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IXGQ35N120BD1

型号:

IXGQ35N120BD1

品牌:

IXYS[ IXYS CORPORATION ]

页数:

6 页

PDF大小:

551 K

Advanced Technical Information  
IXGQ 35N120BD1  
High Voltage IGBT  
with Diode  
VCES  
IC25  
= 1200 V  
= 75 A  
VCE(sat) = 3.3 V  
tfi(typ)  
= 160 ns  
Symbol  
TestConditions  
Maximum Ratings  
TO-3P(IXGQ)  
VCES  
VCGR  
TJ = 25°C to 150°C  
TJ = 25°C to 150°C; RGE = 1 MΩ  
1200  
1200  
V
V
VGES  
VGEM  
Continuous  
Transient  
20  
30  
V
V
G
IC25  
IC110  
TC = 25°C  
TC = 110°C  
75  
35  
A
A
C
E
(TAB)  
IF110  
T
= 110°C  
8
A
A
ICM  
TCC = 25°C, 1 ms  
200  
G = Gate  
C = Collector  
E = Emitter  
TAB = Collector  
SSOA  
V
= 15 V, TJ = 125°C, RG = 10 Ω  
ICM = 120  
A
(RBSOA)  
CGlaE mped inductive load  
@0.8 VCES  
Features  
PC  
TC = 25°C  
400  
W
z
International standard packages  
IGBT and anti-parallel FRED for  
resonant power supplies  
- Induction heating  
TJ  
TJM  
Tstg  
-55 ... +150  
150  
-55 ... +150  
°C  
°C  
°C  
z
- Rice cookers  
Md  
Mounting torque  
1.13/10 Nm/lb.in.  
z
z
MOS Gate turn-on  
- drive simplicity  
Fast Recovery Expitaxial Diode (FRED)  
- soft recovery with low IRM  
Maximum lead temperature for soldering  
1.6 mm (0.062 in.) from case for 10 s  
300  
°C  
Weight  
Symbol  
6
g
Advantages  
TestConditions  
Characteristic Values  
z
Saves space (two devices in one  
(TJ = 25°C, unless otherwise specified)  
package)  
min. typ. max.  
z
Easy to mount with 1 screw  
(isolated mounting screw hole)  
VGE(th)  
ICES  
IC = 250 µA, VCE = VGE  
2.5  
5.0  
V
z
Reduces assembly time and cost  
VCE = V  
T=25°C  
50 µA  
VGE = 0CVES  
T=125°C  
250 µA  
IGES  
VCE = 0 V, VGE = 20 V  
100 nA  
VCE(sat)  
IC  
= 35A, VGE = 15 V  
2.7  
3.3  
V
Note 2  
© 2004 IXYS All rights reserved  
DS99195(07/04)  
IXGQ 35N120BD1  
Symbol  
gfs  
TestConditions  
Characteristic Values  
(TJ = 25°C, unless otherwise specified)  
min. typ. max.  
TO-3P (IXGQ) Outline  
IC = 35A; VCE = 10 V,  
Note 2.  
28  
38  
S
Cies  
Coes  
Cres  
2300  
190  
80  
pF  
pF  
pF  
VCE = 25 V, VGE = 0 V, f = 1 MHz  
Qg  
Qge  
Qgc  
140  
20  
50  
nC  
nC  
nC  
IC = 40A, VGE = 15 V, VCE = 0.5 VCES  
td(on)  
40  
ns  
Inductive load, TJ = 25°C  
IC = 35 A; VGE = 15 V  
VCE = 0.8 VCES; RG = Roff = 3 Ω  
Note 1.  
tri  
50  
ns  
Eon  
0.9  
mJ  
td(off)  
tfi  
Eoff  
270  
160  
3.8  
500 ns  
300 ns  
7.0 mJ  
td(on)  
tri  
Eon  
td(off)  
tfi  
45  
60  
1.9  
380  
400  
8.0  
ns  
ns  
mJ  
ns  
ns  
mJ  
Inductive load, TJ = 125°C  
IC = 35A; VGE = 15 V  
VCE = 0.8 VCES; RG = Roff = 3 Ω  
Note 1  
Eoff  
RthJC  
