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2SK3581-01S

型号:

2SK3581-01S

描述:

N沟道硅功率MOSFET[ N-CHANNEL SILICON POWER MOSFET ]

品牌:

FUJI[ FUJI ELECTRIC ]

页数:

4 页

PDF大小:

255 K

2SK3581-01L,S,SJ  
200304  
N-CHANNEL SILICON POWER MOSFET  
FUJI POWER MOSFET  
Outline Drawings [mm]  
Super FAP-G Series  
Features  
High speed switching  
Low on-resistance  
No secondary breadown  
Low driving power  
Avalanche-proof  
P4  
Applications  
Switching regulators  
UPS (Uninterruptible Power Supply)  
DC-DCconverters  
Maximum ratings and characteristicAbsolute maximum ratings  
(Tc=25°C unless otherwise specified)  
Item  
Symbol  
VDS  
Ratings  
500  
Unit  
V
Drain-source voltage  
Continuous drain current  
Pulsed drain current  
Gate-source voltage  
Repetitive or non-repetitive  
Maximum Avalanche Energy  
Maximum Drain-Source dV/dt  
Peak Diode Recovery dV/dt  
Max. power dissipation  
Equivalent circuit schematic  
A
ID  
±16  
±64  
±30  
16  
A
ID(puls]  
VGS  
V
Drain(D)  
A
IAR *2  
mJ  
kV/µs  
kV/µs  
W
EAS*1  
212.2  
20  
dVDS/dt *4  
dV/dt *3  
PD Ta=25  
Tc=25  
Tch  
5
Gate(G)  
°C  
°C  
1.67  
Source(S)  
225  
+150  
-55 to +150  
Operating and storage  
temperature range  
°C  
°C  
Tstg  
<
*1 L=1.52mH, Vcc=50V,Tch=25°C, See to Avalanche Energy Graph *2 Tch 150°C  
=
<
<
<
*4 VDS 500V  
=
<
*3 IF -ID, -di/dt=50A/µs, Vcc BVDSS, Tch 150°C  
=
=
=
Electrical characteristics (Tc =25°C unless otherwise specified)  
Min.  
Typ.  
Max. Units  
Symbol  
V(BR)DSS  
VGS(th)  
Test Conditions  
Item  
µ
ID= 250 A  
VGS=0V  
Drain-source breakdown voltaget  
Gate threshold voltage  
V
500  
µ
ID= 250 A  
VDS=VGS  
V
3.0  
5.0  
25  
Tch=25°C  
µA  
VDS=500V VGS=0V  
Zero gate voltage drain current  
IDSS  
Tch=125°C  
250  
100  
VDS=400V VGS=0V  
VGS=±30V VDS=0V  
IGSS  
RDS(on)  
gfs  
nA  
Gate-source leakage current  
Drain-source on-state resistance  
Forward transcondutance  
Input capacitance  
10  
ID=7A VGS=10V  
0.35  
0.46  
S
ID=7A VDS=25V  
VDS=25V  
7
14  
1600  
160  
7
Ciss  
2400  
240  
pF  
Coss  
Crss  
td(on)  
tr  
VGS=0V  
Output capacitance  
f=1MHz  
10.5  
Reverse transfer capacitance  
Turn-on time ton  
ns  
VCC=300V ID=7A  
18  
27  
24  
50  
15  
50  
19  
16  
16  
VGS=10V  
td(off)  
tf  
35  
Turn-off time toff  
RGS=10  
8
33  
QG  
VCC=250V  
ID=14A  
nC  
Total Gate Charge  
12.5  
10.5  
QGS  
QGD  
IAV  
Gate-Source Charge  
Gate-Drain Charge  
VGS=10V  
16  
L=2.27mH Tch=25°C  
A
Avalanche capability  
Diode forward on-voltage  
Reverse recovery time  
Reverse recovery charge  
1.00  
1.50  
VSD  
trr  
Qrr  
IF=14A VGS=0V Tch=25°C  
IF=14A VGS=0V  
V
0.65  
6.0  
µs  
µC  
-di/dt=100A/µs  
Tch=25°C  
Thermalcharacteristics  
Item  
Min.  
Typ.  
Max. Units  
Symbol  
Test Conditions  
Rth(ch-c)  
channel to case  
0.556  
°C/W  
