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IX21844NTR

型号：

IX21844NTR

品牌：

IXYS[ IXYS CORPORATION ]

页数：

14 页

PDF大小：

307 K

下载PDF手册
IX21844  
High Voltage Half-Bridge  
Gate Driver  
INTEGRATED  
C
IRCUITS  
D
IVISION  
Driver Characteristics  
Description  
The IX21844 is a high voltage IC that can drive high  
speed MOSFETs and IGBTs that operate up to  
+600V. The IX21844 is configured with dependent  
high-side and low side referenced output channels  
which can source 1.4A and sink 1.8A. The floating  
high-side channel can drive an N-channel power  
MOSFET or IGBT 600V from the common reference.  
Parameter  
VOFFSET  
Rating  
Units  
600  
V
A
V
IO +/- (Source/Sink)  
1.4 / 1.8  
10-20  
V
BIAS  
Features  
Manufactured on IXYS Integrated Circuits Division's  
proprietary high-voltage BCDMOS on SOI (silicon on  
isolator) process, the IX21844 is extremely robust and  
virtually immune to negative transients. The UVLO  
circuit prevents the turn-on of the MOSFET or IGBT  
• Floating Channel for Bootstrap Operation to +600V  
with an Absolute Maximum Rating of +700V  
• Programmable Dead-Time  
• Outputs Can Source 1.4A and Sink 1.8A  
• Gate Drive Supply Range From 10V to 20V  
• Tolerant to Negative Voltage Transients:  
dV/dt Immune  
• 3.3V and 5V Logic Compatible  
• Undervoltage Lockout for Both High-side and  
Low-Side Outputs  
until there is sufficient V or V supply voltage. A  
BS  
CC  
programmable dead-time can be set between 400ns  
and 5us to insure that both the high-side and low-side  
power MOSFET or IGBT are not enabled at the same  
time. Propagation delays are matched for use in high  
frequency applications.  
• Matched Propagation Delays  
Applications  
• Switch Mode Power Supply  
• Motor Driver Inverter  
The IX21844 is available in 14-pin DIP and 14-pin  
SOIC (narrow body) packages. The 14-pin SOIC  
(narrow body) package is also available in tape & reel.  
• DC/DC Converter  
Ordering Information  
• Uninterruptible Power Supplies (UPS)  
Part  
Description  
IX21844G  
IX21844N  
14-Pin DIP (25/Tube)  
14-Pin SOIC (Narrow Body) (50/Tube)  
IX21844NTR 14-Pin SOIC (Narrow Body) (2000/Reel)  
IX21844 Functional Block Diagram  
VB  
Level  
Shift  
UVLO  
High  
IN  
Pulse  
Generator  
Voltage  
Level  
Shift  
V
SS / COM  
R
Input  
&
R
S
Buffer  
Q
HO  
Dead-Time  
Control Logic  
DT  
SD  
VSS  
+5V  
VS  
UVLO  
VCC  
Level  
Shift  
LS Delay  
Control  
Buffer  
LO  
V
SS / COM  
COM  
DS-IX21844-R01  
www.ixysic.com  
1
IX21844  
INTEGRATED  
C
IRCUITS  
D
IVISION  
1. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
1.1 Package Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
1.2 Pin Description (DIP & SOIC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
1.3 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4  
1.4 Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4  
1.5 Static Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5  
1.6 Dynamic Electrical Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5  
1.7 Test Waveforms. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
2. Performance Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7  
3. Manufacturing Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12  
3.1 Moisture Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12  
3.2 ESD Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12  
3.3 Reflow Profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12  
3.4 Board Wash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12  
3.5 Mechanical Dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
2
www.ixysic.com  
R01  
IX21844  
INTEGRATED  
C
IRCUITS  
D
IVISION  
1 Specifications  
1.1 Package Pinout  
IN  
1
14 N/C  
13 VB  
SD  
VSS  
2
3
12 HO  
11 VS  
DT  
4
5
10 N/C  
COM  
9
N/C  
N/C  
LO  
VCC  
6
7
8
1.2 Pin Description (DIP & SOIC)  
Pin#  
Name  
Description  
Logic input for both high-side gate  
drive output (HO) and low-side gate  
drive output (LO). In phase with HO.  
1
IN  
2
3
SD  
Shut-down logic input. Active low.  
