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NX20P0408UKZ

型号:

NX20P0408UKZ

品牌:

NXP[ NXP ]

页数:

18 页

PDF大小:

479 K

NX20P0408  
NXP Semiconductors  
USB D+/D- Protection IC  
1. General description  
NX20P0408 is a single chip USB data lines protection solution. D+ and D- pins in system  
side are protected from 28V short to VBUS, which pins are located near VBUS pins.  
USB Type C allows VBUS voltage to increase up to 20V through Power delivery protocol,  
the concern is that these D+/D- pins can be shorted with VBUS when plugging out with  
mechanical twisted connector since Type C connector contact pin is 25% closer to each  
other than prior generation connector, micro USB which most mobile devices have been  
using. Another concern is that moisture or fine dust may cause short to 20V VBUS with  
next to pins.  
NX20P0408 enables D+/D- to be robust in even abnormal conditions. NX20P0408 has  
28V DC tolerant on D+/D- pin in connector side and quickly disconnects switchers if the  
voltage is above over voltage threshold, D+/D- in system side is protected from high  
voltage.  
2. Features and benefits  
USB Type C D+/D- short protection to VBUS  
CON_DP / CON_DN : 28VDC  
Low Rdson switch : 4Ω  
High switch bandwidth = 1.5GHz  
35V surge protection on CON_DP/CON_DN  
Fast OVP turn off time : 60ns  
Post-stage clamp circuit to clamp voltage until switch is off.  
3. Applications  
Smartphone  
Tablet  
Laptop  
NX20P0408  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V.. 2016. All rights reserved.  
Product Datasheet  
Rev. 1.0 — July 05, 2018  
1 of 18  
 
 
 
NX20P0408  
NXP Semiconductors  
USB D+/D- Protection IC  
4. Ordering information  
Table 1.  
Ordering information  
Type number Temperature range Name  
Description  
Version  
NX20P0408UK 40 °C to +85 °C  
WLCSP12 Wafer level chip-size, 12 bumps; 1.27 x 1.67 x  
0.525 mm (back side coating included)  
NX20P0408  
5. Marking  
Table 2.  
Marking Codes  
Type number  
Marking code  
NX20P0408UK  
N08  
NX20P0408  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V.. 2016. All rights reserved.  
Product Datasheet  
Rev. 1.0 — July 05, 2018  
2 of 18  
 
 
 
 
NX20P0408  
NXP Semiconductors  
USB D+/D- Protection IC  
6. Functional Diagram  
NX20P0408  
FLAG  
VSYS  
SWEN  
Comparators  
Control Logic  
Rpd  
CON_DP  
CON_DN  
DP  
Post  
cl amp  
DN  
Post  
cl amp  
Fig 1. Block diagram  
NX20P0408  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V.. 2016. All rights reserved.  
Product Datasheet  
Rev. 1.0 — July 05, 2018  
3 of 18  
 
 
NX20P0408  
NXP Semiconductors  
USB D+/D- Protection IC  
7. Pinning information  
7.1 Pinning  
1
2
3
3
2
1
A
B
C
A
B
C
NC  
NC  
VSYS  
VSYS  
NC  
NC  
NC  
NC  
NC  
DP  
DN  
GND  
Flag  
GND  
Flag  
NC  
DP  
DN  
CON_  
DP  
CON_  
DP  
CON_  
DN  
CON_  
DN  
SWEN  
SWEN  
D
D
Pin Map Bump-side down  
Pin Map Bump-side Up  
Fig 2. NX20P0408, WLCSP12  
NX20P0408  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V.. 2016. All rights reserved.  
Product Datasheet  
Rev. 1.0 — July 05, 2018  
4 of 18  
 
 
 
