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2SK3469-01

型号:

2SK3469-01

描述:

N沟道硅功率MOSFET[ N CHANNEL SILICON POWER MOSFET ]

品牌:

FUJI[ FUJI ELECTRIC ]

页数:

4 页

PDF大小:

117 K

FUJI POWER MOSFET  
2SK3469-01MR  
Super FAP-G Series  
N-CHANNEL SILICON POWER MOSFET  
Outline Drawings  
TO-220F  
Features  
High speed switching  
Low on-resistance  
No secondary breadown  
Low driving power  
Avalanche-proof  
Applications  
Switching regulators  
UPS (Uninterruptible Power Supply)  
DC-DCconverters  
Maximum ratings and characteristicAbsolute maximum ratings  
(Tc=25°C unless otherwise specified)  
Item  
Symbol  
VDS  
Ratings  
500  
Unit  
V
Drain-source voltage  
Continuous drain current  
Pulsed drain current  
Gate-source voltage  
Repetitive or non-repetitive  
Maximum Avalanche Energy  
Maximum Drain-Source dV/dt  
Peak Diode Recovery dV/dt  
Max. power dissipation  
Equivalent circuit schematic  
A
ID  
±12  
±48  
±30  
12  
A
ID(puls]  
VGS  
V
Drain(D)  
A
IAR *2  
mJ  
kV/µs  
kV/µs  
W
EAS*1  
dVDS/dt  
dV/dt *3  
PD Ta=25  
Tc=25  
Tch  
217  
20  
5
Gate(G)  
°C  
°C  
2.16  
Source(S)  
50  
+150  
-55 to +150  
Operating and storage  
temperature range  
°C  
°C  
<
Tstg  
<
<
<
*3 IF=-ID, -di/dt=50A/µs, Vcc=BVDSS, Tch=150°C  
*1 L=2.77mH, Vcc=50V *2 Tch=150°C  
Electrical characteristics (Tc =25°C unless otherwise specified)  
Min.  
Typ.  
Max. Units  
Symbol  
V(BR)DSS  
VGS(th)  
Item  
Test Conditions  
Drain-source breakdown voltaget  
Gate threshold voltage  
µ
V
ID=250 A  
VGS=0V  
500  
V
µ
ID= 250 A  
VDS=VGS  
3.0  
5.0  
25  
µA  
VDS=500V VGS=0V  
VDS=400V VGS=0V  
VGS=±30V  
VDS=0V  
Tch=25°C  
Zero gate voltage drain current  
IDSS  
250  
100  
Tch=125°C  
IGSS  
RDS(on)  
gfs  
nA  
Gate-source leakage current  
Drain-source on-state resistance  
Forward transcondutance  
Input capacitance  
10  
ID=6A VGS=10V  
0.40  
0.52  
S
ID=6A VDS=25V  
5.5  
11  
1200  
140  
Ciss  
pF  
1800  
210  
VDS=25V  
VGS=0V  
Coss  
Crss  
td(on)  
tr  
Output capacitance  
Reverse transfer capacitance  
Turn-on time ton  
6.0  
9.0  
f=1MHz  
VCC=300V ID=6A  
ns  
17  
15  
34  
7
26  
23  
51  
11  
VGS=10V  
td(off)  
tf  
Turn-off time toff  
RGS=10  
QG  
nC  
Total Gate Charge  
30  
11  
10  
45  
16.5  
15  
VCC=250V  
ID=12A  
QGS  
QGD  
IAV  
Gate-Source Charge  
Gate-Drain Charge  
VGS=10V  
12  
A
Avalanche capability  
Diode forward on-voltage  
Reverse recovery time  
Reverse recovery charge  
L=2.77mH Tch=25°C  
VSD  
trr  
Qrr  
1.00  
1.50  
V
IF=12A VGS=0V Tch=25°C  
IF=12A VGS=0V  
-di/dt=100A/µs  
0.7  
4.5  
µs  
µC  
Tch=25°C  
Thermalcharacteristics  
Item  
Min.  
Typ.  
Max. Units  
Symbol  
Test Conditions  
Rth(ch-c)  
channel to case  
2.50  
°C/W  