Logic ground  
V
SS  
4
DT  
COM  
LO  
Programmable Dead-Time input  
Low-side return  
5
6
Low-side gate drive output  
Low-side and logic supply  
No connection  
V
7
CC  
8
N/C  
N/C  
N/C  
9
No connection  
10  
11  
12  
13  
14  
No connection  
V
High-side floating supply return  
High-side gate drive output  
High-side floating supply  
No connection  
S
HO  
V
B
N/C  
R01  
www.ixysic.com  
3
IX21844  
INTEGRATED  
C
IRCUITS  
D
IVISION  
1.3 Absolute Maximum Ratings  
Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage  
parameters are absolute voltages referenced to COM.  
Parameter  
High-Side Floating Absolute Voltage  
High-Side Floating Supply Offset Voltage  
High-Side Floating Output Voltage  
Low-Side and Logic Fixed Supply Voltage  
Low-Side Output Voltage  
Symbol  
Min  
Max  
Units  
V
-0.3  
VB-20  
700  
VB+0.3  
B
V
S
V
VS-0.3  
-0.3  
VB+0.3  
HO  
V
20  
CC  
V
V
V
CC+0.3  
VCC+0.3  
VCC+0.3  
VCC+0.3  
LO  
-0.3  
VSS-0.3  
Programmable Dead-Time Pin Voltage  
Logic Input Voltage  
DT  
V , V  
IN SD  
VSS-0.3  
VCC-20  
V
Logic ground  
SS  
dV /dt  
S
Allowable Offset Supply Voltage Transient  
-
-
-
-
-
-
50  
1.6  
1
V/ns  
W
14-Pin PDIP  
14-Pin SOIC  
14-Pin PDIP  
14-Pin SOIC  
Package Power Dissipation @ T 25°C  
PD  
A
75  
R
Thermal Resistance, Junction to Ambient  
°C/W  
°C  
JA  
120  
150  
150  
300  
T
Junction Temperature  
J
T
Storage Temperature  
-50  
-
S
T
Lead Temperature (Soldering, 10 Seconds)  
L
1.4 Recommended Operating Conditions  
For proper operation, the device should be used within the recommended conditions. The V and V offset ratings  
S
SS  
are tested with all supplies biased at a 15V differential.  
Parameter  
Symbol  
Min  
Max  
Units  
V
High-Side Floating Supply Absolute Voltage  
High-Side Floating Supply Offset Voltage  
High-Side Floating Output Voltage  
Low-Side and Logic Fixed Supply Voltage  
Low-Side Output Voltage  
VS+10  
VS+20  
B
V
-5  
600  
VB  
S
V
VS  
HO  
V
10  
0
20  
VCC  
CC  
V
V
LO  
V , V  
Logic Input Voltage  
VSS  
VSS  
-5  
VSS + 5  
VCC  
IN SD  
Programmable Dead-Time Pin Voltage  
Logic Ground  
DT  
V
5
SS  
T
Ambient Temperature  
-40  
+125  
°C  
A
4
www.ixysic.com  
R01  
IX21844  
INTEGRATED  
C
IRCUITS  
D
IVISION  
1.5 Static Electrical Characteristics  
(V , V )=15V, V =COM, DT=V , and T =25°C unless otherwise specified. The V , V , and I  
IN  
V
BIAS  
CC BS  
SS  
SS  
A
IL IH  
parameters are referenced to V /COM and are applicable to the respective input leads: IN and SD. V and I are  
SS  
O
O
referenced to COM and are applicable to the respective output leads: HO and LO.  
