2SK3730-01MR
FUJI POWER MOSFET
N-CHANNEL SILICON POWER MOSFET
Trench Power MOSFET
■Features
■Outline Drawings [mm]
■Equivalent circuit schematic
High speed switching
Low on-resistance
No secondary breakdown
Low driving power
Avalanche-proof
Drain (D)
■Applications
Gate (G)
Source (S)
Switching regulators
DC-DC converters
General purpose power amplifier
■Absolute Maximum Ratings at Tc=25℃(unless otherwise specified)
Description
Symbol
VDS
VDSX
ID
Characteristics
Unit
V
Remarks
VGS=-20V
75
40
Drain-Source Voltage
V
Continuous Drain Current
±70
±280
±20
70
A
Pulsed Drain Current
IDP
A
Gate-Source Voltage
VGS
IAS
V
Non-Repetitive Maximum Avalanche current
Non-Repetitive Maximum Avalanche Energy
Maximum Power Dissipation
A
Note*1
Note*2
EAS
PD
251
mJ
W
℃
℃
70
Tch
150
Operating and Storage Temperature range
Tstg
-55 to +150
Note*1 : Tch≦150℃,See Fig.1 and Fig.2
Note*2 : Starting Tch=25℃,L=48μH,VCC=48V,RG=50Ω,See Fig.1 and Fig.2
EAS limited by maximum channel temperature and avalanche current.
See to Avalanche Energy graph of page 4
■Electrical Characteristics at Tc=25℃(unless otherwise specified)
Static Ratings
Description
Symbol
BVDSS
Conditions
Min.
Typ.
Max.
Unit
V
ID=1mA
VGS=0V
75
40
-
-
Drain-Source Breakdown Voltage
ID=1mA
BVDSX
V
V
-
-
VGS=-20V
ID=10mA
VDS= VGS
Gate Threshold Voltage
VGS(th)
2.5
3.0
3.5
Tch=25℃
1
100
500
-
-
VDS= 75V
VGS=0V
Zero Gate Voltage Drain current
IDSS
μA
Tch=125℃
10
VGS= ±20V
Gate-Source Leakage current
IGSS
10
100
7.9
nA
-
-
VDS= 0V
ID=35A
Drain-Source On-State Resistance
RDS(on)
6.4
mΩ
VGS=10V
http://www.fujielectric.co.jp/products/semiconductor/index.html
1
Jul. 2013