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IXGH22N50BU1

型号:

IXGH22N50BU1

描述:

HiPerFAST IGBT与二极管[ HiPerFAST IGBT with Diode ]

品牌:

IXYS[ IXYS CORPORATION ]

页数:

2 页

PDF大小:

74 K

Preliminary data  
VCES  
IC(25)  
= 500 V  
= 44 A  
IXGH22N50BU1  
IXGH22N50BU1S  
HiPerFASTTM IGBT  
with Diode  
Combi Pack  
VCE(sat)typ = 2.1 V  
tfi(typ)  
= 55 ns  
TO-247 SMD*  
Symbol  
Test Conditions  
Maximum Ratings  
C (TAB)  
G
VCES  
VCGR  
TJ = 25°C to 150°C  
TJ = 25°C to 150°C; RGE = 1 MΩ  
500  
500  
V
V
E
VGES  
VGEM  
Continuous  
Transient  
±20  
±30  
V
V
TO-247 AD  
IC25  
IC90  
ICM  
TC = 25°C  
TC = 90°C  
TC = 25°C, 1 ms  
44  
22  
88  
A
A
A
TAB)  
G
C
E
SSOA  
(RBSOA)  
VGE= 15 V, TVJ = 125°C, RG = 22 Ω  
Clamped inductive load, L = 100 µH  
ICM = 44  
@ 0.8 VCES  
A
G = Gate,  
E = Emitter,  
C = Collector,  
TAB = Collector  
PC  
TC = 25°C  
150  
W
*Add suffix letter "S" for surface mountable  
package  
TJ  
TJM  
Tstg  
-55 ... +150  
150  
-55 ... +150  
°C  
°C  
°C  
Features  
International standard packages  
JEDEC TO-247 SMD surface  
mountable and JEDEC TO-247 AD  
High frequency IGBT and antiparallel  
FRED in one package  
Maximum Lead and Tab temperature for soldering  
1.6 mm (0.062 in.) from case for 10 s  
300  
°C  
Md  
Mounting torque, TO-247 AD  
1.13/10 Nm/lb.in.  
High current handling capability  
HiPerFASTTM HDMOSTM process  
MOS Gate turn-on  
Weight  
TO-247 SMD  
TO-247 AD  
4
6
g
g
- drive simplicity  
Applications  
Uninterruptible power supplies (UPS)  
Switched-mode and resonant-mode  
power supplies  
AC motor speed control  
DC servo and robot drives  
DC choppers  
Symbol  
Test Conditions  
Characteristic Values  
(TJ = 25°C, unless otherwise specified)  
min. typ. max.  
BVCES  
VGE(th)  
IC = 250µA, VGE = 0 V  
IC = 250 µA, VCE = VGE  
500  
2.5  
V
V
5.5  
Advantages  
Space savings (two devices in one  
package)  
ICES  
VCE = 0.8 • VCES  
VGE = 0 V  
TJ = 25°C  
TJ = 125°C  
200  
8
µA  
mA  
High power density  
IGES  
VCE = 0 V, VGE = ±20 V  
±100  
nA  
V
Suitable for surface mounting  
Very low switching losses for high  
frequency applications  
VCE(sat)  
IC = IC90, VGE = 15 V  
2.1  
2.5  
Easy to mount with 1 screw,TO-247  
(insulated mounting screw hole)  
© 1997 IXYS All rights reserved  
97509(2/97)  
IXGH22N50BU1  
IXGH22N50BU1S  
TO-247 AD Outline  
Symbol  
gfs  
Test Conditions  
Characteristic Values  
(TJ = 25°C, unless otherwise specified)  
min. typ. max.  
IC = IC90; VCE = 10 V,  
9
16  
S
Pulse test, t 300 µs, duty cycle 2 %  
P
Cies  
Coes  
Cres  
1450  
120  
37  
pF  
pF  
pF  
VCE = 25 V, VGE = 0 V, f = 1 MHz  