Parameter  
Logic “1” Input Voltage  
Conditions  
Symbol  
Min  
Typ  
Max  
Units  
V
2
-
-
IH  
Logic “0” Input Voltage  
V
-
2
-
-
-
-
-
0.8  
-
IL  
V
=10V to 20V  
CC  
V
SD Input Positive Going Threshold  
SD Input Negative Going Threshold  
SD,TH+  
V
V
0.8  
2.5  
SD,TH-  
High Level Output Voltage, V  
- V  
I =0A  
O
V
-
BIAS  
O
OH  
Low Level Output Voltage, V  
I =20mA  
O
V
-
-
-
33  
87  
1.8  
35  
-
0.2  
60  
150  
2.2  
60  
1
O
OL  
V =V =600V  
S
Offset Supply Leakage Current  
I
B
LK  
A  
mA  
A  
Quiescent V Supply Current  
BS  
I
20  
0.4  
-
QBS  
V =0V or 5V  
IN  
Quiescent V Supply Current  
CC  
I
QCC  
Logic “1” Input Bias Current  
Logic “0” Input Bias Current  
SD Logic “1” Input Bias Current  
SD Logic “0” Input Bias Current  
IN=5V  
IN=0V  
I
IN+  
I
-
IN-  
V
=5V  
I
-
-
30  
60  
A  
A  
SD  
SD  
SD+  
V
=0V  
I
-
15  
SD-  
V
and V Supply  
BS  
V
CC  
CCUV+  
8
8.6  
7.9  
0.7  
9.8  
9
Under-voltage Positive Going Threshold  
and V Supply  
V
BSUV+  
V
V
CC  
BS  
CCUV-  
-
7.4  
0.3  
V
Under-voltage Negative Going Threshold  
V
BSUV-  
V
CCUVH  
Hysteresis  
-
V
BSUVH  
V =0V, PW<10s  
Output High Short Circuit Pulsed Current  
Output Low Short Circuit Pulsed Current  
I +  
O
1.4  
1.8  
2.2  
2.5  
-
-
O
A
V =15V, PW<10s  
I -  
O
O
1.6 Dynamic Electrical Characteristics  
V
(V , V )=15V, C =1000pF, T =25°C, DT=V , and V =COM unless otherwise specified.  
BIAS  
CC BS  
L
A
SS  
SS  
Parameter  
Conditions  
Symbol  
ton  
Min  
Typ  
Max  
Units  
V =0V  
S
Turn-On Propagation Delay  
Turn-Off Propagation Delay  
Shutdown propagation Delay  
-
-
560  
200  
900  
400  
V =0V or 600V  
S
toff  
-
tSD  
-
-
-
-
225  
0
0
400  
90  
40  
Delay Matching, HS & LS Turn-on  
Delay Matching, HS & LS Turn-off  
Turn-On Rise Time  
MTon  
MToff  
tr  
ns  
23  
60  
V =0V  
S
Turn-Off Fall Time  
tf  
-
14  
355  
5
35  
520  
6
Dead-Time: LO Turn-off to HO Turn-on (DT  
)
R
=0  
280  
LO-HO  
DT  
DT  
R
R
=200k  
=0  
& HO Turn-off to LO Turn-on (DT  
)
4
-
s  
DT  
HO-LO  
R
0
50  
DT  
Dead-Time Matching: (DT  
) - (DT  
)
MDT  
ns  
LO-HO  
HO-LO  
=200k  
-
0
600  
DT  
R01  
www.ixysic.com  
5
IX21844  
INTEGRATED  
C
IRCUITS  
D
IVISION  
1.7 Test Waveforms  
1.7.1 Switching Time Test Circuit  
IN  
1
14  
13  
VB=15V  
HO  
SD  
2
3 VSS  
4 DT  
5 COM  
6
12  
CL  
10μF 0.1μF  
VS 11  
10  
9
LO  
CL  
7 VCC  
8
VCC=15V  
10μF  
0.1μF  
1.7.2 Input/Output Timing Diagram  
1.7.5 Delay Matching Waveform Definitions  
IN(LO)  
IN  
50%  
50%  
HO  
IN(HO)  
SD  
LO  
10%  
HO  
LO  
MT  
HO  
MT  
90%  
LO  
1.7.6 Switching Time Waveform Definitions  
1.7.3 Shutdown Waveform Definition  
IN(LO)  
SD  
50%  
50%  
toff  
50%  
IN(HO)  
tsd  
ton  
tf  
tr  
HO  
LO  
90%  
90%  
90%  
LO  
HO  
10%  
10%  
1.7.4 Dead-Time Waveform Definition  
1.7.7 Truth Table  
IN  
SD  
HO  
LO  
50%  
50%  
IN  
1
0
1
1
0
H
L
L
L
H
L
90%  
DTLO-HO  
HO  
LO  
10%  
X
DTHO-LO  
10%  
MDT= DTLO-HO - DTHO-LO  
90%  
6
www.ixysic.com  
R01  
IX21844  
INTEGRATED  
C
IRCUITS  
D
IVISION  
2 Performance Characteristics  
Turn-On Propagation Delay  
vs. VBIAS Supply Voltage  
Turn-On Propagation Delay  
Turn-Off Propagation Delay  
vs. VBIAS Supply Voltage  
vs.Temperature  
1000  
500  
400  
300  
200  
100  
0
1000  
900  
800  
700  
