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2SK3687-01MR

型号:

2SK3687-01MR

描述:

N沟道硅功率MOSFET超级FAP -G系列[ N-CHANNEL SILICON POWER MOSFET Super FAP-G Series ]

品牌:

FUJI[ FUJI ELECTRIC ]

页数:

4 页

PDF大小:

109 K

2SK3687-01MR  
FUJI POWER MOSFET  
200311  
N-CHANNEL SILICON POWER MOSFET  
Super FAP-G Series  
Outline Drawings [mm]  
Features  
TO-220F  
High speed switching  
No secondary breadown  
Avalanche-proof  
Low on-resistance  
Low driving power  
Applications  
Switching regulators  
DC-DC converters  
UPS (Uninterruptible Power Supply)  
Maximum ratings and characteristicAbsolute maximum ratings  
(Tc=25°C unless otherwise specified)  
Item  
Symbol Ratings  
Unit  
V
Remarks  
Drain-source voltage  
VDS  
VDSX  
ID  
600  
600  
±16  
±64  
±30  
16  
V
VGS=-30V  
Continuous drain current  
Pulsed drain current  
Gate-source voltage  
Non-Repetitive  
A
ID(puls]  
VGS  
IAS  
A
V
<
A
Tch 150°C  
=
Equivalent circuit schematic  
Maximum avalanche current  
Non-Repetitive  
EAS  
242.7  
mJ  
L=1.74mH  
Maximum avalanche energy  
Maximum Drain-Source dV/dt  
Peak diode recovery dV/dt  
Max. power dissipation  
VCC=60V *1  
Drain(D)  
<
dVDS/dt  
dV/dt  
PD  
20  
5
kV/s  
kV/µs  
W
VDS 600V  
=
*2  
2.16  
Ta=25°C  
Tc=25°C  
97  
+150  
Gate(G)  
Operating and storage  
temperature range  
Isolation voltage  
Tch  
°C  
Tstg  
VISO  
-55 to +150  
2
Source(S)  
°C  
t=60sec, f=60Hz  
kVrms  
*1 See to Avalanche Energy Graph  
<
<
<
*2 IF -ID, -di/dt=50A/µs, VCC BVDSS, Tch 150°C  
=
=
=
Electrical characteristics (Tc =25°C unless otherwise specified)  
Min.  
Typ.  
Max. Units  
Item  
Symbol  
V(BR)DSS  
VGS(th)  
Test Conditions  
Drain-source breakdown voltaget  
Gate threshold voltage  
V
µ
600  
ID= 250 A  
VGS=0V  
VDS=VGS  
V
µ
3.0  
5.0  
ID= 250 A  
µA  
nA  
25  
250  
100  
VDS=600V VGS=0V  
Tch=25°C  
Zero gate voltage drain current  
IDSS  
VDS=480V VGS=0V  
VGS=±30V  
VDS=0V  
ID=8A VGS=10V  
ID=8A VDS=25V  
VDS=25V  
Tch=125°C  
Gate-source leakage current  
Drain-source on-state resistance  
Forward transcondutance  
Input capacitance  
IGSS  
RDS(on)  
gfs  
10  
0.42  
0.57  
S
6.5  
13  
1590  
200  
8
Ciss  
Coss  
Crss  
td(on)  
tr  
pF  
2390  
300  
12  
Output capacitance  
VGS=0V  
Reverse transfer capacitance  
Turn-on time ton  
f=1MHz  
VCC=300V ID=8A  
ns  
29  
43.5  
16  
24  
87  
12  
51  
18  
15  
VGS=10V  
58  
Turn-off time toff  
td(off)  
tf  
RGS=10  
8
34  
nC  
Total Gate Charge  
QG  
VCC=300V  
ID=16A  
12  
Gate-Source Charge  
Gate-Drain Charge  
QGS  
QGD  
IAV  
10  
VGS=10V  
16  
A
Avalanche capability  
Diode forward on-voltage  
Reverse recovery time  
Reverse recovery charge  
L=1.74mH Tch=25°C  
1.00  
1.50  
V
VSD  
IF=16A VGS=0V Tch=25°C  
IF=16A VGS=0V  
0.68  
7.8  
µs  
µC  
trr  
Qrr  
-di/dt=100A/µs  
Tch=25°C  
