  
10 kW, 1/4W, 5%, Carbon Film Resistor  
33 kW, 1/4W, 5%, Carbon Film Resistor  
120 kW, 1/4W, 5%, Carbon Film Resistor  
130 kW, 1/4W, 5%, Carbon Film Resistor  
150 kW, 1/4W, 5%, Carbon Film Resistor  
160 kW, 1/4W, 5%, Carbon Film Resistor  
0.001 uF, 5%, 50V, Ceramic Disk Capacitor C1, C2, C3, C4  
0.1uF. 50V. 10% Capacitor  
C11, C12  
C6, C7, C8, C9, C10  
C5  
U1  
22.0uF, 16V Electrolytic Capacitor  
47.0uF, 16V Electrolytic Capacitor  
QX2130SDIP Integrated Circuit  
10  
11  
NOTE: These values are suitable for applicatons where cost is an overriding factor.  
Operation within quoted specifications cannot be guaranteed using the parts listed above.  
When strict conformance to the quoted specifications is required use the values indicated  
on the schematic.  
Ref: 2010V253.DOC  
Rev: 2.53  
QX2010 Data Sheet -- Preliminary -- Confidential  
QSound Labs, Inc.  
Date: 97.01.29  
Page 6 of 7  
QX2010 QXpander Processor  
Device Specifications  
Package Data  
Ordering Code  
QX2010-P22C  
QX2010-S20C  
Package Code Package Type  
P22  
S20  
PLASTIC SDIP  
PLASTIC SSOP  
PLASTIC SDIP  
22 LEAD  
P22  
6.5  
300 MIL  
0.070 PITCH  
UNITS: mm  
19.2  
8.0  
3.5  
3.3  
0~15°  
0.25  
0.42  
1.0  
1.78  
0.70  
8.9±0.3  
PLASTIC SSOP  
20 LEAD  
11  
20  
S20  
300 MIL  
0.030 PITCH  
5.4±  
0.2  
7.8±  
0.3  
UNITS: mm  
0~0.1  
1
10  
0~10°  
0.15±0.1  
1.8  
0.05±  
0.05  
0.5±0.2  
0.8  
0.36  
Ref: 2010V253.DOC  
Rev: 2.53  
QX2010 Data Sheet -- Preliminary -- Confidential  
QSound Labs, Inc.  
Date: 97.01.29  
Page 7 of 7  
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