600  
500  
400  
300  
900  
800  
700  
600  
500  
400  
300  
10  
12  
14  
16  
18  
20  
10  
12  
14  
16  
18  
20  
-50 -25  
0
25  
50  
75 100 125 150  
Supply Voltage (V)  
Supply Voltage (V)  
Temperature (ºC)  
Turn-On Rise Time  
vs. VBIAS Supply Voltage  
Turn-On Rise Time  
vs.Temperature  
Turn-Off Propagation Delay  
vs.Temperature  
50  
40  
30  
20  
10  
0
50  
40  
30  
20  
10  
0
500  
400  
300  
200  
100  
0
10  
12  
14  
16  
18  
20  
-50 -25  
0
25  
50  
75 100 125 150  
-50 -25  
0
25  
50  
75 100 125 150  
Temperature (ºC)  
Supply Voltage (V)  
Temperature (ºC)  
Deadtime  
vs. VBIAS Supply Voltage  
(RDT=0Ω)  
Turn-Off Fall Time  
vs. VBIAS Supply Voltage  
Turn-Off Fall Time  
vs.Temperature  
50  
40  
30  
20  
10  
0
600  
500  
400  
300  
200  
100  
0
50  
40  
30  
20  
10  
0
10  
12  
14  
16  
18  
20  
10  
12  
14  
16  
18  
20  
-50 -25  
0
25  
50  
75 100 125 150  
Supply Voltage (V)  
Supply Voltage (V)  
Temperature (ºC)  
Deadtime  
vs.Temperature  
(RDT=0Ω)  
SD Propagation Delay  
vs. VBIAS Supply Voltage  
Deadtime  
vs. RDT  
400  
350  
300  
250  
200  
150  
100  
50  
600  
500  
400  
300  
200  
100  
0
6
5
4
3
2
1
0
0
10  
12  
14  
16  
18  
20  
-50 -25  
0
25  
50  
75 100 125 150  
0
50  
100  
150  
200  
Supply Voltage (V)  
Temperature (ºC)  
RDT (kΩ)  
R01  
www.ixysic.com  
7
IX21844  
INTEGRATED  
C
IRCUITS  
D
IVISION  
SD Propagation Delay  
SD Input Positive Going Threshold  
vs. VBIAS Supply Voltage  
SD Input Positive Going Threshold  
vs.Temperature  
vs.Temperature  
400  
350  
300  
250  
200  
150  
100  
50  
5
4
3
2
1
0
5
4
3
2
1
0
0
-50 -25  
0
25  
50  
75 100 125 150  
-50 -25  
0
25  
50  
75 100 125 150  
10  
12  
14  
16  
18  
20  
Temperature (ºC)  
Temperature (ºC)  
Supply Voltage (V)  
SD Input Negative Going Threshold  
vs. VBIAS Supply Voltage  
SD Input Negative Going Threshold  
VCC and VBS Undervoltage Threshold (-)  
vs.Temperature  
vs.Temperature  
5
4
3
2
1
0
5
4
3
2
1
0
15  
12  
9
6
3
0
10  
12  
14  
16  
18  
20  
-50 -25  
0
25  
50  
75 100 125 150  
-50 -25  
0
25  
50  
75 100 125 150  
Temperature (ºC)  
Supply Voltage (V)  
Temperature (ºC)  
VBS Supply Current  
vs.Temperature  
VCC and VBS Undervoltage Threshold (+)  
VBS Floating Supply Current  
vs. VBS Floating Supply Voltage  
vs Temperature  
250  
200  
150  
100  
50  
250  
200  
150  
100  
50  
15  
12  
9
6
3
0
0
0
-50 -25  
0
25  
50  
75 100 125 150  
10  
12  
14  
16  
18  
20  
-50 -25  
0
25  
50  
75 100 125 150  
Temperature (ºC)  
Supply Voltage (V)  
Temperature (ºC)  
VCC Supply Current  
vs.Temperature  
(VCC=15V)  
VCC Supply Current  
vs. VCC Supply Voltage  
Offset Supply Leakage Current  
vs.Temperature  
5
4
3
2
1
0
5
4
3
2
1
0
100  
75  
50  
25  
0
10  
12  
14  
16  
18  
20  
-50 -25  
0
25  
50  
75 100 125 150  
-50 -25  
0
25  
50  
75 100 125 150  
Supply Voltage (V)  
Temperature (ºC)  
Temperature (ºC)  
8
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R01  
IX21844  
INTEGRATED  
C
IRCUITS  
D
IVISION  
Logic "1" Input Bias Current  
Logic "0" Input Bias Current  
vs. VCC Supply Voltage  
Logic "1" Input Bias Current  
vs. VCC Supply Voltage  
vs.Temperature  
100  
80  
60  
40  
20  
0
5
4
3
2
1
0
100  
80  
60  
40  
20  
0
-50 -25  
0
