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2SK972

型号:

2SK972

描述:

硅N沟道MOS FET[ Silicon N-Channel MOS FET ]

品牌:

HITACHI[ HITACHI SEMICONDUCTOR ]

页数:

7 页

PDF大小:

42 K

2SK972  
Silicon N-Channel MOS FET  
Application  
TO–220AB  
High speed power switching  
Features  
• Low on-resistance  
• High speed switching  
2
1
2
3
• Low drive current  
• 4 V gate drive device  
1. Gate  
2. Drain  
(Flange)  
3. Source  
– Can be driven from 5 V source  
• Suitable for motor drive, DC-DC converter,  
power switch and solenoid drive  
1
3
Table 1 Absolute Maximum Ratings (Ta = 25°C)  
Item  
Symbol  
Ratings  
Unit  
———————————————————————————————————————————  
Drain to source voltage  
V
60  
V
DSS  
———————————————————————————————————————————  
Gate to source voltage  
V
±20  
V
GSS  
———————————————————————————————————————————  
Drain current  
I
25  
A
D
———————————————————————————————————————————  
Drain peak current  
I
*
100  
A
D(pulse)  
———————————————————————————————————————————  
Body to drain diode reverse drain current  
I
25  
A
DR  
———————————————————————————————————————————  
Channel dissipation  
Pch**  
50  
W
———————————————————————————————————————————  
Channel temperature  
Tch  
150  
°C  
———————————————————————————————————————————  
Storage temperature  
Tstg  
–55 to +150  
°C  
———————————————————————————————————————————  
PW 10 µs, duty cycle 1 %  
** Value at T = 25 °C  
*
C
2SK972  
Table 2 Electrical Characteristics (Ta = 25°C)  
Item  
Symbol  
Min  
Typ  
Max  
Unit Test conditions  
———————————————————————————————————————————  
Drain to source breakdown  
V
60  
V
I
= 10 mA, V  
= 0  
(BR)DSS  
D
GS  
voltage  
———————————————————————————————————————————  
Gate to source breakdown  
V
±20  
V
I
= ±100 µA, V  
= 0  
(BR)GSS  
G
DS  
voltage  
———————————————————————————————————————————  
Gate to source leak current  
I
±10  
µA  
V
= ±16 V, V  
= 0  
GSS  
GS  
DS  
———————————————————————————————————————————  
Zero gate voltage drain current  
I
250  
µA  
V
= 50 V, V  
= 0  
DSS  
DS  
GS  
———————————————————————————————————————————  
Gate to source cutoff voltage  
V
1.0  
2.0  
V
I
= 1 mA, V  
= 10 V  
GS(off)  
D
DS  
———————————————————————————————————————————  
Static drain to source on state  
R
0.033  
0.04  
I
= 15 A, V  
= 10 V *  
DS(on)  
D
GS  
resistance  
———————  
——————————–  
0.05  
0.06  
I
= 15 A, V  
= 4 V *  
D
GS  
———————————————————————————————————————————  
Forward transfer admittance  
|y |  
12  
20  
S
I
= 15 A, V  
= 10 V *  
fs  
D
DS  
———————————————————————————————————————————  
Input capacitance  
Ciss  
1400  
pF  
V
= 10 V, V  
= 0,  
DS  
GS  
————————————————————————————————  
Output capacitance  
Coss  
720  
pF  
f = 1 MHz  
————————————————————————————————  
Reverse transfer capacitance  
Crss  
220  
pF  
———————————————————————————————————————————  
Turn-on delay time  
t
15  
ns  
I
= 15 A, V  
= 10 V,  
d(on)  
D
GS  
————————————————————————————————  
Rise time  
t
130  
ns  
R = 2  
L
r
————————————————————————————————  
Turn-off delay time  
t
270  
ns  
d(off)  
————————————————————————————————  
Fall time  
t
180  
ns  
f
———————————————————————————————————————————  
