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2SK2292-01S

型号:

2SK2292-01S

描述:

N沟道MOS - FET的[ N-channel MOS-FET ]

品牌:

FUJI[ FUJI ELECTRIC ]

页数:

2 页

PDF大小:

90 K

N-channel MOS-FET  
2SK2292-01L,S  
FAP-IIA Series  
250V 1,1W 4A  
20W  
> Features  
> Outline Drawing  
- High Speed Switching  
- Low On-Resistance  
- No Secondary Breakdown  
- Low Driving Power  
- High Voltage  
- VGS = ± 30V Guarantee  
- Avalanche Proof  
> Applications  
- Switching Regulators  
- UPS  
- DC-DC converters  
- General Purpose Power Amplifier  
> Maximum Ratings and Characteristics  
> Equivalent Circuit  
- Absolute Maximum Ratings (TC=25°C), unless otherwise specified  
Item  
Symbol  
Rating  
Unit  
V
Drain-Source-Voltage  
V
250  
DS  
Drain-Gate-Voltage (RGS=20KW)  
Continous Drain Current  
Pulsed Drain Current  
V
250  
V
DGR  
I
4
16  
A
D
I
A
D(puls)  
Gate-Source-Voltage  
V
±30  
V
GS  
Max. Power Dissipation  
Operating and Storage Temperature Range  
P
20  
W
°C  
°C  
D
T
150  
ch  
T
-55 ~ +150  
stg  
Electrical Characteristics (TC=25°C), unless otherwise specified  
-
Item  
Symbol  
Test conditions  
Min.  
250  
Typ.  
3,0  
Max.  
Unit  
V
ID=1mA  
ID=1mA  
VDS=250V  
VGS=0V  
VGS=±30V  
ID=2,0A  
ID=2,0A  
VGS=0V  
Drain-Source Breakdown-Voltage  
Gate Threshhold Voltage  
Zero Gate Voltage Drain Current  
V
(BR)DSS  
VDS=VGS  
Tch=25°C  
Tch=125°C  
VDS=0V  
V
2,5  
3,5  
500  
1,0  
V
GS(th)  
I
10  
0,2  
10  
µA  
mA  
nA  
W
S
DSS  
Gate Source Leakage Current  
Drain Source On-State Resistance  
Forward Transconductance  
Input Capacitance  
I
100  
1,1  
GSS  
VGS=10V  
VDS=25V  
R
0,8  
2,0  
230  
70  
DS(on)  
g
1,0  
fs  
VDS=25V  
C
350  
110  
70  
pF  
pF  
pF  
ns  
ns  
ns  
ns  
A
iss  
VGS=0V  
f=1MHz  
VCC=150V  
ID=4A  
Output Capacitance  
C
oss  
Reverse Transfer Capacitance  
Turn-On-Time ton (ton=td(on)+tr)  
C
45  
rss  
t
10  
15  
d(on)  
t
20  
30  
r
Turn-Off-Time toff (ton=td(off)+tf)  
VGS=10V  
RGS=10 W  
t
25  
40  
d(off)  
t
10  
15  
f
Tch=25°C  
Avalanche Capability  
I
L = 100µH  
4
AV  
Continous Reverse Drain Current  
Pulsed Reverse Drain Current  
Diode Forward On-Voltage  
Reverse Recovery Time  
I
4
8
A
DR  
I
A
DRM  
IF=2xIDR VGS=0V Tch=25°C  
IF=IDR VGS=0V  
V
V
1,0  
110  
0,5  
1,5  
SD  
t
ns  
µC  
rr  
-dIF/dt=100A/µs Tch=25°C  
Reverse Recovery Charge  
Q
rr  
-
Thermal Characteristics  
Item  
Symbol  
Test conditions  
channel to air  
Min.  
Typ.  
Max.  
Unit  
Thermal Resistance  
R
°C/W  
th(ch-a)  
R
channel to case  
62,5 °C/W  
th(ch-c)  
 
N-channel MOS-FET  
2SK2292-01L,S  
250V  
1,1W  
4A  
20W  
FAP-IIA Series  
> Characteristics  
Typical Output Characteristics  
Drain-Source On-State Resistance vs. Tch  
Typical Transfer Characteristics  
ID=f(VDS); 80µs pulse test; TC=25°C  
RDS(on) = f(Tch); ID=2A; VGS=10V  
ID=f(VGS); 80µs pulse test; VDS=25V; Tch=25°C  
VDS [V] ®  
Tch [°C] ®  
VGS [V] ®  
Typical Drain-Source On-State-Resistance vs. ID  
Typical Transconductance  
Gate Threshold Voltage vs. Tch  
RDS(on)=f(ID); 80µs pulse test; TC=25°C  
gfs=f(ID); 80µs pulse test; VDS=25V; Tch=25°C  
VGS(th)=f(Tch); ID=1mA; VDS=VGS  
ID [A] ®  
ID [A] ®  
Tch [°C] ®  
Typical Capacitances  
Typical Gate Charge Characteristics  
Forward Characteristics of Reverse Diode  
C=f(VDS); VGS=0V; f=1MHz  
VGS=f(Qg); ID=4A  
IF=f(VSD); 80µs pulse test; VGS=0V  
VDS [V] ®  
Qg [nC] ®  
VSD [V] ®  
Power Dissipation  
Safe Operation Area  
PD=f(Tc)  
ID=f(VDS): D=0,01, Tc=25°C  
Transient Thermal impedance  
Zthch=f(t) parameter:D=t/T  
Tch [°C] ®  
VDS [V] ®  
t [s] ®  
This specification is subject to change without notice!  
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