25  
50  
75 100 125 150  
10  
12  
14  
16  
18  
20  
10  
12  
14  
16  
18  
20  
Temperature (ºC)  
Supply Voltage (V)  
Supply Voltage (V)  
Logic "1" Input Voltage  
Logic "0" Input Bias Current  
Logic "1" Input Voltage  
vs. VCC Supply Voltage  
vs.Temperature  
vs.Temperature  
6
5
4
3
2
1
0
5
4
3
2
1
0
6
5
4
3
2
1
0
-50 -25  
0
25  
50  
75 100 125 150  
-50 -25  
0
25  
50  
75 100 125 150  
10  
12  
14  
16  
18  
20  
Temperature (ºC)  
Temperature (ºC)  
Supply Voltage (V)  
Logic "0" Input Voltage  
Logic "0" Input Voltage  
vs. VCC Supply Voltage  
High Level Output (VBIAS-VO)  
vs. VBIAS Supply Voltage  
vs.Temperature  
6
5
4
3
2
1
0
6
5
4
3
2
1
0
5
4
3
2
1
0
-50 -25  
0
25  
50  
75 100 125 150  
10  
12  
14  
16  
18  
20  
10  
12  
14  
16  
18  
20  
Temperature (ºC)  
Supply Voltage (V)  
Supply Voltage (V)  
Low Level Output Voltage (VO)  
High Level Output Voltage (VBIAS - VO)  
Low Level Output Voltage (VO)  
vs. VBIAS Supply Voltage  
vs.Temperature  
vs.Temperature  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
5
4
3
2
1
0
1.0  
0.8  
0.6  
0.4  
0.2  
0
-50 -25  
0
25  
50  
75 100 125 150  
-50 -25  
0
25  
50  
75 100 125 150  
10  
12  
14  
16  
18  
20  
Temperature (ºC)  
Temperature (ºC)  
Supply Voltage (V)  
R01  
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9
IX21844  
INTEGRATED  
C
IRCUITS  
D
IVISION  
Output Source Current  
vs.Temperature  
Output Source Current  
vs. VBIAS Supply Voltage  
5
4
3
2
1
0
5
4
3
2
1
0
-50 -25  
0
25  
50  
75 100 125 150  
10  
12  
14  
16  
18  
20  
Temperature (ºC)  
Supply Voltage (V)  
Output Sink Current  
vs. VBIAS Supply Voltage  
Output Sink Current  
vs.Temperature  
5
4
3
2
1
0
5
4
3
2
1
0
10  
12  
14  
16  
18  
20  
-50 -25  
0
25  
50  
75 100 125 150  
Supply Voltage (V)  
Temperature (ºC)  
10  
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R01  
IX21844  
INTEGRATED  
C
IRCUITS  
D
IVISION  
Figure 1. Typical Connection Diagram  
up to 600V  
VCC  
IN  
VCC  
HO  
VB  
VS  
IN  
LOAD  
SD  
SD  
DT  
RDT  
COM  
LO  
VSS  
VSS  
R01  
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11  
IX21844  
INTEGRATED  
C
IRCUITS  
D
IVISION  
3 Manufacturing Information  
3.1 Moisture Sensitivity  
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated  
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the  
latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product  
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee  
proper operation of our devices when handled according to the limitations and information in that standard as well as  
to any limitations set forth in the information or standards referenced below.  
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced  
product performance, reduction of operable life, and/or reduction of overall reliability.  
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to  
the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.  
Device  
Moisture Sensitivity Level (MSL) Rating  
IX21844G / IX21844N  
MSL 1  
3.2 ESD Sensitivity  
This product is ESD Sensitive, and should be handled according to the industry standard  
JESD-625.  
3.3 Reflow Profile  
This product has a maximum body temperature and time rating as shown below. All other guidelines of  
J-STD-020 must be observed.  