NX20P0408  
NXP Semiconductors  
USB D+/D- Protection IC  
7.2 Pin description  
Table 3.  
Symbol  
Pin description  
Pin  
Type  
DIO  
DIO  
DIO  
DIO  
Description  
CON_DP  
CON_DN  
DP  
C1  
D1  
C2  
D2  
Type C connector side DP. Connect DP of Type C USB connector.  
Type C connector side DN. Connect DN of Type C USB connector.  
System side DP.  
DN  
System side DN.  
USB switch enable/disable control pin. SWEN is driven high to enable  
USB switch. There is internal pull-down resistor, 460Kohm.  
SWEN  
VSYS  
D3  
A3  
DI  
P
Power supply input, connect System voltage and bypass 1uF capacitor  
to GND.  
Open-drain output indicating fault condition. Low when Fault condition  
happen. External pull-up resistor is required.  
FLAG  
GND  
NC  
C3  
B3  
DO  
P
Ground  
A1, A2,  
B1, B2  
No connection. Leave them open.  
NX20P0408  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V.. 2016. All rights reserved.  
Product Datasheet  
Rev. 1.0 — July 05, 2018  
5 of 18  
 
 
NX20P0408  
NXP Semiconductors  
USB D+/D- Protection IC  
8. Functional description  
NX20P0408 is placed in front of Type C connector and protects D+ and D- pins in  
System side from 20V VBUS short, ESD and Surge.  
Type C  
Connector  
VSYS  
VSYS  
1uF  
Application  
Processor  
FLAG  
SBUEN  
NX20P0407  
CON_CC1  
CON_CC2  
CC1  
CC1  
CC/PD  
controller  
CC2  
CC2  
SBU1  
SBU1  
SBU2  
CON_SBU1  
CON_SBU2  
Cross bar  
swtich  
SBU2  
GND  
VSYS  
VSYS  
1uF  
Application  
Processor  
FLAG  
SWEN  
NX20P0408  
CON_DP  
CON_DN  
DP  
DP  
USB PHY  
DN  
DN  
GND  
Fig 3. NX20P0408 application diagram  
8.1 Power status  
When VSYS is below VSYSUVLO, NX20P0408 stays shutdown mode, where bias, switches  
and all comparators are disabled.  
NX20P0408 enters standby mode when VSYS exceed VSYSUVLO. USB switch is controlled  
by SWEN.  
NX20P0408  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V.. 2016. All rights reserved.  
Product Datasheet  
Rev. 1.0 — July 05, 2018  
6 of 18  
 
 
 
NX20P0408  
NXP Semiconductors  
USB D+/D- Protection IC  
Table 4.  
Power state  
Power state  
VSYS  
Flag  
Hi-Z  
Hi-Z  
Hi-Z  
SWEN  
x
USB Switch  
OFF  
Dead battery  
Power ON_A  
Power ON_B  
< VSYSUVLO  
> VSYSUVLO  
> VSYSUVLO  
Low  
High  
OFF  
ON  
8.2 Over voltage protection  
NX20P0408 has short circuit protection of CON_DP and CON_DN up to 28V. USB  
switch overvoltage threshold is VOVP to secure turn the switch off not to pass high voltage  
to USB phy in system side.  
Once overvoltage on any of channels is triggered, the switch is super fast turned off  
within tOVP_res, not to pass over the overvoltage to system side. FLAG pin goes low in  
tFLAG_RES to inform system this fault condition. If the voltage of the channel triggered OVP  
come down back below overvoltage threshold for tOVP_Deb, the switch is turned back on  
and FLAG pin get Hi-Z.  
Four switches for DP and DN are each own OVP comparator and controlled by its  
comparator independently. If DP voltage exceed OVP threshold, the DP switch is turned  
off, but the other switch stays ON.  
CON_DP /  
CON_DN  
40V/us  
VOVP_th  
VOVP_Hys  
DP/DN  
tOVP_Deb  
tFLAG_RES  
tOVP_RES  
FLAG  
tFLAG_RES  
Fig 4. Overvoltage protection timing  
NX20P0408  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V.. 2016. All rights reserved.  
Product Datasheet  
Rev. 1.0 — July 05, 2018  
7 of 18  
 
 
 
