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2SK3450-01

型号:

2SK3450-01

描述:

N沟道硅功率MOSFET[ N-CHANNEL SILICON POWER MOSFET ]

品牌:

FUJI[ FUJI ELECTRIC ]

页数:

4 页

PDF大小:

108 K

FUJI POWER MOSFET 200303  
2SK3450-01  
Super FAP-G Series  
N-CHANNEL SILICON POWER MOSFET  
Outline Drawings [mm]  
TO-220AB  
Features  
High speed switching  
Low on-resistance  
No secondary breadown  
Low driving power  
Avalanche-proof  
Applications  
Switching regulators  
UPS (Uninterruptible Power Supply)  
DC-DCconverters  
Maximum ratings and characteristicAbsolute maximum ratings  
(Tc=25°C unless otherwise specified)  
Item  
Symbol  
VDS  
Ratings  
600  
Unit  
V
Drain-source voltage  
Continuous drain current  
Pulsed drain current  
Gate-source voltage  
Repetitive or non-repetitive  
Maximum Avalanche Energy  
Maximum Drain-Source dV/dt  
Peak Diode Recovery dV/dt  
Max. power dissipation  
Equivalent circuit schematic  
A
ID  
±13  
±52  
±30  
13  
A
ID(puls]  
VGS  
V
Drain(D)  
A
IAR *2  
mJ  
kV/µs  
kV/µs  
W
EAS*1  
dVDS/dt  
dV/dt *3  
PD Ta=25  
Tc=25  
Tch  
216.7  
20  
5
Gate(G)  
°C  
°C  
2.02  
Source(S)  
225  
+150  
-55 to +150  
Operating and storage  
temperature range  
°C  
°C  
Tstg  
<
*1 L=2.36mH, Vcc=60V See to Avalanche Energy Graph *2 Tch=150°C  
*3 IF=-ID, -di/dt=50A/µs, Vcc=BVDSS, Tch=150°C  
<
<
<
Electrical characteristics (Tc =25°C unless otherwise specified)  
Test Conditions  
Min.  
Typ.  
Max. Units  
Symbol  
V(BR)DSS  
VGS(th)  
Item  
µ
ID=250 A  
VGS=0V  
VDS=VGS  
V
Drain-source breakdown voltaget  
Gate threshold voltage  
600  
µ
ID= 250 A  
V
3.0  
5.0  
25  
Tch=25°C  
µA  
VDS=600V VGS=0V  
VDS=480V VGS=0V  
Zero gate voltage drain current  
IDSS  
Tch=125°C  
250  
100  
VDS=0V  
IGSS  
RDS(on)  
gfs  
VGS=±30V  
nA  
10  
Gate-source leakage current  
Drain-source on-state resistance  
Forward transcondutance  
Input capacitance  
ID=6A VGS=10V  
0.50  
0.65  
5.5  
11  
1600  
160  
7
S
ID=6A VDS=25V  
VDS=25V  
Ciss  
2400  
240  
pF  
VGS=0V  
Coss  
Crss  
td(on)  
tr  
Output capacitance  
f=1MHz  
10.5  
Reverse transfer capacitance  
Turn-on time ton  
ns  
VCC=300V ID=6A  
18  
27  
16  
24  
VGS=10V  
35  
50  
td(off)  
tf  
Turn-off time toff  
RGS=10  
8
15  
34  
51  
VCC=300V  
ID=12A  
QG  
nC  
Total Gate Charge  
12.5  
19  
QGS  
QGD  
IAV  
Gate-Source Charge  
Gate-Drain Charge  
11.5  
17.5  
VGS=10V  
13  
L=2.36mH Tch=25°C  
A
Avalanche capability  
Diode forward on-voltage  
Reverse recovery time  
Reverse recovery charge  
1.0  
1.50  
IF=12A VGS=0V Tch=25°C  
IF=12A VGS=0V  
-di/dt=100A/µs  
Tch=25°C  
VSD  
trr  
Qrr  
V
0.75  
6.5  
µs  
µC  
Thermalcharacteristics  
Item  
Min.  
Typ.  
Max. Units  
Symbol  
Test Conditions  
Rth(ch-c)  
