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STM-2016

型号:

STM-2016

描述:

1800至2200年兆赫高线性度的硅锗主动发射混频器[ 1800 - 2200 MHz High Linearity Silicon Germanium Active Transmit Mixer ]

品牌:

STANFORD[ STANFORD MICRODEVICES ]

页数:

7 页

PDF大小:

137 K

Advanced Data Sheet  
Product Description  
STM-2016  
The Stanford MicrodevicesSTM-2016 is a high linearity  
active mixer for use in a wide variety of communication  
systems covering the 1800-2200 MHz frequency bands.  
This device operates from a single 5V supply and provides  
9dB of conversion gain while requiring only 0dBm input to  
the integrated LO driver. The STM-2016 also includes an  
integrated on chip IF amplifier and is fabricated using sili-  
con germanium device technology.  
1800 - 2200 MHz High Linearity  
Silicon Germanium  
Active Transmit Mixer  
The STM-2016 incorporates internal matching on each RF,  
IF, and LO port to enhance ease of use and to reduce the  
number of external components required. The IF and LO  
ports can be driven differential or single ended. Each  
broadband port has been designed to minimize perfor-  
mance degradation while operating into highly reactive  
components such as SAW filters.  
16 pin TSSOP with Exposed Pad  
Package Body: 0.20 x 0.17 x 0.04 (inches)  
5.0 x 4.4 x 1.0 (mm)  
Product Features  
Functional Block Diagram  
Active mixer with conversion gain  
No need for separate external LO driver  
Low LO drive level required to drive mixer  
IF and LO ports may be driven single-ended  
Single supply operation (+5V)  
Broadband resistive 50impedances on all  
three ports  
VEE  
VCC  
VEE  
RFN  
RFP  
VEE  
VCC  
IFN  
1
2
3
4
5
6
7
8
16 VEE  
15 VCC  
14 VEE  
13 LON  
12 LOP  
11 VEE  
10 VCC  
Applications  
Digital and spread spectrum communication  
systems  
1800-2200 MHz transceivers for base station  
infrastructure equipment  
9
IFP  
Key Specifications  
Parameters  
Test Conditions (VCC=5.0V, I=190mA, T=25ºC)  
Unit  
MHz  
MHz  
dBm  
dBm  
dB  
Min.  
1800  
10  
Typ.  
Max.  
2200  
300  
RF Frequency Range  
IF Frequency Range  
Output IP3  
200  
+15  
+3.5  
9
IF1 = IF2 = -20 dBm/tone  
Output P1dB  
Conversion Gain  
SSB Noise Figure  
dB  
9
The information provided herein is believed to be reliable at press time. Stanford Microdevices assumes no responsibility for inaccuracies or ommisions.  
Stanford Microdevices assumes no responsibility for the use of this information, and all such information shall be entirely at the user’s own risk. Prices and specifications are subject to change without  
notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. Stanford Microdevices does not authorize or warrant any Stanford Microdevices  
product for use in life-support devices and/or systems.  
Copyright 2000 Stanford Microdevices, Inc. All worldwide rights reserved.  
522 Almanor Ave., Sunnyvale, CA 94086  
Phone: (800) SMI-MMIC  
1
http://www.stanfordmicro.com  
05/04/01 rev 1.0  
Advanced Data Sheet  
670ꢀꢁꢂꢃꢄꢅꢃꢆꢂꢂꢀꢁꢁꢂꢂꢅ0+]ꢅ7UDQVPLWꢅ0L[HU  
Absolute Maximum Ratings  
Parameters  
Value  
+6.0  
Unit  
VDC  
dBm  
dBm  
ºC  
Supply Voltage  
LO Input  
+10  
RF Input  
+15  
Operating Temperature  
Storage Temperature  
-40 to +85  
-65 to +150  
ºC  
Test Conditions  
VCC  
+5.0V  
TA  
+25ºC  
IF Input  
LO Input  
-20 dBm @ 200 MHz  
0 dBm @ 1760 MHz  
Product Specifications AC Performance  
Parameters  