NX20P0408  
NXP Semiconductors  
USB D+/D- Protection IC  
8.3 Post-stage Clamp circuit  
NX20P0408 has post stage clamp circuit to clamp extra voltage on DP and DN in system  
side. When shorting with VBUS, the voltage on CON_DP and CON_DN is rapidly  
increased. Even though NX20P0408 features super fast response for overvoltage  
condition, the over-voltage may pass through to DP/DN for the response time, 70ns.  
NX20P0408 post-stage clamp circuit is second protection to clamp the voltage on DP/DN  
in system side not to exceed Clamping voltage, 7V.  
40V/us  
CON_CCx  
CON_SBUx  
Without Post-  
stage clamp  
With  
Post-stage clamp  
VOVP_th  
CCx  
SBUx  
tOVP_RES  
Fig 5. Post-stage clamp operation  
8.4 Flag  
Flag pin is open drain output to indicate device fault condition to application processor. If  
Fault condition is detected, Flag output is latched to low until the fault condition is  
cleared.  
The table 5 shows NX20P0408 fault conditions and its behavior.  
Table 5.  
Fault conditions and behavior  
Fault  
Condition  
Tj > TOTP  
SWEN  
Low  
Flag  
Low  
Low  
Hi-Z  
Low  
USB Switch  
OFF  
Thermal Warning  
Thermal Warning  
OVP  
Tj > TOTP  
High  
Low  
ON  
VCON_Dx > VOVP  
VCON_Dx > VOVP  
OFF  
OVP  
High  
OFF  
NX20P0408  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V.. 2016. All rights reserved.  
Product Datasheet  
Rev. 1.0 — July 05, 2018  
8 of 18  
 
 
 
 
NX20P0408  
NXP Semiconductors  
8.5 Switch  
USB D+/D- Protection IC  
NX20P0408 has a pair of switch. USB switches are controlled by SWEN when SYS  
power is valid. The switch bandwidth is 1.5GHz so that it can be used to protect USB  
D+/D- from overvoltage.  
Fig 6. USB High Speed Eye diagram of USB switch  
NX20P0408  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V.. 2016. All rights reserved.  
Product Datasheet  
Rev. 1.0 — July 05, 2018  
9 of 18  
 
 
NX20P0408  
NXP Semiconductors  
USB D+/D- Protection IC  
9. Limiting values  
Table 6.  
Limiting values (Absolute Maximum Ratings)  
Explanation  
Pin  
Conditions  
Min  
-0.5  
-0.5  
-0.5  
-0.5  
-100  
Max  
28  
6
Unit  
V
CON_DP, CON_DN  
DP, DN  
Voltage range  
(with respect to  
GND)  
V
VSYS,  
6
V
FLAG  
6
V
Output Current CON_DP, CON_DN, DP, DN  
100  
mA  
Junction  
temperature  
-40  
-2  
135  
+2  
°C  
VESD  
HBM (JESD22-001)  
KV  
Electrostatic  
All other pins  
discharge  
voltage  
CDM (JESD22-C101E)  
-500  
+500  
KV  
10. Recommended operating conditions  
Table 7.  
Recommended Operating Conditions  
Explanation  
Pin  
Conditions  
Min  
Max  
Unit  
VSYS  
2.5  
0
5.5  
5.5  
5.5  
4.5  
V
V
V
V
Voltage range  
(with respect to  
GND)  
SWEN  
FLAG  
0
DP, DN, CON_DP, CON_DN  
0
Ambient  
temperature  
-40  
85  
°C  
11. Thermal characteristics  
Table 8.  
Symbol  
Thermal characteristics  
Parameter  
Conditions  
Typ  
Unit  
°C/W  
[1][2]  
Rth(j-a)  
thermal resistance from junction to ambient  
110  
[1] The overall Rth(j-a) can vary depending on the board layout. To minimize the effective Rth(j-a), all pins must have a solid connection to  
larger Cu layer areas e.g. to the power and ground layer. In multi-layer PCB applications, the second layer should be used to create a large  
heat spreader area right below the device. If this layer is either ground or power, it should be connected with several vias to the top layer  
connecting to the device ground or supply.Try not to use any solder-stop varnish under the chip  
[2] This Rth(j-a) is calculated based on JEDEX2S2P board. The actual Rth(j-a) value may vary in applications using different layer stacks  
and layouts.  
NX20P0408  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V.. 2016. All rights reserved.  
Product Datasheet  
Rev. 1.0 — July 05, 2018  
10 of 18  
 
