2SK3752-01R
FUJI POWER MOSFET
200309
N-CHANNEL SILICON POWER MOSFET
Super FAP-G Series
Outline Drawings [mm]
Features
High speed switching
No secondary breadown
Avalanche-proof
Low on-resistance
Low driving power
Applications
Switching regulators
DC-DC converters
UPS (Uninterruptible Power Supply)
Maximum ratings and characteristicAbsolute maximum ratings
(Tc=25°C unless otherwise specified)
Item
Symbol Ratings
Unit
Remarks
V
Drain-source voltage
Continuous drain current
Pulsed drain current
Gate-source voltage
Repetitive and Non-Repetitive
Maximum avalanche current
Non-Repetitive
VDS
ID
500
±16
±64
±30
16
A
A
V
A
ID(puls]
VGS
IAS
<
Tch 150°C
=
Equivalent circuit schematic
mJ
EAS
212.2
*1
Maximum avalanche energy
Maximum Drain-Source dV/dt
Peak diode recovery dV/dt
Max. power dissipation
Drain(D)
<
dVDS/dt
dV/dt
PD
20
5
kV/s
kV/µs
W
VDS 500V
=
*2
3.13
Ta=25°C
Tc=25°C
95
Gate(G)
Operating and storage
temperature range
Isolation voltage
Tch
+150
-55 to +150
°C
Tstg
VISO
°C
Source(S)
t=60sec f=60Hz
2
kVrms
*1 L=1.52mH, Vcc=50V, Starting Tch=25°C,See to Avalanche Energy Graph
<
<
<
*2 IF -ID, -di/dt=50A/µs, VCC BVDSS, Tch 150°C
=
=
=
Electrical characteristics (Tc =25°C unless otherwise specified)
Min.
Typ.
Max. Units
Item
Symbol
V(BR)DSS
VGS(th)
Test Conditions
µ
Drain-source breakdown voltaget
Gate threshold voltage
V
ID= 250 A
VGS=0V
VDS=VGS
500
µ
V
ID= 250 A
3.0
5.0
µA
25
Tch=25°C
VDS=500V VGS=0V
Zero gate voltage drain current
IDSS
Tch=125°C
VDS=400V VGS=0V
250
VGS=±30V
VDS=0V
ID=7A VGS=10V
nA
Gate-source leakage current
Drain-source on-state resistance
Forward transcondutance
Input capacitance
IGSS
RDS(on)
gfs
10
100
Ω
S
0.35
0.46
ID=7A VDS=25V
7
14
1600
160
7
Ciss
Coss
Crss
td(on)
tr
pF
VDS=25V
2400
240
10.5
Output capacitance
VGS=0V
Reverse transfer capacitance
Turn-on time ton
f=1MHz
VCC=300V ID=7A
ns
18
27
24
50
15
50
19
16
VGS=10V
16
Turn-off time toff
td(off)
tf
35
RGS=10 Ω
8
nC
Total Gate Charge
QG
33
VCC=250V
ID=14A
Gate-Source Charge
Gate-Drain Charge
QGS
QGD
IAV
12.5
10.5
VGS=10V
16
A
Avalanche capability
Diode forward on-voltage
Reverse recovery time
Reverse recovery charge
L=1.52mH Tch=25°C
1.00
1.50
V
VSD
IF=14A VGS=0V Tch=25°C
IF=14A VGS=0V
-di/dt=100A/µs
Tch=25°C
0.65
6.0
µs
µC
trr
Qrr
Thermalcharacteristics
Item
Min.
Typ.
Max. Units
Symbol
Test Conditions
Rth(ch-c)
channel to case
1.32
°C/W
Thermal resistance
Rth(ch-a)
channel to ambient
40.0
°C/W
1