Thermalcharacteristics  
Item  
Min.  
Typ.  
Max. Units  
Symbol  
Test Conditions  
Rth(ch-c)  
channel to case  
1.289  
°C/W  
Thermal resistance  
Rth(ch-a)  
channel to ambient  
58.0  
°C/W  
1
2SK3687-01MR  
FUJI POWER MOSFET  
Characteristics  
Typical Output Characteristics  
ID=f(VDS):80 µs pulse test,Tch=25 °C  
Allowable Power Dissipation  
PD=f(Tc)  
50  
40  
30  
20  
10  
0
120  
100  
80  
60  
40  
20  
0
20V  
10V  
8V  
7V  
6.5V  
VGS=6.0V  
0
4
8
12  
16  
20  
24  
0
25  
50  
75  
100  
125  
150  
VDS [V]  
Tc [°C]  
Typical Transfer Characteristic  
ID=f(VGS):80 µs pulse test,VDS=25V,Tch=25°C  
Typical Transconductance  
gfs=f(ID):80 µs pulse test,VDS=25V,Tch=25°C  
100  
10  
1
100  
10  
1
0.1  
0.1  
0.1  
0
1
2
3
4
5
6
7
8
9
10  
1
10  
100  
VGS[V]  
ID [A]  
Typical Drain-Source on-state Resistance  
Drain-Source On-state Resistance  
RDS(on)=f(Tch):ID=8A,VGS=10V  
RDS(on)=f(ID):80 µs pulse test,Tch=25°C  
1.0  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0.0  
1.5  
1.4  
1.3  
1.2  
1.1  
1.0  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0.0  
VGS=6V  
6.5V  
7V  
8V  
10V  
20V  
max.  
typ.  
0
10  
20  
30  
-50  
-25  
0
25  
50  
75  
100  
125  
150  
ID [A]  
Tch [°C]  
2
2SK3687-01MR  
FUJI POWER MOSFET  
Typical Gate Charge Characteristics  
VGS=f(Qg):ID=16A,Tch=25 °C  
Gate Threshold Voltage vs. Tch  
VGS(th)=f(Tch):VDS=VGS,ID=250µA  
14  
12  
10  
8
7.0  
6.5  
6.0  
5.5  
5.0  
4.5  
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
Vcc= 120V  
300V  
max.  
min.  
480V  
6
4
2
0
0
10  
20  
30  
40  
50  
60  
-50  
-25  
0
25  
50  
75  
100  
125  
150  
Qg [nC]  
Tch [°C]  
Typical Forward Characteristics of Reverse Diode  
IF=f(VSD):80 µs pulse test,Tch=25 °C  
Typical Capacitance  
C=f(VDS):VGS=0V,f=1MHz  
104  
100  
10  
1
Ciss  
103  
102  
101  
100  
Coss  
Crss  
0.1  
100  
101  
102  
103  
0.00 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00 2.25 2.50  
VSD [V]  
VDS [V]  
Typical Switching Characteristics vs. ID  
t=f(ID):Vcc=300V,VGS=10V,RG=10 Ω  
Maximum Avalanche Energy vs. starting Tch  
E(AV)=f(starting Tch):Vcc=60V,I(AV)<=16A  
103  
700  
600  
500  
400  
300  
200  
100  
0
IAS=7A  
102  
101  
100  
td(off)  
IAS=10A  
IAS=16A  
td(on)  
tf  
tr  
10-1  
100  
101  
102  
0
25  
50  
75  
100  
125  
150  
ID [A]  
starting Tch [°C]  
3
2SK3687-01MR  
FUJI POWER MOSFET  
Maximum Avalanche Current Pulsewidth  
IAV=f(tAV):starting Tch=25°C,Vcc=50V  
102  
101  
100  
10-1  
10-2  
Single Pulse  
10-8  
10-7  
10-6  
10-5  
10-4  
10-3  
10-2  
tAV [sec]  
Maximum Transient Thermal Impedance  
Zth(ch-c)=f(t):D=0  
101  
100  
10-1  
10-2  
10-3  
10-6  
10-5  
10-4  
10-3  
10-2  
10-1  
100  
t [sec]  
http://www.fujielectric.co.jp/fdt/scd/  
4
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