Qg  
Qge  
Qgc  
90  
11  
30  
nC  
nC  
nC  
IC = IC90, VGE = 15 V, VCE = 0.5 VCES  
e
Dim.  
Millimeter  
Inches  
Min. Max.  
Min. Max.  
td(on)  
tri  
Eon  
td(off)  
tfi  
15  
30  
0.15  
100  
55  
ns  
ns  
mJ  
Inductive load, TJ = 25°C  
A
A1  
A2  
4.7  
2.2  
2.2  
5.3  
2.54  
2.6  
.185 .209  
.087 .102  
.059 .098  
IC = IC90, VGE = 15 V, L = 100 µH,  
VCE = 0.8 VCES, RG = Roff = 10 Ω  
b
b1  
b2  
1.0  
1.65  
2.87  
1.4  
2.13  
3.12  
.040 .055  
.065 .084  
.113 .123  
150 ns  
110 ns  
0.5 mJ  
Eoff  
Note 1  
0.3  
C
D
E
.4  
.8  
.016 .031  
.819 .845  
.610 .640  
20.80 21.46  
15.75 16.26  
Inductive load, TJ = 125°C  
td(on)  
tri  
Eon  
td(off)  
tfi  
15  
30  
0.15  
140  
100  
0.6  
ns  
ns  
mJ  
ns  
ns  
mJ  
IC = IC90, VGE = 15 V, L = 100 µH  
e
L
L1  
5.20  
5.72 0.205 0.225  
19.81 20.32  
4.50  
.780 .800  
.177  
V
CE = 0.8 VCES, RG = Roff = 10 Ω  
P
3.55  
5.89  
3.65  
.140 .144  
Q
6.40 0.232 0.252  
Note 1  
Eoff  
R
S
4.32  
5.49  
.170 .216  
242 BSC  
6.15 BSC  
RthJC  
RthCK  
0.83 K/W  
K/W  
0.25  
TO-247 SMD Outline  
Reverse Diode (FRED)  
Characteristic Values  
(TJ = 25°C, unless otherwise specified)  
min. typ. max.  
Symbol  
VF  
Test Conditions  
IF = IC90, VGE = 0 V,  
1.6  
15  
V
Pulse test, t 300 µs, duty cycle d 2 %  
IRM  
trr  
IF = IC90, VGE = 0 V, -diF/dt = 240 A/µs  
VR = 360 V  
10  
TJ =125°C 150  
IF = 1 A; -di/dt = 100 A/µs; VR = 30 V TJ = 25°C 35  
A
ns  
50 ns  
RthJC  
1 K/W  
1. Gate  
3. Emitter  
2. Collector  
4. Collector  
Note 1: Switching times may increase for VCE (Clamp) > 0.8 • VCES, higher TJ  
or increased RG  
Dim.  
Millimeter  
Min. Max.  
Inches  
Min. Max.  
Min. Recommended Footprint (Dimensions in inches and mm)  
A
A1  
A2  
4.83  
2.29  
1.91  
5.21  
2.54  
2.16  
.190  
.090  
.075  
.205  
.100  
.085  
b
b1  
1.14  
1.91  
1.40  
2.13  
.045  
.075  
.055  
.084  
C
D
0.61  
20.80  
0.80  
21.34  
.024  
.819  
.031  
.840  
E
e
15.75  
5.45  
16.13  
BSC  
.620  
.215 BSC  
.635  
L
4.90  
2.70  
2.10  
0.00  
1.90  
5.10  
2.90  
2.30  
0.10  
2.10  
.193  
.106  
.083  
.00  
.201  
.114  
.091  
.004  
.083  
L1  
L2  
L3  
L4  
.075  
ØP  
Q
3.55  
5.59  
3.65  
6.20  
.140  
.220  
.144  
.244  
R
S
4.32  
6.15  
4.83  
BSC  
.170  
.242 BSC  
.190  
IXYS reserves the right to change limits, test conditions, and dimensions.  
IXYS MOSFETS and IGBTs are covered by one or more of the following U.S. patents: 4,835,592 4,881,106  
4,850,072 4,931,844  
5,017,508  
5,034,796  
5,049,961 5,187,117 5,486,715  
5,063,307 5,237,481 5,381,025  
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