 
 
 
 
 
NX20P0408  
NXP Semiconductors  
USB D+/D- Protection IC  
12. Electrical Characteristics  
12.1 Static Characteristics  
Table 9.  
Static Characteristics (-40C~85C)  
At recommended input voltages and Tamb = -40 °C to +85 °C; voltages are referenced to GND (ground = 0 V); unless  
otherwise specified.  
Symbol  
Supply current / Leakage current  
VSYS Under Voltage  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
Falling, 100mV hysteresis  
VSYS = 3.6V, SWEN = 0V  
VSYS = 3.6V, SWEN = 3.6V  
V
VSYSUVLO  
2.14  
2.27  
32  
2.40  
55.5  
170  
Lockout  
µA  
µA  
µA  
Standby current  
ISYS  
105  
Leakage current  
for DP/DN pins  
VSYS = 3.6V, VDP/DN = 3.6V,  
CON_DP/DN floating  
ILeak  
1
USB switcher  
VSYS = 3.6V, SWEN = High,  
DP/DN= 3.6V  
On resistance  
Ron  
-
3.6  
30  
5.4  
150  
5.0  
mΩ  
V
On resistance  
flatness  
Sweep DP/DN voltage between  
0V and 3.6V  
Ron_Flat  
VOVP  
OVP threshold on  
CON_DP/DN  
VSYS = 3.6V, SWEN = High,  
rising  
4.6  
4.8  
100  
OVP threshold  
hysteresis  
VOVP_hys  
mV  
Capacitance between Dx  
/CON_Dx and GND when  
Powered up. VDP/DN = 0V to  
1.2V, f = 240MHz  
Equivalent on  
capacitance  
Con  
BW  
4.5  
pF  
Single ended, 50ohm  
termination, VDP/DN = 0.1V to  
1.2V  
3dB Bandwidth  
Crosstalk  
1500  
-84  
MHz  
dB  
Swing 1Vpp at 10MHz, measure  
the other channels with 50mohm  
termination  
XTALK  
VCLAMP  
Hot plug voltage CON_Dx =  
22V. load 150nF cap and 40ohm  
in series to GND on DP/DN  
Clamp voltage on  
system side  
7
V
FLAG  
Output low voltage  
VOL  
IOL = 5mA  
0.3  
1
V
High level leakage  
current  
IOH  
VFLAG = 5.5V  
µA  
SWEN  
NX20P0408  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V.. 2016. All rights reserved.  
Product Datasheet  
Rev. 1.0 — July 05, 2018  
11 of 18  
 
 
 
NX20P0408  
NXP Semiconductors  
USB D+/D- Protection IC  
Valid input high  
V
VIH  
VIL  
1.5  
Valid input low  
V
0.4  
Pull down resistor  
kΩ  
RPD  
350  
450  
600  
Over Temperature flag  
Over temperature  
Flag  
TOTP  
125  
10  
°C  
°C  
Over temperature  
Flag hysteresis  
TOTP_hys  
-
-
12.2 Dynamic Characteristics  
Table 10. Dynamic Characteristics  
Symbol Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
Switch Dynamic Characteristics  
Power up time from  
tpwrup  
Valid power source of  
VSYS  
2.5  
5
ms  
Time from OVP trip voltage  
asserted to OVP FET turn-off  
tOVP_res  
OVP response time  
-
-
60  
20  
ns  
Minimum time to exit  
OVP shutdown,  
tOVP_deb  
ms  
CON DP or CON DN  
USB switch enable  
time from SWEN to  
high  
tON  
40  
20  
80  
us  
Minimum time to exit  
Over Temperature flag  
Note 1  
Note 1  
tOTP_deb  
-
ms  
Time to FLAG  
assertion from OVP  
detected.  
tFLAG_RES  
5
us  
us  
Time to Flag from over  
temperature  
tOTP_flag  
20  
Note 1 : Guaranteed by Design  
NX20P0408  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V.. 2016. All rights reserved.  
Product Datasheet  
Rev. 1.0 — July 05, 2018  
12 of 18  
 
