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2SK2593J

型号:

2SK2593J

品牌:

PANASONIC[ PANASONIC ]

页数:

2 页

PDF大小:

50 K

Silicon Junction FETs (Small Signal)  
2SK2593J  
Silicon N-channel junction FET  
Unit: mm  
+0.05  
–0.03  
1.60  
+0.03  
–0.01  
0.12  
For low-frequency amplification  
For switching circuits  
1.00 0.05  
3
Features  
Low noise figure NF  
High gate-drain voltage (source open) VGDO  
SS-Mini type package, allowing downsizing of the equipment and  
automatic insertion through the tape packing.  
1
2
0.27 0.02  
(0.50)(0.50)  
5˚  
Absolute Maximum Ratings Ta = 25°C  
Parameter  
Drain-sourse voltage  
Symbol  
VDS  
VGDO  
VGSO  
ID  
Rating  
Unit  
V
55  
55  
1: Source  
2: Drain  
3: Gate  
Gate-drain voltage (Source open)  
Gate-source voltage (Drain open)  
Drain current  
V
55  
V
EIAJ: SC-89  
SSMini3-F1 Package  
30  
mA  
mA  
mW  
°C  
Marking Symbol: 2B  
Gate current  
IG  
10  
Power dissipation  
PD  
125  
Channel temperature  
Storage temperature  
Tch  
125  
Tstg  
55 to +125  
°C  
Electrical Characteristics Ta = 25°C 3°C  
Parameter  
Gate-drain surrender voltage  
Drain-source cutoff current *  
Gate-source cutoff current  
Gate-source cutoff voltage  
Forward transfer admittance  
Symbol  
VGDS  
IDSS  
Conditions  
IG = −100 µA, VDS = 0  
Min  
55  
1.0  
Typ  
Max  
Unit  
V
VDS = 10 V, VGS = 0  
6.5  
10  
5  
mA  
nA  
V
IGSS  
VGS = −30 V, VDS = 0  
VGSC  
Yfs  
Ciss  
VDS = 10 V, ID = 10 µA  
VDS = 10 V, ID = 5 mA, f = 1 kHz  
VDS = 10 V, VGS = 0, f = 1 MHz  
2.5  
7.5  
6.5  
mS  
pF  
Short-circuit forward transfer capacitance  
(Common source)  
Crss  
NF  
1.9  
2.5  
pF  
Reverse transfer capacitance  
(Common source)  
Noise figure  
VDS = 10 V, VGS = 0, f = 100 Hz  
Rg = 100 kΩ  
dB  
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.  
2. : Rank classification  
*
Rank  
P
Q
IDSS (mA)  
1.0 to 3.0  
2.0 to 6.5  
Publication date: December 2004  
SJF00040AED  
1
Request for your special attention and precautions in using the technical information  
and semiconductors described in this material  
(1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of  
the products or technical information described in this material and controlled under the "Foreign Exchange  
and Foreign Trade Law" is to be exported or taken out of Japan.  
(2) The technical information described in this material is limited to showing representative characteristics and  
applied circuits examples of the products. It neither warrants non-infringement of intellectual property right  
or any other rights owned by our company or a third party, nor grants any license.  
(3) We are not liable for the infringement of rights owned by a third party arising out of the use of the technical  
information as described in this material.  
(4) The products described in this material are intended to be used for standard applications or general elec-  
tronic equipment (such as office equipment, communications equipment, measuring instruments and house-  
hold appliances).  
Consult our sales staff in advance for information on the following applications:  
Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combus-  
tion equipment, life support systems and safety devices) in which exceptional quality and reliability are  
required, or if the failure or malfunction of the products may directly jeopardize life or harm the human  
body.  
Any applications other than the standard applications intended.  
(5) The products and product specifications described in this material are subject to change without notice for  
modification and/or improvement. At the final stage of your design, purchasing, or use of the products,  
therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifica-  
tions satisfy your requirements.  
(6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rat-  
ing, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not  
be liable for any defect which may arise later in your equipment.  
Even when the products are used within the guaranteed values, take into the consideration of incidence of  
break down and failure mode, possible to occur to semiconductor products. Measures on the systems such  
as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent  
physical injury, fire, social damages, for example, by using the products.  
(7) When using products for which damp-proof packing is required, observe the conditions (including shelf life  
and amount of time let standing of unsealed items) agreed upon when specification sheets are individually  
exchanged.  
(8) This material may be not reprinted or reproduced whether wholly or partially, without the prior written  
permission of Matsushita Electric Industrial Co., Ltd.  
2003 SEP  
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