RF Frequency Range  
IF Frequency Range  
Output IP3  
Additional Test Conditions  
Unit  
MHz  
MHz  
dBm  
dBm  
dB  
Min.  
1800  
10  
Typ.  
Max.  
2200  
300  
200  
+15  
+3.5  
9
IF1 = IF2 = -20 dBm/tone  
Output P1dB  
Conversion Gain  
SSB Noise figure  
RF Return Loss  
LO Return Loss  
IF Return Loss  
LO Drive  
dB  
9
dB  
14  
14  
14  
0
dB  
dB  
dBm  
-3  
+3  
Product Specifications Isolation Performance  
Parameters  
Additional Test Conditions  
Unit  
dBm  
dBm  
Min.  
Typ.  
-25  
Max.  
Leakage (LO-RF)  
Leakage (LO-IF)  
-30  
Product Specifications Miscellaneous  
Parameters  
Additional Test Conditions  
Unit  
V
Min.  
Typ.  
+5.0  
190  
Max.  
Supply Voltage  
+4.75  
+5.25  
Supply Current  
mA  
ºC/W  
Thermal Resistance  
TBD  
The information provided herein is believed to be reliable at press time. Stanford Microdevices assumes no responsibility for inaccuracies or ommisions.  
Stanford Microdevices assumes no responsibility for the use of this information, and all such information shall be entirely at the users own risk. Prices and specifications are subject to change without  
notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. Stanford Microdevices does not authorize or warrant any Stanford Microdevices  
product for use in life-support devices and/or systems.  
Copyright 2000 Stanford Microdevices, Inc. All worldwide rights reserved.  
522 Almanor Ave., Sunnyvale, CA 94086  
Phone: (800) SMI-MMIC  
2
http://www.stanfordmicro.com  
05/04/01 rev 1.0  
Advanced Data Sheet  
670ꢀꢁꢂꢃꢄꢅꢃꢆꢂꢂꢀꢁꢁꢂꢂꢅ0+]ꢅ7UDQVPLWꢅ0L[HU  
Typical Device Performance  
Conversion Gain  
VCC = 5.0V, RF= 1.96GHz, IF= 200MHz  
Return Loss at RF Input  
VCC = 5.0V  
12  
10  
8
0
-5  
-10  
-15  
-20  
-25  
6
4
2
1.8  
1.9  
2.0  
2.1  
2.2  
1.8  
1.9  
2.0  
2.1  
2.2  
RF Frequency (GHz)  
RF Frequency (GHz)  
Return Loss at IF Input  
VCC = 5.0V  
Return Loss at LO Input  
VCC = 5.0V  
0
0
-10  
-20  
-30  
-40  
-50  
-5  
-10  
-15  
-20  
-25  
-30  
-35  
50  
100  
150  
200  
250  
300  
1.6  
1.7  
1.8  
1.9  
2.0  
IF Frequency (MHz)  
LO Frequency (GHz)  
NOTE: The data shown in the graphs above demonstrates the STM-2016 performance tuned to the PCS band.  
The information provided herein is believed to be reliable at press time. Stanford Microdevices assumes no responsibility for inaccuracies or ommisions.  
Stanford Microdevices assumes no responsibility for the use of this information, and all such information shall be entirely at the users own risk. Prices and specifications are subject to change without  
notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. Stanford Microdevices does not authorize or warrant any Stanford Microdevices  
product for use in life-support devices and/or systems.  
Copyright 2000 Stanford Microdevices, Inc. All worldwide rights reserved.  
522 Almanor Ave., Sunnyvale, CA 94086  
Phone: (800) SMI-MMIC  
3
http://www.stanfordmicro.com  
05/04/01 rev 1.0  
Advanced Data Sheet  
670ꢀꢁꢂꢃꢄꢅꢃꢆꢂꢂꢀꢁꢁꢂꢂꢅ0+]ꢅ7UDQVPLWꢅ0L[HU  
Pin Out Description  
Pin #  
Function  
Description  
Additional Comments  
1
2
3
VEE  
Ground  
VCC  
Positive supply (+5V)  
Ground  
VEE  
Nominal DC voltage is 2.3V. (Internally biased) Output should be  
AC-coupled.  
4
5
RFN  
RFP  
RF input, negative terminal  
RF input, positive terminal  
Nominal DC voltage is 2.3V. (Internally biased) Output should be  