Body to drain diode forward  
V
1.3  
V
I = 25 A, V  
= 0  
DF  
F
GS  
voltage  
———————————————————————————————————————————  
Body to drain diode reverse  
t
135  
ns  
I = 25 A, V  
= 0,  
rr  
F
GS  
recovery time  
di /dt = 50 A/µs  
F
———————————————————————————————————————————  
* Pulse Test  
2SK972  
Maximum Safe Operation Area  
Power vs. Temperature Derating  
500  
300  
60  
40  
20  
100  
30  
10  
3
Ta = 25°C  
1.0  
0.5  
0
50  
100  
150  
0.1 0.3  
1.0  
3
10  
30  
100  
Case Temperature TC (°C)  
Drain to Source Voltage VDS (V)  
Typical Transfer Characteristics  
75°C  
Typical Output Characteristics  
50  
40  
30  
20  
10  
50  
40  
30  
20  
10  
8 V  
6 V  
10 V  
4.5 V  
4.0 V  
TC= 25°C  
VDS = 10 V  
Pulse Test  
–25°C  
Pulse Test  
3.5 V  
3.0 V  
VGS = 2.5 V  
0
1
2
3
4
5
0
2
4
6
8
10  
Gate to Source Voltage VGS (V)  
Drain to Source Voltage VDS (V)  
2SK972  
Drain to Source Saturation Voltage  
vs. Gate to Source Voltage  
Static Drain to Source on State  
Resistance vs. Drain Current  
5
4
0.5  
0.2  
Pulse Test  
Pulse Test  
VGS = 4 V  
0.1  
3
2
1
0.05  
10 V  
ID = 50 A  
0.02  
0.01  
20 A  
10 A  
0.005  
0
2
4
6
8
10  
1
2
5
10  
20  
50 100  
Gate to Source Voltage VGS (V)  
Drain Current ID (A)  
Forward Transfer Admittance  
vs. Drain Current  
Static Drain to Source on State  
Resistance vs. Temperature  
0.10  
0.08  
0.06  
0.04  
0.02  
0
100  
50  
Pulse Test  
ID = 20 A  
VDS = 10 V  
Pulse Test  
–25°C  
TC = 25°C  
10 A  
VGS = 4 V  
20  
10  
5
5 A  
20 A  
10 A  
75°C  
5 A  
VGS = 10 V  
2
1
–40  
0
40  
80  
120  
160  
0.5  
1.0  
2
20  
50  
5
10  
Case Temperature TC (°C)  
Drain Current ID (A)  
2SK972  
Typical Capacitance vs.  
Drain to Source Voltage  
Body to Diode Reverse  
Recovery Time  
10,000  
1,000  
di/dt = 50 A/µs, Ta = 25°C  
VGS = 0  
Pulse Test  
VGS = 0  
f = 1 MHz  
3,000  
1,000  
500  
200  
100  
Ciss  
Coss  
300  
100  
Crss  
50  
20  
10  
30  
10  
0
10  
20  
30  
40  
50  
0.5 1.0  
2
5
10  
20  
50  
Drain to Source Voltage VDS (V)  
Reverse Drain Current IDR (A)  
Switching Characteristics  
Dynamic Input Characteristics  
1000  
500  
100  
20  
VDD = 50 V  
25 V  
td (off)  
80  
16  
10 V  
200  
100  
tf  
60  
40  
20  
12  
8
VGS  
VDS  
tr  
50  
20  
10  
VGS = 10 V  
PW = 2µs, duty < 1 %  
VDD = 50 V  
25 V  
10 V  
4
ID = 25 A  
td (on)  
0
100  
0.5 1.0  
2
5
0
20  
40  
60  
10  
20  
50  
80  
Drain Current ID (A)  
Gate Charge Qg (nc)  
2SK972  
Reverse Drain Current vs.  
Source to Drain Voltage  
50  
40  
Pulse Test  
10 V  
15 V  
30  
20  
10  
5 V  
VGS = 0, –5 V  
0
0.4  
0.8  
1.2  
1.6  
2.0  
Source to Drain Voltage VSD (V)  
Normalized Transient Thermal Impedance vs. Pulse Width  
3
TC = 25°C  
D = 1  
0.5  
1.0  
0.3  
0.1  
θch–c(t) = γS (t) · θch–c  
θch–c = 2.5°C/W, TC = 25°C  
PDM  
PW  
T
0.03  
0.01  
D =  
PW  
T
10 µ  
100µ  
1 m  
10 m  
100 m  
1
10  
Pulse Width PW (s)  
2SK972  
Switching Time Test Circuit  
Vin Monitor  
Wavewforms  
90 %  
Vout Monitor  
RL  
D.U.T  
Vin  
10 %  
10 %  
10 %  
Vout  
50 Ω  
90 %  
d (off)  
90 %  
t
.
Vin = 10 V  
VDD = 30 V  
.
t
t
t
d (on)  
r
f
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