Thermal resistance  
Rth(ch-a)  
channel to ambient  
58.0  
°C/W  
1
2SK3469-01MR  
FUJI POWER MOSFET  
Characteristics  
Maximum Avalanche Energy vs. starting Tch  
E(AV)=f(starting Tch):Vcc=50V,I(AV)<=12A  
Allowable Power Dissipation  
PD=f(Tc)  
60  
50  
40  
30  
20  
10  
0
300  
250  
200  
150  
100  
50  
0
0
25  
50  
75  
100  
125  
150  
0
25  
50  
75  
100  
125  
150  
starting Tch [°C]  
Tc [°C]  
Typical Transfer Characteristic  
ID=f(VGS):80µs Pulse test, VDS=25V,Tch=25°C  
Typical Output Characteristics  
ID=f(VDS):80µs Pulse test,Tch=25°C  
30  
28  
26  
24  
22  
20  
18  
16  
14  
12  
10  
8
20V  
10V  
8V  
10  
7.5V  
7.0V  
1
VGS=6.5V  
6
4
0.1  
2
0
0
1
2
3
4
5
6
7
8
9
10  
0
2
4
6
8
10 12 14 16 18 20 22 24 26 28 30  
VDS [V]  
VGS[V]  
Typical Drain-Source on-state Resistance  
Typical Transconductance  
gfs=f(ID):80µs Pulse test, VDS=25V,Tch=25°C  
RDS(on)=f(ID):80µs Pulse test, Tch=25°C  
100  
10  
1
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
VGS=6.5V  
7.0V  
7.5V  
10V  
20V  
8V  
0.1  
0.1  
1
10  
0
5
10  
15  
20  
25  
30  
ID [A]  
ID [A]  
2
2SK3469-01MR  
FUJI POWER MOSFET  
Gate Threshold Voltage vs. Tch  
Drain-Source On-state Resistance  
VGS(th)=f(Tch):VDS=VGS,ID=250uA  
RDS(on)=f(Tch):ID=6A,VGS=10V  
1.4  
1.3  
1.2  
1.1  
1.0  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0.0  
7.0  
6.5  
6.0  
5.5  
5.0  
4.5  
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
max.  
min.  
max.  
typ.  
-50  
-25  
0
25  
50  
75  
100  
125  
150  
-50  
-25  
0
25  
50  
75  
100  
125  
150  
Tch [°C]  
Tch [°C]  
Typical Capacitance  
C=f(VDS):VGS=0V,f=1MHz  
Typical Gate Charge Characteristics  
VGS=f(Qg):ID=12A, Tch=25°C  
24  
22  
20  
18  
16  
14  
12  
10  
8
10n  
Vcc= 120V  
Ciss  
1n  
100p  
10p  
1p  
300V  
480V  
Coss  
Crss  
6
4
2
0
10-1  
100  
101  
102  
103  
0
10  
20  
30  
40  
50  
60  
70  
80  
Qg [nC]  
VDS [V]  
Typical Switching Characteristics vs. ID  
Typical Forward Characteristics of Reverse Diode  
t=f(ID):Vcc=300V, VGS=10V, RG=10  
IF=f(VSD):80µs Pulse test,Tch=25°C  
100  
102  
tr  
td(off)  
10  
td(on)  
tf  
101  
1
100  
0.1  
100  
101  
0.00 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00  
VSD [V]  
ID [A]  
3
2SK3469-01MR  
FUJI POWER MOSFET  
Transient Thermal Impedance  
Zth(ch-c)=f(t):D=t/T  
1
10  
D=0.5  
0
10  
0.2  
0.1  
0.05  
-1  
10  
0.02  
0.01  
t
t
-2  
10  
D=  
T
0
T
-3  
10  
-6  
-5  
-4  
-3  
-2  
-1  
0
10  
10  
10  
10  
10  
10  
10  
t [sec]  
Maximum Avalanche Current Pulsewidth  
IAV=f(tAV):starting Tch=25°C. Vcc=50V  
102  
101  
100  
10-1  
10-2  
Single Pulse  
10-8  
10-7  
10-6  
10-5  
10-4  
10-3  
10-2  
tAV [sec]  
4
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