Device  
Maximum Temperature x Time  
IX21844G (DIP)  
245°C for 30 seconds  
260°C for 30 seconds  
IX21844N (SOIC)  
3.4 Board Wash  
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to  
remove flux residue is acceptable, and the use of a short drying bake may be necessary. Chlorine-based or  
Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be  
used.  
12  
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IX21844  
INTEGRATED  
C
IRCUITS  
D
IVISION  
3.5 Mechanical Dimensions  
3.5.1 IX21844G 14-Pin DIP Package  
18.542 / 19.050  
(0.730 / 0.750)  
See Note 2  
PCB Hole Pattern  
0º / 15º  
8.509 / 9.525  
7.62  
(0.300)  
7.62 BSC  
(0.300 BSC)  
1.35  
(0.053)  
(0.335 / 0.375)  
See Note 3  
Pin 1  
2.542  
(0.100)  
2.54  
(0.100)  
1.524 typ  
(0.06 typ)  
0.85  
(0.0335)  
Hole Size =  
6.223 / 6.477  
(0.245 / 0.255)  
See Note 2  
5.334 max  
NOTES:  
(0.210 max)  
3.175 / 3.429  
1. JEDEC outline: MS-001 AA.  
(0.125 / 0.135)  
2. This dimension does not include mold flash or  
protrusions. Mold flash or protrusions shall not  
exceed 0.254 (0.010).  
3. Measured at the lead tips with the leads  
unconstrained.  
4. Pointed or rounded lead tips are preferred to  
ease insertion.  
5. Distance between leads including dam bar  
protrusions to be 0.127 (0.005).  
6. Datum plane H coincident with the bottom of  
lead where lead exits body.  
H
Seating Plane  
0.457 typ  
(0.018 typ)  
2.921 / 3.810  
(0.115 / 0.150)  
0.381 min  
(0.015 min)  
DIMENSIONS  
(min / max)  
mm  
(inches)  
3.5.2 IX21844N 14-Pin SOIC (Narrow Body) Package  
8.65 BSC  
(0.341 BSC)  
See Note 2  
PCB Pattern  
3.90 BSC  
(0.154 BSC)  
See Note 3  
5.98 / 6.02  
(0.235 / 0.237)  
5.30  
(0.209)  
1.50  
(0.059)  
0.15 / 0.25  
(0.006 / 0.010)  
0.31 / 0.51  
0.60  
(0.024)  
1.27  
(0.05)  
DIMENSIONS  
(0.012 / 0.020)  
min / max  
mm  
1.25 min  
(inches)  
(0.049 min)  
NOTES:  
1. JEDEC outline: MS-012 AB Rev F. (reference)  
2. Molded package dimension do not include mold flash,  
protrusions, or gate burrs. Mold flash, protrusions, and  
gate burrs shall not exceed 0.15 (0.006) per side.  
3. Lead dimensions do not include inter-lead flash or  
protrusions. Inter-lead flash and protrusions shall not  
exceed 0.25 (0.010) per side.  
0º / 8º  
1.27 TYP  
1.75 max  
(0.05 TYP)  
(0.069 max)  
0.4 / 0.95  
(0.016 / 0.037)  
0.10 / 0.25  
(0.004 / 0.010)  
R01  
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13  
IX21844  
INTEGRATED  
C
IRCUITS  
D
IVISION  
3.5.3 IX21844NTR Tape & Reel Packaging  
1.75 0.10  
4.00 0.10  
8.00 0.10  
330.2 DIA.  
(13.00 DIA.)  
2.00 0.10  
7.50 0.10  
Top Cover  
Tape Thickness  
0.102 MAX.  
1.20  
(0.004 MAX.)  
Ø1.50  
+0.1, -0  
6.50 9.65 0.10  
16.00 0.30  
Embossed Carrier  
3.50  
6.55 0.10  
Ø1.50 MIN  
Embossment  
2.35 0.10  
2.85 0.10  
NOTES:  
1. All dimensions in millimeters  
2. 10 sprocket hole pitch cumulative tolerance 0.20.  
3. Carrier camber is within 1mm in 250mm.  
4. Tape material : Black Conductive Polystyrene Alloy.  
5. All dimensions meet EIA-481-C requirements.  
6. Thickness : 0.30 0.05mm.  
For additional information please visit our website at: www.ixysic.com  
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make  
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated  
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its  
products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.  
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other  
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe  
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.  
Specification: DS-IX21844-R01  
©Copyright 2013, IXYS Integrated Circuits Division  
All rights reserved. Printed in USA.  
12/19/2013  
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