Thermal resistance  
Rth(ch-a)  
channel to ambient  
75.0  
°C/W  
1
2SK3581-01L,S,SJ  
FUJI POWER MOSFET  
Characteristics  
Maximum Avalanche Energy vs. starting Tch  
EAS=f(starting Tch):Vcc=50V  
Allowable Power Dissipation  
PD=f(Tc)  
500  
450  
400  
350  
300  
250  
200  
150  
100  
50  
250  
200  
150  
100  
50  
IAS=7A  
IAS=10A  
IAS=16A  
0
0
0
25  
50  
75  
100  
125  
150  
0
25  
50  
75  
100  
125  
150  
Tc [°C]  
starting Tch [°C]  
Typical Transfer Characteristic  
ID=f(VGS):80µs Pulse test, VDS=25V,Tch=25°C  
Typical Output Characteristics  
ID=f(VDS):80µs Pulse test,Tch=25°C  
30  
28  
26  
24  
22  
20  
18  
16  
14  
12  
10  
8
20V  
10V  
8V  
7.5V  
7.0V  
10  
1
VGS=6.5V  
6
4
0.1  
2
0
0
2
4
6
8
10 12 14 16 18 20 22  
VDS [V]  
0
1
2
3
4
5
6
7
8
9
10  
VGS[V]  
Typical Drain-Source on-state Resistance  
RDS(on)=f(ID):80µs Pulse test, Tch=25°C  
Typical Transconductance  
gfs=f(ID):80µs Pulse test, VDS=25V,Tch=25°C  
1.0  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0.0  
100  
10  
1
7.5V  
VGS=6.5V  
7.0V  
8V  
10V  
20V  
0.1  
0.1  
1
10  
0
5
10  
15  
20  
25  
30  
ID [A]  
ID [A]  
2
2SK3581-01L,S,SJ  
FUJI POWER MOSFET  
Drain-Source On-state Resistance  
RDS(on)=f(Tch):ID=7A,VGS=10V  
Gate Threshold Voltage vs. Tch  
VGS(th)=f(Tch):VDS=VGS,ID=250uA  
1.2  
1.1  
1.0  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0.0  
7.0  
6.5  
6.0  
5.5  
5.0  
4.5  
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
max.  
min.  
max.  
typ.  
-50  
-25  
0
25  
50  
75  
100 125 150  
-50  
-25  
0
25  
50  
75  
100  
125  
150  
Tch [°C]  
Tch [°C]  
Typical Capacitance  
C=f(VDS):VGS=0V,f=1MHz  
Typical Gate Charge Characteristics  
VGS=f(Qg):ID=14A, Tch=25°C  
24  
22  
20  
18  
16  
14  
12  
10  
8
10n  
1n  
Vcc= 100V  
Ciss  
250V  
400V  
100p  
10p  
1p  
Coss  
Crss  
6
4
2
0
10-1  
100  
101  
102  
103  
0
10  
20  
30  
40  
50  
60  
70  
80  
VDS [V]  
Qg [nC]  
Typical Forward Characteristics of Reverse Diode  
IF=f(VSD):80µs Pulse test,Tch=25°C  
Typical Switching Characteristics vs. ID  
t=f(ID):Vcc=300V, VGS=10V, RG=10  
100  
10  
1
102  
101  
100  
tr  
td(off)  
td(on)  
tf  
0.1  
100  
101  
0.00 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00  
VSD [V]  
ID [A]  
3
2SK3581-01L,S,SJ  
FUJI POWER MOSFET  
Maximum Avalanche Current vs Pulse width  
IAV=f(tAV):starting Tch=25°C,Vcc=50V  
102  
101  
100  
10-1  
10-2  
Single Pulse  
10-8  
10-7  
10-6  
10-5  
10-4  
10-3  
10-2  
tAV [sec]  
Maximum Transient Thermal Impedance  
Zth(ch-c)=f(t):D=0  
101  
100  
10-1  
10-2  
10-3  
10-6  
10-5  
10-4  
10-3  
10-2  
10-1  
100  
t [sec]  
Outline Drawings (mm)  
Type(L)  
Type(S)  
Type(SJ)  
4
1
2
3
1
2
3
4
1
2
3
1
2 3  
http://www.fujielectric.co.jp/denshi/scd/  
4
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