RthCK  
0.35 K/W  
K/W  
0.25  
ReverseDiode(FRED)  
Characteristic Values  
(TJ = 25°C, unless otherwise specified)  
min. typ. max.  
Symbol  
VF  
TestConditions  
I = 10 A, VGE = 0 V  
3.3  
2.2  
V
V
IFF = 10 A, VGE = 0 V, TJ = 125°C  
IRM  
trr  
IF = 10 A; -diF/dt = 100 A/µs, VR = 100 V  
VGE = 0 V; TJ = 125°C  
4.0  
190  
A
ns  
trr  
IF = 1 A; -diF/dt = 100 A/µs; VR = 30 V, VGE = 0 V  
40  
ns  
RthJC  
2.5 K/W  
Notes: 1. Switching times may increase for VCE (Clamp) > 0.8 • VCES, higher TJ  
or increased RG.  
2. Pulse test, t 300 µs, duty cycle d 2 %.  
IXYS reserves the right to change limits, test conditions, and dimensions.  
IXYSMOSFETs andIGBTsarecovered by  
oneormoreofthefollowingU.S.patents:  
4,835,592  
4,850,072  
4,881,106  
4,931,844  
5,017,508  
5,034,796  
5,049,961  
5,063,307  
5,187,117  
5,237,481  
5,381,025  
5,486,715  
6,162,665  
6,259,123B1  
6,306,728 B1  
6,404,065B1  
6,534,343  
6,583,505  
6,683,344  
6,710,405B2  
6,710,463  
6,727,585  
IXGQ 35N120BD1  
© 2004 IXYS All rights reserved  
IXGQ 35N120BD1  
IXYS reserves the right to change limits, test conditions, and dimensions.  
IXGQ 35N120BD1  
© 2004 IXYS All rights reserved  
IXGQ 35N120BD1  
30  
A
2000  
40  
A
T = 100°C  
VVRJ= 600V  
T = 100°C  
VVRJ= 600V  
nC  
25  
1500  
30  
IF  
IRM  
Qr  
I = 20A  
IFF= 5A  
IF= 10A  
20  
15  
10  
5
TVJ=150°C  
TVJ=100°C  
I = 20A  
IF= 10A  
IFF= 5A  
1000  
500  
0
20  
10  
0
TVJ= 25°C  
0
A/µs  
0
1
2
3
4 V  
100  
1000  
0
200 400 600 1000  
-diF/dt  
A/µs  
-diF/dt  
VF  
Fig. 18. Forward current IF versus VF  
2.0  
Fig. 19. Reverse recovery charge Qr  
versus -diF/dt  
Fig. 20. Peak reverse current IRM  
versus -diF/dt  
150  
120  
1.2  
µs  
T = 100°C  
T = 100°C  
VVRJ= 600V  
IFVJ = 10A  
ns  
V
140  
VFR  
tfr  
trr  
tfr  
1.5  
Kf  
VFR  
130  
80  
40  
0
0.8  
I = 20A  
IF= 10A  
120  
1.0  
IRM  
IFF= 5A  
110  
0.4  
0.
0.5  
Qr  
100  
90  
0.0  
A/µs  
0
40  
80  
120  
160  
0
200 400 600 800 1000  
0
200 400 600 800 1000  
°C  
A/µs  
diF/dt  
TVJ  
-diF/dt  
Fig. 21. Dynamic parameters Qr, IRM  
versus TVJ  
Fig. 22. Recovery time trr versus -diF/dt  
Fig. 23. Peak forward voltage VFR and tfr  
versus diF/dt  
10  
K/W  
Constants for ZthJC calculation:  
i
Rthi (K/W)  
ti (s)  
1
1
2
3
1.449  
0.558  
0.493  
0.0052  
0.0003  
0.017  
ZthJC  
0.1  
0.01  
DSEP 8-12A  
0.001  
s
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
t
Fig. 24. Transient thermal resistance junction to case  
IXYS reserves the right to change limits, test conditions, and dimensions.  
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