 
NX20P0408  
NXP Semiconductors  
USB D+/D- Protection IC  
13. Package outline  
WLCSP12; wafer level chip-scale package, 12 bumps, 1.67 x 1.27 x 0.525 mm (Backside  
coating included)  
Fig 7. Package outline WLCSP12  
NX20P0408  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V.. 2016. All rights reserved.  
Product Datasheet  
Rev. 1.0 — July 05, 2018  
13 of 18  
 
 
NX20P0408  
NXP Semiconductors  
USB D+/D- Protection IC  
14. Legal information  
14.1 Data sheet status  
Document status[1][2]  
Product status[3]  
Development  
Definition  
Objective [short] data sheet  
This document contains data from the objective specification for product development.  
This document contains data from the preliminary specification.  
This document contains the product specification.  
Preliminary [short] data sheet Qualification  
Product [short] data sheet Production  
[1]  
[2]  
[3]  
Please consult the most recently issued document before initiating or completing a design.  
The term ‘short data sheet’ is explained in section “Definitions”.  
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product  
status information is available on the Internet at URL http://www.nxp.com.  
notice. This document supersedes and replaces all information supplied prior  
to the publication hereof.  
14.2 Definitions  
Draft — The document is a draft version only. The content is still under  
internal review and subject to formal approval, which may result in  
modifications or additions. NXP Semiconductors does not give any  
representations or warranties as to the accuracy or completeness of  
information included herein and shall have no liability for the consequences  
of use of such information.  
Suitability for use — NXP Semiconductors products are not designed,  
authorized or warranted to be suitable for use in life support, life-critical or  
safety-critical systems or equipment, nor in applications where failure or  
malfunction of an NXP Semiconductors product can reasonably be expected  
to result in personal injury, death or severe property or environmental  
damage. NXP Semiconductors and its suppliers accept no liability for  
inclusion and/or use of NXP Semiconductors products in such equipment or  
applications and therefore such inclusion and/or use is at the customer’s own  
risk.  
Short data sheet — A short data sheet is an extract from a full data sheet  
with the same product type number(s) and title. A short data sheet is  
intended for quick reference only and should not be relied upon to contain  
detailed and full information. For detailed and full information see the  
relevant full data sheet, which is available on request via the local NXP  
Semiconductors sales office. In case of any inconsistency or conflict with the  
short data sheet, the full data sheet shall prevail.  
Applications — Applications that are described herein for any of these  
products are for illustrative purposes only. NXP Semiconductors makes no  
representation or warranty that such applications will be suitable for the  
specified use without further testing or modification.  
Product specification — The information and data provided in a Product  
data sheet shall define the specification of the product as agreed between  
NXP Semiconductors and its customer, unless NXP Semiconductors and  
customer have explicitly agreed otherwise in writing. In no event however,  
shall an agreement be valid in which the NXP Semiconductors product is  
deemed to offer functions and qualities beyond those described in the  
Product data sheet.  
Customers are responsible for the design and operation of their applications  
and products using NXP Semiconductors products, and NXP  
Semiconductors accepts no liability for any assistance with applications or  
customer product design. It is customer’s sole responsibility to determine  
whether the NXP Semiconductors product is suitable and fit for the  
customer’s applications and products planned, as well as for the planned  
application and use of customer’s third party customer(s). Customers should  
provide appropriate design and operating safeguards to minimize the risks  
associated with their applications and products.  
14.3 Disclaimers  
Limited warranty and liability — Information in this document is believed to  
be accurate and reliable. However, NXP Semiconductors does not give any  
representations or warranties, expressed or implied, as to the accuracy or  
completeness of such information and shall have no liability for the  
consequences of use of such information. NXP Semiconductors takes no  
responsibility for the content in this document if provided by an information  
source outside of NXP Semiconductors.  
NXP Semiconductors does not accept any liability related to any default,  
damage, costs or problem which is based on any weakness or default in the  
customer’s applications or products, or the application or use by customer’s  
third party customer(s). Customer is responsible for doing all necessary  
testing for the customer’s applications and products using NXP  
Semiconductors products in order to avoid a default of the applications and  
the products or of the application or use by customer’s third party  
customer(s). NXP does not accept any liability in this respect.  
In no event shall NXP Semiconductors be liable for any indirect, incidental,  
punitive, special or consequential damages (including - without limitation -  
lost profits, lost savings, business interruption, costs related to the removal or  
replacement of any products or rework charges) whether or not such  
damages are based on tort (including negligence), warranty, breach of  
contract or any other legal theory.  
Limiting values — Stress above one or more limiting values (as defined in  
the Absolute Maximum Ratings System of IEC 60134) will cause permanent  
damage to the device. Limiting values are stress ratings only and (proper)  
operation of the device at these or any other conditions above those given in  
the Recommended operating conditions section (if present) or the  
Characteristics sections of this document is not warranted. Constant or  
repeated exposure to limiting values will permanently and irreversibly affect  
the quality and reliability of the device.  
Notwithstanding any damages that customer might incur for any reason  
whatsoever, NXP Semiconductors’ aggregate and cumulative liability  
towards customer for the products described herein shall be limited in  
accordance with the Terms and conditions of commercial sale of NXP  
Semiconductors.  
Terms and conditions of commercial sale — NXP Semiconductors  
products are sold subject to the general terms and conditions of commercial  
sale, as published at http://www.nxp.com/profile/terms, unless otherwise  
agreed in a valid written individual agreement. In case an individual  
agreement is concluded only the terms and conditions of the respective  
Right to make changes — NXP Semiconductors reserves the right to make  
changes to information published in this document, including without  
limitation specifications and product descriptions, at any time and without  
NX20P0408  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2016. All rights reserved.  
Product Datasheet  
Rev. 1.0 — July 05, 2018  
14 of 18  
 