AC-coupled.  
6
7
VEE  
VCC  
Ground  
Positive supply (+5V)  
Nominal DC voltage is 2.2V. (Internally biased) Input should be AC-  
coupled  
8
9
IFN  
IFP  
IF output, negative terminal  
IF output, positive terminal  
Nominal DC voltage is 2.2V. (Internally biased) Input should be AC-  
coupled  
10  
11  
VCC  
VEE  
Positive supply (+5V)  
Ground  
Nominal DC voltage is 2.3V. (Internally biased) Input should be AC-  
coupled.  
12  
13  
LOP  
LON  
LO input, positive terminal  
LO input, negative terminal  
Nominal DC voltage is 2.3V. (Internally biased) Input should be AC-  
coupled.  
14  
15  
16  
VEE  
VCC  
VEE  
Ground  
Positive supply (+5V)  
Ground  
The information provided herein is believed to be reliable at press time. Stanford Microdevices assumes no responsibility for inaccuracies or ommisions.  
Stanford Microdevices assumes no responsibility for the use of this information, and all such information shall be entirely at the users own risk. Prices and specifications are subject to change without  
notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. Stanford Microdevices does not authorize or warrant any Stanford Microdevices  
product for use in life-support devices and/or systems.  
Copyright 2000 Stanford Microdevices, Inc. All worldwide rights reserved.  
522 Almanor Ave., Sunnyvale, CA 94086  
Phone: (800) SMI-MMIC  
4
http://www.stanfordmicro.com  
05/04/01 rev 1.0  
Advanced Data Sheet  
670ꢀꢁꢂꢃꢄꢅꢃꢆꢂꢂꢀꢁꢁꢂꢂꢅ0+]ꢅ7UDQVPLWꢅ0L[HU  
Part Number Ordering Information  
Part Number  
Reel Size  
Devices/Reel  
Caution: ESD Sensitive  
STM-2016  
TBD  
TBD  
Appropriate precaution in handling, packaging  
and testing devices must be observed.  
Part Symbolization  
The part will be symbolized with a TBDmarking  
designator on the top surface of the package.  
Package Dimensions (16Package)  
NOTE  
1. PACKAGE BODY SIZES EXCLUDE MOLD FLASH  
PROTRUSIONS OR GATE BURRS  
2. TOLERANCE ±0.1 mm UNLESS OTHERWISE SPECIFIED  
3. COPLANARITY : 0.1 mm  
4. CONTROLLING DIMENSION IS MILLIMETER. CONVERTED  
INCH DIMENSIONS ARE NOT NECESSARILY EXACT.  
5. FOLLOWED FROM JEDEC MO-153  
DIMENSIONS IN MILLIMETERS  
DIMENSIONS IN INCHES  
SYMBOLS  
MIN  
NOM  
MAX  
MIN  
NOM  
MAX  
A
A1  
A2  
b
C
D
D1  
E
E1  
−−−  
0.00  
0.80  
0.19  
0.09  
4.90  
−−−  
−−−  
4.30  
−−−  
−−−  
1.00  
−−−  
−−−  
5.00  
2.80  
6.40  
4.40  
1.15  
0.10  
1.05  
0.30  
0.20  
5.10  
−−−  
−−−  
4.50  
−−−  
0.000  
0.031  
0.007  
0.004  
0.193  
−−−  
−−−  
−−−  
0.039  
−−−  
0.045  
0.004  
0.041  
0.012  
0.008  
0.201  
−−−  
−−−  
0.197  
0.110  
0.252  
0.173  
−−−  
0.169  
−−−  
0.177  
E2  
e
L
y
−−−  
−−−  
0.45  
−−−  
0°  
2.80  
0.65  
0.60  
−−−  
−−−  
−−−  
−−−  
0.75  
0.10  
8°  
−−−  
−−−  
0.018  
−−−  
0°  
0.110  
0.026  
0.024  
−−−  
−−−  
−−−  
0.030  
0.004  
8°  
θ
−−−  
12°(4X)  
Test PCB Pad Layout  
1.25  
3.0  
0.25  
0.4  
0.74  
0.74  
3.0  
φ0.33 via  
0.7  
0.9  
6.9  
all units are in mm  
- Indicates metalization  
- vias connect pad to underlying ground plane  
The information provided herein is believed to be reliable at press time. Stanford Microdevices assumes no responsibility for inaccuracies or ommisions.  
Stanford Microdevices assumes no responsibility for the use of this information, and all such information shall be entirely at the users own risk. Prices and specifications are subject to change without  
notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. Stanford Microdevices does not authorize or warrant any Stanford Microdevices  
product for use in life-support devices and/or systems.  
Copyright 2000 Stanford Microdevices, Inc. All worldwide rights reserved.  
522 Almanor Ave., Sunnyvale, CA 94086  
Phone: (800) SMI-MMIC  
5
http://www.stanfordmicro.com  
05/04/01 rev 1.0  
Advanced Data Sheet  
670ꢀꢁꢂꢃꢄꢅꢃꢆꢂꢂꢀꢁꢁꢂꢂꢅ0+]ꢅ7UDQVPLWꢅ0L[HU  
Demo Test Board Schematic  
+5V  
CON  
1
2
Lfil  
C30  
A10  
STM-2016  
VCC  
VEE  
VEE  
C3  
C1  
VCC  
VCC  
VCC  
VCC  
VEE  
VCC  
VEE  
C11  
C4  
A9  
A11  
A8  
RFN  
RFP  
LON  
LOP  
A12  
C12  
C5  
VEE  
VCC  
IFN  
VEE  
VCC  
IFP  
VCC  
C20  
C21  
C7  
C9  
A2  
A7  
Bill of Materials  
Component  
Value  
Qty  
1
Vendor  
SMDI  
Part Number  
Description  
SiGe Transmit Mixer  
Designator  
A10  
STM-2016  
Johnson  
Components  
SMA connector, end launch with tab, for 62 mil  
pitch thick board  
A7, A8, A12  
3
142-0701-851  
CON  
A9, A11  
A2  
1
2
1
1
Digikey  
S1212-36-ND  
EHF-FD1619  
TC1-1  
2-pin header  
1:1  
1:1  
Panasonic  
Mini-Circuits  
Digikey  
RF transformer  
IF transformer  
Lfil  
1uH  
PCD1008CT-ND  
Inductor, 1210 footprint, min. 200mA rating  
C1, C3, C20,  
C21, C30  
6.8pF  
5
Venkel  
C0603COG500-6R8CNE Capacitor, 0603 footprint  
C0603COG500-101JNE Capacitor, 0603 footprint  
C7, C9  
C4, C5  
100pF  
2.2pF  
4.7pF  
2
2
2
Venkel  
Venkel  
Venkel  
C0603COG500-2R2CNE Capacitor, 0603 footprint  
C0603COG500-4R7CNE Capacitor, 0603 footprint  
C11, C12  
The information provided herein is believed to be reliable at press time. Stanford Microdevices assumes no responsibility for inaccuracies or ommisions.  
Stanford Microdevices assumes no responsibility for the use of this information, and all such information shall be entirely at the users own risk. Prices and specifications are subject to change without  
notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. Stanford Microdevices does not authorize or warrant any Stanford Microdevices  
product for use in life-support devices and/or systems.  
Copyright 2000 Stanford Microdevices, Inc. All worldwide rights reserved.  
522 Almanor Ave., Sunnyvale, CA 94086  
Phone: (800) SMI-MMIC  
6
http://www.stanfordmicro.com  
05/04/01 rev 1.0  
Advanced Data Sheet  
670ꢀꢁꢂꢃꢄꢅꢃꢆꢂꢂꢀꢁꢁꢂꢂꢅ0+]ꢅ7UDQVPLWꢅ0L[HU  
Demo Test Board  
(Fully Assembled PCB)  
2.00  
2
1
CON  
C30  
Lfil  
2.00  
A8  
A10  
C1  
C3  
A12  
C11  
C12  
C4  
C5  
A11  
A9  
C21  
C20  
C7  
C9  
A2  
A7  
Note: Dimensions in inches  
The information provided herein is believed to be reliable at press time. Stanford Microdevices assumes no responsibility for inaccuracies or ommisions.  
Stanford Microdevices assumes no responsibility for the use of this information, and all such information shall be entirely at the users own risk. Prices and specifications are subject to change without  
notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. Stanford Microdevices does not authorize or warrant any Stanford Microdevices  
product for use in life-support devices and/or systems.  
Copyright 2000 Stanford Microdevices, Inc. All worldwide rights reserved.  
522 Almanor Ave., Sunnyvale, CA 94086  
Phone: (800) SMI-MMIC  
7
http://www.stanfordmicro.com  
05/04/01 rev 1.0  
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