channel to case  
0.556  
°C/W  
Thermal resistance  
Rth(ch-a)  
channel to ambient  
62.0  
°C/W  
1
2SK3450-01  
FUJI POWER MOSFET  
Characteristics  
Maximum Avalanche Energy vs. starting Tch  
EAS=f(starting Tch):Vcc=60V  
Allowable Power Dissipation  
PD=f(Tc)  
500  
400  
300  
200  
100  
0
250  
200  
150  
100  
50  
IAS=6A  
IAS=8A  
IAS=13A  
0
0
25  
50  
75  
100  
125  
150  
0
25  
50  
75  
100  
125  
150  
starting Tch [°C]  
Tc [°C]  
Typical Output Characteristics  
ID=f(VDS):80 µs pulse test,Tch=25 °C  
Typical Transfer Characteristic  
ID=f(VGS):80µs Pulse test, VDS=25V,Tch=25°C  
30  
28  
26  
24  
22  
20  
18  
16  
14  
12  
10  
8
20V  
10V  
8V  
10  
7.5V  
7.0V  
1
VGS=6.5V  
6
4
0.1  
2
0
0
1
2
3
4
5
6
7
8
9
10  
0
2
4
6
8
10 12 14 16 18 20 22  
VDS [V]  
VGS[V]  
Typical Transconductance  
gfs=f(ID):80µs Pulse test, VDS=25V,Tch=25°C  
Typical Drain-Source on-state Resistance  
RDS(on)=f(ID):80µs Pulse test, Tch=25°C  
100  
10  
1
1.4  
1.3  
1.2  
1.1  
1.0  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0.0  
VGS=6.5V  
7.0V  
7.5V  
8V  
10V  
20V  
0.1  
0.1  
1
10  
0
2
4
6
8
10 12 14 16 18 20 22 24 26  
ID [A]  
ID [A]  
2
2SK3450-01  
FUJI POWER MOSFET  
Drain-Source On-state Resistance  
RDS(on)=f(Tch):ID=6A,VGS=10V  
Gate Threshold Voltage vs. Tch  
VGS(th)=f(Tch):VDS=VGS,ID=1mA  
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
7.0  
6.5  
6.0  
5.5  
5.0  
4.5  
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
max.  
min.  
max.  
typ.  
-50  
-25  
0
25  
50  
75  
100  
125  
150  
-50  
-25  
0
25  
50  
75  
100  
125  
150  
Tch [°C]  
Tch [°C]  
Typical Capacitance  
C=f(VDS):VGS=0V,f=1MHz  
Typical Gate Charge Characteristics  
VGS=f(Qg):ID=12A, Tch=25°C  
10n  
1n  
24  
22  
20  
18  
16  
14  
12  
10  
8
Vcc= 120V  
Ciss  
300V  
480V  
100p  
10p  
1p  
Coss  
Crss  
6
4
2
0
0
10  
20  
30  
40  
50  
60  
70  
80  
10-1  
100  
101  
102  
103  
VDS [V]  
Qg [nC]  
Typical Switching Characteristics vs. ID  
t=f(ID):Vcc=300V, VGS=10V, RG=10  
Typical Forward Characteristics of Reverse Diode  
IF=f(VSD):80µs Pulse test,Tch=25°C  
100  
102  
tr  
td(off)  
10  
td(on)  
tf  
101  
1
100  
0.1  
100  
101  
0.00 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00  
VSD [V]  
ID [A]  
3
2SK3450-01  
FUJI POWER MOSFET  
Maximum Transient Thermal Impedance  
Zth(ch-c)=f(t):D=0  
101  
100  
10-1  
10-2  
10-3  
10-6  
10-5  
10-4  
10-3  
10-2  
10-1  
100  
t [sec]  
Maximum Avalanche Current vs Pulse width  
IAV=f(tAV):starting Tch=25°C,Vcc=60V  
102  
Single Pulse  
01  
100  
10-1  
10-2  
10-8  
10-7  
10-6  
10-5  
10-4  
10-3  
10-2  
tAV [sec]  
http://www.fujielectric.co.jp/denshi/scd/  
4
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