 
 
 
 
 
 
NX20P0408  
NXP Semiconductors  
USB D+/D- Protection IC  
agreement shall apply. NXP Semiconductors hereby expressly objects to  
applying the customer’s general terms and conditions with regard to the  
purchase of NXP Semiconductors products by customer.  
In the event that customer uses the product for design-in and use in  
automotive applications to automotive specifications and standards,  
customer (a) shall use the product without NXP Semiconductors’ warranty of  
the product for such automotive applications, use and specifications, and (b)  
whenever customer uses the product for automotive applications beyond  
NXP Semiconductors’ specifications such use shall be solely at customer’s  
own risk, and (c) customer fully indemnifies NXP Semiconductors for any  
liability, damages or failed product claims resulting from customer design  
and use of the product for automotive applications beyond NXP  
Semiconductors’ standard warranty and NXP Semiconductors’ product  
specifications.  
No offer to sell or license — Nothing in this document may be interpreted  
or construed as an offer to sell products that is open for acceptance or the  
grant, conveyance or implication of any license under any copyrights,  
patents or other industrial or intellectual property rights.  
Export control — This document as well as the item(s) described herein  
may be subject to export control regulations. Export might require a prior  
authorization from competent authorities.  
Quick reference data — The Quick reference data is an extract of the  
product data given in the Limiting values and Characteristics sections of this  
document, and as such is not complete, exhaustive or legally binding.  
Translations — A non-English (translated) version of a document is for  
reference only. The English version shall prevail in case of any discrepancy  
between the translated and English versions.  
Non-automotive qualified products — Unless this data sheet expressly  
states that this specific NXP Semiconductors product is automotive qualified,  
the product is not suitable for automotive use. It is neither qualified nor  
tested in accordance with automotive testing or application requirements.  
NXP Semiconductors accepts no liability for inclusion and/or use of non-  
automotive qualified products in automotive equipment or applications.  
14.4 Trademarks  
Notice: All referenced brands, product names, service names and  
trademarks are property of their respective owners.  
15. Contact information  
For more information, please visit: http://www.nxp.com  
NX20P0408  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2016. All rights reserved.  
Product Datasheet  
Rev. 1.0 — July 05, 2018  
15 of 18  
 
 
NX20P0408  
NXP Semiconductors  
USB D+/D- Protection IC  
16. List of figures  
Fig 1.  
Fig 2.  
Fig 3.  
Fig 4.  
Fig 5.  
Fig 6.  
Fig 7.  
Block diagram ...................................................3  
NX20P0408, WLCSP12....................................4  
NX20P0408 application diagram.......................6  
Overvoltage protection timing ...........................7  
Post-stage clamp operation ..............................8  
USB High speed Eye diagram of USB switch...9  
Package outline WLCSP12.............................13  
NX20P0408  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2016. All rights reserved.  
Product Datasheet  
Rev. 1.0 — July 05, 2018  
16 of 18  
 
NX20P0408  
NXP Semiconductors  
USB D+/D- Protection IC  
17. List of tables  
Table 1. Ordering information .........................................2  
Table 2. Marking Codes..................................................2  
Table 3. Pin description ..................................................5  
Table 4. Power state.......................................................7  
Table 5. Fault conditions and behavior...........................8  
Table 6. Limiting values (Absolute Maximum Ratings) .10  
Table 7. Recommended Operating Conditions.............10  
Table 8. Thermal characteristics...................................10  
Table 9. Static Characteristics (-40C~85C)...................11  
Table 10. Dynamic Characteristics .................................12  
NX20P0408  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2016. All rights reserved.  
Product Datasheet  
Rev. 1.0 — July 05, 2018  
17 of 18  
 
NX20P0408  
NXP Semiconductors  
USB D+/D- Protection IC  
18. Contents  
1.  
2.  
3.  
4.  
5.  
6.  
General description.............................................1  
Features and benefits .........................................1  
Applications.........................................................1  
Ordering information ..........................................2  
Marking ................................................................2  
Functional Diagram.............................................3  
7.  
7.1  
7.2  
Pinning information ............................................4  
Pinning...............................................................4  
Pin description....................................................5  
8.  
Functional description........................................6  
Power status ......................................................6  
Over voltage protection......................................7  
Post-stage Clamp circuit ....................................8  
Flag....................................................................8  
Switch ................................................................9  
8.1  
8.2  
8.3  
8.4  
8.5  
9.  
Limiting values ..................................................10  
Recommended operating conditions ..............10  
Thermal characteristics....................................10  
10.  
11.  
12.  
12.1  
12.2  
Electrical Characteristics..................................11  
Static Characteristics .......................................11  
Dynamic Characteristics ..................................12  
13.  
Package outline.................................................13  
14.  
Legal information ..............................................14  
Data sheet status .............................................14  
Definitions ........................................................14  
Disclaimers.......................................................14  
Trademarks......................................................15  
14.1  
14.2  
14.3  
14.4  
15.  
16.  
17.  
18.  
Contact information ..........................................15  
List of figures.....................................................16  
List of tables......................................................17  
Contents.............................................................18  
Please be aware that important notices concerning this document and the product(s)  
described herein, have been included in the section 'Legal information'.  
© NXP Semiconductors N.V. 2016.  
All rights reserved.  
For more information, please visit: http://www.nxp.com  
Date of release: July 05, 2018  
Document identifier: NX20P0408  
 
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